Refrigerating and heating device
A device, heat-generating technology
Inactive Publication Date: 2011-06-15
HENAN HONGCHANG ELECTRONICS
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- Abstract
- Description
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- Application Information
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Problems solved by technology
[0002] Semiconductor cooling and heating devices use different temperatures on both sides of the semiconductor to achieve heating and cooling. The existing cooling plates on both sides of the device are heat sinks or fans, which have the disadvantages of complex structure and high cost.
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[0011] The present invention will be further described below in conjunction with the accompanying drawings.
[0012] Such as figure 1 As shown, the semiconductor cooling and heating device includes a semiconductor device 1 and heat dissipation plates on both sides, and is characterized in that: the heat dissipation plate is a water tank 2, and the water tank 2 has a water inlet 3 and a water outlet 4.
[0013] Further speaking, there is an epoxy resin sealing layer 4 around the semiconductor located in the middle of the water tank 1 .
[0014] Further speaking, the water tank 1 is formed by connecting multiple water tanks in series or in parallel.
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The invention relates to a refrigerating and heating device, in particular to a device for refrigerating and heating by using a semiconductor element. The semiconductor refrigerating and heating device comprises a semiconductor device and heat dissipation plates on two sides, wherein the heat dissipation plate is a water tank, and the water tank is provided with a water inlet and a water outlet. The periphery of a semiconductor positioned in the middle of the water tank is provided with an epoxy resin sealing layer. The water tank consists of a plurality of water tanks connected in series or in parallel. The refrigerating and heating device has simple structure and good refrigerating and heating effect; and in addition, cold water and hot water flowing out from the two sides can be used.
Description
technical field [0001] The invention relates to a cooling and heating device, in particular to a cooling and heating device using a semiconductor element. Background technique [0002] Semiconductor cooling and heating devices use different temperatures on both sides of the semiconductor to achieve heating and cooling. The heat sinks or fans on both sides of the existing device have the disadvantages of complex structure and high cost. Contents of the invention [0003] The object of the present invention is to provide a semiconductor cooling and heating device with a simple structure to address the above disadvantages. [0004] The technical solution of the present invention is realized as follows: the semiconductor cooling and heating device includes a semiconductor device and heat dissipation plates on both sides, and the feature is that the heat dissipation plate is a water tank, and the water tank has a water inlet and a water outlet. [0005] Further speaking, there...
Claims
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IPC IPC(8): F25B29/00F25B21/02
Inventor 陈建民陈建卫陈磊陈燕青
Owner HENAN HONGCHANG ELECTRONICS
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