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A kind of electroplated diamond cathode and its manufacturing method

A technology of electroplating diamonds and manufacturing methods, which is applied in the direction of electrodes, etc., can solve the problems of low yield, high diamond adhesion rate, waste of raw materials and electric energy, etc., and achieve the effects of high qualified rate of finished products, simple production, and low adhesion rate of finished products

Active Publication Date: 2016-04-13
HENAN HUANGHE WHIRLWIND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The cathodes used for electroplating metal on the surface of artificial diamond (grain size range 25 / 30-400 / 500 mesh) particles have different shapes, and most of them have reasonable structures. Some cathodes and anodes have a large difference in contact area, so that The area ratio of cathode and anode does not match, and some are not resistant to use, etc., resulting in high adhesion rate of plated diamonds, low yield, waste of raw materials and electric energy, which is inconsistent with the current advocated energy saving, emission reduction, and clean production

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  • A kind of electroplated diamond cathode and its manufacturing method
  • A kind of electroplated diamond cathode and its manufacturing method

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Embodiment Construction

[0015] The present invention will be further described below in conjunction with the accompanying drawings.

[0016] A kind of manufacture method of electroplated diamond cathode, such as figure 1 shown, including the following steps:

[0017] a. Select a single-core copper wire with an insulating layer, and peel off the insulating layer at the front end 1 and the rear end 2;

[0018] b. The front end 1 is folded into an inverted U shape, such as figure 2 shown;

[0019] c. A section of the insulating layer 3 after the front end 1 is first primed with a waterproof sealing tape 4, and then screwed tightly with an insulating tape 5;

[0020] d. The front end 1 is then folded into an inverted Z shape, and the rear portion 6 of the inverted Z shape is tilted upwards compared with the front portion 7 .

[0021] The better technical solution is: take a single-core copper wire with a length of 450-550mm Φ6mm; the length of the outer edge insulation stripped at the front end 1 is...

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Abstract

The invention relates to a cathode for electroplating diamond and a manufacture method thereof. An electroplated diamond is formed by electroplating a layer of metal on the surface of a man-made diamond. The manufacture method comprises the following steps of a. selecting and using a single-core copper conductor externally wrapped by an insulation layer and peeling off the insulation layer at the front end and at the rear end of the copper conductor; b. bending the front end into a reverse U shape; c. firstly bottoming the section of the copper conductor having insulation layer except for the front end with a waterproof sealing belt, namely a raw plastic belt or a raw material belt, then pressing the section of copper conductor having the insulation layer except for the front end through an insulation tape in a screwing mode; and d. bending the copper conductor except for the front end into a reverse Z shape, wherein the rear portion of the reverse Z shape upwarps relative to the front portion of the reverse Z shape. The cathode for electroplating diamond is manufactured through the manufacture method which has the advantage of being simple in manufacture. The cathode for electroplating diamond has the advantages that an electroplated diamond finished product is low in adhesion rate and high in percent of pass, and the electroplated diamond saves electricity.

Description

technical field [0001] The invention relates to an electroplating diamond cathode and a manufacturing method thereof. Electroplating diamond is to electroplate a layer of metal on the surface of artificial diamond. Background technique [0002] The cathodes used for electroplating metal on the surface of artificial diamond (grain size range 25 / 30-400 / 500 mesh) particles have different shapes, and most of them have reasonable structures. Some cathodes and anodes have a large difference in contact area, so that The area ratio of cathode and anode does not match, and some are not resistant to use, etc., resulting in high adhesion rate of plated diamonds, low yield, waste of raw materials and electric energy, which is inconsistent with the current advocated energy saving, emission reduction, and clean production. Contents of the invention [0003] The purpose of the present invention is to address the above shortcomings, to provide an electroplated diamond cathode that can eff...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D17/12C25D5/54
Inventor 郭松刘拾霞苏志霞曹河周孟为民刘祥王飞山
Owner HENAN HUANGHE WHIRLWIND CO LTD