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A simple bending device for flexible substrate packaging

A technology of bending device and flexible substrate, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of high labor intensity, increased production cost, and many human factors, so as to reduce labor intensity and facilitate bending , Improve the effect of product quality

Active Publication Date: 2016-08-17
NAT CENT FOR ADVANCED PACKAGING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] See figure 1 , in the flexible substrate package, the flexible substrate bending process is the core process, and there is no fully mature special bending equipment at present, and the flexible substrate bending tools and bending methods currently used are labor-intensive and increase The production cost is reduced, and there are many human factors in the processing process, which affects the product quality

Method used

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  • A simple bending device for flexible substrate packaging
  • A simple bending device for flexible substrate packaging
  • A simple bending device for flexible substrate packaging

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Embodiment Construction

[0010] See figure 1 , a simple bending device for flexible substrate packaging, which includes a base plate 1, a back plate 2 is provided at both ends of the base plate, the back plate 2 is connected to the base plate 1, a through hole 3 is provided on the back plate 2, and the rotatable The bending rod 4 passes through the through hole 3 to realize the rotation of the bending rod 4 in the through hole 3. The bending rod 4 includes a rotating head 5 and a bending head 6, and the bending head 6 is two circular tubes 6a with a gap , 6b composed of a fork structure, the round pipes 6a, 6b are connected to the rotating head 5, and the rotating head 5 drives the round pipes 6a, 6b to rotate.

[0011] The base plate 1 is provided with a plurality of suction holes 7, which can be connected to a vacuum adsorption structure, and can better fix the flexible substrate prepared for two-dimensional surface mounting on the base plate 1.

[0012] The flexible substrate is placed on the bott...

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Abstract

The invention provides a simple buckling device for flexible substrate packaging. The simple buckling device comprises a base plate, wherein a rotatable buckling rod is arranged on an end part of the base plate, and comprises a rotating head and a buckling head; and the buckling head is of a fork level structure with clearances. The bending of a flexible substrate can be simply and conveniently realized, the labor intensity and the production cost are reduced, and the product quality is effectively improved.

Description

technical field [0001] The invention relates to the technical field of substrate packaging in the microelectronics industry, in particular to a simple bending device for flexible substrate packaging. Background technique [0002] See figure 1 , in the flexible substrate package, the flexible substrate bending process is the core process, and there is no fully mature special bending equipment at present, and the flexible substrate bending tools and bending methods currently used are labor-intensive and increase The production cost is increased, and there are many human factors in the processing process, which affects the product quality. Contents of the invention [0003] In view of the above problems, the present invention provides a simple bending device for flexible substrate packaging, which can simply and conveniently realize the bending of flexible substrates, reduces labor intensity and production costs, and effectively improves product quality. [0004] Its techni...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/48
Inventor 尹雯张博陆原
Owner NAT CENT FOR ADVANCED PACKAGING CO LTD