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Solder removing and tin sucking clamp

A clip and collet technology, applied in the field of clips with both desoldering and tin absorption functions, can solve the problems of damage to peripheral devices, difficult to pull out smoothly, etc., and achieve the effect of easy disassembly

Active Publication Date: 2014-01-01
WEIFANG GOERTEK ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, solder paste is mostly used in the packaging of integrated circuits. However, some electrical devices need to be replaced due to Sun Huan or other reasons during the production and debugging process, and they need to be pulled out from the positioning holes when disassembling the electrical devices. However, these positioning The hole has been tightly sealed with solder paste, it is difficult to pull out smoothly, and sometimes even damage peripheral devices

Method used

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  • Solder removing and tin sucking clamp
  • Solder removing and tin sucking clamp
  • Solder removing and tin sucking clamp

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Embodiment Construction

[0020] The core idea of ​​the present invention is to disclose a clip for removing solder and absorbing tin, including a clamping system, a heating system, a tin absorbing system, and a control system, wherein, the clamping system clamps the pins of electrical devices, and the control system controls the heating system Melt the solder on the pins, and at the same time control the tin suction system to suck the melted tin away from the clamping system, realizing the functions of solder removal and tin suction, making the electrical devices easy to disassemble without damaging the surrounding devices; Further, the control system can also independently control the heating system or the tin suction system, so as to realize the independent use of the functions of solder removal and tin suction.

[0021] In order to make the purpose and features of the present invention more obvious and easy to understand, the following will further describe the specific embodiments of the present in...

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Abstract

The invention provides a solder removing and tin sucking clamp, comprising a clamping system, a heating system, a tin sucking system and a control system, wherein the clamping system is used for clamping pins on an electrical device, the control system is used for controlling the heating system to melt soldering tin on the pins, and controlling the tin sucking system to suck molten tin from the clamping system, so that functions of solder removing and tin sucking are realized, the electric device is very easy to detach, and surrounding devices cannot be damaged; further, the control system can be used for independently controlling the heating system and the tin sucking system, so that the solder removing function and the tin sucking function can be independently used.

Description

technical field [0001] The invention relates to the technical field of soldering tools, in particular to a clip with functions of removing solder and absorbing tin. Background technique [0002] At present, solder paste is mostly used in the packaging of integrated circuits. However, some electrical devices need to be replaced due to Sun Huan or other reasons during the production and debugging process, and they need to be pulled out from the positioning holes when disassembling the electrical devices. However, these positioning The hole has been tightly sealed with solder paste, which is difficult to pull out smoothly, and sometimes even damages peripheral devices. [0003] Therefore, there is a need for a clip that can reduce the difficulty of removing the electrical device, so as to avoid the above-mentioned defects. Contents of the invention [0004] The object of the present invention is to provide a clip for removing solder and absorbing tin, which can have the func...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/08
CPCB23K1/018
Inventor 李坡张忠立
Owner WEIFANG GOERTEK ELECTRONICS CO LTD
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