Thermal-driving testability design structure and method capable of reducing small delay defect over-testing

Abstract

The invention provides a thermal-driving testability design structure capable of reducing small delay defect over-testing. The thermal-driving testability design structure comprises n scanning chain groups, n demultiplexers DMUX, n first MUX and a control unit, wherein each scanning chain group comprises k sub-scanning chains which are divided by each original scanning chain in the circuit, the DMUX are correspondingly arranged between n scanning input ends and input ends of n scanning chain groups one by one, the first MUX are correspondingly arranged between n scanning output ends and the output ends of the n scanning chain groups one by one, and the control unit is used for controlling the sub-scanning chains in the scanning chain groups for testing. According to the thermal-driving testability design structure capable of reducing small delay defect over-testing, small delay over-testing can be reduced effectively.

Description

technical field [0001] The invention relates to the technical field of integrated circuit testing, in particular to a heat-driven testability design structure for reducing overtesting of small delay defects. Background technique [0002] As semiconductor technology becomes more and more sophisticated, the gates in the circuit become more and more dense, and the number of transitions in the normal operation of the circuit will increase, and the number of circuit transitions during the test process is much higher than that in normal operation. times, so a large number of circuit jumps per unit time will cause a lot of overheated areas on the circuit, which are called hotspot areas, and at the same time, it will also cause the temperature distribution of the circuit to be very uneven. Due to the increasing number of circuit transitions, the power consumption of the circuit is also increasing. Excessive power consumption of the circuit will lead to higher testing costs for the c...

AI Technical Summary

Problems solved by technology

But none of them are very good at reducing the temperature alarm, thereby reducing the number of tests

In order to reduce the power / energy consumption during circuit testing, many scan test structures have also been proposed by scholars, but so far there is still no effective heat-driven testability structure for reducing small delay defects over-testing

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