Heatsink Vane Package for DUT

Abstract

Embodiments of the present disclosure provide an apparatus (100) configured to interface a device (102, 104, 106) via automatic test equipment (124) to test the device. The apparatus (100) includes a heat sink (114), wherein the heat sink (114) includes a plurality of fins (116) extending from the heat sink (114), and wherein the heat sink (114) is configured to engage the device (102). The device (100) further includes a thermally conductive layer (110) coupled to the heat sink (114), a first leg (118) coupled to the thermally conductive layer (110), and a second leg (118) coupled to the thermally conductive layer (110). The second leg (118) is spaced from the first leg (118). A vacuum path (120) is defined by (i) the thermally conductive layer (110) and (ii) the heat sink (114). Vacuum path (120) allows apparatus (100) to engage device (102) to be tested by automated test equipment (124).

Description

[0001] Cross References to Related Applications [0002] This disclosure claims priority to U.S. Patent Application No. 14 / 076,058, filed November 8, 2013, which is a non-provisional application and claims priority to U.S. Provisional Patent Application No. 61 / 725,241, filed November 12, 2012 , the contents of which are incorporated into this application by reference. technical field [0003] Embodiments of the present disclosure relate to the field of semiconductor processing, and more particularly, to testing semiconductor devices. Background technique [0004] The background description provided herein is for the purpose of generally presenting the context of the disclosure. To the extent that the work is described in this Background section, the inventor's work, and aspects of the work that may not be described as prior art at the time of filing, are neither expressly nor impliedly admitted to be state-of-the-art to the present disclosure. have technology. [0005] W...

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