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Headset connecting structure and headset

A connection structure and earphone technology, applied in earpiece/earphone accessories, loudspeakers, microphones, etc., can solve problems such as unsmooth expansion and contraction, complex structure, etc., achieve comfortable hand feeling, improve earphone quality, and enhance experience effects

Active Publication Date: 2017-01-25
SHENZHEN GRANDSUN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to provide an earphone connection structure and a headphone, aiming at solving the problem of the existing headphone connection structure for telescopically connecting the sounding unit and the headband in the prior art. Unsmooth problem

Method used

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  • Headset connecting structure and headset
  • Headset connecting structure and headset
  • Headset connecting structure and headset

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Embodiment Construction

[0021] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0022] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or there may be an intervening element at the same time. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.

[0023] In addition, it should be noted that the orientation terms such as left, right, up, down, head, and tail in the embodiments of the present invention are only relative concepts or refer to the normal use status of the...

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Abstract

The invention relates to the technical field of a headset structure and discloses a headset connecting structure and a headset. The headset connecting structure is used for connecting a head band and sound production units of the headset and comprises a magnetic sliding arm, a sliding track and a casing covering the periphery of the sliding track, wherein the tail end of the magnetic sliding arm can slide to extend into the sliding track from the head end of the sliding track, the head end of the magnetic sliding arm is fixedly connected with the head band, and the tail ends of the casing are connected with the sound production units; the magnetic sliding arm is covered with a seamless sleeve, and iron-based parts in adsorption matching with left and right sides of magnetic sliding arm are arranged in the sliding track and attached to the seamless sleeve. The headset comprises the head band, the sound production units and the headset connecting structure for connecting the head band and the sound production units. According to the headset connecting structure and the headset, the iron-based parts arranged in the sliding track are in adsorption matching with the magnetic sliding arm movably extending into the sliding track, so that the magnetic sliding arm slides smoothly under the dual actions of magnetic force and frictional force, and the use effect of a user is improved.

Description

technical field [0001] The invention relates to the technical field of earphone structures, in particular to an earphone connection structure and a headset. Background technique [0002] Headphones and in-ear headphones are common audio equipment. Compared with in-ear headphones, headphones are larger in size and generally have two larger sounding units connected together by an elastic headband. When the headset is in use, the sound unit is closely attached to the human ear by its headband. Due to the particularity of the one-piece structure of the headset, it has poor adaptability to different head shapes and ear positions of various users. It is necessary to use a retractable connection structure to connect the sound unit and the headband, and through the connection structure to expand and contract Adjust the enclosing size of the entire earphone to adapt to different head shapes and ear positions. Although the connection structure of the existing headphone can also be s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/10
CPCH04R1/105H04R2201/10
Inventor 余新吴海全师瑞文
Owner SHENZHEN GRANDSUN ELECTRONICS
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