A method for improving die loss during dicing of GAAS-based LED chips

A technology of LED chips and dies, which is applied in the manufacture of semiconductor devices, electrical components, and semiconductor/solid-state devices, etc., can solve problems such as no specific solutions for dies, so as to improve stickiness, increase product output, and improve The effect of dropping the die

Active Publication Date: 2019-03-01
SHANDONG INSPUR HUAGUANG OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] Chinese patent document CN102709171A discloses a method for cutting ultra-small LED chips on a GaAs substrate. Firstly, a comprehensive micro-cutting step is performed on the chip surface, and then a comprehensive through-cutting is performed on the micro-cut knife marks. There is an obvious improvement in improving the cutting quality, but there is no specific solution to the phenomenon of die dropping in the cutting operation.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] A method for improving die loss during the cutting process of GaAs-based LED chips, the steps of which are:

[0034] a) Half-cut the surface of the chip; the height of the half-cut knife is set to 130 μm, the cutting speed is 50 mm / s, the protrusion of the knife edge is 550 μm, the width of the cutting groove is 25 μm, and the depth is 20% of the chip thickness. b) Baking the chip after the half-cut operation; set the baking temperature to 50°C and the baking time to 100s. c) After the chip is baked, carry out the blue film laminating operation; set the heating temperature of the film laminating machine to 50°C, and use the blue film of SPV-224 220mm*100m. d) After the film is pasted, the chips are then baked: set the baking temperature to 70°C and the baking time to 100s. e) After the film is baked, perform a full cut on the half-cut knife mark: the full-cut knife height is set to 60 μm, the cutting speed is 20 mm / s, the blade extension is 560 μm, and the cutting groo...

Embodiment 2

[0036] The difference from Example 1 is that the baking temperature in step b) is 50°C and the baking time is 110s. The baking temperature in step d) is 72°C, and the baking time is 110s. The cutting speed of full cut in step e) is 30mm / s.

Embodiment 3

[0038] The difference from Example 1 is that the baking temperature in step b) is 53°C and the baking time is 110s. The baking temperature in step d) is 73°C, and the baking time is 110s. In step e), the cutting speed of the full cut is 30 mm / s, and the knife height is 80 μm.

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PUM

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Abstract

The invention relates to a method for improving drop of tube cores in a GaAs-based LED chip cutting process. The method comprises the steps of: (a), semi-cutting the surface of an LED chip by utilizing a saw blade; (b), baking the semi-cut LED chip; (c), performing blue film lamination of the baked LED chip; (d), performing secondary baking of the blue film laminated LED chip; (e), fully cutting the secondarily baked LED chip; and (f), performing film expansion after cleaning the fully cut LED chip. With the help of a heater, the chip is baked before being laminated; the stress of the chip itself can be effectively released; the deformation tension of the chip itself can be reduced; simultaneously, the laminated chip together with a blue film is baked; therefore, the malleability of the blue film is improved; therefore, the film is thoroughly expanded; the viscidity of the blue film is improved; the method for effectively improving drop of the tube cores in the GaAs-based LED chip cutting process is simple to work and high in effectiveness; the drop problem of the tube cores can be effectively solved; and thus, the product throughput can be increased.

Description

technical field [0001] The invention relates to the field of photoelectric manufacturing, in particular to a method for improving die loss during GaAs-based LED chip cutting. Background technique [0002] Due to the high luminous efficiency, wide color range and long service life of LED chips, they have been widely valued by the semiconductor lighting industry and have been widely used in various fields such as large-screen display, landscape lighting, traffic lights, and automobile status display. With the progress and development of integrated circuit technology, products tend to be miniaturized and multi-functional, and the requirements for integration are getting higher and higher. The chip size is reduced, the width of the cutting groove is reduced, and the thickness of the chip is getting thinner. More and more new materials are applied, and these rapid changes have put forward higher requirements for the cutting process of chips. [0003] In the LED chip manufacturin...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): H01L33/00H01L21/78
CPCH01L21/78H01L33/0095
Inventor郑军邢建国闫宝华汤福国刘琦徐现刚
OwnerSHANDONG INSPUR HUAGUANG OPTOELECTRONICS