Supercharge Your Innovation With Domain-Expert AI Agents!

Housing, electronic module having the housing, and manufacturing method thereof

A technology of electronic modules and shells, which is applied in the field of electronic modules, and can solve the problems of affecting the appearance of electronic devices, affecting the structural strength of electronic devices, and not being waterproof.

Active Publication Date: 2020-07-03
LITE ON ELECTRONICS (GUANGZHOU) LTD +1
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, generally this kind of shell cannot prevent fluid from entering the shell at the riveted part of the upper shell and the lower shell, that is to say, it does not have a waterproof function.
In addition, because the mechanism and method of joining the shell parts will not only affect the appearance of the electronic device, but also affect the overall structural strength and electrical characteristics of the electronic device.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Housing, electronic module having the housing, and manufacturing method thereof
  • Housing, electronic module having the housing, and manufacturing method thereof
  • Housing, electronic module having the housing, and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0046] refer to Figure 1 to Figure 5 , an embodiment of the electronic module 10 of the present invention includes a first casing 1 , a second casing 2 , a first wire waterproof casing 3 , and a second wire waterproof casing 4 . Wherein, the first housing 1 forms an accommodating space for setting a circuit board with electronic components, but for the sake of simplicity, the circuit board is not shown in figure 1 and in the subsequent drawings.

[0047] The first casing 1 includes a first base plate 11 and a first surrounding wall 12 connected to the first base plate 11 . In this embodiment, the first surrounding wall 12 of the first casing 1 is approximately in the shape of a square surrounding and has four side wall portions 124, but in other implementations the first surrounding wall 12 can also be in other shapes. , such as circles, other polygons, and so on. The first surrounding wall 12 has a first outer wall surface 121 and a first inner wall surface 122 on the opp...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An electronic module includes a first casing and a second casing. The first shell has a first end face and a first joint unit formed on the first end face, and the first shell also has at least one protrusion extending from the first joint unit. The second housing has a second end face and a second joint unit formed on the second end face and cooperating with the first joint unit, and the first joint unit and the second joint unit are connected to each other join together.

Description

technical field [0001] The invention relates to an electronic module, in particular to a casing, an electronic module with the casing and a manufacturing method thereof. Background technique [0002] In order to meet the different power specifications of various types of electronic products, various electronic modules such as power adapters, transformers, and power connectors are produced accordingly. The above-mentioned electronic modules need to properly isolate and protect the internal electronic components from the outside world, so they are usually covered with a shell to prevent the electronic components from being exposed to direct contact with users, moisture, dust, and the like. However, generally such shells cannot prevent fluid from entering the shell at the riveted joint between the upper shell and the lower shell, that is to say, they do not have a waterproof function. In addition, not only the appearance of the electronic device, but also the overall structura...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K5/02H05K5/06
CPCH05K5/0217H05K5/066H05K5/069B29L2031/3481B23K20/10B29C65/08B29C66/1222B29C66/1224B29C66/12445B29C66/12469B29C66/1282B29C66/12841B29C66/30221B29C66/30223B29C66/322B29C66/54B29C66/7392B29C66/8322B23K2101/045B23K2101/36
Inventor 易亚东朱建华
Owner LITE ON ELECTRONICS (GUANGZHOU) LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com