Design method of structural positioning screw hole PAD, and PCB

A technology of structure positioning and design method, which is applied in the direction of electrical connection of printed components, printed circuit components, electrical components, etc., can solve the problems of wave soldering fixture opening restrictions, poor welding, and polluted screw hole pads, etc., to achieve Avoid the problem of poor soldering, increase the opening range, and ensure the quality of tinning

Inactive Publication Date: 2018-08-14
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In PCB design, due to the structure of some wave soldering components, the exposed positioning hole PAD is very close to the upper tin pin, which restricts the opening of the wave soldering fixture, resulting in poor soldering of the wave soldering components.
In addition, some exposed screw holes in the PCB board are too close to the tin holes on adjacent wave soldering components (both are structurally positioned and cannot be moved), which will also cause poor soldering
In response to this situation, some board factories will use adhesive tape to stick the screw hole PAD in order to increase the opening of the fixture and prevent the screw hole PAD from being tinned during production. However, due to the high temperature after the furnace, this method will pollute the screw hole soldering. plate

Method used

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  • Design method of structural positioning screw hole PAD, and PCB
  • Design method of structural positioning screw hole PAD, and PCB

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Such as figure 1 As shown, a design method for structural positioning screw hole PAD, the method sets the size and shape of the pad 1 adjacent to the screw hole according to the position of the wave soldering component, between the pad 1 of the screw hole and the pin 2 of the adjacent wave soldering component Set the restricted area 3 between them, and make the screw hole pad 1 avoid the restricted area 3, so as to avoid being exposed to the tin wave during soldering.

[0031] The method covers the restricted area 3 with green oil, and increases the opening range of the wave soldering fixture to the restricted area 3, so as to ensure that the screw hole pad 1 is not polluted, and also ensures the amount of tin on the wave soldering components.

[0032] The distance between the screw hole pad 1 and the pin 2 of the adjacent wave soldering component is ≥ 2 mm, that is, the width of the restricted area 3 is ≥ 2 mm.

[0033] The screw holes are round holes or gourd holes, ...

Embodiment 2

[0035] The implementation steps of the method include:

[0036] According to the position of the pin 2 of the wave soldering component and the opening requirements of the wave soldering fixture, set the restricted area 3 on the PCB;

[0037] Set the size and shape of the screw hole pad 1 according to the restricted area 3;

[0038] The screw hole pad 1 avoids the restricted area 3;

[0039] Cover with green paint in Restricted Area 3;

[0040] The opening range of the corresponding wave soldering fixture is increased to the restricted area 3 .

[0041] The pad 4 of the pin of the wave soldering component also avoids the restricted area, such as figure 1 the right part of the .

Embodiment 3

[0043] A PCB with a structure positioning screw hole pad, the structure of the PCB includes the area where the pin 2 of the wave soldering component is located, the restricted area 3, and the screw hole pad 1, wherein the restricted area 3 is located at the screw hole pad 1 and adjacent between pin 2 of the wave soldering component.

[0044] The distance between the screw hole pad 1 and the pin 2 of the adjacent wave soldering component is greater than or equal to 2 mm.

[0045] The restricted area 3 is covered with green oil.

[0046] The pads 4 of the pins of the wave soldering components also avoid the restricted area.

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PUM

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Abstract

The invention discloses a design method of a structural positioning screw hole PAD, and a PCB. According to the method, the sizes and shapes of adjacent screw holes PAD can be set according to a wave-soldering element; and a limiting region is arranged between the screw hole PAD and the adjacent wave-soldering element pin, and the screw hole PAD avoids the limiting region. By virtue of the technical scheme, the problem of screw hole PAD poor tin gluing caused in wave soldering, and the problem of pollution caused by utilization of an adhesive tape can be avoided effectively; and in addition, through the optimized screw hole PAD, the open pore range of a wave-soldering jig can be enlarged, and the tinning quality of the wave-soldering element is ensured.

Description

technical field [0001] The invention relates to the technical field of printed circuit PCB / PCBA manufacturing, in particular to a design method of a structural positioning screw hole PAD and a PCB. Background technique [0002] In PCB design, due to the structure of some wave soldering components, the exposed positioning hole PAD is very close to the upper tin pin, which restricts the opening of the wave soldering fixture, resulting in poor tin on the wave soldering components. In addition, some exposed screw holes in the PCB board are too close to the tin holes on adjacent wave soldering components (both are structurally positioned and cannot be moved), which will also cause poor soldering. In response to this situation, some board factories will use adhesive tape to stick the screw hole PAD in order to increase the opening of the fixture and prevent the screw hole PAD from being tinned during production. However, due to the high temperature after the furnace, this method w...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): H05K1/11
CPCH05K1/116H05K2201/09427
Inventor齐志远
OwnerZHENGZHOU YUNHAI INFORMATION TECH CO LTD