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A flexible soaking structure and electronic product

A technology of electronic products and thermal structure, applied in the direction of electrical components, electrical equipment structural parts, cooling/ventilation/heating transformation, etc., can solve problems such as complex structure, affecting the performance of electronic equipment, difficult to adapt to the structure and shape of electronic products, etc. , to achieve the effect of good deformation ability

Pending Publication Date: 2019-01-18
GEER TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the complex structure of electronic products, heat dissipation components such as phase change vapor chambers are limited by their own structural shapes, and it is difficult to adapt to the structure and shape requirements of electronic products.
In addition, metal materials are often used for components with heat dissipation functions such as heat sinks and phase-change vapor chambers, but metal materials will produce electromagnetic shielding for antennas and other equipment in electronic products, seriously affecting the performance of electronic equipment

Method used

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  • A flexible soaking structure and electronic product
  • A flexible soaking structure and electronic product
  • A flexible soaking structure and electronic product

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Embodiment Construction

[0030] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0031] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0032] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0033] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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Abstract

The invention discloses a flexible soaking structure and an electronic product. The flexible soaking structure comprises two layers of flexible sheath, wherein the flexible sheath comprises at least two flexible film layers and one graphite material layer, and the graphite material layer is positioned between the two flexible film layers; The sealing frame is a hollow structure, the sealing frameis sandwiched between two layers of the flexible skins, the hollow part of the sealing frame forms a sealed accommodation space, and the air pressure range in the accommodation space is 10-1Pa to 10-3Pa; A capillary structure and a liquid working medium, the capillary structure being disposed in the accommodation space, the liquid working medium being filled in the accommodation space; The accommodation space is configured to evacuate.

Description

technical field [0001] The invention belongs to the technical field of electronic products, and in particular relates to a flexible heat uniform structure and electronic products. Background technique [0002] In recent years, the technology of consumer electronic products has developed rapidly, and electronic products such as mobile phones, VR equipment, and AR glasses have been recognized by consumers and widely used. The performance of consumer electronics products is also gradually improving. Existing consumer electronic products have performance characteristics of small size and high power consumption, which causes the problem of heat concentration in electronic products. In order to meet the design requirements of electronic products, existing electronic products often have a complex stacked device structure inside, which especially increases the difficulty of dissipating heat from the case of the electronic product. [0003] Those skilled in the art also try to plac...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH05K7/20445
Inventor 马红霞
Owner GEER TECH CO LTD