Unlock instant, AI-driven research and patent intelligence for your innovation.

Mounting method for circuit board

A circuit board and mounting technology, applied in the field of circuit board mounting, can solve the problem of low use efficiency of the production line, and achieve the effect of improving the utilization efficiency, reducing the production cost, and monitoring the product quality in real time.

Inactive Publication Date: 2019-04-05
CHINA COMM TECH CO LTD +1
View PDF3 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a method for mounting circuit boards, which aims to solve the technical problem of low efficiency of the production line of the mounting method for circuit boards in the prior art

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Mounting method for circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0023] Embodiments of the present invention are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals designate the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0024] In describing the present invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", The orientation or positional relationship indicated by "horizontal", "top", "bottom", "inner", "outer", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than Nothing indicating or implying that a referenced device or element...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention belongs to the technical field of circuit boards, in particular relating to a mounting method for a circuit board. The mounting method for the circuit board includes the following steps:providing a mounting production line and a plurality of jigs, wherein the mounting production line includes a mounter and a reflow oven, and first accommodating grooves and second accommodating groove are arranged on the jigs; placing, in the first accommodating grooves, a first batch of first circuit boards with bottoms mounted; performing mounting and reflowing; repeating the placing step untilonly the top surfaces of the last batch of second circuit boards haven't finished mounting and reflowing; and placing, on the mounting production line, second circuit boards that haven't finished mounting and reflowing to complete mounting and reflowing, thus mounting and reflowing of all circuit boards are completed. The mounting method for the circuit board of the invention improves the utilization efficiency of the production line, reduces printed circuit board assembly (PCBA) oxidation caused by a long time interval between passage of top surfaces through an furnace and production of thetop surfaces, thus the production cost is reduced, the time for line change is reduced, and product quality can be monitored in real time.

Description

technical field [0001] The invention belongs to the technical field of circuit boards, in particular to a mounting method for circuit boards. Background technique [0002] SMT is Surface Mount Technology (SMT), also known as surface mount or surface mount technology, which is currently the most popular technology and process in the electronics assembly industry. In the whole production process of SMT, the PCB board is the main material. The PCB board is divided into single-panel and double-panel, and the double-panel is divided into Top and Bottom. There are many components on the top surface (such as BGA, QFP, etc.) that have high temperature requirements and cannot pass through the secondary furnace. Only the bottom surface is produced first, and then the top surface is produced by switching lines. Moreover, the lack of Bottom components will seriously affect the use efficiency of the production line, resulting in higher production costs, and can reduce the PCBA oxidation...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K13/04
CPCH05K13/0465
Inventor 张晶苗伟刘俊杰詹宇昕
Owner CHINA COMM TECH CO LTD