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A welding process method and welding equipment

A welding process and welding equipment technology, applied in the field of welding process methods and welding equipment, can solve the problems of unstable amount of solder paste, limited usage of liquid solder paste, uneven thickness, etc.

Active Publication Date: 2021-05-11
广州煌牌自动设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, most solder paste interlayer welding and connection processes use liquid solder paste for dispensing welding operations. Due to the limitations of liquid solder paste storage and use methods: 1. The amount of solder paste dispensed is unstable; 2. The solder paste produced by dispensing is round and inconsistent with the shape of the material to be welded; 3. The liquid solder paste is pressed by the upper and lower layers, resulting in uneven thickness after solidification; 4. The usage of a can of liquid solder paste is limited, and continuous dispensing is not possible Welding, changing the solder paste will affect product quality and production capacity; 5. After the solid solder paste sheet is directly heated to the center point, the solder paste layer will be completely melted and scattered, and the thickness will be thinner

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  • A welding process method and welding equipment
  • A welding process method and welding equipment
  • A welding process method and welding equipment

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Embodiment Construction

[0023] The present invention will now be described more fully with reference to the accompanying drawings hereinafter, in which embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the specific embodiments set forth herein. Rather, these embodiments are intended to convey the scope of the invention to those skilled in the art.

[0024] Unless otherwise defined, terms (including technical and scientific terms) used herein should be understood to have the same meaning as commonly understood by those skilled in the art to which this invention belongs. Moreover, it is to be understood that the terms used herein should be understood to have a meaning consistent with the meaning in this specification and the relevant art, and should not be interpreted in an ideal or overly formal sense, unless expressly stated herein so stipulated.

[0025] In describing the present invention, it should b...

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Abstract

The invention relates to a welding process and welding equipment. The welding equipment includes a laser generator and an adjustable reflector, and the scanning trajectory of the laser beam is controlled by adjusting the reflector to complete welding. The welding process method firstly heats and melts the solid solder paste sheet in the middle, and then controls and adjusts the mirror to move the laser beam to melt around the solder paste sheet, so as to ensure that the thickness of the solder paste layer remains unchanged during welding; the solid solder paste The storage and transportation of the chips are more convenient, the cost is low, and the vibrating plate can be used on the equipment to continuously feed the solid solder paste chips.

Description

technical field [0001] The invention relates to the technical field of welding technology, in particular to a welding technology method and welding equipment. Background technique [0002] At present, most solder paste interlayer welding and connection processes use liquid solder paste for dispensing welding operations. Due to the limitations of liquid solder paste storage and use methods: 1. The amount of solder paste dispensed is unstable; 2. The solder paste produced by dispensing is round and inconsistent with the shape of the material to be welded; 3. The liquid solder paste is pressed by the upper and lower layers, resulting in uneven thickness after solidification; 4. The usage of a can of liquid solder paste is limited, and continuous dispensing is not possible Soldering, changing the solder paste will affect the product quality and production capacity; 5. After the solid solder paste sheet is directly heated to the center point, the thickness of the solder paste lay...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K1/00B23K1/005
Inventor 何锋
Owner 广州煌牌自动设备有限公司