Automatic tape sticking equipment

Abstract

The invention provides an automatic tape sticking device, which relates to the technical field of chip production, and comprises a frame, a clamp for carrying a chip semi-finished product, a pair of conveying mechanisms for intermittently conveying the clamp, and a gluing mechanism for gluing pin feet of the chip semi-finished product; the pair of conveying mechanisms are installed on the frame in parallel with each other, and the gluing mechanism can be connected to the frame slidably along the transport direction of the conveying mechanism and is located above the conveying mechanism; the invention has a reasonable design, can automatically stick tape to the chip pin feet, avoids manual input, has high sticking efficiency, and has excellent and stable sticking quality.

Description

Technical Field

[0001] The present invention relates to the technical field of chip production, and in particular to an automatic adhesive tape sticking device. Background Art

[0002] Semi-finished chips are mostly produced by mold forming. After forming, the semi-finished chips are connected in a row of plates. Adjacent semi-finished chips need to be separated by cutting equipment to obtain single semi-finished chips, which is convenient for subsequent processing. In this process, the chip pins are easily bent and damaged. In order to avoid damage to the pins, the chip pins need to be protected with tape before cutting. Now most of them use manual tape pasting, which is inefficient and has inconsistent pasting quality. Summary of the invention

[0003] The object of the present invention is to provide an automatic tape sticking device, which can automatically stick tape to chip pins, avoid manual input, have high sticking efficiency, and have excellent and stable sticking quality.

[0004] The embodiment of the present invention is achieved as follows:

[0005] An automatic adhesive tape sticking device is used for sticking glue to the pin pins of a chip semi-finished product, comprising a frame, a fixture for carrying the chip semi-finished product, a conveying mechanism for intermittently transporting the fixture, and a sticking mechanism for sticking glue to the pin pins of the chip semi-finished product; the conveying mechanisms are installed on the frame in parallel with each other, and the sticking mechanism is connected to the frame and can move along the transport direction of the conveying mechanism and is located above the conveying mechanism.

[0006] Further, the conveying mechanism includes a pair of belt pulley conveying devices with the same speed, the clamp is simultaneously connected to the pair of belt pulley conveying devices, and at least one of the pair of belt pulley conveying devices is movably installed on the frame to adjust the distance between the two belt pulley conveying devices. Further, the conveying mechanism is provided with a clamping mechanism to prevent the clamp from moving, and the clamping mechanism includes a pair of clamping blocks, and at least one of the pair of clamping blocks is movably connected to a conveying mechanism to realize the movement of the pair of clamping blocks towards or away from each other to clamp or release the clamp.

[0007] Furthermore, it also includes a material blocking mechanism, which is arranged in the middle of the conveying mechanism. The material blocking mechanism includes a material blocking block and a material blocking cylinder. The material blocking block can be moved in the vertical direction and is arranged on the frame to block or release the clamp. The material blocking cylinder is installed on the frame, and the material blocking block is connected to the output end of the material blocking cylinder and is connected to the material blocking block to drive the material blocking block to move.

[0008] Furthermore, the blocking block is provided with a sensor for detecting the position of the clamp, and the sensor is electrically connected to the clamping mechanism to control the clamping or loosening of the clamping device.

[0009] Furthermore, the glue sticking mechanism includes a mounting plate, a glue applying mechanism and a glue cutting mechanism;

[0010] The mounting plate is fixed to the frame;

[0011] The gluing mechanism includes a tape installation disk for placing the tape and a pasting mechanism for pasting the tape; the tape installation disk and the change-direction roller are both installed on the installation plate, and the pasting mechanism includes a pressing box, a pressing roller and a pressing cylinder, the pressing box is provided with a tape channel, the feed inlet end of the tape channel of the pressing box is hinged to the installation plate, and the pressing roller is provided at the discharge outlet end of the pressing box to allow the tape to be pasted on the chip semi-finished product; the pressing cylinder is hinged to the installation plate and its output end is hinged to the pressing box to drive the pressing roller to move upward or downward;

[0012] The rubber cutting mechanism comprises a moving cylinder, a moving plate, a pair of scissors and a cutting cylinder. The scissors are perpendicular to the mounting plate and face the tape at the end position of the upward movement of the pressure roller. One blade of the scissors is fixed to the moving plate. The cutting cylinder is fixed to the moving plate and its output end is used to press the other blade of the scissors to complete the cutting of the tape. The moving cylinder is fixed to the mounting plate and its output end is connected to the moving plate to drive the scissors to move closer to or away from the tape.

[0013] Furthermore, the compression box is provided with a suction cavity, which is arranged on the back side of the tape in the tape channel. The suction cavity is connected to the tape channel through a plurality of suction holes to suck the tape when the suction cavity is under negative pressure.

[0014] Furthermore, the glue laminating mechanism also includes a re-pressing roller, which is arranged behind the pressing roller in the glue laminating direction, and is connected to the mounting plate through a re-pressing cylinder to approach the chip semi-finished product to press the tape again.

[0015] Furthermore, the gluing mechanism can be slidably connected to the frame in a direction perpendicular to the transport direction of the conveying mechanism.

[0016] A method for automatically applying adhesive tape, using the automatic adhesive tape applying device as described above, comprises the following steps:

[0017] S1. Installing the semi-finished chip on the fixture;

[0018] S2. The fixture provided with the semi-finished chip is placed on the conveying mechanism;

[0019] S3. The conveying mechanism transports the fixture with the semi-finished chip to the working area of ​​the gluing mechanism;

[0020] S4. The adhesive sticking mechanism presses down to stick the adhesive tape to the fixture;

[0021] S5. The gluing mechanism moves along the transport direction of the conveying mechanism to perform gluing operation on the pins of the semi-finished chip;

[0022] S6. After the gluing operation is completed, the gluing mechanism moves upward, and then the tape cutting operation is performed.

[0023] The beneficial effects of the present invention are:

[0024] The invention has reasonable design, can automatically paste the tape on the chip pins, avoids manual input, has high pasting efficiency, and has excellent and stable pasting quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 A schematic diagram of the structure of an automatic tape applying device provided by an embodiment of the present invention;

[0027] Figure 2 A schematic diagram of the use of a clamp and a conveying mechanism provided in an embodiment of the present invention;

[0028] Figure 3 A schematic diagram of the connection between the gluing mechanism and the frame provided in an embodiment of the present invention;

[0029] Figure 4 for Figure 3 The enlarged schematic diagram of point a in the middle;

[0030] Figure 5 A schematic diagram of the structure of a pasting mechanism provided by an embodiment of the present invention;

[0031] Figure 6 A schematic diagram of the structure of a compression box provided by an embodiment of the present invention;

[0032] Figure 7 A schematic diagram of the glue cutting state of the glue cutting mechanism provided in an embodiment of the present invention;

[0033] Icons: 1-frame, 2-clamp, 3-conveying mechanism, 4-gluing mechanism, 41-mounting plate, 42-gluing mechanism, 421-tape mounting plate, 422-changing roller, 423-pasting mechanism, 4231-pressing box, 4231a-tape channel, 4231b-suction chamber, 4231c-suction hole, 4232-pressing roller, 4233-pressing cylinder, 43-glue cutting mechanism, 431-moving cylinder, 432-moving plate, 433-scissors, 434-cutting cylinder, 44-re-pressing roller, 45-re-pressing cylinder, 5-clamping mechanism, 51-clamping block, 6-material blocking mechanism, 61-material blocking block, 62-material blocking cylinder, 63-sensor. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0035] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0037] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, or are the directions or positional relationships in which the inventive product is usually placed when in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0038] The terms “first”, “second”, “third”, etc. are only used for distinguishing descriptions and should not be understood as indicating or implying relative importance.

[0039] The terms "parallel", "vertical", etc. do not mean that the components must be absolutely parallel or vertical, but can be slightly tilted. For example, "parallel" only means that its direction is more parallel than "vertical", and does not mean that the structure must be completely parallel, but can be slightly tilted.

[0040] The terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal, vertical or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0041] In addition, the terms "roughly" and "basically" are intended to explain that the relevant content does not require absolute precision, but can have certain deviations. For example, "roughly equal" does not only mean absolute equality. Since it is difficult to achieve absolute "equality" in actual production and operation, there are generally certain deviations. Therefore, in addition to absolute equality, "roughly equal" also includes the above-mentioned situation with certain deviations. Taking this as an example, in other cases, unless otherwise specified, the terms "roughly" and "basically" have similar meanings to the above.

[0042] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] Example 1

[0044] Please refer to Figure 1 The present embodiment provides an automatic tape sticking device for sticking glue to the pin pins of a semi-finished chip, comprising a frame 1, a fixture 2 for carrying the semi-finished chip, a conveying mechanism 3 for intermittently conveying the fixture 2, and a sticking mechanism 4 for sticking glue to the pin pins of the semi-finished chip; the conveying mechanisms 3 are installed on the frame 1 in parallel with each other, and the sticking mechanism 4 is connected to the frame 1 and can be moved along the transport direction of the conveying mechanism 3 and is located above the conveying mechanism 3.

[0045] In actual production, different chip semi-finished products have different sizes, so the fixtures 2 used to carry them are also of different specifications. In this embodiment, in order to make the device suitable for transporting fixtures 2 of more specifications, the conveying mechanism 3 includes a pair of pulley conveying devices with the same speed, and the fixture 2 is simultaneously connected to a pair of the pulley conveying devices, and at least one of the pair of pulley conveying devices is movably installed on the frame 1 to achieve the spacing adjustment of the two pulley conveying devices; the movable methods are: ①. The pulley conveying device is connected to the frame 1 through a sliding connection of a slide rail, and the power source for driving the conveying mechanism 3 to move is a screw nut, and the screw of the screw nut can be rotatably connected to the frame 1 around its own rotating center axis, and the nut of the screw nut is connected to the belt The pulley conveying device is fixedly connected. At the same time, in this implementation mode, in order to prevent the two pulley conveying devices from deviating again after the spacing between the pulley conveying devices is adjusted into place, a screw clamping mechanism can be provided to prevent the screw from rotating, such as a clamping hoop, etc. In addition to the clamping mechanism, a latch or the like can also be used. The ultimate goal is to prevent the screw from rotating under non-human operation; ②. The pulley conveying device is detachably connected to the frame 1 by a latch fixing method, and a plurality of fixed positions are provided on the frame 1; ③. The pulley conveying device is detachably connected to the frame 1 by a screw fixing method; there are many ways to achieve the above purpose, which are not listed here one by one. Of course, the several methods listed above are not used to limit the implementation methods of the present device.

[0046] If the clamp 2 is active when the gluing mechanism 4 is gluing, the clamp 2 may be deflected by the gluing mechanism 4, which eventually leads to a poor adhesive effect of the tape. Therefore, in actual production, it is often necessary to fix the clamp 3 that is gluing. In this embodiment, the conveying mechanism 3 is provided with a clamping mechanism 5 for preventing the clamp 2 from moving. The clamping mechanism 5 includes a pair of clamping blocks 51. At least one of the pair of clamping blocks 51 is movably connected to a conveying mechanism 3 to realize the movement of the pair of clamping blocks 51 toward or away from each other to clamp or release the clamp 2; when the clamp 3 moves to the gluing working area of ​​the gluing mechanism 4, the clamping mechanism 5 is started to fix the clamp 2. The clamping force of the clamping block 51 comes from the clamping cylinder. The clamping cylinder is fixed on the conveying mechanism 3 or the frame 1, and the output end of the clamping cylinder is connected to the clamping block 51.

[0047] In order to ensure that the clamp 3 can stop at an accurate position every time, the device also includes a material stopping mechanism 6, which is arranged between a pair of pulley conveying devices. The material stopping mechanism 6 includes a material stopping block 61 and a material stopping cylinder 62. The material stopping block 61 can be moved in the vertical direction on the frame 1 to stop or release the clamp 2. The material stopping cylinder 62 is installed on the frame 1, and the material stopping block 61 is connected to the output end of the material stopping cylinder 62, which is connected to the material stopping block 61 to drive the material stopping block 61 to move.

[0048] In order to increase the degree of automation of the device, the blocking block 61 is provided with a sensor 63 for detecting the position of the clamp 2. The sensor 63 is electrically connected to the clamping mechanism 5 to control the clamping or loosening of the clamping mechanism 5. The sensor 63 can also be electrically connected to the conveying mechanism 3 to control the start and stop of the conveying mechanism 3. The sensor 63 can be an infrared sensor.

[0049] In this embodiment, the glue sticking mechanism 4 includes a mounting plate 41 , a glue applying mechanism 42 and a glue cutting mechanism 43 .

[0050] The mounting plate 41 is fixed to the frame 1 .

[0051] The gluing mechanism 42 includes a tape installation disk 421 for placing the tape, a direction-changing roller 422 for changing the direction of the tape, and a pasting mechanism 423 for pasting the tape; the tape installation disk 421 and the direction-changing roller 422 are both installed on the installation plate 41, and the pasting mechanism 423 includes a pressing box 4231, a pressing roller 4232 and a pressing cylinder 4233, and the pressing box 4231 is provided with a tape channel 4231a, and the tape channel 4231 of the pressing box 4231 is The feed port end of 31a is hinged to the mounting plate 41, and the pressing roller 4232 is arranged at the discharge port end of the pressing box 4231 to allow the tape to be attached to the chip semi-finished product; the pressing cylinder 4233 is hinged to the mounting plate 41 and its output end is hinged to the pressing box 4231 to drive the pressing roller 4232 to move upward or downward; when the pressing rod 4232 moves downward to the end position, the glue sticking operation is performed, and when it moves upward to the end position, the tape cutting operation is performed.

[0052] The glue cutting mechanism 43 includes a moving cylinder 431, a moving plate 432, a pair of scissors 433 and a shearing cylinder 434. The scissors 433 are perpendicular to the mounting plate 41 and are directly opposite to the tape at the end position of the pressing roller 4232. One blade of the scissors 433 is fixed to the moving plate 432. The shearing cylinder 434 is fixed to the moving plate 432 and its output end is used to press the other blade of the scissors 433 to complete the shearing of the tape. The moving cylinder 431 is fixed to the mounting plate 41 and its output end is connected to the moving plate 432 to drive the scissors 433 to approach or move away from the tape. When the pressing rod 4232 is gluing, the scissors 433 are away from the tape. When the pressing rod 4232 moves up to the end position, the scissors 433 approach the tape, and the tape is located between the two blades of the scissors 433. The shearing cylinder 434 is started to enable the scissors to complete the shearing work.

[0053] After the cutting is completed, the tape shrinks due to the action of the tensioning force, so that the tape needs to be pulled out when the tape is pasted next time, which is very troublesome. In order to avoid the shrinkage of the tape, in this embodiment, the compression box 4231 is provided with a suction chamber 4231b, and the suction chamber 4231b is arranged on the back side of the tape in the tape channel 4231a. The suction chamber 4231b is connected to the tape channel 4231a through a plurality of suction holes 4231c to suck the tape when the suction chamber 4231b is under negative pressure. While the cutting work is being performed, the suction chamber 4231b generates negative pressure, and the back side of the tape is sucked through the suction holes 4231c to offset the tensioning force of the tape, until the negative pressure in the suction chamber 4231b disappears after the gluing work starts. It should be noted that the negative pressure chamber 4231b is connected to the negative pressure generating device, that is, the negative pressure in the negative pressure chamber 4231b is generated to the negative pressure generating device.

[0054] A method for automatically applying adhesive tape, using the automatic adhesive tape applying device as described above, comprises the following steps:

[0055] S1. Install the semi-finished chip on the fixture 2;

[0056] S2. The fixture 2 having the semi-finished chip is placed on the conveying mechanism 3;

[0057] S3. The conveying mechanism 3 conveys the fixture 2 provided with the semi-finished chip to the working area of ​​the gluing mechanism 4;

[0058] S4. The adhesive laminating mechanism 4 presses down to fit the adhesive tape to the fixture 2;

[0059] S5. The gluing mechanism 4 moves along the transport direction of the conveying mechanism 3 to perform gluing operation on the pins of the semi-finished chip;

[0060] S6. After the gluing operation is completed, the gluing mechanism 4 moves upward, and then the tape cutting operation is performed.

[0061] In order to avoid that the tape will not be torn off the chip semi-finished product when the pressing roller 4232 moves up to cut after a row of tapes are pasted, in the present embodiment, the gluing mechanism 4 also includes a re-pressing roller 44, which is arranged behind the pressing roller 4232 in the gluing direction, and the re-pressing roller 44 is connected to the mounting plate 41 through a re-pressing cylinder 45 to approach the chip semi-finished product to press the tape again, when the pressing roller 4232 is translated for gluing, the re-pressing roller 44 follows the pressing roller 4232 to translate and press the pasted tape again, and when the re-pressing roller 44 moves to the end position of the chip semi-finished product, the re-pressing roller 44 continues to maintain pressure, the pressing roller 4232 moves upward, and the glue cutting mechanism 43 cuts the tape.

[0062] In some embodiments, a fixture 3 may carry multiple rows of chip semi-finished products. In order to make the present device applicable to the situation of multiple rows of chip semi-finished products, the gluing mechanism 4 can be connected to the frame 1 by sliding along a direction perpendicular to the transport direction of the conveying mechanism 3. In this embodiment, the gluing mechanism 42 is installed on a mobile mechanism similar to a trolley. The mobile mechanism includes an X-axis slide bar and a Y-axis slide bar. The X-axis slide bar is arranged perpendicular to the transport direction of the conveying mechanism 3, and the Y-axis slide bar is arranged parallel to the transport direction of the conveying mechanism 3. The X-axis slide bar is mounted on the frame 1, and the Y-axis slide bar can be connected to the X-axis slide bar by sliding along the extension direction of the X-axis slide bar, and the gluing mechanism 42 can be connected to the Y-axis slide bar by sliding along the extension direction of the Y-axis slide bar.

[0063] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An automatic tape sticking device for sticking tape on the pin feet of a semi-finished chip, characterized by: The invention comprises a frame (1), a fixture (2) for carrying a chip semi-finished product, a conveying mechanism (3) for intermittently conveying the fixture (2), and a gluing mechanism (4) for gluing the pins of the chip semi-finished product; the conveying mechanisms (3) are installed on the frame (1) in parallel with each other, and the gluing mechanism (4) is connected to the frame (1) and can be moved along the transport direction of the conveying mechanism (3) and is located above the conveying mechanism (3); The conveying mechanism (3) comprises a pair of belt pulley conveying devices with the same speed, the clamp (2) is simultaneously connected to the pair of belt pulley conveying devices, and at least one of the pair of belt pulley conveying devices is movably mounted on the frame (1) to adjust the distance between the two belt pulley conveying devices; The glue sticking mechanism (4) comprises a mounting plate (41), a glue applying mechanism (42) and a glue cutting mechanism (43); The mounting plate (41) is fixed to the frame (1); The gluing mechanism (42) comprises a tape installation disk (421) for placing the tape and a pasting mechanism (423) for pasting the tape; the tape installation disk (421) is installed on the installation plate (41); the pasting mechanism (423) comprises a pressing box (4231), a pressing roller (4232) and a pressing cylinder (4233); the pressing box (4231) is provided with a tape channel (4231a); the feed inlet end of the tape channel (4231a) of the pressing box (4231) is hinged to the installation plate (41); the pressing roller (4232) is provided at the discharge outlet end of the pressing box (4231) to allow the tape to be pasted on the chip semi-finished product; the pressing cylinder (4233) is hinged to the installation plate (41) and its output end is hinged to the pressing box (4231) to drive the pressing roller (4232) to move upward or downward; The rubber cutting mechanism (43) comprises a moving cylinder (431), a moving plate (432), a pair of scissors (433) and a shearing cylinder (434); the scissors (433) are perpendicular to the mounting plate (41) and are directly opposite to the tape at the end position of the upward movement of the pressing roller (4232); one blade of the scissors (433) is fixed to the moving plate (432); the shearing cylinder (434) is fixed to the moving plate (432) and its output end is used to press against the other blade of the scissors (433) to complete the shearing of the tape; the moving cylinder (431) is fixed to the mounting plate (41) and its output end is connected to the moving plate (432) to drive the scissors (433) to move closer to or away from the tape; The compression box (4231) is provided with a suction chamber (4231b), and the suction chamber (4231b) is arranged on the back side of the tape of the tape channel (4231a). The suction chamber (4231b) is connected to the tape channel (4231a) through a plurality of suction holes (4231c) to suck the tape when the suction chamber (4231b) is under negative pressure. The glue laminating mechanism (4) further comprises a re-pressing roller (44), which is arranged behind the pressing roller (4232) in the glue laminating direction. The re-pressing roller (44) is connected to the mounting plate (41) via a re-pressing cylinder (45) to approach the chip semi-finished product to press the tape again.

2. The automatic tape applying device according to claim 1, characterized in that: The conveying mechanism (3) is provided with a clamping mechanism (5) for preventing the clamp (2) from moving, the clamping mechanism (5) comprising a pair of clamping blocks (51), at least one of the pair of clamping blocks (51) being movably connected to a conveying mechanism (3) to achieve the movement of the pair of clamping blocks (51) towards or away from each other to clamp or release the clamp (2).

3. The automatic tape applying device according to claim 2, characterized in that: The invention also comprises a material blocking mechanism (6), wherein the material blocking mechanism (6) is arranged in the middle of the conveying mechanism (3), and the material blocking mechanism (6) comprises a material blocking block (61) and a material blocking cylinder (62). The material blocking block (61) is arranged on the frame (1) and can be moved in a vertical direction to block or release the clamp (2); the material blocking cylinder (62) is installed on the frame (1); the material blocking block (61) is connected to the output end of the material blocking cylinder (62) and is connected to the material blocking block (61) to drive the material blocking block (61) to move.

4. The automatic tape applying device according to claim 3, characterized in that: The material blocking block (61) is provided with a sensor (63) for detecting the position of the clamp (2); the sensor (63) is electrically connected to the clamping mechanism (5) for controlling the clamping or loosening of the clamping mechanism (5).

5. The automatic tape applying device according to claim 1, characterized in that: The gluing mechanism (4) can be slidably connected to the frame (1) in a direction perpendicular to the transport direction of the conveying mechanism (3).

6. A method for automatically applying adhesive tape, characterized in that: The automatic tape applying device according to any one of claims 1 to 5 comprises the following steps: S1. Installing the semi-finished chip on the fixture (2); S2. placing the fixture (2) provided with the semi-finished chip on the conveying mechanism (3); S3. The conveying mechanism (3) conveys the fixture (2) provided with the semi-finished chip to the working area of ​​the gluing mechanism (4); S4. The adhesive bonding mechanism (4) is pressed down to bond the adhesive tape to the fixture (2); S5. The gluing mechanism (4) moves along the transport direction of the conveying mechanism (3) to perform gluing operation on the pins of the semi-finished chip; S6. After the gluing operation is completed, the gluing mechanism (4) moves upward, and then the tape cutting operation is performed.

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