Electronic equipment, housing components and frames

A technology of electronic equipment and housing assembly, applied in the field of electronic equipment housing structure, can solve the problems of affecting the appearance of electronic equipment, insufficient reserved clearance, increase production cost, etc. The effect of the bonding effect

Active Publication Date: 2021-07-27
OPPO CHONGQING INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the current structure of electronic products such as mobile phones, the middle frame or frame and the display cover are generally bonded and connected by dispensing glue. Glue overflow often occurs due to insufficient clearance between the display screen covers; once the glue overflows, the production line workers need to clean up the overflowing glue, which undoubtedly increases the production cost
If the spilled glue is not cleaned up, it will also affect the overall appearance of the electronic device

Method used

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  • Electronic equipment, housing components and frames
  • Electronic equipment, housing components and frames
  • Electronic equipment, housing components and frames

Examples

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Embodiment Construction

[0024] The present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments. In particular, the following examples are only used to illustrate the present invention, but not to limit the scope of the present invention. Likewise, the following embodiments are only some but not all of the embodiments of the present invention, and all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0025] Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present invention. The occurrences of this phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is understoo...

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PUM

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Abstract

The present application provides an electronic device, a housing assembly and a frame; the frame includes a main body, and the main body is provided with a load-bearing surface and a blocking surface connected to each other, and a plurality of height-limiting platforms on the load-bearing surface, each A glue overflow tank is correspondingly set on the high platform, and the bearing surface and the blocking surface are jointly set up to form a glue containing area, the bearing surface is used to carry glue, and the blocking surface is used to limit the overflow of glue from one side. The overflow tank is used to hold the excess glue applied. The frame structure provided in the embodiment of this application can solve the problem of glue overflow on the one hand and save the amount of glue dispensing by designing a local glue overflow groove structure with an ingenious structure; on the other hand, the glue can be pressed open at the glue overflow groove position Finally, it has a better spreading effect, thereby improving the bonding effect between the frame and the display cover.

Description

technical field [0001] The present invention relates to the technical field of housing structures of electronic equipment, in particular to an electronic equipment, a housing assembly and a frame. Background technique [0002] In the current structure of electronic products such as mobile phones, the middle frame or frame and the display cover are generally bonded and connected by dispensing glue. Glue overflow often occurs due to insufficient clearance between the display screen covers; once the glue overflows, the production line workers need to clean up the overflowing glue, which undoubtedly increases the production cost. If the spilled glue is not cleaned up, it will also affect the overall appearance of the electronic device. Therefore, how to solve the problem of glue overflow has become an important issue in the process of bonding and assembling electronic products. Contents of the invention [0003] The first aspect of the embodiment of the present application p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04M1/18H04M1/02
CPCH04M1/0249H04M1/0266H04M1/18
Inventor 代晓峰邹林胜
Owner OPPO CHONGQING INTELLIGENT TECH CO LTD
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