Laser processing system with power correction function

Abstract

The present invention discloses a laser processing system with a power correction function, which adds a power feedback correction device to the original laser processing system, including an electrically adjustable laser attenuator and a B / S spectroscope sequentially arranged on the optical path between each beam expander at the end of the system and each pair of scanners corresponding thereto, and a photodiode corresponding to each B / S spectroscope for receiving 1% reflected light from the B / S spectroscope, and also includes an industrial computer electrically connected to each photodiode and the electrically adjustable laser attenuator at the same time; the industrial computer is used to detect whether the power of the laser beam emitted by each electrically adjustable laser attenuator is consistent, and record the minimum power value; and adjust the power of the laser beam emitted by it to be consistent with the minimum power through the electrically adjustable laser attenuator. The present invention can ensure the consistency of the processing effect of the laser processing system and improve the processing quality.

Description

Technical Field

[0001] The invention relates to a laser processing system with a power correction function. Background Art

[0002] A laser processing system generally refers to a system that transmits a laser beam emitted from a laser oscillator using a laser beam transmission device, and performs tasks such as drilling, marking, or welding by irradiating the laser beam onto a substrate to be finally processed.

[0003] Conventional laser processing systems often only include a laser oscillator, a beam splitter, two pairs of scanners, and a scanning lens. The laser beam emitted from a single laser oscillator is split into two laser beams, each laser beam having a ratio determined by the beam splitter, and the two separated laser beams pass through different paths to be deflected to the desired positions on the substrate by two pairs of scanners, and finally converged by a single scanning lens and irradiated onto the substrate.

[0004] While the cost of electrical and electronic devices using semiconductors has recently dropped due to the mass production of semiconductors, the unit per hour (UPH) achieved in a single processing system is an important factor in the current field of manufacturing semiconductor processing equipment. However, due to the limitation of UPH caused by dividing a single laser beam into two laser beams, the conventional laser processing system is limited in improving the conventional laser processing system as a single processing system. In addition, the conventional laser processing system also has the problem that its laser beam cannot be separated or used completely according to the user's choice, and has poor flexibility and responsiveness. And when there is a problem in any of the multiple components forming the laser beam transmission device, it will cause the entire conventional laser processing system to fail to work.

[0005] To this end, the applicant has improved the above-mentioned traditional laser processing system and designed an upgraded and improved device, as shown in the authorized invention patent with patent number ZL200810091169.7. The disclosed laser processing system (equipment) is capable of dividing a single laser beam into four or more laser beams and converging each of these laser beams thereon using a single scanning lens. The design core of this patent is actually the selective utilization and separation of the laser beams by the separation device. The multiple laser beams separated from the single laser beam are irradiated on the substrate for processing and thus the consumption time of each substrate processing is reduced, and the UPH can be maximized in a single processing system. In addition, four pairs of scanners and a single scanning lens are combined to correspond to each other to construct a laser processing system, thereby reducing the manufacturing cost of a single laser processing system compared to a traditional laser processing system in which a pair of scanners and a single scanning lens correspond to each other.

[0006] Furthermore, by adjusting the traveling path of the laser beam using the reciprocating motion unit including the beam splitting unit and the beam penetrating unit, the laser processing system can still operate even if any of the components forming the entire laser processing system has a problem, thereby improving the stability of production and reducing additional purchase costs for replacing damaged components.

[0007] As we all know, when the above laser processing systems are used in the industry, they are all equipped with control systems. Such control systems mainly use industrial computers to control the laser processing power. Laser processing control software is usually installed inside the industrial computer, which can set and control various power parameters of the laser processing system, laser motion path, etc., which is a common technology in the industry.

[0008] However, the existing multi-beam laser processing system has the following problems in long-term use:

[0009] The optical path of this type of system is long, and the power consistency will deteriorate due to the loss of optical components in the optical path, thus affecting the consistency of the processing effect. The current control system cannot effectively adjust the power of the above-mentioned multiple laser beams. In this regard, there is currently no better solution except replacing the worn components. Summary of the invention

[0010] The purpose of the present invention is to provide a laser processing system with a power correction function, which can correct the multiple laser beams emitted to the processed substrate to have consistent power and the same as the predetermined power, thereby ensuring the consistency of the processing effect of this type of laser processing system and improving the processing quality.

[0011] The technical solution of the present invention is: a laser processing system with a power correction function, comprising:

[0012] A laser oscillator emitting a laser beam and a separation device group of three or more stages, the number of separation devices in the n-th stage separation device group A=2 n-1 , n is a positive integer; and the separation devices in the next-order separation device group are a pair, and these separation device pairs correspond one-to-one to each separation device in the previous-order separation device group; any separation device in the previous-order separation device group and the corresponding pair of separation devices in the next-order separation device group together constitute a splitting unit group system, and for each splitting unit group system,

[0013] Each separation device of the previous order can selectively separate the laser beam incident thereon so that it travels along at least one path of a pair of paths; one separation device of a pair of separation devices of the next order can selectively separate the laser beam incident along one of the previous pair of paths so that it travels along at least one path of a new pair of paths, and the other separation device of the pair can selectively separate the laser beam incident along the other of the pair of paths so that it also travels along at least one path of the new pair of paths;

[0014] Also included are, B pairs of scanners, the laser beams passing through the respective separation devices in the last order separation device group being incident on the corresponding scanners so that each is deflected to a desired position of the substrate to be processed thereby;

[0015] a single scanning lens on which the laser beam from the above-mentioned B pair scanner is incident so as to be focused on a spot having a predetermined diameter and irradiated on the substrate; and

[0016] B beam expanders, the B beam expanders are arranged at the upstream side of the B pairs of scanners, and are used to adjust the diameter of each laser beam, wherein the four beam expanders correspond to each laser beam, respectively, wherein each pair of the B pairs of scanners includes an X-axis galvanometer scanner for controlling the incident laser beam in the X-axis direction and a Y-axis galvanometer scanner for controlling the incident laser beam in the Y-axis direction; the above B is the number of separation devices in the last-order separation device group;

[0017] It also includes a power feedback correction device, which includes a motorized attenuator and a B / S spectrometer sequentially arranged on the optical path between each beam expander and a pair of scanners corresponding thereto, and a photodiode corresponding to each B / S spectrometer for receiving 1% reflected light from the B / S spectrometer, and also includes an industrial computer electrically connected to each photodiode and the motorized adjustable laser attenuator at the same time; the industrial computer is used to detect whether the power values ​​of the laser beams emitted by each motorized adjustable laser attenuator are consistent, and record the minimum power value; and then adjust the power values ​​of each laser beam emitted by the motorized adjustable laser attenuator to be consistent with the minimum power value through the motorized adjustable laser attenuator.

[0018] Furthermore, the power feedback correction device in the present invention also includes a laser power detector (Power detector) for detecting the actual output power value of the laser beam irradiated onto the substrate, and an automatic power calibrator APC (auto power calibrator) electrically connected to the laser power detector, that is, an automatic power calibrator, and the automatic power calibrator is electrically connected to the industrial computer, and is used to convert the power analog value signal of the laser beam obtained by the laser power detector into a digital signal and transmit it to the industrial computer. When the industrial computer determines that the actual output power value of the laser beam detected by the laser power detector is different from the preset power value, the industrial computer controls each electrically adjustable laser attenuator to adjust the power value of the laser beam emitted by it to be the same as the preset power value.

[0019] Laser power detector, also known as laser power detection probe, can be manually held or fixed by a bracket or mechanical arm to measure the power of the laser beam. For example, the Israeli OPHIR company's series of products include F100A-PF-DIF-18, FL250A-BB-35, L300W-LP, 1000W-LP, 100K-W, etc.

[0020] Automatic power calibrator, referred to as APC (auto power calibrator), is also known as laser power meter, which is a common device in the industry. It can be developed by various companies or purchased directly from the market. It has the functions of displaying power value and digital-to-analog conversion. Its role is to convert the power analog value signal obtained by the laser power detector into a digital signal for transmission to the industrial computer so that it can be recognized by the laser processing control software installed in the industrial computer. For example, the VEGA model product of OPHIR of Israel.

[0021] The motorized adjustable laser attenuator (Motorized Attenuator) in the present invention is a known technology in the industry, which installs a rotatable half-wave plate in the direction of the incident polarized light beam. By rotating the half-wave plate with a shaft driven by a motor, the light intensity ratio of s light and p light can be continuously changed without changing its parameters. In this way, the intensity of the output light beam and the s / p light intensity ratio can be adjusted within a wide range. The power of the laser beam output can be changed by allowing all p light to pass through and almost zero s light, or by allowing the intensity of s light to reach the maximum and the intensity of p light to be almost zero. For example, the LPA-A model product of Optogama Company of Lithuania.

[0022] The industrial computer in the present invention is a commonly used device in the field of laser processing control, such as the IPC-610-H model industrial computer of Advantech. This type of industrial computer can be installed with laser processing control software for setting and controlling various power parameters of the laser processing system, which is well known to technical personnel in this field.

[0023] Furthermore, in the present invention, for the three separation devices in each spectroscopic unit group, at least one is a reciprocating motion unit including a beam separation unit, a beam penetration unit and a transfer device, wherein the beam separation unit reflects a portion of the incident laser beam and allows the remaining portion of the incident laser beam to penetrate, the beam penetration unit allows all of the incident laser beam to penetrate, and the transfer device changes the position of the beam separation unit or the beam penetration unit so that the laser beam is incident on any one of the beam separation unit and the beam penetration unit.

[0024] Furthermore, the beam splitting unit in the present invention is a beam splitter, which reflects 50% of the incident laser beam and allows the remaining 50% of the incident laser beam to penetrate.

[0025] Furthermore, the beam penetration unit in the present invention is a penetrating lens, and the penetrating lens allows more than 99% of the incident laser beam to penetrate.

[0026] Furthermore, the transfer device in the present invention includes a support bracket, a driving source and a power transmission unit, wherein the support bracket supports the beam separation unit and the beam penetration unit and the power transmission unit transmits the driving power of the driving source to the support bracket to move the support bracket back and forth in the left and right directions.

[0027] Furthermore, in the present invention, for the three separation devices in each spectroscopic unit group, at least one is an acousto-optic modulator AOM that emits an incident laser beam after modulating the laser beam using sound waves, and the acousto-optic modulator emits a laser beam by splitting the laser beam into two beams traveling along different paths from each other or by adjusting the amount of light of the incident laser beam so that the laser beam travels along a single path.

[0028] Furthermore, for the three separation devices in each spectroscopic unit group in the present invention, at least one is an electro-optical modulator EOM that emits an incident laser beam after modulating the laser beam using an electric field, and the electro-optical modulator adjusts the light amount of the incident laser beam and emits the laser beam so that the laser beam travels along a single path.

[0029] Furthermore, in the present invention, the laser beam is irradiated on the substrate to perform drilling, marking or welding on the substrate.

[0030] The laser processing system of the present invention can be used for drilling, marking or welding according to actual needs. Relying on the combination of separation devices and the selective function of the separation device itself to separate or transmit the incident light beam, we can separate a single laser beam into 2, 3, or 4 or more beams. With the help of the power feedback correction device, we further improve the working quality of the system.

[0031] The operation process of the power feedback correction device is divided into:

[0032] (1) Power acquisition of the laser beam that is about to enter each pair of scanners

[0033] Before entering the corresponding pair of scanners, the main laser beam emitted from each beam expander first passes through an electrically adjustable laser attenuator, and then is refracted and reflected by a B / S beam splitter. 1% of the reflected light is captured by a photodiode and converted into an electrical signal and input into an industrial computer, which then obtains the corresponding main laser beam power value.

[0034] (2) The power is initially corrected to the minimum value

[0035] The industrial computer determines the power values ​​of each main laser beam by comparison. If they are inconsistent, the power value of the laser beam with the smallest detected power is recorded as the power reference value, and the power reference value is fed back to each electric adjustable laser attenuator, which adjusts the power value of each corresponding main laser beam to be consistent with the power reference value.

[0036] (3) Collect the actual output power of the laser beam irradiated onto the processed substrate

[0037] A laser power detector is used to detect the actual output power value of any laser beam irradiated onto the substrate. The power value is an analog signal, which is transmitted to an automatic power calibrator, converted into a digital signal by the automatic power calibrator and then transmitted to an industrial computer;

[0038] (4) Correct the actual output power of the laser beam irradiated onto the processed substrate to the standard value

[0039] As with the known technology, the industrial computer is installed with laser processing control software for setting and controlling various power parameters of the laser processing system. During actual processing, according to the different requirements of the substrate to be processed, the processor can pre-set a power value required for laser processing (that is, the laser beam output to the substrate) through the industrial computer, which is called the preset power value; the industrial computer determines whether the actual output power value of the laser beam detected by the laser power detector is the same as the preset power value. If not, the industrial computer controls each electrically adjustable laser attenuator to adjust the power value of the laser beam emitted by it to the same as the preset power value.

[0040] The advantages of the present invention are:

[0041] (1) Based on the original laser processing system, the present invention further adds a power feedback correction device, which can correct the power of multiple laser beams emitted to the processed substrate to be consistent and the same as the predetermined power, thereby ensuring the consistency of the processing effect of this type of laser processing system and improving the processing quality.

[0042] (2) The power feedback correction device added in the present invention is highly automated for the correction and execution of laser beam power, which can avoid the loss and inconvenience caused by frequent replacement or substitution of parts in common technologies, and effectively save production costs.

[0043] (3) The power feedback correction device added in the present invention does not make any improvement or interference to the original laser processing system, and can retain the functional advantages and characteristics of the original laser processing system. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] The present invention will be further described below in conjunction with the accompanying drawings and embodiments:

[0045] Figure 1 It is a structural schematic diagram of a specific embodiment of the present invention;

[0046] Figure 2 for Figure 1 A perspective view of four pairs of scanners and a single scanning lens;

[0047] Figure 3 For the incident Figure 2 A schematic diagram of the incident area of ​​each laser beam on a single scanning lens is shown;

[0048] Figure 4 yes Figure 1 A perspective view of a reciprocating unit in an embodiment;

[0049] Figure 5 yes Figure 1 A front view of the reciprocating unit in the embodiment;

[0050] Figure 6 It is a schematic diagram of the execution flow of the power feedback correction device in the present invention. DETAILED DESCRIPTION

[0051] The invention will be described in more detail hereinafter with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown.

[0052] Reference Figure 1As shown, the laser processing system 100 of the present embodiment is configured to converge four laser beams separated from a single laser beam by using a single scanning lens 150. The laser processing system 100 includes a laser oscillator 101, a reciprocating motion unit 120 serving as first, second and third separation means, four pairs of scanners 140, a single scanning lens 150 and an additional power feedback correction device.

[0053] The laser oscillator 101 generates a laser beam as an energy source for the laser processing process. Depending on the type of substrate 2 to be processed or the processing method, the laser oscillator 101 is selected to generate a laser beam having a wavelength selected from various wavelengths and most suitable for the desired processing (e.g., ultraviolet light, visible light, and infrared light).

[0054] The first, second and third splitting devices selectively split the incident laser beam to travel (or propagate) along at least one of a pair of paths. The laser beam emitted from the laser oscillator 101 is incident on the first splitting device to be reflected on and / or pass through the first splitting device.

[0055] In this embodiment, the reciprocating unit 120 is used as each of the first, second and third separation devices and each reciprocating unit 120 includes a beam separation unit 121, a beam penetration unit 122, and a transfer device. The first, second and third separation devices with the reciprocating unit 120 constitute a light splitting unit system.

[0056] The beam splitting unit 121 splits the incident laser beam into two laser beams. Therefore, the beam splitting unit 121 reflects one laser beam to the side where the laser beam is incident, and the other laser beam penetrates to the side opposite to the laser beam incidence. In this embodiment, a beam splitter is used as the beam splitting unit 121, and the beam splitter splits the incident laser beam into two laser beams, each having 50% of the total energy of the incident laser beam. In the beam splitter, a reflective film having a reflectivity of about 50% is coated on one surface where the laser beam is incident, and an antireflection film having a transmittance of about 99.9% is coated on the other surface where the split laser beam passes.

[0057] The beam penetration unit 122 allows the incident laser beam to penetrate to the opposite side on which the laser beam is incident. In this embodiment, a member having a penetration hole formed in the middle is used as the beam penetration unit 122. Meanwhile, a penetration mirror through which more than 99% of the incident laser beam passes may be used as the beam penetration unit 122, and an anti-reflection film having a penetration rate of about 99.9% is coated on both sides of the penetration mirror.

[0058] The transfer device changes the position of the beam splitting unit 121 or the beam penetrating unit 122 so that the laser beam incident on one side of the transmission unit 120 is incident on at least one of the beam splitting unit 121 and the beam penetrating unit 122, and the transfer device includes a supporting bracket 123, a base 127, a driving source and a power transmission unit.

[0059] Combination Figure 4 and Figure 5 As shown, the support bracket 123 supports the beam separation unit 121 and the beam penetration unit 122. The driving source provides energy to move the support bracket back and forth in the left and right directions, and the motor 124 is mainly used as the driving source. The support bracket 123 is configured to move in the right and left directions relative to the base 127, and the motor 124 is fixed to the base 127. The power transmission unit may include a pinion member 125 and a rack member 126. The pinion member 125 is coaxially connected to the rotation shaft of the motor 124 and meshes with the rack member 126 fixed to the support bracket 123. When the motor 124 and the pinion member 125 rotate forward or reversely, the rack member 126 meshed with the pinion member 125 moves linearly in the left and right directions, and the support bracket 123 on which the rack member 126 is fixed moves together with the rack member 126, and therefore, the positions of the beam separation unit 121 and the beam penetration unit 122 can be changed.

[0060] Since the position of the beam splitting unit 121 or the beam penetrating unit 122 can be changed, the travel path of the laser beam can be controlled, that is, when the beam splitting unit 121 is located on the travel path of the laser beam, part of the incident laser beam is reflected from the incident surface of the beam splitting unit 121 to the side where the laser beam is incident, and the remaining laser beam is penetrated to the opposite side where the laser beam is incident. At the same time, when the beam penetrating unit 122 is located on the travel path of the laser beam, the entire incident laser beam is penetrated to the opposite side where the laser beam is incident.

[0061] The laser beam passing through the reciprocating unit 120 and reflected from the reflector 102 is incident on the beam expander 130. If the diameter of the laser beam is adjusted using the beam expander 130, the focusing distance on which the laser beam is focused and the size of the focused spot can be changed through the scanning lens 150, and thus various processing methods and types of the substrate 2 can be used. The beam expander 130 is arranged on the upstream side of the four pairs of scanners 140. There are four beam expanders 130 corresponding to the four laser beams, respectively.

[0062] Combination Figure 2 and Figure 3As shown, four pairs of scanners 140 deflect the incident laser beam to the desired position on the substrate 2 and generally include an X-axis galvanometer scanner for controlling the incident laser beam in the direction of the X-axis, and a Y-axis galvanometer scanner for controlling the incident laser beam in the direction of the Y-axis. Each pair of scanners 140 means a pair of scanners including an X-axis galvanometer scanner and a Y-axis galvanometer scanner. In this embodiment, there are four pairs of scanners 140 corresponding to the four laser beams, respectively.

[0063] Still combined Figure 2 and Figure 3 As shown, a single scanning lens 150 converges the laser beams incident on the four pairs of scanners 140 to a light spot having a predetermined diameter and irradiates the converged laser beams on the substrate 2 to be processed. In this embodiment, four laser beams are incident on an incident surface 151 of a single scanning lens 150. Figure 3 As shown in FIG. 1 , each of the laser beams passing through the four pairs of scanners 140 is incident on one side of a single scanning lens 150 to respectively form one of the incident areas 103 on an incident surface 151 of the scanning lens 150. Generally, an f-θ lens may mainly function as the scanning lens 150.

[0064] The added power feedback correction device is the focus of improvement in this case, which is composed of four electrically adjustable laser attenuators 170, four photodiodes 180, four B / S spectrometers 190, an industrial computer 201, an automatic power calibrator 202 and a single laser power detector 203.

[0065] In this embodiment, four electrically adjustable laser attenuators 170 are respectively provided corresponding to the four beam expanders 130 and the four pairs of scanners 140. An electrically adjustable laser attenuator 170 and a B / S beam splitter 190 are sequentially arranged on the optical path between the reflector 120 at the output end of each beam expander 130 and the corresponding pair of scanners 140, and a photodiode 180 is provided corresponding to each B / S beam splitter 190 for receiving 1% reflected light of the B / S beam splitter 190.

[0066] The industrial computer 201 is electrically connected to each photodiode 180 and the electrically adjustable laser attenuator 170 at the same time; the industrial computer 201 is used to detect whether the power values ​​of the laser beams emitted by each electrically adjustable laser attenuator 170 are consistent, and record the minimum power value; and then adjust the power values ​​of each laser beam emitted by the electrically adjustable laser attenuator 170 to be consistent with the minimum power value.

[0067] The laser power detector 203 is used to detect the actual output power value of the laser beam irradiated onto the substrate 2. The automatic power calibrator 202 is electrically connected to the laser power detector 203 and is also electrically connected to the industrial computer 201. The automatic power calibrator 202 is used to convert the power analog value signal of the laser beam detected by the laser power detector 203 into a digital signal and transmit it to the industrial computer 201. When the industrial computer 201 determines that the actual output power value of the laser beam detected by the laser power detector 203 is different from the preset power value, the industrial computer 201 controls each electrically adjustable laser attenuator 170 to adjust the power value of the laser beam emitted by it to be the same as the preset power value.

[0068] The following will refer to Figure 1-5 The traveling path of the laser beam in the laser processing system 100 according to the embodiment of the present invention is described. First, the case where the reciprocating unit 120 is adjusted so that the beam splitting unit 121 is located on the traveling path of the laser beam is described.

[0069] The laser beam emitted from the laser oscillator 101 is incident on one side of the beam splitting unit 121 of the reciprocating unit 120 and the single laser beam is split into two laser beams by the beam splitting unit 121. The laser beam reflected by the beam splitting unit 121 travels along a first path 161a on the laser incident side, while the laser beam passing through the beam splitting unit 121 travels along a first path 161b on the opposite side to the laser beam incident.

[0070] The laser beam traveling along the first path 161a on the laser incident side is incident again on one side of the beam splitting unit 121 of the reciprocating unit 120, the laser beam reflected by the beam splitting unit 121 travels along the second path 162a on the laser incident side, and the laser beam passing through the beam splitting unit 121 travels along the second path 162b on the opposite side of the laser beam incidence.

[0071] The laser beam traveling along the first path 161b on the opposite side of the laser beam incidence is also incident on one side of the beam splitting unit 121 of the reciprocating unit 120, the laser beam reflected by the beam splitting unit 121 travels along the third path 163a on the laser incidence side, and the laser beam passing through the beam splitting unit 121 travels along the third path 163b on the opposite side of the laser beam incidence.

[0072] As such, the paths of the four laser beams are adjusted by the reflection mirrors 102 so as to be incident on the four pairs of scanners 140 , and the four laser beams passing through the four pairs of scanners 140 are incident on the single scanning lens 150 so as to be irradiated on the substrate 2 .

[0073] Meanwhile, according to a combination of various situations, for example, any one of the three reciprocating units 120 positions the beam separation unit 121 on the laser beam travel path and the other two of the three reciprocating units 120 position the beam penetration unit 122 on the laser beam travel path, a single laser beam can be separated into four or three or two to complete the processing process or a single laser beam can be used by itself (as it is as) to complete the processing process.

[0074] The laser processing system according to the embodiment of the present invention is configured to irradiate four laser beams separated from a single laser beam on a substrate for processing and thus the consumption time for processing each substrate can be reduced and the UPH achieved in a single processing system can be maximized. In addition, four pairs of scanners and a single scanning lens are combined to correspond to each other to construct a laser processing system, thereby reducing the manufacturing cost of a single laser processing system compared to a conventional laser processing system in which a pair of scanners and a single scanning lens are configured to correspond to each other.

[0075] Furthermore, since the laser processing system according to the embodiment of the present invention can adjust the traveling path of the laser beam using the reciprocating motion unit including the beam splitting unit and the beam penetrating unit, the laser processing system can still operate even if any of the components forming the entire laser processing system has a problem, thereby improving the stability of production and reducing additional purchase costs for replacing damaged components.

[0076] Combination Figure 1 and Figure 6 As shown, the operation process of the power feedback correction device is divided into:

[0077] (1) Power acquisition of the laser beam about to enter each pair of scanners 140

[0078] Before entering the corresponding pair of scanners 140, the main laser beam emitted by each beam expander 130 first passes through the electrically adjustable laser attenuator 170, and then is refracted and reflected by the B / S beam splitter 190, and travels along the reflection path 164a and the refraction path 164b respectively. The reflected light that travels along the reflection path 164a accounts for only 1% of the power of the main laser beam, which is captured by the photodiode 180 and converted into an electrical signal and input into the industrial computer 201, and the corresponding main laser beam power value is obtained by internal calculation of the industrial computer 201.

[0079] (2) The power is initially corrected to the minimum value

[0080] The industrial computer 201 determines the power values ​​of each main laser beam by comparison. If they are inconsistent, the power value of the laser beam with the smallest detected power is recorded as the power reference value, and the power reference value is fed back to each electrically adjustable laser attenuator 170, which adjusts the power value of each main laser beam to be consistent with the power reference value.

[0081] (3) Collecting the actual output power of the laser beam irradiated onto the processed substrate 2

[0082] The laser power detector 203 is used to detect the actual output power value of any laser beam irradiated onto the substrate 2. The power value is an analog signal, which is transmitted to the automatic power calibrator 202, converted into a digital signal by the automatic power calibrator 202 and then transmitted to the industrial computer 201;

[0083] (4) Correct the actual output power of the laser beam irradiated onto the processed substrate to the standard value

[0084] As in the known technology, the industrial computer is installed with laser processing control software for setting and controlling various power parameters of the laser processing system. During actual processing, according to the different requirements of the substrate 2 to be processed, the processor can pre-set a power value required for laser processing (that is, the laser beam output to the substrate 2) through the industrial computer 201, which is called the preset power value; the industrial computer 201 determines whether the actual output power value of the laser beam detected by the laser power detector 203 is the same as the preset power value. If not, the industrial computer 201 controls each electrically adjustable laser attenuator 170 to adjust the power value of the laser beam emitted by it to the same as the preset power value.

[0085] Of course, the above embodiments are only for illustrating the technical concept and features of the present invention, and their purpose is to enable people familiar with the technology to understand the content of the present invention and implement it accordingly, and they cannot be used to limit the protection scope of the present invention. Any modifications made according to the spirit of the main technical solution of the present invention should be included in the protection scope of the present invention.

Claims

1. A laser processing system with power correction function, comprising: A laser oscillator emitting a laser beam and a separation device group of three or more stages, the number of separation devices in the n-th stage separation device group A=2 n-1 , n is a positive integer; and the separation devices in the next-order separation device group are a pair, and these separation device pairs correspond one-to-one to each separation device in the previous-order separation device group; any separation device in the previous-order separation device group and the corresponding pair of separation devices in the next-order separation device group together constitute a splitting unit group system, and for each splitting unit group system, Each separation device of the previous order can selectively separate the laser beam incident thereon so that it travels along at least one path of a pair of paths; one separation device of a pair of separation devices of the next order can selectively separate the laser beam incident along one of the previous pair of paths so that it travels along at least one path of a new pair of paths, and the other separation device of the pair can selectively separate the laser beam incident along the other of the pair of paths so that it also travels along at least one path of the new pair of paths; Also included are, B pairs of scanners, the laser beams passing through the respective separation devices in the last order separation device group being incident on the corresponding scanners so that each is deflected to a desired position of the substrate to be processed thereby; a single scanning lens on which the laser beam from the above-mentioned B pair scanner is incident so as to be focused on a spot having a predetermined diameter and irradiated on the substrate; and B beam expanders, the B beam expanders are arranged at the upstream side of the B pairs of scanners, and are used to adjust the diameter of each laser beam, wherein four of the beam expanders correspond to each of the laser beams, wherein each pair of the B pairs of scanners includes an X-axis galvanometer scanner for controlling the incident laser beam in the X-axis direction and a Y-axis galvanometer scanner for controlling the incident laser beam in the Y-axis direction; the above B is the number of separation devices in the last-order separation device group; It also includes a power feedback correction device, which includes an electrically adjustable laser attenuator and a B / S spectrometer sequentially arranged on the optical path between each beam expander and a pair of scanners corresponding thereto, and a photodiode corresponding to each B / S spectrometer for receiving 1% reflected light from the B / S spectrometer, and also includes an industrial computer electrically connected to each photodiode and the electrically adjustable laser attenuator at the same time; the industrial computer is used to detect whether the power values ​​of the laser beams emitted by each electrically adjustable laser attenuator are consistent, and record the minimum power value, and then adjust the power values ​​of each laser beam emitted by it to be consistent with the minimum power value through the electrically adjustable laser attenuator.

2. The laser processing system with power correction function according to claim 1, characterized in that The power feedback correction device also includes a laser power detector for detecting the actual output power value of the laser beam irradiated onto the substrate, and an automatic power calibrator electrically connected to the laser power detector, and the automatic power calibrator is electrically connected to the industrial computer and is used to convert the power analog value signal of the laser beam detected by the laser power detector into a digital signal and transmit it to the industrial computer. When the industrial computer determines that the actual output power value of the laser beam detected by the laser power detector is different from the preset power value, the industrial computer controls each electrically adjustable laser attenuator to adjust the power value of the laser beam emitted by it to be the same as the preset power value.

3. The laser processing system with power correction function according to claim 1, characterized in that For the three separation devices in each spectroscopic unit group, at least one is a reciprocating unit including a beam separation unit, a beam penetration unit and a transfer device, wherein the beam separation unit reflects a portion of the incident laser beam and allows the remaining portion of the incident laser beam to penetrate, the beam penetration unit allows all of the incident laser beam to penetrate, and the transfer device changes the position of the beam separation unit or the beam penetration unit so that the laser beam is incident on either the beam separation unit or the beam penetration unit.

4. The laser processing system with power correction function according to claim 3, characterized in that The beam splitting unit is a beam splitter that reflects 50% of an incident laser beam and allows the remaining 50% of the incident laser beam to pass through.

5. The laser processing system with power correction function according to claim 3, characterized in that The beam penetration unit is a penetration lens that allows more than 99% of the incident laser beam to penetrate.

6. The laser processing system with power correction function according to claim 3, characterized in that The transfer device includes a support bracket, a driving source, and a power transmission unit. The support bracket supports the beam separation unit and the beam penetration unit and the power transmission unit transmits driving power of the driving source to the support bracket to move the support bracket back and forth in the left and right directions.

7. The laser processing system with power correction function according to claim 1, characterized in that For the three separation devices in each optical splitting unit group, at least one is an acousto-optic modulator AOM that emits an incident laser beam after modulating the laser beam using sound waves, and the acousto-optic modulator emits a laser beam by splitting the laser beam into two beams that travel along different paths from each other or by adjusting the light amount of the incident laser beam so that the laser beam travels along a single path.

8. The laser processing system with power correction function according to claim 1, characterized in that For the three separation devices in each splitting unit group, at least one is an electro-optical modulator EOM that emits an incident laser beam after modulating the laser beam using an electric field, and the electro-optical modulator adjusts the light amount of the incident laser beam and emits the laser beam so that the laser beam travels along a single path.

9. The laser processing system with power correction function according to claim 1, characterized in that The laser beam is irradiated on the substrate to perform drilling, marking or welding on the substrate.

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