Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Principal component analysis method and Q clustering analysis-based valuation model for enterprise to be listed on Sci-Tech innovation board

A technique of principal component analysis and cluster analysis, applied in character and pattern recognition, instrumentation, finance, etc.

Inactive Publication Date: 2020-07-10
CHANGZHOU INST OF TECH
View PDF8 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In view of the fact that the service objects of the science and technology innovation board market and the registration system implemented have higher requirements for the issuance, trading and delisting of stocks and other related systems, there may be many risks in the science and technology innovation board market

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Principal component analysis method and Q clustering analysis-based valuation model for enterprise to be listed on Sci-Tech innovation board
  • Principal component analysis method and Q clustering analysis-based valuation model for enterprise to be listed on Sci-Tech innovation board
  • Principal component analysis method and Q clustering analysis-based valuation model for enterprise to be listed on Sci-Tech innovation board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0160] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0161] Using the valuation model of companies to be listed on the Science and Technology Innovation Board based on principal component analysis and Q-cluster analysis, we can get:

[0162] 1. Select the price-to-sales ratio of China's A-share market and the US NASDAQ market in 2018 as the evaluation standard, use the weighted average method to compare and analyze the price-to-sales ratio of the two stock markets, and obtain the valuation premium or discount level of the two markets .

[0163] 2. The annual average of each indicator is used to represent the fundamental indicators and liquidity indicators of the two markets. Standardize the obtained data, establish a principal component analysis model, and compare the differences between China's A-share market and the US NASDAQ market.

[0164] 3. Establish a forecasting model to obtain the f...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a principal component analysis method and Q clustering analysis-based valuation model for an enterprise to be listed on the Sci-Tech innovation board. Reasonable hypothesis andsymbol description are provided for problem modeling; the market sales rates of the Chinese stock market A and the American NASDAQ market in 2018 are selected as evaluation standards, and the marketsales rates of the stock markets of two countries are compared and analyzed by using a weighted average method. An estimated value premium or discount level of the two markets is obtained. The obtained data is standardized, a principal component analysis model is established. The difference between the Chinese stock A and the American NASDAQ market is determined through comparison. The predicted values of various indexes are obtained by using an MATLAB program. An estimation index relational expression is obtained, and an estimation index is solved by using an undetermined coefficient method.According to the method, the estimated value levels of the first batch of enterprises listed on the Sci-Tech innovation board in China after is predicted.

Description

technical field [0001] The invention belongs to a model for estimating companies to be listed on the Science and Technology Innovation Board, specifically a valuation model for companies to be listed on the Science and Technology Innovation Board based on principal component analysis and Q cluster analysis. Background technique [0002] The Science and Technology Innovation Board was announced at the opening ceremony of the first China International Import Expo on November 5, 2018. It is a new board independent of the existing main board market. The establishment of the science and technology innovation board and the pilot registration system are a major capital market reform measure to improve the ability to serve technological innovation enterprises, enhance market inclusiveness, and strengthen market functions. my country's version of Nasdaq (NASDAQ). [0003] How to value the companies on the Science and Technology Innovation Board is very important to investors. The po...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06Q40/04G06K9/62
CPCG06Q40/04G06F18/2321G06F18/2135
Inventor 文传军夏红卫卢杰舒继增裴昌富
Owner CHANGZHOU INST OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com