Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

An intelligent dispensing equipment for semiconductor products

A semiconductor and dispensing technology, which is applied in the manufacture of semiconductor/solid-state devices, devices for applying liquid to the surface, coatings, etc., to achieve the effects of simple structure, improved dispensing accuracy and assembly quality, and good market application value.

Active Publication Date: 2021-07-23
深圳中科精工科技有限公司
View PDF17 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In view of the deficiencies in the prior art, the purpose of the present invention is to provide an intelligent dispensing device for semiconductor products to solve the problem of precise positioning of the dispensing machine

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • An intelligent dispensing equipment for semiconductor products
  • An intelligent dispensing equipment for semiconductor products
  • An intelligent dispensing equipment for semiconductor products

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] In order to facilitate the understanding of the present invention, the present invention will be described in more detail below in conjunction with the accompanying drawings and specific embodiments. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described in this specification. On the contrary, these embodiments are provided to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0027] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical", "horizontal", "left", "right", "f...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to an intelligent dispensing device for semiconductor products, comprising a base plate, on which a vertical main frame plate is arranged, a mounting plate is arranged on the left side of the top of the main frame plate, a Y-axis assembly is arranged on the mounting plate, and a Y-axis assembly is installed on the Y-axis assembly Set the X-axis assembly, set the visual dispensing mechanism on the X-axis assembly, set the rotation adjustment mechanism on the front wall of the main frame plate, and set the feeding mechanism below the corresponding rotation adjustment mechanism on the bottom plate; the present invention sets the Z axis and the X axis , Y-axis separation, and the visual dispensing mechanism is set above the Z-axis, which greatly saves space. By setting the rotation adjustment mechanism, the workpiece can be rotated along the X-axis direction, and the three-dimensional positioning of the workpiece in the X-axis direction is realized. Through The fine-tuning mechanism is set to realize the three-dimensional positioning of the workpiece in the Y-axis direction, achieve the effect of precise positioning and dispensing, and greatly improve the precision of dispensing and assembly quality of parts, which has good market application value.

Description

technical field [0001] The invention relates to the field of dispensing equipment, in particular to an intelligent dispensing equipment for semiconductor products. Background technique [0002] In the production process of some semiconductor products, in the existing semiconductor device manufacturing process, semiconductor devices such as circuit boards and semiconductor chips usually need to be dispensed. In this process, hot melt adhesive is dripped or coated on the product. On the other hand, the other components and the product can be firmly pasted together by hot melt adhesive. Many existing dispensing machines have the problem of large positioning errors. Some products may be scrapped due to the wrong dispensing position. Based on the above defects And deficiencies, it is necessary to improve the existing dispenser. Contents of the invention [0003] In view of the deficiencies in the prior art, the purpose of the present invention is to provide an intelligent disp...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): B05C5/02B05C9/12B05C13/02B05D3/06H01L21/67H01L21/68
CPCB05C5/0208B05C9/12B05C13/02B05D3/067H01L21/6715H01L21/68
Inventor 易佳朋刘建辉谢国荣王华茂黄辉
Owner 深圳中科精工科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products