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Electronic device

A technology for electronic devices and shafts, applied in electrical digital data processing, instruments, structural components of portable computers, etc., can solve the problems of aggravating the degree of shaking, large assembly skew, contrary to the design trend, etc., to reduce the degree of shaking, reduce The effect of overall thickness

Inactive Publication Date: 2021-06-29
COMPAL ELECTRONICS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the bracket (bracket) has a certain thickness, so the bracket arranged between the hinge assembly and the body will increase the overall thickness of the notebook computer, which is contrary to the current design trend of thinner notebook computers.
Moreover, if a bracket is provided between the hinge assembly and the body as described above, a large amount of assembly skew will be accumulated due to the increase in the number of components
In addition, under the above-mentioned design method, the force borne by the body is transmitted to the rotating shaft through the bracket, and the length of the moment arm between the force-bearing point of the body and the rotating shaft increases due to the setting of the bracket, which will aggravate the force of the body when it is stressed. degree of shaking
If the rigidity of the bracket is not enough, it will cause the body to shake more when it is under force

Method used

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Embodiment Construction

[0029] Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used in the drawings and description to refer to the same or like parts.

[0030] figure 1 It is a perspective view of an electronic device according to an embodiment of the present invention. figure 2 yes figure 1 exploded view of the electronic device. image 3 show figure 1 The electronic device unfolds. Please refer to Figure 1 to Figure 3 , the electronic device 100 of this embodiment is, for example, a notebook computer, which includes at least one hinge assembly 110 (two are shown) and two bodies 120 . The two bodies 120 are pivotally connected to each other through the two hinge components 110, and can be turned over relative to each other. figure 1 The shown closed state (the deployment angle of two bodies 120 is 0 degree) and image 3 Between t...

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Abstract

An electronic device includes at least one hinge assembly and two bodies. The hinge assembly includes a main body and two shafts. One end of each of the shafts is pivotally connected to the main body, another end of each of the shafts has an embedded portion, and the embedded portion has a roughened structure thereon. The two bodies correspond to the two shafts respectively, each of the bodies has at least one depression, and the embedded portion of each of the shafts is embedded in the depression of the corresponding body and contacts an inner wall of the depression through the roughened structure. According to the electronic device, a bracket does not need to be arranged between the shafts and the bodies.

Description

technical field [0001] The invention relates to an electronic device, in particular to an electronic device including a hinge component. Background technique [0002] The notebook computer includes two bodies that can be opened and closed relative to each other, which are pivotally connected to each other through a hinge component, and the rotating shaft of the hinge component is generally indirectly connected to the body through a bracket. However, the bracket has a certain thickness, so the bracket disposed between the hinge assembly and the body will increase the overall thickness of the notebook computer, which is contrary to the current design trend of thinner notebook computers. Moreover, if the bracket is provided between the hinge assembly and the machine body as mentioned above, a large amount of assembly distortion will be accumulated due to the increase in the number of components. In addition, under the above-mentioned design method, the force borne by the body ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F16C11/04G06F1/16
CPCF16C11/04G06F1/1681G06F1/1616G06F1/1683
Inventor 林哲贤吕科延
Owner COMPAL ELECTRONICS INC