Preparation method of LED display module

A technology for display modules and light panels, which is applied to identify devices, instruments, etc., and can solve problems such as the air cannot be exhausted and the display effect is affected

Pending Publication Date: 2021-12-07
LEYARD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The main purpose of the present invention is to provide a method for preparing an LED display module to solve the problem in

Method used

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  • Preparation method of LED display module
  • Preparation method of LED display module
  • Preparation method of LED display module

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Embodiment Construction

[0023] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0024] It should be noted that the terminology used here is only for describing specific implementations, and is not intended to limit the exemplary implementations according to the present application. As used herein, unless the context clearly dictates otherwise, the singular is intended to include...

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Abstract

The invention provides a preparation method of an LED display module, which comprises the following steps: S10, a first enclosure is processed on the periphery of the front surface of a lamp panel so as to form an accommodating pool on the front surface of the lamp panel; S30, the containing pool is filled with glue, and the lamp panel filled with the glue is subjected to vacuum defoaming treatment; S40, the defoamed lamp panel is subjected to first-time curing treatment; S50, the first enclosure is removed, the lamp panel with the first enclosure removed is placed in a containing appliance, so that the front face of the lamp panel with the first enclosure removed faces the bottom of the containing appliance, and lamp beads on the lamp panel with the first enclosure removed are immersed in the defoaming glue in the containing appliance; and S60, acting force facing the bottom of the containing appliance is applied to the back face of the lamp panel with the first enclosure removed, so that the front face of the lamp panel is immersed in the defoaming glue. According to the technical scheme, the problem that the display effect is affected due to the fact that air existing in lamp seams of lamp beads cannot be exhausted in the prior art is effectively solved.

Description

technical field [0001] The invention relates to the technical field of LED display, in particular to a method for preparing an LED display module. Background technique [0002] With the development of LED display technology, the application of LED display screens is becoming more and more extensive, the pitch of LED pixels is getting smaller and smaller, and the size of LED devices used is getting smaller and smaller. Correspondingly, the anti-collision, Anti-corrosion, moisture-proof and anti-static capabilities are getting stronger and stronger. [0003] The related art provides a LED module packaging method, in which a circuit board equipped with LED lamp beads, a solid light-transmitting adhesive layer, and a light-transmitting film are sequentially stacked and placed, wherein the side of the circuit board equipped with LED lamp beads faces the transparent The optical layer is the laminated circuit board and light-transmitting adhesive layer under a preset temperature e...

Claims

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Application Information

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IPC IPC(8): G09F9/33
CPCG09F9/33H01L25/0753H01L33/0095H01L25/13H01L2933/005H01L33/52H01L33/005
Inventor 郑伟王孟强马莉
Owner LEYARD
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