Temperature-controllable laser

Abstract

The invention relates to a temperature-controllable laser, which comprises a laser and a temperature adjusting mechanism coated outside the laser, and is characterized in that the temperature adjusting mechanism comprises a packaging shell, a heat dissipation fin plate, an aluminum-based silicon carbide heat dissipation plate, a positioning ring and a driving circuit, the packaging shell is coated outside the laser, and the packaging shell and the laser are coaxially distributed; a plurality of aluminum-based silicon carbide heat dissipation plates are arranged on the inner side face of the packaging shell, a plurality of heat dissipation fin plates are arranged on the outer side face of the packaging shell, the upper end faces of the aluminum-based silicon carbide heat dissipation plates are connected with the inner side face of the packaging shell, and the lower end faces of the aluminum-based silicon carbide heat dissipation plates are connected with at least three positioning rings evenly distributed along the axis of the packaging shell. And the driving circuit is connected with the outer side surface of the packaging shell. On one hand, the structure of the temperature adjusting equipment is effectively simplified, and the modularization and integration degree of the temperature adjusting equipment is improved; and on the other hand, temperature regulation response is sensitive, heat exchange efficiency is high, and the purpose of stabilizing operation performance of laser equipment is achieved.

Description

Technical Field

[0001] The invention belongs to laser equipment technology, and in particular relates to a temperature-controllable laser and a cooling method thereof. Background Art

[0002] When the laser is in operation, especially when the high-power laser is in operation, the temperature environment has a huge impact on the operating performance of the laser, especially for high-power lasers. For example, a large amount of waste heat will be generated when the laser is in operation, which will cause the laser equipment to accelerate aging or even damage due to high temperature. When the ambient temperature during the operation of the laser is low, it will cause the laser to require a long period of preheating or the laser will not be able to operate at full power. To address this problem, laser equipment is currently equipped with a variety of temperature control devices, such as "A temperature-controllable laser transmitter" with patent application number "2023101449021" and "Packaging of quantum cascade lasers with thermoelectric coolers" with patent application number "2012102952382". However, during operation, the temperature control system used by the current laser has a low heat exchange capacity on the one hand, which cannot effectively meet the needs of temperature regulation of the laser operating environment; on the other hand, the temperature control equipment has a complex structure, which leads to defects such as difficulty and high cost in equipment operation management and equipment maintenance.

[0003] Based on the above problems, after researching and improving the existing problems, a temperature-controllable laser is provided, aiming to solve some existing equipment problems through this device. Summary of the invention

[0004] In order to solve the deficiencies in the prior art, the present invention provides a temperature-controllable laser.

[0005] In order to achieve the above object, the present invention is implemented through the following technical solutions:

[0006] A temperature-controllable laser comprises a laser and a temperature regulating mechanism wrapped around the laser. The temperature regulating mechanism comprises a packaging shell, a heat dissipation fin, an aluminum-based silicon carbide heat dissipation plate, a positioning ring, a temperature sensor, and a driving circuit. The packaging shell is a cavity structure with a rectangular axial cross section, which is wrapped around the laser and coaxially distributed with the laser. A plurality of aluminum-based silicon carbide heat dissipation plates are arranged on the inner side of the packaging shell, and a plurality of heat dissipation fins are arranged on the outer side. The heat dissipation fins and the aluminum-based silicon carbide heat dissipation plates are uniformly distributed around the axis of the packaging shell, and the plate surfaces are parallel to the axis of the packaging shell. The upper end surface of the aluminum-based silicon carbide heat dissipation plate is connected to the inner side surface of the packaging shell and is vertically distributed, and the lower end surface is connected to at least three positioning rings uniformly distributed along the axis of the packaging shell. The positioning ring is an annular structure coaxially distributed with the packaging shell, which is wrapped around the laser and slidably connected to the outer surface of the laser. The number of temperature sensors is consistent with the number of positioning rings. A temperature sensor is arranged on the side surface of each positioning ring. The driving circuit is connected to the outer side surface of the packaging shell and is electrically connected to the packaging shell and each temperature sensor.

[0007] Further, the encapsulation housing includes a thermal insulation outer shell, a heat exchange inner lining, a semiconductor refrigeration mechanism, a blower, an air vortex tube, a buffer tank, a booster pump, and a multi-way valve. The thermal insulation outer shell is a columnar cavity structure with a rectangular axial cross-section. Its inner side is connected to the heat exchange inner lining, and a heat exchange cavity with a width of not less than 10 mm is formed between the thermal insulation outer shell and the heat exchange inner lining. At least two diversion openings are provided at the front and rear end faces of the thermal insulation outer shell corresponding to the heat exchange cavity, and a control valve is provided at each diversion opening. The lower end face of the heat dissipation fin is connected to the thermal insulation outer shell, and its lower end face is located in the heat exchange cavity. The upper end face of the aluminum matrix silicon carbide heat dissipation plate is connected to the heat exchange inner lining, and its upper end face is located in the heat exchange cavity. The heights of the heat dissipation fin and the aluminum matrix silicon carbide heat dissipation plate located in the heat exchange cavity are not greater than 1 / 2 of the width of the heat exchange cavity. At the same time, the heat dissipation fin and the aluminum matrix silicon carbide heat dissipation plate are spaced apart from each other, and the distance between adjacent heat dissipation fins and aluminum matrix silicon carbide heat dissipation plates is 3 - 10 mm. A number of semiconductor refrigeration mechanisms are embedded in the heat exchange cavity. Their refrigeration ends are connected to the heat exchange inner lining, and the heat dissipation ends are in contact with the lower end faces of the heat dissipation fins. At the same time, each semiconductor refrigeration mechanism is evenly distributed along the axis direction of the encapsulation housing. At least one air vortex tube and a buffer tank are provided outside the thermal insulation outer shell. The air vortex tubes are connected in parallel. The intake end of the air vortex tube is connected to the blower through a diversion pipe, and the blower is connected to a diversion pipe through a multi-way valve and is connected to at least one diversion opening at the rear end face of the thermal insulation outer shell through a diversion pipe through a control valve. The low-temperature exhaust port and the high-temperature exhaust port of the air vortex tube are respectively connected to a diversion pipe through a multi-way valve and are both connected to the buffer tank through a diversion pipe. The buffer tank is connected to the booster pump through a diversion pipe, and the booster pump is respectively connected to each diversion opening at the front end face of the thermal insulation outer shell through a diversion pipe. The buffer tank and the booster pump are both located outside the thermal insulation outer shell. In addition, the semiconductor refrigeration mechanism, the blower, the booster pump, and the multi-way valve are all electrically connected to the drive circuit.

[0008] Further, an assembly seat is provided outside the thermal insulation outer shell. The assembly seat is a groove-shaped structure with a "U"-shaped cross-section, and a connecting sliding groove parallel to the axis of the thermal insulation outer shell is provided on the inner side of the side wall of the assembly seat. The assembly seat covers the lower half of the thermal insulation outer shell and is slidably connected to the heat dissipation fins outside the thermal insulation outer shell through the connecting sliding groove; at the same time, the blower, the air vortex tube, the buffer tank, and the booster pump are all connected to the assembly seat.

[0009] Furthermore, the cache tank is a closed cavity structure of any one of a cylinder and an ellipsoid, a plurality of air inlets are provided at one end of the cache tank, and are connected with the air vortex tube through the air inlets, at least one exhaust port is provided at the other end, and is connected with the booster pump through the exhaust port, and at least one liquid replenishing port is provided on the outer side of the thermal insulation shell, and the air inlet, exhaust port and liquid replenishing port are all provided with control valves, and a temperature sensor, an air pressure sensor and at least one ultrasonic atomizer are also provided in the cache tank, and the temperature sensor, air pressure sensor and ultrasonic atomizer are all electrically connected to the driving circuit.

[0010] Furthermore, in the air vortex tube, the low-temperature exhaust port of the air vortex tube is connected to at least one jet port through a multi-way valve, and the jet port is connected to the side surface of the heat dissipation fin plate on the lower end face of the insulation shell, and the axis of each jet port is at an angle of 0°-60° with the axis of the insulation shell, and is located at the front end face of the insulation shell, the caliber of the jet port is 5%-10% of the width of the heat dissipation fin plate, and the distance between the jet port and the insulation shell is 10%-60% of the width of the heat dissipation fin plate.

[0011] Furthermore, the positioning ring includes a bearing ring, a connecting slide bar, a connecting spring, a guide groove, and a connecting slide bar, wherein the bearing ring is a closed ring structure coaxially distributed with the laser, and its cross section is in the shape of an "I" character, the outer side surface of the bearing ring is provided with a plurality of connecting slide grooves evenly distributed around its axis, and the inner side surface is provided with a plurality of guide grooves evenly distributed around its axis, and the connecting slide grooves and the guide grooves are any one of rectangular grooves, dovetail grooves, and T-shaped grooves, and are all distributed parallel to the axis of the laser, the bearing ring is slidingly connected to the lower end surface of the aluminum-based silicon carbide heat sink through the connecting slide groove, the bearing ring is connected to a plurality of connecting slide bars through the guide groove, and each guide groove is connected to a connecting slide bar, the connecting slide bar is a columnar structure with a rectangular axial section, the lower half of which is embedded in the guide groove and distributed parallel to the axis of the bearing ring, and the upper end surface is connected to the outer surface of the laser, and at the same time, the two ends of the connecting slide bar are respectively connected to a connecting spring, and at the same time, the connecting slide bars of two adjacent positioning rings are connected to each other through a connecting spring.

[0012] Furthermore, the aluminum-based silicon carbide heat sink is a groove-shaped structure with a "Y"-shaped cross-section, including an alloy base and an aluminum-based silicon carbide substrate, wherein the alloy base is a columnar structure with a rectangular cross-section, and there are two alloy bases in total, which are distributed in parallel and connected by at least two aluminum-based silicon carbide substrates. The aluminum-based silicon carbide substrates are distributed in parallel, and the spacing between adjacent aluminum-based silicon carbide substrates is 1-5 mm. At the same time, the surfaces of the alloy bases corresponding to the two ends of the aluminum-based silicon carbide substrates are provided with assembly grooves, and are slidingly connected to the alloy bases through the assembly grooves.

[0013] Furthermore, in the aluminum-based silicon carbide substrate, two adjacent aluminum-based silicon carbide substrates are connected to each other via a plurality of spring sheets, and the spring sheets are distributed from top to bottom along the aluminum-based silicon carbide heat sink.

[0014] Furthermore, the heat dissipation fin plate is a plate-like structure with a “>”-shaped cross section, and the top angles of two adjacent heat dissipation fin plates are in opposite directions. At the same time, a plurality of through holes are further arranged on the heat dissipation fin plate.

[0015] Furthermore, the driving circuit is a circuit system based on any one of an FPGA chip and a DSP chip, and the driving circuit is further provided with a serial communication circuit and a control panel including but not limited to a display and buttons.

[0016] Compared with the current laser temperature control equipment, the present invention, on the one hand, effectively simplifies the structure of the temperature control equipment, improves the modularization and integration of the temperature control equipment, and effectively reduces the cost and difficulty of production, management and maintenance of the cooling equipment; on the other hand, it greatly improves the temperature adjustment range during operation, effectively realizing the simultaneous satisfaction of the needs of cooling, heat preservation and temperature increase adjustment operations of the laser, and the temperature adjustment response is sensitive, the heat exchange efficiency is high, and it also has the advantage of low energy consumption in the temperature adjustment operation, thereby achieving the purpose of stabilizing the operating performance of the laser equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments;

[0018] Figure 1 It is a side view structural schematic diagram of the present invention;

[0019] Figure 2 It is a front structural schematic diagram of the present invention;

[0020] Figure 3 It is a schematic diagram of the partial structure of the side section of the present invention;

[0021] Figure 4 It is a schematic diagram of the partial cross-sectional structure of the cache tank;

[0022] Figure 5 It is a schematic diagram of the partial structure of the aluminum-based silicon carbide heat sink from the front view;

[0023] Figure 6 It is a schematic diagram of the local structure of the positioning ring. DETAILED DESCRIPTION

[0024] In order to facilitate the construction of the technical means, creative features, objectives and effects achieved by the present invention, the present invention is further described below in conjunction with specific implementation methods.

[0025] like Figure 1-6As shown, a temperature-controllable laser includes a laser 200 and a temperature regulating mechanism 100 coated on the outside of the laser. The temperature regulating mechanism 100 includes a packaging shell 1, a heat dissipation fin plate 2, an aluminum-based silicon carbide heat dissipation plate 3, a positioning ring 4, a temperature sensor 5, and a driving circuit 6. The packaging shell 1 is a cavity structure with a rectangular axial cross-section, which is coated on the outside of the laser 200 and coaxially distributed with the laser 200. A plurality of aluminum-based silicon carbide heat dissipation plates 3 are arranged on the inner side of the packaging shell 1, and a plurality of heat dissipation fin plates 2 are arranged on the outer side. The heat dissipation fin plates 2 and the aluminum-based silicon carbide heat dissipation plates 3 are uniformly distributed around the axis of the packaging shell 1. The plate surfaces are all distributed parallel to the axis of the packaging shell 1. The upper end surface of the aluminum-based silicon carbide heat sink 3 is connected to the inner side surface of the packaging shell 1 and is distributed vertically. The lower end surface is connected to at least three positioning rings 4 evenly distributed along the axis of the packaging shell 1. The positioning ring 4 is an annular structure coaxially distributed with the packaging shell 1, wrapped around the outside of the laser 200 and slidably connected to the outer surface of the laser 200. The number of temperature sensors 5 is consistent with the number of positioning rings 4. A temperature sensor 5 is arranged on the side surface of each positioning ring 4. The driving circuit 6 is connected to the outer side surface of the packaging shell 1, and is electrically connected to the packaging shell 1 and each temperature sensor 5 respectively.

[0026] It is emphasized that the packaging shell 1 includes an insulating shell 101, a heat exchange liner 102, a semiconductor refrigeration mechanism 103, a fan 104, an air vortex tube 105, a cache tank 106, a booster pump 107, and a multi-way valve 108, wherein the insulating shell 101 is a columnar cavity structure with a rectangular axial cross-section, and its inner side is connected to the heat exchange liner 102, and a heat exchange cavity 109 with a width of not less than 10 mm is formed between the insulating shell 101 and the heat exchange liner 102, and at least two guide ports 1011 are provided at the front end face and the rear end face position of the insulating shell 101 corresponding to the heat exchange cavity 109, and each guide port 1011 is provided with a plurality of guide ports 1012, and each guide port 1013 is provided with a plurality of guide ports 1014, and each guide port 1015 is provided with a plurality of guide ports 1016, and each guide port 1017 is provided with a plurality of guide ports 1018, and each guide port 1019 is provided with a plurality of guide ports 1017, and each guide port 1018 is provided with a plurality of guide ports 1019, and each guide port 1011 is provided with a plurality of guide ports 1011, and each guide port 1011 is provided with a plurality of guide ports 1016, and each guide port 1017 is provided with a plurality of guide ports 1018, and each guide port 1018 is provided with a plurality of guide ports 1019, and each guide port 1018 is provided with a plurality of guide ports 1016, and each guide port 1018 is provided with a plurality of guide ports 1017, and each guide port 1018 is provided with a plurality of guide ports 1016, and each A control valve 1012 is provided at the flow port 1011. The lower end surface of the heat dissipation fin plate 2 is connected to the heat-insulating shell 101, and its lower end surface is located in the heat exchange cavity 109. The upper end surface of the aluminum-based silicon carbide heat dissipation plate 3 is connected to the heat exchange lining 102, and its upper end surface is located in the heat exchange cavity 109. The height of the heat dissipation fin plate 2 and the aluminum-based silicon carbide heat dissipation plate 3 in the heat exchange cavity 109 is not greater than 1 / 2 of the width of the heat exchange cavity 109. At the same time, the heat dissipation fin plate 2 and the aluminum-based silicon carbide heat dissipation plate 3 are spaced apart from each other, and the spacing between adjacent heat dissipation fin plates 2 and aluminum-based silicon carbide heat dissipation plates 3 is 3-10 mm. The semiconductor refrigeration mechanism There are several semiconductor refrigeration mechanisms 103, which are embedded in the heat exchange cavity 109, and the cooling end thereof is connected to the heat exchange lining 102, and the heat dissipation end is against the lower end surface of the heat dissipation fin plate 3. At the same time, each semiconductor refrigeration mechanism 103 is evenly distributed along the axial direction of the packaging shell 1. At least one air vortex tube 105 and a buffer tank 106 are arranged outside the heat preservation shell 101. The air vortex tubes 105 are connected in parallel. The air inlet end of the air vortex tube 105 is connected to the fan 104 through a guide tube, and the fan 104 is connected to a guide tube through a multi-way valve 108, and is connected to at least one guide port 1011 on the rear end surface of the heat preservation shell 101 through the guide tube. The low-temperature exhaust port and the high-temperature exhaust port of the air vortex tube 105 are connected through a control valve 1012, respectively, and are connected to a guide pipe through a multi-way valve 108, and are connected to the buffer tank 106 through the guide pipe. The buffer tank 106 is connected to the booster pump 107 through the guide pipe, and the booster pump 107 is connected to each guide port 1011 on the front end surface of the thermal insulation shell 101 through the guide pipe. The cache tank 106 and the booster pump 107 are both located outside the thermal insulation shell 101. In addition, the semiconductor refrigeration mechanism 103, the fan 104, the booster pump 107, and the multi-way valve 108 are all electrically connected to the drive circuit 6.

[0027] Wherein, an assembly seat 7 is additionally provided outside the heat preservation shell 101. The assembly seat 7 is a trough-shaped structure with a cross-section in the shape of "凵", and a connecting sliding groove 8 parallel to the axis of the heat preservation shell 101 is arranged on the inner side surface of the side wall of the assembly seat 7. The assembly seat 7 is wrapped outside the lower half of the heat preservation shell 101 and is slidably connected to the heat dissipation fin 2 on the outside of the heat preservation shell 101 through the connecting sliding groove 8. At the same time, the fan 104, the air vortex tube 105, the buffer tank 106, and the booster pump 107 are all connected to the assembly seat 7.

[0028] At the same time, the buffer tank 106 is a sealed cavity structure of any one of a cylinder and an ellipsoid. A plurality of air inlets 1061 are arranged at one end of the buffer tank 106 and are communicated with the air vortex tube 105 through the air inlets 1061. At least one air outlet 1062 is arranged at the other end and is communicated with the booster pump 107 through the air outlet 1062. At the same time, at least one liquid supplement port 1063 is additionally arranged on the outer side surface of the heat preservation shell 101. Control valves 1012 are arranged on the air inlets 1061, the air outlets 1062, and the liquid supplement port 1063. At the same time, a temperature sensor 5, a pressure sensor 1064, and at least one ultrasonic atomizer 1065 are additionally arranged in the buffer tank 106. The temperature sensor 5, the pressure sensor 1064, and the ultrasonic atomizer 1065 are all electrically connected to the drive circuit 6.

[0029] It should be noted that in the air vortex tube 105, the low-temperature exhaust port of the air vortex tube 105 is additionally connected to at least one jet port 9 through a multi-way valve 108. The jet port 9 is connected to the side surface of the heat dissipation fin 2 on the lower end surface of the heat preservation shell 101, and the axis of each jet port 9 forms an angle of 0° - 60° with the axis of the heat preservation shell 101 and is located at the front end surface position of the heat preservation shell 101. The diameter of the jet port 9 is 5% - 10% of the width of the heat dissipation fin 2, and the distance between the jet port 9 and the heat preservation shell 101 is 10% - 60% of the width of the heat dissipation fin 2.

[0030] In addition, the positioning ring 4 includes a bearing ring 41, a connecting slide 42, a connecting spring 43, a guide groove 44, and a connecting slide 45, wherein the bearing ring 41 is a closed ring structure coaxially distributed with the laser 200, and its cross section is in the shape of an "I", the outer side surface of the bearing ring 41 is provided with a plurality of connecting slides 45 evenly distributed around its axis, and the inner side surface is provided with a plurality of guide grooves 44 evenly distributed around its axis, and the connecting slide 45 and the guide groove 44 are any one of a rectangular groove, a dovetail groove, and a T-shaped groove, and are all distributed parallel to the axis of the laser 200, and the bearing ring 41 is connected by The slide groove 45 is slidably connected to the lower end surface of the aluminum-based silicon carbide heat sink 3, and the supporting ring 41 is connected to a plurality of connecting slides 42 through a guide groove 44, and each guide groove 44 is connected to a connecting slide 42. The connecting slide 42 is a columnar structure with a rectangular axial cross-section, the lower half of which is embedded in the guide groove 44 and distributed parallel to the axis of the supporting ring 41, and the upper end surface is connected to the outer surface of the laser 200. At the same time, the two ends of the connecting slide 42 are respectively connected to a connecting spring 43, and the connecting slides 42 of two adjacent positioning rings are connected to each other through a connecting spring 43.

[0031] The guide grooves and connecting slide grooves are used to effectively improve the stability and convenience of the assembly operation of the bearing ring, the laser, and the aluminum-based silicon carbide heat sink.

[0032] The connecting springs provided at the same time can realize elastic positioning of the relative positions between the connecting slides, thereby improving the positioning stability of the equipment, and can also elastically absorb the mechanical vibration during the operation of the laser, thereby helping to improve the operating stability of the laser.

[0033] In this embodiment, the aluminum-based silicon carbide heat sink 3 is a groove-shaped structure with a "Y"-shaped cross-section, including an alloy base 31 and an aluminum-based silicon carbide substrate 32, wherein the alloy base 31 is a columnar structure with a rectangular cross-section, and there are two alloy bases 31 in total, the two alloy bases 31 are distributed in parallel, and are connected by at least two aluminum-based silicon carbide substrates 32, the aluminum-based silicon carbide substrates 32 are distributed in parallel, and the spacing between two adjacent aluminum-based silicon carbide substrates 32 is 1-5 mm, and at the same time, the surfaces of the alloy bases 31 corresponding to the two ends of the aluminum-based silicon carbide substrates 32 are provided with assembly grooves 33, and are slidingly connected to the alloy bases 31 through the assembly grooves 33.

[0034] By utilizing the alloy base, the heat exchange operation can be satisfied while the wear resistance of the equipment during installation and assembly can be improved, thereby preventing the aluminum-based silicon carbide substrate from being damaged when it is directly connected to the positioning ring and the packaging shell.

[0035] As a further optimization, in the aluminum-based silicon carbide substrate 32 , two adjacent aluminum-based silicon carbide substrates 32 are connected to each other via a plurality of spring sheets 34 , and the spring sheets 34 are distributed from top to bottom along the aluminum-based silicon carbide heat sink 32 .

[0036] The arranged spring piece can effectively improve the positioning structure stability and vibration damage resistance of the aluminum-based silicon carbide substrate.

[0037] In this embodiment, the heat dissipation fin plate 2 is a plate-like structure with a “>”-shaped cross section, and the top angles of two adjacent heat dissipation fin plates 2 are in opposite directions. At the same time, a plurality of through holes 21 are further provided on the heat dissipation fin plate 2.

[0038] By dissipating the heat of the heat sink into a “>”-shaped groove structure, on the one hand, the surface area of ​​the heat exchange of the heat sink can be increased to improve the heat dissipation efficiency; on the other hand, the airflow passing through the heat sink can be effectively guided, which also helps to improve the heat dissipation efficiency.

[0039] In this embodiment, the driving circuit 6 is a circuit system based on any one of an FPGA chip and a DSP chip, and the driving circuit 6 is further provided with a serial communication circuit and a control panel including but not limited to a display and buttons.

[0040] When the present invention is specifically run:

[0041] First, a temperature sensor is set to detect the current working environment temperature of the laser, and then the fan set on the package shell of the temperature adjustment mechanism is driven to run according to the detection value. When the fan is running, the air in the heat exchange cavity of the package shell is extracted from its rear end surface and transported to the air vortex tube, and at the same time, part of the air in the external environment is driven to be transported to the air vortex tube to supplement the air flow extracted from the heat exchange cavity; the air flow after being pressurized and accelerated by the fan is transported to the air vortex tube, and a low-temperature air flow lower than the input air flow temperature and a high-temperature air flow higher than the input air flow temperature are generated through the air vortex tube; finally:

[0042] When it is necessary to heat up the laser, the high-temperature airflow output by the air vortex tube is twice-pressurized by the buffer tank and the booster pump and then input into the guide cavity from the front end face of the heat exchange cavity. The high-temperature airflow flows from front to back along the axis of the packaging shell driven by its own pressure and the fan, and during the flow, heat is exchanged with the heat exchange lining and the heat dissipation fins and the aluminum-based silicon carbide heat dissipation plate at the same time, so that the heat exchange lining and the heat dissipation fins and the aluminum-based silicon carbide heat dissipation plate are heated at the same time, and then the heat exchange lining and the aluminum-based silicon carbide heat dissipation plate are used to realize heat exchange and heating operation with the laser, so as to meet the defects of power reduction and reaction sensitivity reduction when the laser is started and operated in a low-temperature environment;

[0043] The low-temperature airflow generated in this process can be directly discharged, or it can be driven directly to the surface of the heat dissipation fin plate outside the packaging shell through the jet port, and the low-temperature airflow is made to flow along the axial direction of the packaging shell through the surface of the heat dissipation fin plate, and the heat dissipation fin plate is cooled by the low-temperature airflow, so as to balance the high-temperature environment in the heat exchange cavity on the one hand; on the other hand, as the laser generates heat during operation, the temperature in the heat exchange cavity is simultaneously reduced to prevent the laser operating temperature from being too high; and during the operation of the laser, a higher ambient temperature is required only at startup, and a stable high-temperature environment needs to be maintained during standby, so the heating operation time of the laser is short, and the heat loss caused by the heat dissipation fin plate is ignored during the heating process;

[0044] When the laser needs to be cooled, the low-temperature airflow output by the air vortex tube is secondary-pressurized through the buffer tank and the booster pump and then input into the guide cavity from the front end face of the heat exchange cavity. The low-temperature airflow flows from front to back along the axis of the packaging shell under the drive of its own pressure and the fan, and during the flow, heat is exchanged with the heat exchange lining, the heat dissipation fins, and the aluminum-based silicon carbide heat dissipation plate. During the heat exchange process, the aluminum-based silicon carbide heat dissipation plate and the heat exchange lining first exchange heat with the laser generator to collect the waste heat of the laser operation, and then the heat exchange lining and the aluminum-based silicon carbide heat dissipation plate exchange the collected waste heat of the laser operation with the low-temperature airflow. The low-temperature airflow is discharged from the rear end face of the packaging shell and transported to the air vortex tube after being heated. The purpose of directly cooling the laser and recycling the cooling airflow to reduce the operating energy consumption is achieved. At the same time, the low-temperature airflow also exchanges heat with the heat dissipation fins to indirectly dissipate the waste heat of the laser through the heat dissipation fins.

[0045] At the same time, when cooling is performed, when a small range of cooling is required, or the cooling adjustment range is small, the semiconductor refrigeration mechanism can be directly driven to cool the laser through the heat dissipation fin plate and the aluminum-based silicon carbide heat dissipation plate, instead of driving the air vortex tube and the fan, booster pump and other equipment supporting the air vortex tube, so as to achieve the purpose of reducing the energy consumption of the cooling operation;

[0046] When the air vortex tube is used to significantly reduce the temperature, the semiconductor refrigeration mechanism can be selected to operate synchronously or stop operating, and when the semiconductor refrigeration mechanism and the air vortex tube are operated synchronously, the efficiency of the cooling operation can be further improved.

[0047] During the cooling operation, the high-temperature airflow generated by the air vortex tube is directly discharged, and part of the low-temperature airflow generated is directly driven to the surface of the heat dissipation fin outside the packaging shell through the jet nozzle, and the low-temperature airflow flows along the axis direction of the packaging shell through the surface of the heat dissipation fin. The low-temperature airflow is used to force the heat dissipation fin to cool down, thereby further improving the efficiency of the cooling operation.

[0048] In addition, during the temperature adjustment operation, water for temperature adjustment can be injected into the buffer tank through the liquid replenishment port provided in the buffer tank, and the injected water is ultrasonically atomized by the ultrasonic atomizer, and then the water mist is mixed with the gas injected by the air vortex tube and transported to the heat exchange cavity together, so as to assist the gas prepared by the air vortex tube to further improve the efficiency of the heat exchange operation. Especially during the cooling operation, normal temperature or low temperature water can be injected into the buffer tank, and the high specific heat capacity of water can be used to further improve the efficiency of the heat dissipation operation.

[0049] Compared with the current laser temperature control equipment, the present invention, on the one hand, effectively simplifies the structure of the temperature control equipment, improves the modularization and integration of the temperature control equipment, and effectively reduces the cost and difficulty of production, management and maintenance of the cooling equipment; on the other hand, it greatly improves the temperature adjustment range during operation, effectively realizing the simultaneous satisfaction of the needs of cooling, heat preservation and temperature increase adjustment operations of the laser, and the temperature adjustment response is sensitive, the heat exchange efficiency is high, and it also has the advantage of low energy consumption in the temperature adjustment operation, thereby achieving the purpose of stabilizing the operating performance of the laser equipment.

[0050] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention to be protected. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A temperature-controllable laser, comprising a laser and a temperature-adjusting mechanism encapsulating the laser, characterized in that: The temperature regulating mechanism comprises a packaging shell, a heat dissipation fin plate, an aluminum-based silicon carbide heat dissipation plate, a positioning ring, a temperature sensor, and a driving circuit, wherein the packaging shell is a cavity structure with a rectangular axial cross-section, which is coated outside the laser and coaxially distributed between the lasers, a plurality of aluminum-based silicon carbide heat dissipation plates are arranged on the inner side surface of the packaging shell, and a plurality of heat dissipation fin plates are arranged on the outer side surface, the heat dissipation fin plates and the aluminum-based silicon carbide heat dissipation plates are uniformly distributed around the axis of the packaging shell, and the plate surfaces are parallel to the axis of the packaging shell, the upper end surface of the aluminum-based silicon carbide heat dissipation plate is connected to the inner side surface of the packaging shell and is vertically distributed, and the lower end surface is connected to at least three positioning rings uniformly distributed along the axis of the packaging shell, the positioning ring is an annular structure coaxially distributed with the packaging shell, coated outside the laser and slidably connected to the outer surface of the laser, the number of the temperature sensors is consistent with the number of the positioning rings, and a temperature sensor is arranged on the side surface of each positioning ring, the driving circuit is connected to the outer side surface of the packaging shell, and is electrically connected to the packaging shell and each temperature sensor respectively.

2. A temperature-controllable laser according to claim 1, characterized in that: The packaging shell includes an insulating shell, a heat exchange lining, a semiconductor refrigeration mechanism, a fan, an air vortex tube, a cache tank, a booster pump, and a multi-way valve, wherein the insulating shell is a columnar cavity structure with a rectangular axial cross-section, and its inner side surface is connected to the heat exchange lining, and a heat exchange cavity with a width of not less than 10 mm is formed between the insulating shell and the heat exchange lining, and at least two guide ports are provided at the front end face and the rear end face position of the insulating shell corresponding to the heat exchange cavity, and a control valve is provided at each guide port, the lower end face of the heat dissipating fin is connected to the insulating shell, and its lower end face is located in the heat exchange cavity, the upper end face of the aluminum-based silicon carbide heat dissipating plate is connected to the heat exchange lining, and its upper end face is located in the heat exchange cavity, the height of the heat dissipating fin and the aluminum-based silicon carbide heat dissipating plate in the heat exchange cavity is not greater than 1 / 2 of the width of the heat exchange cavity, and the heat dissipating fin and the aluminum-based silicon carbide heat dissipating plate are spaced apart from each other, and the spacing between adjacent heat dissipating fins and aluminum-based silicon carbide heat dissipating plates is 3-10 mm, and the semiconductor A number of cooling mechanisms are embedded in the heat exchange cavity, with the cooling end connected to the heat exchange lining, and the heat dissipation end abutting against the lower end surface of the heat dissipation fin, and at the same time, each semiconductor refrigeration mechanism is evenly distributed along the axial direction of the packaging shell, and at least one air vortex tube and a buffer tank are arranged outside the thermal insulation shell, and the air vortex tubes are connected in parallel, the air inlet end of the air vortex tube is connected to the fan through a guide tube, and the fan is connected to a guide tube through a multi-way valve, and is connected to at least one guide port on the rear end surface of the thermal insulation shell through the guide tube through a control valve, the low-temperature exhaust port and the high-temperature exhaust port of the air vortex tube are respectively connected to a guide tube through a multi-way valve, and are connected to the cache tank through the guide tube, the cache tank is connected to the booster pump through the guide tube, and the booster pump is respectively connected to each guide port on the front end surface of the thermal insulation shell through the guide tube, and the cache tank and the booster pump are both located outside the thermal insulation shell, in addition, the semiconductor refrigeration mechanism, fan, booster pump, and multi-way valve are all electrically connected to the drive circuit.

3. A temperature-controllable laser according to claim 2, characterized in that: An assembly seat is provided outside the heat-insulating housing. The assembly seat is a trough-shaped structure with a "U"-shaped cross-section. The inner side surface of the side wall of the assembly seat is provided with connecting sliding grooves distributed parallel to the axis of the heat-insulating housing. The assembly seat covers the lower half of the heat-insulating housing and is slidably connected to the heat-dissipating fins on the outer side of the heat-insulating housing through the connecting sliding grooves. At the same time, the fan, the air vortex tube, the buffer tank, and the booster pump are all connected to the assembly seat.

4. A temperature-controllable laser according to claim 2, characterized in that: The buffer tank is a closed cavity structure of any one of a cylinder and an ellipsoid. One end of the buffer tank is provided with a plurality of air inlets and is communicated with the air vortex tube through the air inlets. The other end is provided with at least one exhaust port and is communicated with the booster pump through the exhaust port. At the same time, at least one liquid replenishing port is provided on the outer side surface of the heat-insulating housing. Control valves are provided for the air inlets, the exhaust port, and the liquid replenishing port. At the same time, a temperature sensor, a pressure sensor, and at least one ultrasonic atomizer are further provided in the buffer tank. The temperature sensor, the pressure sensor, and the ultrasonic atomizer are all electrically connected to the drive circuit.

5. A temperature-controllable laser according to claim 2, characterized in that: In the air vortex tube, the low-temperature exhaust port of the air vortex tube is further communicated with at least one jet port through a multi-way valve. The jet port is connected to the side surface of the heat-dissipating fin on the lower end surface of the heat-insulating housing. The axis of each jet port forms an angle of 0° - 60° with the axis of the heat-insulating housing and is located at the front end surface of the heat-insulating housing. The diameter of the jet port is 5% - 10% of the width of the heat-dissipating fin, and the distance between the jet port and the heat-insulating housing is 10% - 60% of the width of the heat-dissipating fin.

6. A temperature-controllable laser according to claim 1, characterized in that: The positioning ring includes a bearing ring, connecting slide bars, connecting springs, guide grooves, and connecting sliding grooves. Among them, the bearing ring is a closed ring structure coaxial with the laser, and its cross-section is "I"-shaped. A plurality of connecting sliding grooves evenly distributed around its axis are provided on the outer side surface of the bearing ring, and a plurality of guide grooves evenly distributed around its axis are provided on the inner side surface. The connecting sliding grooves and the guide grooves are any one of a rectangular groove, a dovetail groove, and a T-shaped groove, and are all distributed parallel to the axis of the laser. The bearing ring is slidably connected to the lower end surface of the aluminum-based silicon carbide heat sink through the connecting sliding grooves. The bearing ring is connected to a plurality of connecting slide bars through the guide grooves, and each guide groove is connected to one connecting slide bar. The connecting slide bar is a columnar structure with a rectangular axial cross-section. Its lower half is embedded in the guide groove and is distributed parallel to the axis of the bearing ring. Its upper end surface is connected to the outer surface of the laser. At the same time, both ends of the connecting slide bar are respectively connected to a connecting spring. At the same time, the connecting slide bars between adjacent positioning rings are connected to each other through the connecting springs.

7. A temperature-controllable laser according to claim 1, characterized in that: The aluminum-based silicon carbide heat sink is a trough-shaped structure with a "Y"-shaped cross-section, including an alloy base and an aluminum-based silicon carbide substrate. Among them, the alloy base is a columnar structure with a rectangular cross-section. There are two alloy bases in total. The two alloy bases are distributed in parallel and are connected by at least two aluminum-based silicon carbide substrates. The aluminum-based silicon carbide substrates are distributed in parallel, and the distance between adjacent aluminum-based silicon carbide substrates is 1 - 5 mm. At the same time, assembly grooves are provided on the surfaces of the alloy bases corresponding to both ends of the aluminum-based silicon carbide substrate, and the aluminum-based silicon carbide substrate is slidably connected to the alloy base through the assembly grooves.

8. A temperature-controllable laser according to claim 7, characterized in that: In the aluminum-based silicon carbide substrate, two adjacent aluminum-based silicon carbide substrates are connected to each other via a plurality of spring sheets, and the spring sheets are distributed from top to bottom along the aluminum-based silicon carbide heat sink.

9. The temperature-controllable laser according to claim 1, characterized in that: The heat dissipation fin plate is a plate-like structure with a ">"-shaped cross section, and the top angles of two adjacent heat dissipation fin plates are in opposite directions. At the same time, a plurality of through holes are arranged on the heat dissipation fin plate.

10. The temperature-controllable laser according to claim 1, characterized in that: The driving circuit is a circuit system based on any one of an FPGA chip and a DSP chip, and the driving circuit is further provided with a serial communication circuit and a control panel including but not limited to a display and buttons.

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