Preparation method of fused deposition modeling part surface metal circuit

Abstract

The invention relates to the technical field of additive manufacturing, in particular to a preparation method of a fused deposition modeling part surface metal circuit, which comprises the following steps: respectively carrying out 3D printing on a first thermoplastic material not containing an LDS additive and a second thermoplastic material containing the LDS additive, the outer surface of the formed part is the second thermoplastic material, and the interior of the formed part is the first thermoplastic material; performing laser activation on the surface of the formed part according to the metal circuit diagram; and chemical plating is conducted on the surface of the formed part subjected to laser activation, and the surface metal circuit is prepared and obtained. The preparation method of the metal circuit on the surface of the fused deposition molding part aims at solving the problem that the mechanical property is poor due to the fact that a body material contains a metal additive.

Description

Technical Field

[0001] The invention relates to the technical field of additive manufacturing, and in particular to a method for preparing metal circuits on the surface of a fused deposition modeling part. Background Art

[0002] Laser direct structuring (LDS) is a process of directly transferring to the target part surface through laser processing, using the three-dimensional surface of the three-dimensional part to form circuit interconnections, or realizing metallized vias through laser drilling. The traditional process is to uniformly add the LDS activator to the part material, use injection molding to form, then use laser processing to scan the target pattern, laser activate and shallowly etch the surface of the part, and use chemical plating to selectively deposit copper on the patterned part processed by laser to achieve the effect of surface patterned metal circuit preparation. The LDS process realizes the rapid manufacturing of three-dimensional circuits quickly, integrated and at low cost through simple laser scanning, and is widely used in communications, medical, automobile and other industries. At present, the LDS process parts are to melt and evenly mix the LDS additives with thermoplastics and use the injection molding process to realize the molding of thermoplastic materials. In order to further reduce costs, the LDS process parts can also be obtained by melt deposition molding technology, reducing the expensive mold costs required for the injection molding process. CN113001965A mentions a method of preparing a filament material by blending a marking additive so that it can change color under laser exposure. CN111117181A discloses a laser direct forming resin that can be used for 3D printing, in which LDS additives and thermoplastic resins are blended by twin screws and prepared into raw materials that can be used for 3D printing. Ensinger of Germany has launched TECAFIL PEEK LDS black filament materials that can be used to prepare parts through 3D printing, and then laser activation and chemical plating steps are performed on the surface to prepare metal circuits on the surface. In addition, since LDS additives are mostly metal salts, adding them to the resin material body can provide a photoactivation effect, but it will greatly reduce the mechanical properties of the entire part, especially the impact resistance.

[0003] Therefore, the inventor provides a method for preparing metal circuits on the surface of a fused deposition modeling part. Summary of the invention

[0004] (1) Technical issues to be solved

[0005] The embodiment of the present invention provides a method for preparing a metal circuit on the surface of a fused deposition modeling part, which solves the technical problem of poor mechanical properties caused by the presence of metal additives in the base material.

[0006] (2) Technical solution

[0007] The present invention provides a method for preparing a metal circuit on the surface of a fused deposition modeling part, comprising the following steps:

[0008] 3D printing is performed on a first thermoplastic material without an LDS additive and a second thermoplastic material with an LDS additive, respectively, to obtain a molded part with an outer surface made of the second thermoplastic material and an inner portion made of the first thermoplastic material;

[0009] According to the metal circuit diagram, the surface of the molded part is laser activated;

[0010] The surface of the laser-activated molded part is chemically plated to prepare a surface metal circuit.

[0011] Further, the first thermoplastic material and / or the second thermoplastic material includes at least one of polycarbonate, polylactic acid, polyamide, ABS resin, liquid crystal polymer, polyphenylene sulfide, polyarylate, polyethersulfone, polyaryletherketone, polyetheretherketone, polyetherketoneketone, polyethersulfoneketone, polyetherimide, and thermoplastic polyimide.

[0012] Furthermore, the first thermoplastic material and the second thermoplastic material are the same type of resin raw materials.

[0013] Furthermore, the LDS additive includes at least one of copper metal salts, tin metal salts, titanium metal salts, copper oxides, tin oxides and titanium oxides.

[0014] Furthermore, the LDS additive includes at least one of basic copper phosphate, copper chrome black, arsenic trioxide and tin dioxide.

[0015] Furthermore, the content of the LDS additive is 0.1% to 30%wt.

[0016] Furthermore, a pulse laser is used to perform laser activation on the surface of the molded part.

[0017] Furthermore, the central wavelength of the light source of the pulse laser is 355-1064 nm.

[0018] Furthermore, the output power of the pulse laser is 0.1-100W.

[0019] Furthermore, the surface of the laser-activated molded part is chemically plated to prepare a surface metal circuit, specifically:

[0020] The surface of the formed part is ultrasonically cleaned, and then the formed part is placed in a pre-chemical plating solution for multi-step chemical plating.

[0021] (3) Beneficial effects

[0022] In summary, the present invention overcomes the problem of the decrease in mechanical properties of the overall parts caused by the addition of LDS additives to thermoplastic resins by combining the advantages of mold-free rapid manufacturing of fused deposition modeling 3D printing and conformal processing on curved surfaces by laser direct molding. At the same time, the one-piece molding method of 3D printing layer-by-layer manufacturing is adopted to avoid the problem of weak bonding between multiple materials to a certain extent. The present invention can realize the low-cost manufacturing of conformal metal circuits on 3D printed parts, thereby realizing the conformal manufacturing of metal circuits of frequency-selective radar surfaces (FSS), conformal sensor circuit manufacturing on curved surfaces, and conformal antenna circuit manufacturing on curved surfaces. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments of the present invention are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 It is a schematic flow chart of a method for preparing a metal circuit on the surface of a fused deposition modeling part provided by an embodiment of the present invention;

[0025] Figure 2 This is a schematic diagram of a 3D printing model of a metal circuit on the surface of a fused deposition modeling part provided in Example 1 of the present invention;

[0026] Figure 3 This is a schematic diagram of a 3D printing model of metal circuits on the surface of a fused deposition modeling part provided in Example 2 of the present invention;

[0027] Figure 4 This is a schematic diagram of path planning for 3D printing of metal circuits on the surface of a fused deposition modeling part provided in Example 2 of the present invention;

[0028] Figure 5 This is a schematic diagram of a 3D printing model of a metal circuit on the surface of a fused deposition modeling part provided in Example 3 of the present invention;

[0029] Figure 6 This is a schematic diagram of path planning for 3D printing of metal circuits on the surface of a fused deposition modeling part provided in Example 3 of the present invention;

[0030] Figure 7 This is a schematic diagram of a 3D printing model of a metal circuit on the surface of a fused deposition modeling part provided in Example 4 of the present invention;

[0031] Figure 8 This is a schematic diagram of a 3D printing model of metal circuits on the surface of a fused deposition modeling part provided in Example 5 of the present invention. DETAILED DESCRIPTION

[0032] The following detailed description of the embodiments of the present invention is provided in conjunction with the accompanying drawings and examples. The following detailed description of the embodiments and the accompanying drawings are used to illustrate the principles of the present invention, but cannot be used to limit the scope of the present invention, that is, the present invention is not limited to the described embodiments.

[0033] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0034] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the products of the present invention are conventionally placed when in use, or are the orientations or positional relationships conventionally understood by those skilled in the art. These are merely for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0035] Figure 1 is a schematic diagram of a method for preparing a metal circuit on the surface of a fused deposition modeling part provided by an embodiment of the present invention, see Figure 1 , the method may include the following steps:

[0036] S100, 3D printing is performed on a first thermoplastic material without an LDS additive and a second thermoplastic material with an LDS additive, respectively, to obtain a molded part with an outer surface of the second thermoplastic material and an inner portion of the first thermoplastic material.

[0037] Specifically, multi-material fused deposition modeling 3D printing requires that the 3D printer has at least two or more nozzles. The materials of the two nozzles are respectively a thermoplastic material without LDS additives and a thermoplastic material containing LDS additives. The shape of the material is not limited, and it can enter the extruder. It is preferably a shape of wire (filament), particles, powder and other aspects of the feed as the raw material for fused deposition modeling 3D printing. The thermoplastic material used can be selected from one or more of polycarbonate, polylactic acid, polyamide, ABS resin, LCP, polyphenylene sulfide, polyarylate, polyethersulfone, polyaryletherketone, polyetheretherketone, polyetherketoneketone, polyethersulfoneketone, polyetherimide, thermoplastic polyimide, etc. In addition, fillers can also be often added to the resin to improve performance or give it specific functions, such as mechanical properties, thermal conductivity, dielectric properties, heat resistance, phase change energy storage, flame retardant properties, ablation resistance, ablation performance, electrical conductivity, electromagnetic properties (wave absorption and electromagnetic shielding), color controllability, radiation resistance, barrier properties, friction properties, biological properties, optical properties, etc. The filler here can be in different forms such as fiber, granule, powder, flake, etc. Optionally, the filler can be continuous or chopped fiber, organic fiber, inorganic fiber or metal wire, including carbon fiber, glass fiber, quartz fiber, mullite fiber, basalt fiber, lignin fiber, natural fiber, carbon nanotube fiber, ceramic fiber, boron fiber, aramid fiber, Kevlar fiber, ultra-high molecular weight polyethylene fiber, liquid crystal polymer (LCP), optical fiber, polyaryletherketone fiber, nylon fiber, polyimide fiber, etc. The filler can also be ceramic particles or powders, such as polymer powder, polytetrafluoroethylene powder, liquid crystal polymer powder, glass beads, ceramic beads, carbon nanotubes, graphene, aluminum oxide (corundum), zinc oxide, titanium dioxide, mullite, calcium carbonate, magnesium carbonate, calcium silicate, aluminum silicate, magnesium silicate, potassium aluminum silicate, barium sulfate, silicon carbide, silicon nitride, boron nitride, silicon dioxide, whiskers, zirconium dioxide, yttrium dioxide, tungsten sulfide, adamantane, montmorillonite, nanosilver, cage-type polyhedral oligomeric silsesquioxane (POSS), MXene, ferrite, color powder, etc.

[0038] LDS additive is a material that has chemical plating activity in the area irradiated by the laser due to photoinduced reaction after laser irradiation. It is usually a metal salt powder, preferably one or more of copper, tin, titanium metal salts or oxides, preferably one or more of basic copper phosphonate, copper chrome black, arsenic trioxide, tin dioxide, etc. The content of LDS additive is generally 0.1% to 30% wt, preferably 1% to 10% wt. The material extruded by one nozzle is the above-mentioned thermoplastic material, and the material extruded by the other nozzle is a thermoplastic material containing LDS additive. In order to ensure the interlayer bonding of the parts and prevent stratification or difficulty in bonding between different materials, the thermoplastic resin material used in the double nozzles often has similar thermal properties, processing windows, and molecular structures, such as having similar melting temperatures (Tm), multi-stage extrusion temperatures, glass transition temperatures (Tg), molecular structures containing the same groups, etc. It is preferred that the materials extruded by the two nozzles are the same type of resin raw materials, and the difference between the two materials is whether they contain LDS additives. Depending on the target parts to be printed, supports may be added during the printing process. To facilitate post-processing of the parts and quickly remove the supports, additional nozzles may be used to separately print support materials with weaker bonding strength with the part material interface.

[0039] 3D printers are preferably three-axis or more printers. For X, Y, Z three-axis travel printers, the nozzle has two degrees of freedom in the X and Y axes, and can move to a specified location in a plane. The part deposition molding platform has a Z axis formation, which can move with one degree of freedom. Four-axis and five-axis printers usually have a part deposition molding platform or an extrusion nozzle with a single-axis or dual-axis turntable, which can realize the rotation of the molded parts or nozzles.

[0040] According to the number of nozzles and the printer conditions, appropriate path planning is performed in the computer slicing software. The principle of path planning is to ensure that the surface part that needs to prepare metal circuits is formed by deposition of thermoplastic materials containing LDS additives. The outer surface of the part that needs to prepare metal circuits is a "shell" of thermoplastic materials containing LDS additives, and the interior is filled with thermoplastic materials without LDS additives. Combining the layer-by-layer manufacturing characteristics of 3D printing and path planning means, the "shell" and internal materials are integrated and formed synchronously. According to different material requirements, the molecular chains of the "shell" and internal materials are mutually diffused during the molding process to ensure the interlayer bonding between the "shell" material and the internal material of the molded part.

[0041] Furthermore, a certain temperature can be applied to the platform or the printer cavity during the printing process, and the temperature is selected according to the characteristics of different materials to promote interlayer bonding. Taking into account the parameters of laser processing and the accuracy of fused deposition molding, the thickness of the "shell" with a surface made of thermoplastic material containing LDS additives is between 0.05 and 10 mm, preferably between 0.1 and 3 mm. Depending on the shape of the part and the printer, the slicing parameters for the surface made of LDS additive materials are different. Typical control parameters include layer height, line width, etc.

[0042] S200, laser activation is performed on the surface of the molded parts according to the metal circuit diagram.

[0043] Specifically, according to the requirements of the parts, the surface of the 3D printed parts can be post-processed to remove the layer lines and roughness caused by the 3D printing process, and improve the surface flatness and roughness of the parts. The preferred post-processing methods are snow spray polishing, chemical polishing, abrasive flow polishing, sandpaper / grinding wheel polishing, mechanical processing, etc. For parts with lower surface quality requirements, post-processing is not required. The LDS additive in the surface material of the part has a photoactivation effect. The surface of the 3D printed part is laser processed according to the metal circuit drawing. The computer controls the galvanometer or mechanical device to make the laser etch the surface of the part. The processed surface can be flat or curved.

[0044] The selected laser is a pulsed laser, preferably a nanometer, picosecond or femtosecond laser, which is generally transmitted by optical fiber or hard optical path, and the central wavelength of the light source is 355-1064nm, preferably 532nm or 1064nm; the processing system is generally a field lens or an objective lens, wherein the field lens can also be equipped with a two-dimensional or three-dimensional galvanometer. The output power of laser processing is generally between 0.1 and 100W, preferably 1 to 5W.

[0045] S300, chemically plating the surface of the laser-activated molded part to prepare a surface metal circuit.

[0046] Specifically, chemical plating is a method of transferring metal elements in a plating solution to the surface of a target material by a chemical deposition method. The metallized circuit obtained by this process has the characteristics of being dense and highly conductive. According to the needs, the 3D printed parts obtained in step S200 can be ultrasonically cleaned to remove surface dust, grease, etc. Subsequently, the workpiece is placed in a pre-chemical plating solution for multi-step chemical plating. It is preferably placed in a chemical copper plating tank, and the plating time is 15 to 30 minutes, and the laser-activated patterned part is pre-plated with a copper layer. Then, the 3D printed parts are transferred to a chemical thick copper plating tank for further copper plating, so that the copper layer can reach a specified thickness. The plating time depends on the designed copper layer thickness, and the workpiece is taken out every half an hour for copper thickness testing. According to the three-proof requirements, the copper-plated circuit is subjected to an anti-oxidation surface encapsulation treatment, or further activated by ion palladium and subjected to chemical nickel plating, chemical silver plating, chemical gold plating, chemical plating of platinum and other chemical plating metal elements.

[0047] Example 1

[0048] Step 1: Use a dual-nozzle three-axis wire 3D printer to print a rectangular sample. The materials used by the two nozzles are polycarbonate (PC) wire and polycarbonate (PC) wire containing LDS additive. The nozzle extrusion temperature of the two nozzles is 260°C. The LDS additive component in the polycarbonate (PC) wire containing LDS additive is hydroxy phosphate ketone, with a mass content of 2%. It is blended with resin powder using a twin-screw extruder and granulated, and then extruded into a wire with a diameter of 1.75mm by a single-screw extruder. See the three-dimensional model and the layout of the model printing. Figure 2 , see the metal circuit part Figure 2 , path planning and slicing are performed by computer, and G code is used to control the movement of the machine tool to achieve layer-by-layer additive manufacturing. The slice layer height is set to 0.4mm, the material deposited in the Z-axis direction is polycarbonate (PC) filament, and the last three layers of material deposited are polycarbonate (PC) filament containing LDS additives, ensuring that the 1.2mm material on the upper surface of the cube is polycarbonate (PC) filament containing LDS additives. The chamber temperature of the 3D printer is 100℃.

[0049] Step 2: Use a nano laser to activate the 3D printed parts obtained in step 1 on the plane surface according to the drawing through an optical fiber and a three-dimensional galvanometer processing head. The central wavelength of the line light source is 1064nm and the output power is 5w.

[0050] Step 3. Place the 3D printed parts obtained in step 2 in deionized water for ultrasonic cleaning for 20 minutes. Then transfer to the pre-copper plating tank, perform chemical plating at 55°C for 15 minutes, and use a blower to send air for stirring. Then transfer to the chemical thick copper tank, perform chemical plating at 50°C for 1 hour, and use a blower to send air for stirring. After the chemical plating is completed, use deionized water to fully clean the surface of the composite board, and after drying, perform anti-oxidation encapsulation on the circuit surface.

[0051] Example 2

[0052] Step 1: Use a dual-nozzle three-axis wire 3D printer to print developable curved surface samples. The materials used by the two nozzles are ABS wire and ABS wire containing LDS additives. The nozzle extrusion temperature of the two nozzles is 270°C. The LDS additive component in the ABS wire containing LDS additives is copper chromium black, with a mass content of 3%. It is mixed with resin powder using a twin-screw extruder and granulated, and then extruded into a wire with a diameter of 1.75mm through a single-screw extruder. The three-dimensional model and the layout of the model printing and the surface metal circuit part are shown in Figure 3 , the path planning and slicing are performed by computer, and G code is used to control the movement of the machine tool to achieve layer-by-layer additive manufacturing. Set the slice layer height to 0.6mm, according to Figure 4 As shown in the path planning, in the path diagram, the dotted line part is the ABS filament nozzle containing LDS additive printing outer wall surface ("shell"), the solid line part is the ABS filament nozzle printing path, and the printing line width is 1mm. The cavity temperature of the 3D printer is 90℃.

[0053] Step 2: Use a nano laser to activate the 3D printed parts obtained in step 1 on the developable surface according to the drawing through an optical fiber and a three-dimensional galvanometer processing head. The central wavelength of the line light source is 355nm and the output power is 3w.

[0054] Step 3: Place the 3D printed parts obtained in step 2 in deionized water for ultrasonic cleaning for 30 minutes. Then transfer to the pre-copper plating tank, perform chemical plating at 55°C for 30 minutes, and use a blower to send air for stirring. Then transfer to the chemical thick copper tank, perform chemical plating at 50°C for 2 hours, and use a blower to send air for stirring. Then, the surface three-proof treatment is completed by surface chemical nickel plating and chemical silver plating.

[0055] Example 3

[0056] Step 1: Use a dual-nozzle three-axis powder 3D printer to print developable curved surface samples. The materials used by the two nozzles are PEEK powder and PEEK powder containing LDS additives. The nozzle extrusion temperature of the two nozzles is 270°C. The LDS additive component in the PEEK wire containing LDS additives is copper chromium black, with a mass content of 5%. It is blended with resin powder using a twin-screw extruder and granulated, and then ground into powder with uniform particle size using a ball mill. The powder particle size D50 is 100 microns. See the three-dimensional model and the layout of the model printing and the surface metal circuit part. Figure 5 , path planning and slicing are performed by computer, and G code is used to control the movement of the machine tool to achieve layer-by-layer additive manufacturing. Set the slice layer height to 0.5mm, according to Figure 6 As shown in the path planning, the dotted line is a schematic diagram of the path of the PEEK nozzle containing LDS additives to print the outer wall surface ("shell"), the solid line is the PEEK nozzle printing path, the arrow position is the path starting position, and the print line width is 0.8mm. The cavity temperature of the 3D printer is 130℃.

[0057] Step 2: Use a nano laser to activate the 3D printed parts obtained in step 1 on the developable surface according to the drawing through an optical fiber and a three-dimensional galvanometer processing head. The central wavelength of the line light source is 355nm and the output power is 3w.

[0058] Step 3: Place the 3D printed parts obtained in step 2 in deionized water for ultrasonic cleaning for 30 minutes. Then transfer to the pre-copper plating tank, perform chemical plating at 55°C for 30 minutes, and use a blower to send air for stirring. Then transfer to the chemical thick copper tank, perform chemical plating at 50°C for 2 hours, and use a blower to send air for stirring. Then, the surface three-proof treatment is completed by surface chemical nickel plating and chemical silver plating.

[0059] Example 4

[0060] Step 1. Use a dual-nozzle filament four-axis 3D printer to print developable curved surface samples. The four-axis 3D printer has X, Y, and Z three-axis travels, and two print nozzles have A-axis processing inclinations. The materials used by the two nozzles are PEEK / GF filaments and PEEK filaments containing LDS additives. The nozzle extrusion temperature of the PEEK / GF filament nozzle is 420°C, and the nozzle extrusion temperature of the PEEK filament containing LDS additives is 400°C. The LDS additive component in the PEEK filament containing LDS additives is copper chromium black, with a mass content of 1%. It is blended with resin powder using a twin-screw extruder and granulated, and extruded into a filament with a diameter of 1.75mm using a single-screw extruder. See the three-dimensional model and the layout of the model printing and the surface metal circuit part. Figure 7, path planning and surface slicing are performed by computer, and G code is used to control the movement of the machine tool to achieve layer-by-layer additive manufacturing. The surface slicing layer height is set to 0.8mm, and the material is deposited layer by layer. First, the PEEK wire nozzle containing LDS additive is used to print the material, depositing 3 layers, and then PEEK / GF wire material is used to deposit other layers in the digital model. The chamber temperature of the 3D printer is 150℃.

[0061] Step 2: The 3D printed parts obtained in step 1 are laser activated on the specified surface according to the drawing using a femtosecond laser through a hard optical path and a three-dimensional galvanometer processing head. The central wavelength of the light source is 532nm and the output power is 7w.

[0062] Step 3: Place the 3D printed parts obtained in step 2 in deionized water for ultrasonic cleaning for 10 minutes. Then transfer to a pre-copper plating tank, perform chemical plating at 55°C for 10 minutes, and use a blower to introduce air for stirring. Then transfer to a chemical thick copper tank, perform chemical plating at 50°C for 5 hours, and use a blower to introduce air for stirring. Then, chemical gold plating is performed on the surface.

[0063] Example 5

[0064] Step 1: Use a dual-nozzle five-axis particle 3D printer to print non-developable surface samples. The five-axis 3D printer has X, Y, and Z axis travels, and the part deposition molding platform has A-axis and C-axis turntables. The materials used by the two nozzles are PEI particles and PEI particles containing LDS additives. The nozzle extrusion temperature of the dual nozzle is 370°C. The LDS additive component in the PEI particles containing LDS additives is tin dioxide, with a mass content of 10%. It is mixed with resin powder using a twin-screw extruder and then granulated. The three-dimensional model and the placement of the model printing and the surface metal circuit part are shown in Figure 8 , path planning and surface slicing are performed by computer, and G code is used to control the movement of the machine tool to achieve layer-by-layer additive manufacturing. The surface slicing layer height is set to 1.2mm, and the material is deposited layer by layer. First, the PEI particle nozzle containing LDS additive is used to print the material, deposit 1 layer, and then the PEI particle material is used to deposit other layers in the digital model. The chamber temperature of the 3D printer is 200℃.

[0065] Step 2: The 3D printed parts obtained in step 1 are laser activated on the specified surface according to the drawing using a femtosecond laser through a hard optical path and a three-dimensional galvanometer processing head. The central wavelength of the light source is 1064nm and the output power is 10w.

[0066] Step 3. Place the 3D printed parts obtained in step 2 in deionized water for ultrasonic cleaning for 20 minutes. Then transfer to the pre-copper plating tank, perform chemical plating at 55°C for 15 minutes, and use a blower to send air for stirring. Then transfer to the chemical thick copper tank, perform chemical plating at 50°C for 1 hour, and use a blower to send air for stirring. After the chemical plating is completed, use deionized water to fully clean the surface of the composite board, and after drying, perform anti-oxidation encapsulation on the circuit surface.

[0067] It should be clear that the various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. The present invention is not limited to the specific steps and structures described above and shown in the figures. In addition, for the sake of brevity, a detailed description of known methods and technologies is omitted here.

[0068] The above are only embodiments of the present application and are not limited to the present application. For those skilled in the art, the present application may have various changes and variations without departing from the scope of the present invention. Any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. A method for preparing a metal circuit on the surface of a fused deposition modeling part, characterized in that: The method comprises the following steps: 3D printing is performed on a first thermoplastic material without an LDS additive and a second thermoplastic material with an LDS additive, respectively, to obtain a molded part with an outer surface made of the second thermoplastic material and an inner portion made of the first thermoplastic material; According to the metal circuit diagram, the surface of the molded part is laser activated; The surface of the laser-activated molded part is chemically plated to prepare a surface metal circuit.

2. The method for preparing a metal circuit on the surface of a fused deposition modeling part according to claim 1, characterized in that: The first thermoplastic material and / or the second thermoplastic material include at least one of polycarbonate, polylactic acid, polyamide, ABS resin, liquid crystal polymer, polyphenylene sulfide, polyarylate, polyethersulfone, polyaryletherketone, polyetheretherketone, polyetherketoneketone, polyethersulfoneketone, polyetherimide, and thermoplastic polyimide.

3. The method for preparing metal circuits on the surface of a fused deposition modeling part according to claim 2, characterized in that: The first thermoplastic material and the second thermoplastic material are the same type of resin raw material.

4. The method for preparing a metal circuit on the surface of a fused deposition modeling part according to claim 1, characterized in that: The LDS additive includes at least one of copper metal salts, tin metal salts, titanium metal salts, copper oxides, tin oxides and titanium oxides.

5. The method for preparing metal circuits on the surface of a fused deposition modeling part according to claim 4, characterized in that: The LDS additive includes at least one of basic copper phosphite, copper chrome black, arsenic trioxide and tin dioxide.

6. The method for preparing metal circuits on the surface of a fused deposition modeling part according to claim 1, characterized in that: The content of the LDS additive is 0.1% to 30%wt.

7. The method for preparing metal circuits on the surface of a fused deposition modeling part according to claim 1, characterized in that: A pulse laser is used to perform laser activation on the surface of the molded part.

8. The method for preparing metal circuits on the surface of a fused deposition modeling part according to claim 7, characterized in that: The central wavelength of the light source of the pulse laser is 355-1064nm.

9. The method for preparing metal circuits on the surface of a fused deposition modeling part according to claim 7, characterized in that: The output power of the pulse laser is 0.1-100W.

10. The method for preparing metal circuits on the surface of a fused deposition modeling part according to claim 1, characterized in that: The surface of the laser-activated molded part is chemically plated to prepare a surface metal circuit, specifically: The surface of the formed part is ultrasonically cleaned, and then the formed part is placed in a pre-chemical plating solution for multi-step chemical plating.

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