Optical engine packaging structure with detachable optical fiber array

By designing a detachable fiber array packaging structure in the optoelectronic module, the adapter block, overhang segment and lens structure can achieve high coupling accuracy between the fiber array and the silicon optical chip, solving the installation complexity and coupling of the optical fiber array in the prior art. The problem of accuracy enables the stable and flexible installation of optical fiber arrays.

CN119126316AActive Publication Date: 2024-12-13SHUNYUN TECH (ZHONG SHAN) LTD

Patent Information

Application Number
CN202411402205.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-10-09
Publication Date
2024-12-13
Estimated Expiration
2044-10-09

AI Technical Summary

Technical Problem

The optical fiber array of the optical electronic module in the prior art is complex in installation structure, and it is difficult to ensure the coupling accuracy between the optical fiber array and the silicon optical chip after disassembly and assemble.

Method used

An optical engine packaging structure with a detachable fiber array is designed, including substrates, electric chips, silicon optical chips, fixed seats and fiber arrays. The accurate installation and high coupling of the fiber array are achieved through adapter blocks, overhang segments and lens structures. Accuracy, simplifying the installation process with grooves and card firmware.

Benefits of technology

It realizes high coupling accuracy and flexible disassembly and installation between the optical fiber array and the silicon optical chip, simplifies the installation structure, and ensures the stable reliability and precise positioning of the optical fiber array.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to the technical field of optical engines, and discloses an optical engine packaging structure with a detachable optical fiber array, the optical engine packaging structure comprises a substrate, an electric chip, a silicon optical chip, a fixed seat and the optical fiber array, the electric chip, the silicon optical chip and the fixed seat are all mounted on one side of the substrate, and the electric chip and the silicon optical chip are electrically connected with the substrate; a groove is formed in the side face of the fixing base, an adapter block is installed at the end of the optical fiber array, the adapter block is detachably installed in the groove in the direction perpendicular to the side face of the substrate, the adapter block comprises a limiting section and an overhanging section which are fixedly connected, and the limiting section is in concave-convex fit with the groove; the overhanging section protrudes towards one side close to the silicon optical chip, the overhanging section and the silicon optical chip are opposite up and down, a lens structure is further installed between the end face, corresponding to the silicon optical chip, of the overhanging section and the silicon optical chip, and the lens structure is in light conduction connection with the optical fiber array and the silicon optical chip; the fixing base is detachably provided with a clamping piece, and the clamping piece and the switching block are in fastening fit in the direction perpendicular to the side face of the base plate.
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Description

Technical Field

[0001] The present invention relates to the technical field of optical engines, and in particular to an optical engine packaging structure with a detachable optical fiber array. Background Art

[0002] At present, in optical communication systems, the optical engine is the core component for optical signal conversion, and its performance has a close impact on the transmission rate and stability of the optical communication system. In order to maintain, upgrade or replace components of the optical engine, the optical fiber of the optical engine needs to be detachable.

[0003] For example, a Chinese utility model patent with authorization announcement number CN209560165U and authorization announcement date 2019.10.29 discloses an optoelectronic module with a silicon-based optical base, which specifically includes a circuit board, a rectangular mounting frame fixed on the top of the circuit board, an optical base fixed on the circuit board is provided inside the mounting frame, a positioning groove opened on the circuit board is provided on one side of the mounting frame, and one end of the positioning groove extends to the edge of the circuit board, a mounting plate is slidably connected to the bottom inner wall of the positioning groove, an optical fiber fixing plate is slidably connected to the top of the mounting plate, a connection seat is equidistantly installed on the left side of the optical fiber fixing plate, and an equidistantly arranged connection line is connected to the right side of the optical base. When maintenance or replacement is required, the optical fiber fixing plate can be slid out along the slide groove to facilitate reinstallation, arrangement or replacement of the optical fiber on the optical fiber fixing plate.

[0004] However, the optical fiber array installation structure of the optoelectronic module in the prior art is complex, and it is difficult to ensure the coupling accuracy between the optical fiber array and the silicon photonic chip after disassembly and assembly. Summary of the invention

[0005] The technical problem to be solved by the present invention is that the optical fiber array installation structure of the optoelectronic module in the prior art is complex, and it is difficult to ensure the coupling accuracy between the optical fiber array and the silicon photonic chip after disassembly and assembly.

[0006] In order to solve the above technical problems, the present invention provides a technical solution for a light engine packaging structure with a detachable optical fiber array:

[0007] The optical engine packaging structure of the detachable optical fiber array comprises a substrate, an electric chip, a silicon photonic chip, a fixing seat and an optical fiber array, wherein the electric chip, the silicon photonic chip and the fixing seat are all mounted on one side of the substrate, and the electric chip and the silicon photonic chip are electrically connected to the substrate respectively;

[0008] A groove is provided on the side of the fixing seat away from the substrate, and an adapter block is installed at the end of the optical fiber array. The adapter block is detachably installed in the groove along a direction perpendicular to the side of the substrate, and the adapter block includes a fixedly connected limiting section and an overhanging section, and the limiting section is matched with the groove in a concave-convex manner;

[0009] The overhang section is protruding toward a side close to the silicon photonic chip, and the overhang section and the silicon photonic chip are arranged opposite to each other up and down. A lens structure is also installed between the end face of the overhang section corresponding to the silicon photonic chip and the silicon photonic chip, and the lens structure is optically connected to the optical fiber array and the silicon photonic chip respectively;

[0010] A clamping piece is detachably mounted on a side of the fixing seat away from the base plate, and the clamping piece is tightly matched with the adapter block along a side direction perpendicular to the base plate.

[0011] Furthermore, the groove is a long through groove, the length direction of the groove extends in a direction close to the silicon photonic chip, the side wall of the groove is provided with a guide portion, and the outer side of the limiting section is also provided with a positioning portion, and the positioning portion and the guide portion are guided and matched along a side direction perpendicular to the substrate.

[0012] Furthermore, two guiding parts are provided, and the two guiding parts are arranged opposite to each other along the width direction of the groove, and two positioning parts are also provided, and the two positioning parts are arranged opposite to each other along the width direction of the adapter block.

[0013] Furthermore, the guiding portion is a V-shaped guiding groove, the opening of which is arranged toward the inner side of the groove, and the positioning portion is a semi-cylindrical protrusion, the height direction of which is extended along a direction perpendicular to the side direction of the substrate.

[0014] Furthermore, the shape of the overhang section is a right-angled trapezoid, and a slanted side surface is provided on a side of the overhang section close to the fixing seat, and the slanted side surface is inclined in a direction away from the side surface of the substrate toward a side close to the fixing seat.

[0015] Furthermore, the lens structure is provided with two lenses, namely a first lens and a second lens. The first lens is installed on the end face of the overhang section corresponding to the silicon photonic chip, and the second lens is installed on the side of the silicon photonic chip away from the substrate, and the first lens and the second lens are arranged with an interval up and down.

[0016] Furthermore, the fixing seat is provided with flanges on both sides corresponding to the width direction of the groove, and the clamping piece is a U-shaped clamping piece, and both sides of the U-shaped clamping piece are provided with inwardly turned edges, and the flange and the inwardly turned edges are stopped and matched in a direction perpendicular to the side of the substrate.

[0017] Furthermore, the U-shaped clamping member is made by bending an elastic sheet, and the side walls of the U-shaped clamping member are respectively clamped and matched with the flange along the width direction of the groove.

[0018] Furthermore, the fixing seat is made of glass material, the bottom surface of the groove is provided with a frosted surface, the roughness of the frosted surface is between 0.03mm and 0.1mm, and the limiting section is also provided with a smooth surface facing the bottom surface of the groove, and the smooth surface is in contact with the frosted surface.

[0019] Furthermore, a plurality of optical fiber channels are provided inside the adapter block, and the optical fiber channels are smoothly arranged from the limiting section to the overhanging section corresponding to the end face of the silicon photonic chip, and a step portion is also provided on the side of the limiting section away from the groove, the optical fiber array is bonded and fixed to the step portion, and a plurality of fiber cores of the optical fiber array are respectively installed in the optical fiber channels.

[0020] Compared with the prior art, the optical engine packaging structure of a detachable optical fiber array of the present invention has the following beneficial effects: the optical engine packaging structure of the detachable optical fiber array adopts a design form of a substrate, an electric chip, a silicon photonic chip, a fixing seat, an optical fiber array and a switching block, and the electric chip, the silicon photonic chip and the fixing seat are all installed on one side of the substrate, wherein the electric chip integrates the driver and TIA functions, and the silicon photonic chip integrates the modulator, the multiplexer, the demultiplexer and the grating waveguide and other structures, and the electric chip and the silicon photonic chip are both arranged on the substrate by a flip-chip connection method, thereby realizing the electrical connection between the electric chip, the silicon photonic chip and the substrate.

[0021] In addition, a groove is provided on the side of the fixing seat away from the substrate, and an adapter block is installed at the end of the optical fiber array. The adapter block can be detachably installed in the groove along the side direction perpendicular to the substrate. The adapter block includes a limiting section and an overhanging section. The limiting section of the adapter block and the groove of the fixing seat form a concave-convex fit, so that the optical fiber array can be accurately detachably installed on the fixing seat. The groove plays a role in limiting the position of the adapter block and the optical fiber array. A clamping fixture is detachably installed on the side of the fixing seat away from the substrate, which simplifies the design of the installation structure. The clamping fixture can produce a tightening effect on the adapter block in the side direction perpendicular to the substrate, ensuring the stability and reliability of the installation position of the optical fiber array.

[0022] In addition, the overhang section and the silicon photonic chip are arranged opposite to each other up and down, and a lens structure is installed between the end face of the overhang section corresponding to the silicon photonic chip and the silicon photonic chip, and the lens structure is optically connected to the optical fiber array and the silicon photonic chip respectively. The lens structure forms a conductive optical path between the optical fiber array and the silicon photonic chip, ensuring that the silicon photonic chip can accurately send optical signals to the optical fiber array and effectively receive optical signals transmitted by the optical fiber array. While meeting the flexible disassembly and installation of the optical fiber array, the purpose of disassembly and replacement of the optical fiber array and the silicon photonic chip with high coupling accuracy is achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1is a structural schematic diagram of an optical engine packaging structure of a detachable optical fiber array in an embodiment of the present invention applied to an optical module;

[0024] Figure 2 is a three-dimensional schematic diagram of a light engine packaging structure of a detachable optical fiber array in an embodiment of the present invention;

[0025] Figure 3 is a disassembled schematic diagram of a light engine packaging structure of a detachable optical fiber array in an embodiment of the present invention;

[0026] Figure 4 is a schematic diagram of the assembly of a light engine packaging structure of a detachable optical fiber array in an embodiment of the present invention;

[0027] In the figure: 1-substrate, 2-electric chip, 3-silicon photonic chip, 30-lens structure, 31-first lens, 32-second lens, 4-fixed seat, 40-groove, 41-guide part, 42-flange, 5-optical fiber array, 50-adapter block, 51-limiting section, 52-overhang section, 53-positioning part, 54-step part, 6-clamping fixture, 60-inner flange. DETAILED DESCRIPTION

[0028] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0029] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like used in the present invention to indicate the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention.

[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0031] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] like Figures 1 to 4 As shown, a light engine packaging structure of a detachable optical fiber array according to an embodiment of the present invention includes a substrate 1, an electric chip 2, a silicon photonic chip 3, a fixing seat 4 and an optical fiber array 5. The electric chip 2, the silicon photonic chip 3 and the fixing seat 4 are all installed on one side of the substrate 1, and the electric chip 2 and the silicon photonic chip 3 are electrically connected to the substrate 1 respectively; a groove 40 is provided on the side of the fixing seat 4 away from the substrate 1, and an adapter block 50 is installed at the end of the optical fiber array 5, and the adapter block 50 can be detachably installed in the groove 40 along a side direction perpendicular to the substrate 1.

[0033] The adapter block 50 includes a limit section 51 and an overhang section 52 that are fixedly connected, and the limit section 51 is concavely matched with the groove 40; the overhang section 52 is protruded toward the side close to the silicon photonic chip 3, and the overhang section 52 and the silicon photonic chip 3 are arranged opposite to each other up and down, and a lens structure 30 is also installed between the end face of the overhang section 52 corresponding to the silicon photonic chip 3 and the silicon photonic chip 3, and the lens structure 30 is optically connected to the optical fiber array 5 and the silicon photonic chip 3 respectively; the side of the fixed seat 4 away from the substrate 1 is detachably equipped with a clamping fixture 6, and the clamping fixture 6 is tightly matched with the adapter block 50 along the side direction perpendicular to the substrate 1.

[0034] The optical engine packaging structure of the detachable optical fiber array adopts a design form of a substrate 1, an electric chip 2, a silicon photonic chip 3, a fixing seat 4, an optical fiber array 5 and a transfer block 50. The electric chip 2, the silicon photonic chip 3 and the fixing seat 4 are all installed on one side of the substrate 1, wherein the electric chip 2 integrates the driver and TIA functions, and the silicon photonic chip 3 integrates the modulator, multiplexer, demultiplexer and grating waveguide structures. The electric chip 2 and the silicon photonic chip 3 are both arranged on the substrate 1 by a flip-chip connection method, thereby realizing the electrical connection between the electric chip 2, the silicon photonic chip 3 and the substrate 1.

[0035] In addition, a groove 40 is provided on the side of the fixing seat 4 away from the substrate 1, and an adapter block 50 is installed at the end of the optical fiber array 5. The adapter block 50 can be detachably installed in the groove 40 along the side direction perpendicular to the substrate 1. The adapter block 50 includes a limiting section 51 and an overhanging section 52. The limiting section 51 of the adapter block 50 forms a concave-convex fit with the groove 40 of the fixing seat 4, so that the optical fiber array 5 can be accurately and detachably installed on the fixing seat 4. The groove 40 plays a role in limiting the position of the adapter block 50 and the optical fiber array 5. A clamping fixture 6 is detachably installed on the side of the fixing seat 4 away from the substrate 1, which simplifies the design of the installation structure. The clamping fixture 6 can produce a tightening effect on the adapter block 50 in the side direction perpendicular to the substrate 1, ensuring the stability and reliability of the installation position of the optical fiber array 5.

[0036] In addition, the overhang section 52 and the silicon photonic chip 3 are arranged opposite to each other in the vertical direction, and a lens structure 30 is installed between the end face of the overhang section 52 corresponding to the silicon photonic chip 3 and the silicon photonic chip 3, and the lens structure 30 is optically connected to the optical fiber array 5 and the silicon photonic chip 3 respectively. The lens structure 30 forms a conductive optical path between the optical fiber array 5 and the silicon photonic chip 3, ensuring that the silicon photonic chip 3 can accurately send optical signals to the optical fiber array 5 and effectively receive optical signals transmitted by the optical fiber array 5. While meeting the flexible disassembly and installation of the optical fiber array 5, the purpose of high coupling accuracy between the disassembly and replacement of the optical fiber array 5 and the silicon photonic chip 3 is achieved.

[0037] In this embodiment, the groove 40 is a long through groove, and the length direction of the groove 40 extends toward the direction close to the silicon photonic chip 3. The side wall of the groove 40 is provided with a guide portion 41, and the outer side of the limit section 51 is also provided with a positioning portion 53, and the positioning portion 53 and the guide portion 41 are guided and matched along the side direction perpendicular to the substrate 1. Specifically, there are two guide portions 41, and the two guide portions 41 are arranged oppositely along the width direction of the groove 40. There are also two positioning portions 53, and the two positioning portions 53 are arranged oppositely along the width direction of the adapter block 50. The guide portion 41 of the groove 40 and the positioning portion 53 of the limit section 51 are used for guiding and matching, so as to ensure the accuracy of the disassembly and installation position of the adapter block 50 and the optical fiber array 5.

[0038] As a further preferred solution, the guide portion 41 is a V-shaped guide groove, the opening of which is arranged toward the inner side of the groove 40, and the positioning portion 53 is a semi-cylindrical protrusion, the height direction of which is arranged to extend along a direction perpendicular to the side of the substrate 1. The V-shaped guide groove and the semi-cylindrical protrusion not only play a good guiding and matching role, but the V-shaped guide groove can also effectively accommodate the deviation of the shape.

[0039] The shape of the overhang section 52 is a right-angled trapezoid, and a side of the overhang section 52 close to the fixing seat 4 is provided with an inclined side surface, and the inclined side surface is inclined toward the side close to the fixing seat 4 in the side direction away from the substrate 1. The overhang section 52 adopts a right-angled trapezoidal design, which shortens the vertical distance between the end face of the overhang section 52 corresponding to the silicon photonic chip 2 and the silicon photonic chip 3, improves the transmission efficiency and accuracy of the optical signal, and also avoids interference with the fixing seat 5 through the inclined side surface of the overhang section 52.

[0040] In this embodiment, the lens structure 30 is provided with two lenses, namely, the first lens 31 and the second lens 32. The first lens 31 is installed on the end face of the overhang section 52 corresponding to the silicon photonic chip 3, and the second lens 32 is installed on the side of the silicon photonic chip 3 away from the substrate 1, and the first lens 31 and the second lens 32 are arranged vertically and spaced apart. The first lens 31 and the second lens 32 are arranged between the optical fiber array 5 and the silicon photonic chip 3, which play a role in collimating and focusing the optical signal, ensuring that the new optical fiber array 5 can form an accurate optical signal conduction transmission relationship with the silicon photonic chip 3 after disassembly and replacement.

[0041] In this embodiment, flanges 42 are provided on both sides of the width direction of the groove 40 of the fixing seat 4, and the clamping member 6 is a U-shaped clamping member 6. Inner flanges 60 are provided on both sides of the U-shaped clamping member 6, and the flanges 42 and the inner flanges 60 are blocked and matched along the side direction perpendicular to the substrate 1. It should be noted that the U-shaped clamping member 6 is made of a bent elastic sheet, and the side walls of the U-shaped clamping member 6 are clamped and matched with the flanges 42 along the width direction of the groove 40. When disassembling, the U-shaped clamping member 6 can be opened to make the inner flanges 60 on both sides separate from the flanges 42 of the fixing seat 4, so that the U-shaped clamping member 6 and the optical fiber array 5 can be removed smoothly. After replacing and installing a new optical fiber array 5, the U-shaped clamping member 6 is clamped on the flange 42 of the fixing seat 4, so that the installation position of the optical fiber array 5 can be reliably defined.

[0042] In this embodiment, the fixing seat 4 is made of glass material, the bottom surface of the groove 40 is provided with a frosted surface, the roughness of the frosted surface is between 0.03mm and 0.1mm, and the bottom surface of the limiting section 51 facing the groove 40 is also provided with a smooth surface, and the smooth surface fits with the frosted surface. The roughness of the frosted surface of the groove 40 is 0.03mm to 0.1mm, which can accommodate tiny particles and impurities and avoid inclusions that lead to inadequate fitting, and the frosted surface has a higher fit with the smooth surface of the limiting section 51, thereby improving the installation accuracy of the optical fiber array 5.

[0043] In addition, a plurality of optical fiber channels are arranged inside the adapter block 50, and the optical fiber channels are arranged smoothly from the limit section 51 to the overhang section 52 corresponding to the end face of the silicon photonic chip 3, and a step portion 54 is also provided on the side of the limit section 51 away from the groove 40, and the optical fiber array 5 is bonded and fixed on the step portion 54, and the plurality of fiber cores of the optical fiber array 5 are respectively installed in the optical fiber channels. Since the optical fiber channels are arranged inside the adapter block 50, it is ensured that the optical fiber array 5 forms a smooth transition from the step portion 54 of the adapter block 50 to the first lens 31 on the end face, thereby improving the transmission stability of the optical signal.

[0044] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.

Claims

1. A light engine packaging structure with a detachable optical fiber array, characterized in that: It includes a substrate, an electric chip, a silicon photonic chip, a fixing seat and an optical fiber array, wherein the electric chip, the silicon photonic chip and the fixing seat are all installed on one side of the substrate, and the electric chip and the silicon photonic chip are electrically connected to the substrate respectively; A groove is provided on the side of the fixing seat away from the substrate, and an adapter block is installed at the end of the optical fiber array. The adapter block is detachably installed in the groove along a direction perpendicular to the side of the substrate, and the adapter block includes a fixedly connected limiting section and an overhanging section, and the limiting section is matched with the groove in a concave-convex manner; The overhang section is protruding toward a side close to the silicon photonic chip, and the overhang section and the silicon photonic chip are arranged opposite to each other up and down. A lens structure is also installed between the end face of the overhang section corresponding to the silicon photonic chip and the silicon photonic chip, and the lens structure is optically connected to the optical fiber array and the silicon photonic chip respectively; A clamping piece is detachably mounted on a side of the fixing seat away from the base plate, and the clamping piece is tightly matched with the adapter block along a side direction perpendicular to the base plate.

2. The light engine packaging structure of the detachable optical fiber array according to claim 1, characterized in that: The groove is a long through groove, and the length direction of the groove extends in the direction close to the silicon photonic chip. The side wall of the groove is provided with a guide part, and the outer side of the limiting section is also provided with a positioning part. The positioning part and the guide part are guided and matched along the side direction perpendicular to the substrate.

3. The light engine packaging structure of the detachable optical fiber array according to claim 2, characterized in that: There are two guide parts, which are arranged opposite to each other along the width direction of the groove. There are also two positioning parts, which are arranged opposite to each other along the width direction of the adapter block.

4. The light engine packaging structure of the detachable optical fiber array according to claim 2, characterized in that: The guiding portion is a V-shaped guiding groove, the opening of which is arranged toward the inner side of the groove, and the positioning portion is a semi-cylindrical protrusion, the height direction of which is extended along a direction perpendicular to the side direction of the substrate.

5. The light engine packaging structure of the detachable optical fiber array according to claim 1, characterized in that: The overhang section is in the shape of a right-angled trapezoid. A side of the overhang section close to the fixing seat is provided with an inclined side surface, and the inclined side surface is inclined in a direction away from the side surface of the substrate toward a side close to the fixing seat.

6. The light engine packaging structure of the detachable optical fiber array according to claim 1, characterized in that: The lens structure is provided with two lenses, namely a first lens and a second lens. The first lens is installed on the end face of the overhanging section corresponding to the silicon photonic chip, and the second lens is installed on the side of the silicon photonic chip away from the substrate, and the first lens and the second lens are arranged with an interval up and down.

7. The light engine packaging structure of the detachable optical fiber array according to claim 1, characterized in that: The fixing seat is provided with flanges on both sides of the width direction of the groove, and the clamping piece is a U-shaped clamping piece. Both sides of the U-shaped clamping piece are provided with inner flanges, and the flanges and the inner flanges are stopped and matched perpendicular to the side direction of the substrate.

8. The light engine packaging structure of the detachable optical fiber array according to claim 7, characterized in that: The U-shaped clamping member is made by bending an elastic sheet, and the side walls of the U-shaped clamping member are respectively clamped and matched with the flange along the width direction of the groove.

9. The light engine packaging structure of the detachable optical fiber array according to claim 1, characterized in that: The fixing seat is made of glass material, the bottom surface of the groove is provided with a frosted surface, the roughness of the frosted surface is between 0.03mm and 0.1mm, and the bottom surface of the limiting section facing the groove is also provided with a smooth surface, and the smooth surface is in contact with the frosted surface.

10. The light engine packaging structure of the detachable optical fiber array according to claim 1, characterized in that: A plurality of optical fiber channels are arranged inside the adapter block. The optical fiber channels are smoothly arranged from the limiting section to the overhanging section corresponding to the end face of the silicon photonic chip. A step portion is also provided on the side of the limiting section away from the groove. The optical fiber array is bonded and fixed to the step portion, and a plurality of fiber cores of the optical fiber array are respectively installed in the optical fiber channels.

Citation Information

Patent Citations

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    CN104570240A

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