Automatic laser solder ball welding equipment for ball grid array packaging chip

Abstract

The invention provides automatic laser solder ball welding equipment for a ball grid array packaging chip, two jig driving assemblies are mounted on a mounting platform, and two chip jigs are mounted on the two jig driving assemblies respectively and move along a first direction under the driving of the jig driving assemblies. The welding device is installed on the welding driving assembly and driven by the welding driving assembly to move in the second direction. The detection driving assembly is installed on the installation platform, and the positioning assembly and the detection assembly are both installed on the detection driving assembly and are driven by the detection driving assembly to move in the second direction or the third direction. According to the automatic laser solder ball welding equipment for the ball grid array packaging chip, welding and detection can be synchronously carried out through the two jig driving assemblies and the two chip jigs, and compared with the related technology, continuous welding can be carried out, the welding efficiency is greatly improved, and the automation degree is high.

Description

Technical Field

[0001] The present application relates to the field of automatic welding technology, and in particular to an automatic laser solder ball welding device for ball grid array packaged chips. Background Art

[0002] Ball Grid Array (BGA) is a packaging technology for integrated circuits (ICs) that connects to circuit boards by soldering a series of solder balls on the bottom of the chip. BGA packaging has a high density and a low package height, making it suitable for high-performance integrated circuit packaging.

[0003] During the packaging process, due to the large number of solder balls, automatic welding equipment is usually used to weld a series of solder balls to improve welding efficiency. In the related art, when using automatic welding equipment to package chips, it is necessary to use a jig to fix the chip and complete the packaging at the welding station. After the packaging is completed, the jig drives the chip into the inspection station to detect whether the package is qualified. However, during the inspection process, the welding station is idle, and the jig needs to wait until the chip inspection is completed before it can be used to fix the next chip, resulting in a significant reduction in welding efficiency. Summary of the invention

[0004] The purpose of the embodiments of the present application is to provide an automatic laser solder ball welding device for ball grid array packaged chips to solve the technical problem in the prior art that the fixture needs to wait until the chip detection is completed before it can be used to fix the next chip, which greatly reduces the welding efficiency.

[0005] To achieve the above purpose, the technical solution adopted by the present application is to provide an automatic laser solder ball welding device for ball grid array package chips, comprising: Installation platform; A chip transport mechanism, the chip transport mechanism comprising two jig drive assemblies and two chip jigs, the two jig drive assemblies are both mounted on the mounting platform, the two chip jigs are respectively mounted on the two jig drive assemblies, and move along a first direction under the drive of the jig drive assemblies; A chip welding mechanism, the chip welding mechanism comprising a welding drive assembly and a welder, the welding drive assembly is mounted on the mounting platform, the welder is mounted on the welding drive assembly and moves along the second direction under the drive of the welding drive assembly; A chip detection mechanism, the chip detection mechanism includes a detection drive component, a positioning component and a detection component, the detection drive component is installed on the installation platform, the positioning component and the detection component are both installed on the detection drive component, and move along the second direction or the third direction under the drive of the detection drive component.

[0006] Optionally, the chip jig includes a jig frame, a chip placement plate, a negative pressure chamber, a plurality of adsorption holes and a vacuum generator, the jig frame is mounted on the jig drive assembly, the chip placement plate is mounted on the jig frame, the negative pressure chamber is opened on the chip placement plate, a plurality of adsorption holes are opened on the chip placement plate and are connected to the negative pressure chamber, the vacuum generator is mounted on the chip placement plate, and is configured to form a negative pressure in the negative pressure chamber when the chip is placed on the surface of the chip placement plate.

[0007] Optionally, the negative pressure chamber and the vacuum generator are both provided in plurality; the chip placement plate comprises a first plate body and at least one second plate body, at least one second plate body is clamped to the first plate body, and is enclosed with the first plate body to form a plurality of the negative pressure chambers.

[0008] Optionally, the chip fixture also includes a correction baffle, which is installed on the chip placement plate; the correction baffle includes a first baffle and a second baffle, the first baffle is installed on the chip placement plate and limits the chip along a first direction, and the second baffle is connected to one end of the first baffle and limits the chip along a second direction.

[0009] Optionally, the detection drive assembly includes a first detection drive member and a second detection drive member, the first detection drive member is installed on the mounting platform, the second detection drive member is installed on the first detection drive member, and moves along the second direction under the drive of the first detection drive member, and is also configured to drive the positioning assembly and the detection assembly to move along a third direction.

[0010] Optionally, the first detection drive component includes a detection guide rail, a first detection slider, two detection anti-collision blocks and two detection accordion covers, the detection guide rail is installed on the mounting platform, the first detection slider can be slidably installed on the detection guide rail, the two detection anti-collision blocks are respectively installed at both ends of the detection guide rail, and the two detection accordion covers are respectively installed at both ends of the first detection slider and cover the detection guide rail.

[0011] Optionally, the second detection drive member includes a first detection platform, a detection driver, a detection screw, a second detection slider and a second detection platform, the first detection platform is installed on the first detection drive member, the detection driver is installed on the first detection platform, the detection screw is installed on the output end of the detection driver, and rotates around a third direction under the drive of the detection driver, the second detection slider is passed through the detection screw, and is threadedly connected to the detection screw, and is held against the first detection platform, and the second detection platform is installed on the second detection slider.

[0012] Optionally, the positioning component includes a positioning camera, a positioning lens and a positioning light source, the positioning camera is installed on the welding drive component, the positioning lens is installed on the positioning camera, and the positioning light source is installed on the welding drive component; the detection component includes a detection camera, a detection lens and a detection light source, the detection camera is installed on the welding drive component, the detection lens is installed on the detection camera, and the detection light source is installed on the welding drive component.

[0013] Optionally, the jig drive assembly includes a jig guide rail, a jig slider, two jig anti-collision blocks and two jig accordion covers, the jig guide rail is installed on the mounting platform, the jig slider is slidably installed on the jig guide rail, the two jig anti-collision blocks are respectively installed at both ends of the jig guide rail, and the two jig accordion covers are respectively installed at both ends of the jig slider and cover the jig guide rail.

[0014] Optionally, the welding drive assembly includes a welding guide rail, a welding slider, two welding anti-collision blocks and two welding accordion covers, the welding guide rail is installed on the mounting platform, the welding slider can be slidably installed on the welding guide rail, the two welding anti-collision blocks are respectively installed at both ends of the welding guide rail, and the two welding accordion covers are respectively installed at both ends of the welding slider and cover the welding guide rail.

[0015] The beneficial effects of the automatic laser solder ball welding equipment for ball grid array package chips provided by the present application are: The automatic laser solder ball welding equipment for ball grid array packaged chips provided in the present application can perform welding and detection simultaneously through two fixture drive components and two chip fixtures. Compared with related technologies, it can perform welding continuously, greatly improving welding efficiency and having a high degree of automation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0017] Figure 1 A first-perspective stereoscopic image of an automatic laser solder ball welding device for ball grid array package chips provided in an embodiment of the present application; Figure 2 A second perspective stereoscopic image of the automatic laser solder ball welding device for ball grid array package chips provided in an embodiment of the present application; Figure 3A three-dimensional diagram of a chip fixture of an automatic laser solder ball welding device for a ball grid array package chip provided in an embodiment of the present application; Figure 4 An exploded diagram of a chip fixture of an automatic laser solder ball welding device for a ball grid array package chip provided in an embodiment of the present application; Figure 5 A first board plan view of the automatic laser solder ball welding equipment for ball grid array package chips provided in an embodiment of the present application; Figure 6 for Figure 2 A partial enlarged view of the middle A; Figure 7 A three-dimensional diagram of the automatic laser solder ball welding equipment for ball grid array package chips provided in an embodiment of the present application, excluding the chip fixture, welder, positioning assembly and detection assembly; Figure 8 for Figure 7 A partial enlarged view of point B in the middle; Fig. 9 for Figure 7 A partial enlarged view of point C in the middle.

[0018] Among them, the reference numerals in the figure are: 1. Installation platform; 2. Chip transport mechanism; 21. Jig drive assembly; 211. Jig guide rail; 212. Jig slider; 213. Jig anti-collision block; 214. Jig accordion cover; 22. Chip jig; 221. Jig rack; 222. Chip placement plate; 2221. First plate body; 2222. Second plate body; 223. Negative pressure chamber; 224. Adsorption hole; 225. Vacuum generator; 226. Correction bar; 2261. First bar; 2262. Second bar; 3. Chip welding mechanism; 31. Welding drive assembly; 311. Welding guide rail; 312. Welding slider; 313. Welding anti-collision block; 314. Welding accordion cover; 32. Welding device; 4. Chip detection mechanism; 41. Detection drive assembly; 411. First detection drive member; 4111. Detection guide rail; 4112. First detection slider; 4113. Detection accordion cover; 412. Second detection drive member; 4121. First detection platform; 4122. Detection driver; 4123. Detection screw rod; 4124. Second detection slider; 4125. Second detection platform; 42. Positioning assembly; 421. Positioning camera; 422. Positioning lens; 423. Positioning light source; 43. Detection assembly; 431. Detection camera; 432. Detection lens; 433. Detection light source. DETAILED DESCRIPTION

[0019] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0020] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0021] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0022] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0023] The present application provides an automatic laser solder ball welding device for ball grid array package chips, comprising a mounting platform 1, a chip transport mechanism 2, a chip welding mechanism 3 and a chip detection mechanism 4. The chip transport mechanism 2 comprises two jig drive components 21 and two chip jigs 22, both of which are mounted on the mounting platform 1, and the two chip jigs 22 are respectively mounted on the two jig drive components 21, and move along the first direction under the drive of the jig drive component 21. The chip welding mechanism 3 comprises a welding drive component 31 and a welder 32, the welding drive component 31 is mounted on the mounting platform 1, and the welder 32 is mounted on the welding drive component 31, and moves along the second direction under the drive of the welding drive component 31. The chip detection mechanism 4 comprises a detection drive component 41, a positioning component 42 and a detection component 43, the detection drive component 41 is mounted on the mounting platform 1, and the positioning component 42 and the detection component 43 are both mounted on the detection drive component 41, and move along the second direction or the third direction under the drive of the detection drive component 41.

[0024] It should be noted that the first direction mentioned above and below refers to the bidirectional direction of the shortest connection line between the two ends of the fixture drive assembly 21. Figure 1 The second direction above and below refers to the bidirectional direction of the shortest line between the two ends of the welding drive assembly 31, as shown in FIG. Figure 1 The third direction above and below refers to the bidirectional direction of the shortest connection line between the two ends of the detection drive component 41, as shown in FIG. Figure 1 The Z axis shown in .

[0025] The working principle of this embodiment is as follows: the chip to be welded is placed on one of the chip jigs 22, and the chip to be welded is fixed by the chip jig 22. Driven by the jig drive component 21, the chip jig 22 moves to the bottom of the welder 32 along the first direction. Under the action of the welder 32, the welder 32 welds a series of solder balls on the surface of the chip. After welding is completed, the jig drive component 21 drives the chip jig 22 to move to the bottom of the chip detection mechanism 4 along the first direction. At the same time, another chip to be welded is placed on another chip jig 22, and is moved to the bottom of the welder 32 under the drive of the corresponding jig drive component 21, and a series of solder balls are welded by the welder 32. When the chip jig 22 moves to the bottom of the chip detection mechanism 4, the positioning component 42 positions the detection component 43 according to the chip position, and drives the detection component 43 to move to the top of the chip along the second direction through the detection drive component 41. After the detection component 43 moves to the top of the chip, the detection component 43 detects a series of solder balls welded by the welder 32.

[0026] The automatic laser solder ball welding equipment for ball grid array packaged chips provided in the present application can perform welding and detection simultaneously through two fixture driving components 21 and two chip fixtures 22. Compared with related technologies, it can perform welding continuously, greatly improving welding efficiency and having a high degree of automation.

[0027] In one embodiment of the present application, see Figure 1 The chip fixture 22 includes a fixture frame 221, a chip placement plate 222, a negative pressure chamber 223, a plurality of adsorption holes 224 and a vacuum generator 225. The fixture frame 221 is installed on the fixture driving assembly 21, the chip placement plate 222 is installed on the fixture frame 221, the negative pressure chamber 223 is opened on the chip placement plate 222, a plurality of adsorption holes 224 are opened on the chip placement plate 222 and are connected to the negative pressure chamber 223, the vacuum generator 225 is installed on the chip placement plate 222, and is configured to form a negative pressure in the negative pressure chamber 223 when the chip is placed on the surface of the chip placement plate 222.

[0028] It should be noted here that due to the warping of some chip surfaces, in the actual welding process, the chip is directly placed on the surface of the chip placement plate 222, and there is a large deviation in the distance between different positions of the chip and the welder 32, which can easily lead to poor welding quality.

[0029] With such a configuration, after the chip is placed on the surface of the chip placement plate 222, a negative pressure is formed in the negative pressure chamber 223 through the vacuum generator 225. The negative pressure acts on the chip through the plurality of adsorption holes 224, so that the chip is firmly fixed on the surface of the chip placement plate 222, thereby flattening the chip, making it easier for the welder 32 to weld solder balls on the chip surface, which helps to improve the welding quality.

[0030] In one embodiment of the present application, please refer to Figure 1 The negative pressure chamber 223 and the vacuum generator 225 are both provided in plurality. The chip placement plate 222 includes a first plate body 2221 and at least one second plate body 2222 , at least one second plate body 2222 is clamped to the first plate body 2221 , and encloses the first plate body 2221 to form a plurality of negative pressure chambers 223 .

[0031] With such a configuration, in the actual welding process, a corresponding number of negative pressure chambers 223 and vacuum generators 225 are selected according to the chip size, so that the chip size and the size formed by the combination of multiple negative pressure chambers 223 are roughly consistent. Compared with the related art, it is convenient for the negative pressure chamber 223 to fix the chip, prevent the situation where the adsorption area of ​​the negative pressure chamber 223 is too small, causing the chip to be easily loose, and can also prevent the situation where the adsorption area of ​​the negative pressure chamber 223 is too large, causing increased energy consumption. In addition, it can be applicable to chips of different sizes, which helps to improve the scope of application of the device. Through the first plate body 2221 and the second plate body 2222, the negative pressure chamber 223 can be enclosed to form a negative pressure chamber 223, ensuring that the chip can be adsorbed on the surface of the first plate body 2221. In addition, the first plate body 2221 and the second plate body 2222 adopt a detachable connection design, which is convenient for maintenance and replacement, and helps to improve the convenience of use.

[0032] In one embodiment of the present application, see Figure 1 The chip fixture 22 further includes a correction bar 226, which is mounted on the chip placement plate 222. The correction bar 226 includes a first bar 2261 and a second bar 2262, wherein the first bar 2261 is mounted on the chip placement plate 222 and limits the chip along the first direction, and the second bar 2262 is connected to one end of the first bar 2261 and limits the chip along the second direction.

[0033] With such a configuration, the correction bar 226 is used. After the chip is placed on the surface of the chip placement plate 222, the correction bar 226 can limit the chip in the first direction and the second direction. With the cooperation of the negative pressure chamber 223, the chip can be moved to the bottom of the welder 32 in a predetermined posture, which is convenient for the welder 32 to weld and helps to further improve the welding quality. The first bar 2261 can prevent the chip from moving in the second direction. In one embodiment of the present application, see Figure 1 The detection drive component 41 includes a first detection drive member 411 and a second detection drive member 412. The first detection drive member 411 is installed on the installation platform 1, and the second detection drive member 412 is installed on the first detection drive member 411. It moves along the second direction under the drive of the first detection drive member 411, and is also configured to drive the positioning component 42 and the detection component 43 to move along the third direction.

[0034] With such arrangement, the first detection driver 411 and the second detection driver 412, in cooperation with the positioning component 42, can be used to adjust the position of the detection component 43 so that the detection component 43 is always located directly above the chip. The distance between the chip and the detection component 43 can also be adjusted, which helps to improve the detection accuracy of the detection component 43.

[0035] In one embodiment of the present application, please refer to Figure 1 The first detection driving member 411 includes a detection guide rail 4111, a first detection slider 4112, two detection anti-collision blocks and two detection accordion covers 4113. The detection guide rail 4111 is installed on the installation platform 1. The first detection slider 4112 is slidably installed on the detection guide rail 4111. The two detection anti-collision blocks are respectively installed at both ends of the detection guide rail 4111. The two detection accordion covers 4113 are respectively installed at both ends of the first detection slider 4112 and cover the detection guide rail 4111.

[0036] With such a configuration, when the chip moves to the bottom of the detection component 43, the first detection slider 4112 moves along the detection track with the cooperation of the positioning component 42. Driven by the first detection slider 4112, the detection component 43 moves along the second direction, so that the detection component 43 can be located directly above the chip, so that the detection component 43 can be used to detect chips on different chip fixtures 22, so that welding and detection can be carried out simultaneously, which helps to improve welding efficiency and detection efficiency. The use of two detection anti-collision blocks can prevent the first detection slider 4112 from moving excessively, thereby effectively protecting the detection drive component 41, which helps to extend the service life of the detection drive component 41. The use of two detection accordion covers 4113 can be used to protect the detection guide rail 4111, prevent the detection guide rail 4111 from being damaged due to external environmental factors, and help to extend the service life of the detection guide rail 4111.

[0037] In one embodiment of the present application, see Figure 1 The second detection driving member 412 includes a first detection platform 4121, a detection driver 4122, a detection screw rod 4123, a second detection slider 4124 and a second detection platform 4125. The first detection platform 4121 is installed on the first detection driving member 411, the detection driver 4122 is installed on the first detection platform 4121, the detection screw rod 4123 is installed on the output end of the detection driver 4122, and rotates around a third direction under the drive of the detection driver 4122. The second detection slider 4124 is penetrated by the detection screw rod 4123, and is screwed to the detection screw rod 4123, and is abutted against the first detection platform 4121. The second detection platform 4125 is installed on the second detection slider 4124.

[0038] With such arrangement, after the detection component 43 and the chip are aligned, the detection driver 4122 drives the detection screw rod 4123 to rotate about the third direction, so that the second detection slider 4124 moves along the third direction. The second detection platform 4125 can drive the detection component 43 to move along the third direction, so that the distance between the detection component 43 and the chip can be adjusted, which helps to improve the detection accuracy of the detection component 43.

[0039] In one embodiment of the present application, see Figure 1 The positioning assembly 42 includes a positioning camera 421, a positioning lens 422 and a positioning light source 423. The positioning camera 421 is installed on the welding drive assembly 31, the positioning lens 422 is installed on the positioning camera 421, and the positioning light source 423 is installed on the welding drive assembly 31. The detection assembly 43 includes a detection camera 431, a detection lens 432 and a detection light source 433. The detection camera 431 is installed on the welding drive assembly 31, the detection lens 432 is installed on the detection camera 431, and the detection light source 433 is installed on the welding drive assembly 31.

[0040] With such a configuration, the positioning camera 421 can be used to photograph whether there is a chip on the thin chip transport mechanism 2. With the cooperation of the external controller, the detection component 43 can be moved to the top of the chip, so that the detection component 43 can detect the chip. The positioning lens 422 is used to help improve the shooting quality of the positioning camera 421. The positioning light source 423 is used to help further improve the shooting quality of the positioning camera 421. With the cooperation of the positioning lens 422 and the positioning light source 423, the detection component 43 can be quickly aligned with the chip. The detection camera 431 can be used to photograph the welding image of the chip. The detection lens 432 is used to help improve the shooting quality of the detection camera 431. The detection light source 433 is used to help further improve the shooting quality of the detection camera 431. With the cooperation of the detection lens 432 and the detection light source 433, the welding image captured by the detection component 43 can be made clearer, thereby helping to improve the detection accuracy of the detection component 43.

[0041] In one embodiment of the present application, please refer to Figure 1 The jig driving assembly 21 includes a jig guide rail 211, a jig slider 212, two jig anti-collision blocks 213 and two jig accordion covers 214. The jig guide rail 211 is installed on the installation platform 1, the jig slider 212 is slidably installed on the jig guide rail 211, the two jig anti-collision blocks 213 are respectively installed at both ends of the jig guide rail 211, and the two jig accordion covers 214 are respectively installed at both ends of the jig slider 212 and cover the jig guide rail 211.

[0042] With such a configuration, the chip jig 22 can be moved along the first direction to below the welder 32 or the detection assembly 43 under the cooperation of the jig guide rail 211 and the jig slider 212. The two jig anti-collision blocks 213 can prevent the jig slider 212 from moving excessively, and can buffer the jig slider 212 along the first direction, thereby effectively protecting the components of the jig drive assembly 21 and helping to extend the service life of the jig drive assembly 21. The two jig accordion covers 214 can be used to protect the jig guide rail 211 and prevent the jig guide rail 211 from being damaged by external factors, which helps to extend the service life of the jig guide rail 211.

[0043] In one embodiment of the present application, see Figure 1 The welding drive assembly 31 includes a welding guide rail 311, a welding slider 312, two welding anti-collision blocks 313 and two welding accordion covers 314. The welding guide rail 311 is installed on the installation platform 1. The welding slider 312 is slidably installed on the welding guide rail 311. The two welding anti-collision blocks 313 are respectively installed at both ends of the welding guide rail 311. The two welding accordion covers 314 are respectively installed at both ends of the welding slider 312 and cover the welding guide rail 311.

[0044] With such arrangement, with the cooperation of the welding rail 311 and the welding slider 312, the chip welding can be moved along the second direction to below the welder 32 or the detection assembly 43. The two welding anti-collision blocks 313 can prevent the welding slider 312 from moving excessively, and can buffer the welding slider 312 along the second direction, so as to effectively protect the parts of the welding drive assembly 31, which helps to extend the service life of the welding drive assembly 31. The two welding bellows 314 can be used to protect the welding rail 311, prevent the welding rail 311 from being damaged by external factors, and help to extend the service life of the welding rail 311.

[0045] One or more embodiments of the present application are intended to cover all such substitutions, modifications and variations that fall within the broad scope of the present application. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of one or more embodiments of the present application should be included in the protection scope of the present application.

Claims

1. An automatic laser solder ball welding device for ball grid array package chips, characterized in that: include: Mounting platform (1); A chip transport mechanism (2), the chip transport mechanism (2) comprising two jig drive assemblies (21) and two chip jigs (22), the two jig drive assemblies (21) being mounted on the mounting platform (1), the two chip jigs (22) being mounted on the two jig drive assemblies (21) respectively, and moving along a first direction under the drive of the jig drive assemblies (21); A chip welding mechanism (3), the chip welding mechanism (3) comprising a welding drive component (31) and a welder (32), the welding drive component (31) being mounted on the mounting platform (1), the welder (32) being mounted on the welding drive component (31) and moving along a second direction under the drive of the welding drive component (31); A chip detection mechanism (4), the chip detection mechanism (4) comprising a detection drive component (41), a positioning component (42) and a detection component (43), the detection drive component (41) being mounted on the mounting platform (1), the positioning component (42) and the detection component (43) being both mounted on the detection drive component (41), and moving along a second direction or a third direction under the drive of the detection drive component (41).

2. The automatic laser solder ball welding equipment for ball grid array package chips according to claim 1, characterized in that: The chip fixture (22) comprises a fixture frame (221), a chip placement plate (222), a negative pressure chamber (223), a plurality of adsorption holes (224) and a vacuum generator (225); the fixture frame (221) is mounted on the fixture drive assembly (21); the chip placement plate (222) is mounted on the fixture frame (221); the negative pressure chamber (223) is opened on the chip placement plate (222); the plurality of adsorption holes (224) are opened on the chip placement plate (222) and are in communication with the negative pressure chamber (223); the vacuum generator (225) is mounted on the chip placement plate (222) and is configured to form a negative pressure in the negative pressure chamber (223) when a chip is placed on a surface of the chip placement plate (222).

3. The automatic laser solder ball welding equipment for ball grid array package chips according to claim 2, characterized in that: The negative pressure chamber (223) and the vacuum generator (225) are both provided in plurality; the chip placement plate (222) comprises a first plate body (2221) and at least one second plate body (2222); at least one second plate body (2222) is snap-connected to the first plate body (2221) and encloses the first plate body (2221) to form a plurality of the negative pressure chambers (223).

4. The automatic laser solder ball welding equipment for ball grid array package chips according to claim 2, characterized in that: The chip fixture (22) further comprises a correction bar (226), wherein the correction bar (226) is mounted on the chip placement plate (222); the correction bar (226) comprises a first bar (2261) and a second bar (2262), wherein the first bar (2261) is mounted on the chip placement plate (222) and limits the chip in a first direction, and the second bar (2262) is connected to one end of the first bar (2261) and limits the chip in a second direction.

5. The automatic laser solder ball welding equipment for ball grid array package chips according to claim 1, characterized in that: The detection drive component (41) comprises a first detection drive member (411) and a second detection drive member (412), wherein the first detection drive member (411) is mounted on the mounting platform (1), and the second detection drive member (412) is mounted on the first detection drive member (411) and moves along a second direction under the drive of the first detection drive member (411), and is also configured to drive the positioning component (42) and the detection component (43) to move along a third direction.

6. The automatic laser solder ball welding equipment for ball grid array package chips according to claim 5, characterized in that: The first detection drive member (411) comprises a detection guide rail (4111), a first detection slider (4112), two detection anti-collision blocks and two detection accordion covers (4113); the detection guide rail (4111) is mounted on the mounting platform (1); the first detection slider (4112) is slidably mounted on the detection guide rail (4111); the two detection anti-collision blocks are respectively mounted at two ends of the detection guide rail (4111); and the two detection accordion covers (4113) are respectively mounted at two ends of the first detection slider (4112) and cover the detection guide rail (4111).

7. The automatic laser solder ball welding equipment for ball grid array package chips according to claim 5, characterized in that: The second detection drive member (412) comprises a first detection platform (4121), a detection driver (4122), a detection screw rod (4123), a second detection slider (4124) and a second detection platform (4125); the first detection platform (4121) is mounted on the first detection drive member (411); the detection driver (4122) is mounted on the first detection platform (4121); the detection screw rod (4123) is mounted on the output end of the detection driver (4122) and rotates around a third direction under the drive of the detection driver (4122); the second detection slider (4124) is inserted into the detection screw rod (4123) and is screwed to the detection screw rod (4123) and is abutted against the first detection platform (4121); the second detection platform (4125) is mounted on the second detection slider (4124).

8. The automatic laser solder ball welding equipment for ball grid array package chips according to claim 1, characterized in that: The positioning component (42) comprises a positioning camera (421), a positioning lens (422) and a positioning light source (423); the positioning camera (421) is mounted on the welding drive component (31); the positioning lens (422) is mounted on the positioning camera (421); and the positioning light source (423) is mounted on the welding drive component (31); the detection component (43) comprises a detection camera (431), a detection lens (432) and a detection light source (433); the detection camera (431) is mounted on the welding drive component (31); the detection lens (432) is mounted on the detection camera (431); and the detection light source (433) is mounted on the welding drive component (31).

9. The automatic laser solder ball welding equipment for ball grid array package chips according to claim 1, characterized in that: The jig drive assembly (21) comprises a jig guide rail (211), a jig slider (212), two jig anti-collision blocks (213) and two jig accordion covers (214); the jig guide rail (211) is mounted on the mounting platform (1); the jig slider (212) is slidably mounted on the jig guide rail (211); the two jig anti-collision blocks (213) are respectively mounted on two ends of the jig guide rail (211); and the two jig accordion covers (214) are respectively mounted on two ends of the jig slider (212) and cover the jig guide rail (211).

10. The automatic laser solder ball welding equipment for ball grid array package chips according to claim 1, characterized in that: The welding drive assembly (31) comprises a welding guide rail (311), a welding slider (312), two welding anti-collision blocks (313) and two welding accordion covers (314); the welding guide rail (311) is mounted on the mounting platform (1); the welding slider (312) is slidably mounted on the welding guide rail (311); the two welding anti-collision blocks (313) are respectively mounted on two ends of the welding guide rail (311); and the two welding accordion covers (314) are respectively mounted on two ends of the welding slider (312) and cover the welding guide rail (311).

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