Semiconductor function testing device based on mechatronics

Abstract

The invention belongs to the technical field of semiconductor function testing devices, and discloses a semiconductor function testing device based on mechatronics, which comprises a box body, two box doors hinged to one side of the box body, a controller arranged on one side of the upper box door, an observation window arranged below the controller, and a fixed block fixedly connected in the box body. A partition plate is fixedly connected to the top of the fixing block, a high-temperature cavity is formed in one side of the partition plate, a low-temperature cavity is formed in the other side of the partition plate, and a heating block is fixedly installed on the inner wall of the top of the high-temperature cavity. The two semiconductors are placed in the box body to be tested respectively, and the two semiconductors can be converted after being subjected to high-temperature and low-temperature testing, so that the two semiconductors do not need to be taken out independently, the high-temperature and low-temperature testing can be completed, and the semiconductors are kept dry; and water vapor in high-temperature air is prevented from being quickly condensed into water mist to be adhered to a semiconductor, so that the test effect is not influenced.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor functional testing devices, and in particular relates to a semiconductor functional testing device based on mechatronics. Background Art

[0002] The basic principle of semiconductor testing refers to a series of testing methods and technologies for testing and verifying the performance, reliability and qualification of semiconductor devices. Semiconductor devices are important components of electronic devices, including integrated circuits, transistors, diodes, etc. These devices usually need to be tested to verify their performance and quality to ensure that they can work properly in actual applications. Among them, functional testing is to test the functions of semiconductor devices to verify whether they meet the design requirements. Semiconductor high and low temperature testing has an impact on the reliability and life of semiconductors. High and low temperature test results can help manufacturers find possible problems and defects, thereby improving the quality and reliability of semiconductors.

[0003] However, in the prior art, when performing high and low temperature tests on semiconductors, it is necessary to wait until the high temperature test is completed before performing the low temperature test. When the high temperature air comes into contact with the low temperature object, the water vapor in the high temperature air will quickly condense into water mist and adhere to the semiconductor, which is not conducive to improving the test efficiency and affects the test effect. Summary of the invention

[0004] The present invention aims at the problem that in the prior art, when performing high and low temperature tests on semiconductors, it is necessary to wait until the high temperature test is completed before performing the low temperature test. When the high temperature air contacts the low temperature object, the water vapor in the high temperature air will quickly condense into water mist and adhere to the semiconductor, which is not convenient for improving the test efficiency and affects the test effect. The present invention proposes the following technical scheme: a semiconductor function testing device based on mechatronics, comprising a box body, two box doors hingedly connected to one side of the box body, a controller is arranged on one side of the box door located at the upper side, an observation window is arranged below the controller, a fixed block is fixedly connected to the inside of the box body, a partition plate is fixedly connected to the top of the fixed block, a high temperature cavity is arranged on one side of the partition plate, and a low temperature cavity is arranged on the other side thereof, a heating block is fixedly installed on the inner wall of the top of the high temperature cavity, a refrigeration block is fixedly installed on the inner wall of the top of the low temperature cavity, four discharge ports are opened on the top of the fixed block, and a first installation frame and a second installation frame are arranged on the top of the two discharge ports. A first rack is fixedly connected to one side of the frame, and a second rack is fixedly connected to one side of the second mounting frame. An installation groove is provided on the inner wall of the first mounting frame and the first rack close to the first mounting frame, and on the inner wall of the second mounting frame and the second rack close to the second mounting frame. A rotating motor is fixedly installed inside the installation groove, and an electric telescopic rod is fixedly connected to the output end of the rotating motor, and a clamping block is fixedly connected to one end of the electric telescopic rod, and a semiconductor is arranged in the middle of the clamping block. A first gear is meshed on one side of the first rack, and a second rack is meshed on one side of the first gear. The bottoms of the first rack and the second rack are evenly fixed and slidably connected to the top of the fixed block, a rotating rod is fixedly connected to the middle of the first gear, and the top of the rotating rod is fixedly connected to the first motor, and the top of the first motor is fixedly installed on the inner wall of the top of the partition plate, and two first electric push rods are fixedly connected to the inner wall of the top of the partition plate, and the bottoms of the two first electric push rods are fixedly connected to a moving plate, and placement grooves are arranged on both sides of the moving plate, and a drying structure is arranged on one side of the placement groove.

[0005] As a preferred embodiment of the above technical solution, temperature detectors are fixedly installed inside the high-temperature cavity and the low-temperature cavity, the first installation frame is located inside the high-temperature cavity, and the second installation frame is located inside the low-temperature cavity. The first installation frame and the second installation frame are located on the diagonal of the fixed block and are located on both sides of the partition plate. A first baffle is arranged inside the discharge port on the right side of the first installation frame, and a second baffle is arranged inside the discharge port on the left side of the second installation frame. A discharge frame is arranged at the bottom of the discharge port at the bottom of the first installation frame and the second installation frame.

[0006] As a preferred embodiment of the above technical solution, two movable openings are opened on both sides of the partition plate, the bottom of the movable plate is located at the top of the fixed block, the rotating rod, the first gear and the two first electric push rods are located inside the partition plate, the movable plate and the two first electric push rods are located on both sides of the rotating rod and the first gear, and a first movable opening is opened on the side of the movable plate close to the first gear, and one end of the first rack and the second rack are both located inside the first movable opening.

[0007] As a preferred embodiment of the above technical solution, the electric telescopic rod close to the first rack and the second rack passes through one side of the first mounting frame and the second mounting frame and extends to the inside of the first mounting frame and the second mounting frame. The rotating motor, the electric telescopic rod and the clamping block are symmetrically arranged with the center of the first mounting frame and the second mounting frame. A compression spring is fixedly connected to the inner wall of the clamping block, and one end of the compression spring is fixedly connected to an extrusion block. One side of the extrusion block is in contact with one side of the semiconductor, and the semiconductor is located between the extrusion blocks.

[0008] As a preferred embodiment of the above technical solution, the drying structure includes a dual-axis motor, a moving block is fixedly installed at the bottom of the dual-axis motor, one side of the moving block is slidably connected to the inner wall of the partition plate, a movable rod is fixedly connected to the output end of the dual-axis motor, an arc groove is opened on the inner wall of the top of the placement groove, the inner wall of the arc groove is rotatably connected to the movable rod, a mounting plate is fixedly connected to the bottom of the movable rod, and a fan is fixedly installed on one side of the mounting plate.

[0009] As a preferred embodiment of the above technical solution, the fan is located inside the placement slot and is evenly distributed on one side of the mounting plate. The mounting plate is located at two movable openings. The dual-axis motor is located between the movable plates and is located on the front and rear sides of the rotating rod.

[0010] As a preferred embodiment of the above technical solution, a fixed plate is connected to the bottom of the fixed block and is located on the inner wall of the box, a second motor is fixedly installed on both sides of the fixed plate and is located on the inner wall of the box, a threaded rod is fixedly connected to the output end of the second motor, one end of the threaded rod is rotatably connected to a support block, the bottom of the support block is fixedly connected to the inner wall of the bottom of the box, a sliding block is threadedly connected to the outer surface of the threaded rod, both sides of the sliding block are fixedly connected with limiting blocks, one side of the limiting block is slidably connected to the inner wall of the box, and the other side is slidably connected to one side of the fixed plate, a second electric push rod is fixedly connected to the top of the sliding block, the top of the second electric push rod is fixedly connected to the unloading frame, the sliding block, the second electric push rod and the unloading frame are respectively arranged corresponding to the first installation frame and the second installation frame.

[0011] As a preferred embodiment of the above technical solution, a movable groove is opened in the middle of the fixed block, and a second movable opening is arranged between two adjacent discharge openings. One end of the rotating rod passes through the bottom of the partition plate, the top of the fixed block and is rotatably connected to the inner wall of the bottom of the movable groove. The bottom end of the rotating rod is fixedly connected to the second gear, a third rack is meshed on one side of the second gear, and a fourth rack is meshed on the other side. The third rack and the fourth rack are fixedly connected with a connecting block on the side away from the second gear, and one side of the connecting block is fixedly connected to the first baffle plate and the second baffle plate on the side close to the movable groove.

[0012] As a preferred embodiment of the above technical solution, the second gear, the third rack and the fourth rack are all located inside the movable groove, the bottom of the third rack and the fourth rack are slidably connected to the inner wall of the bottom of the movable groove, the third rack is located on one side of the first baffle plate, the fourth rack is located on one side of the second baffle plate, and the first baffle plate and the second baffle plate are located on the diagonal line of the fixed block.

[0013] The beneficial effects of the present invention are: (1) The present invention places two semiconductors in a box for testing respectively, and can switch between high temperature and low temperature tests on the two semiconductors, so that the two semiconductors do not need to be taken out separately, and high temperature and low temperature tests can be completed, which is convenient for improving the test efficiency. The drying structure keeps the semiconductors dry, preventing the water vapor in the high temperature air from condensing rapidly into water mist and adhering to the semiconductor when the high temperature air contacts the low temperature object, thereby affecting the test effect. (2) The present invention facilitates the unloading of semiconductors after testing through the unloading port and the unloading frame, prevents the temperature of the semiconductors just after testing from being too high or too low, making it inconvenient to remove the semiconductors, and prevents high and low temperature steam from rushing out of the box and causing burns, thereby improving safety in use. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 What is shown is a schematic diagram of the overall structure of the embodiment; Figure 2 Shown is a front view of the embodiment box; Figure 3 Shown is the internal structure diagram of the high temperature chamber and the low temperature chamber of the embodiment; Figure 4 Shown is an internal structural diagram of a partition plate of an embodiment; Figure 5 Shown is a top view of the first installation frame and the second installation frame of the embodiment; Figure 6 Shown is a structural diagram of a drying structure of an embodiment; Figure 7 What is shown is the internal structure diagram of the first installation frame of the embodiment; Figure 8 Shown is a bottom structural diagram of a fixed block of an embodiment; Fig. 9 What is shown is the bottom structure diagram of the blanking frame of the embodiment diagram; Fig.10 Shown is a diagram of the internal structure of the movable slot of an embodiment.

[0015] In the figure: 1, box body; 2, box door; 3, controller; 4, observation window; 5, fixed block; 6, partition plate; 7, heating block; 8, cooling block; 9, first installation frame; 10, second installation frame; 11, first rack; 12, second rack; 13, rotating motor; 14, electric telescopic rod; 15, clamping block; 16, semiconductor; 17, first gear; 18, rotating rod; 19, first motor; 20, first electric push rod; 21, moving plate; 22, drying structure; 23. First baffle; 24. Second baffle; 25. Unloading frame; 26. Compression spring; 27. Extrusion block; 221. Dual-axis motor; 222. Moving block; 223. Movable rod; 224. Arc groove; 225. Mounting plate; 226. Fan; 28. Fixed plate; 29. ​​Second motor; 30. Threaded rod; 31. Sliding block; 32. Limiting block; 33. Second electric push rod; 34. Second gear; 35. Third rack; 36. Fourth rack; 37. Connecting block. DETAILED DESCRIPTION

[0016] In order to make the purpose, technical solution and advantages of the embodiments of the present invention more clear, the technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments.

[0017] The present invention provides a semiconductor functional testing device based on mechatronics, such as Figure 1-7As shown, it includes a box body 1, two box doors 2 are hinged on one side of the box body 1, a controller 3 is arranged on one side of the box door 2 located at the top, and an observation window 4 is arranged below the controller 3. A fixed block 5 is fixedly connected inside the box body 1, and a partition plate 6 is fixedly connected to the top of the fixed block 5. A high-temperature cavity is arranged on one side of the partition plate 6, and a low-temperature cavity is arranged on the other side thereof. A heating block 7 is fixedly installed on the inner wall of the top of the high-temperature cavity, and a refrigeration block 8 is fixedly installed on the inner wall of the top of the low-temperature cavity. Four discharge ports are opened on the top of the fixed block 5, and a first mounting frame 9 and a second mounting frame 10 are arranged on the top of two of the discharge ports. A first rack 11 is fixedly connected to one side of the first mounting frame 9, and a second rack 12 is fixedly connected to one side of the second mounting frame 10. The inner wall of the first mounting frame 9 and the first rack 11 are close to the first mounting frame 9, and the inner wall of the second mounting frame 10 and the second rack 12 are close to the second mounting frame 10. An installation groove is provided, and a rotating motor 13 is fixedly installed inside the installation groove. An electric telescopic rod 14 is fixedly connected to the output end of the rotating motor 13, and a clamping block 15 is fixedly connected to one end of the electric telescopic rod 14. A semiconductor 16 is arranged in the middle of the clamping block 15. A first gear 17 is meshed on one side of the first rack 11, and a second rack 12 is meshed on one side of the first gear 17. The bottoms of the first rack 11 and the second rack 12 are evenly connected to the top of the fixed block 5 for sliding connection. A rotating rod 18 is fixedly connected to the middle of the first gear 17, and a first motor 19 is fixedly connected to the top of the rotating rod 18. The top of the first motor 19 is fixedly installed with the inner wall of the top of the partition plate 6, and two first electric push rods 20 are fixedly connected to the inner wall of the top of the partition plate 6. A moving plate 21 is fixedly connected to the bottom of the two first electric push rods 20, and placement grooves are provided on both sides of the moving plate 21, and a drying structure 22 is arranged on one side of the placement groove.

[0018] Open the upper door 2 and place the semiconductor 16 inside the first installation frame 9 and the second installation frame 10. Drive the clamping block 15 to move to both sides of the semiconductor 16 through the electric telescopic rod 14, so that the clamping block 15 installs the semiconductor 16 inside the first installation frame 9 and the second installation frame 10, so that the semiconductor 16 is located inside the high-temperature cavity and the low-temperature cavity respectively. Close the upper door 2, heat the heating block 7 through the controller 3, increase the temperature inside the high-temperature cavity, and perform a high-temperature test on the semiconductor 16 inside the first installation frame 9. Use the refrigeration block 8 to control the temperature inside the low-temperature cavity to reduce the temperature inside the low-temperature cavity. Perform a low-temperature test on the semiconductor 16 inside the second installation frame 10, and start the rotating motor 13 to drive the electric The telescopic rod 14 rotates, so that the clamping block 15 drives the semiconductor 16 to rotate, so that the semiconductor 16 is heated and cooled evenly in the low-temperature chamber and the high-temperature chamber during the low-temperature and high-temperature tests, thereby improving the test effect. The high-temperature and low-temperature test conditions of the semiconductor 16 inside the box 1 can be observed through the observation window 4. When the high-temperature test of the semiconductor 16 inside the high-temperature chamber is completed, and the low-temperature test of the semiconductor 16 inside the low-temperature chamber is completed, the two first electric push rods 20 are started to drive the moving plate 21 and the drying structure 22 to move upward, so that the bottom of the moving plate 21 leaves the top of the fixed block 5 to the top of the first installation frame 9 and the second installation frame 10, and then the first motor 19 is started to drive the rotating rod 18 and the first gear 17 to rotate, so that the first rack 11 The first mounting frame 9 and the semiconductor 16 are driven to move from the bottom of the moving plate 21 to the inside of the low-temperature chamber, and the second rack 12 drives the second mounting frame 10 and the semiconductor 16 from the bottom of the moving plate 21 to the inside of the high-temperature chamber. When the first rack 11 and the second rack 12 move away from one end of the first gear 17 to the bottom of the moving plate 21, the first mounting frame 9 drives the semiconductor 16 to move to the top of the material discharge port of the low-temperature chamber, and the second mounting frame 10 drives the semiconductor 16 to move to the top of the material discharge port in the high-temperature chamber. Then, the second electric push rod 33 drives the moving plate 21 to move to the top of the fixed block 5 and return to its original position, and then the drying structure 22 is started and the semiconductor 16 in the middle of the clamping block 15 is rotated by rotating the rotating motor 13 and the electric telescopic rod 14. The semiconductor 16 in the first mounting frame 9 inside the low-temperature chamber and the semiconductor 16 in the first mounting frame 9 inside the high-temperature chamber are kept dry to prevent the large temperature difference when the high-temperature air contacts the low-temperature object, causing the water vapor in the high-temperature air to quickly condense into water mist and adhere to the semiconductor 16, thereby affecting the test effect. After drying, the drying structure 22 is moved to its original position by rotating it, and the temperature inside the low-temperature chamber is lowered by the refrigeration block 8, and the semiconductor 16 inside the first mounting frame 9 is tested at a low temperature. The temperature inside the high-temperature chamber is increased by the heating block 7, and the semiconductor 16 inside the second mounting frame 10 is tested at a high temperature, thereby facilitating high-temperature and low-temperature tests on the two semiconductors 16 at the same time to improve the test efficiency.

[0019] like Figure 2-8 As shown, temperature detectors are fixedly installed inside the high-temperature cavity and the low-temperature cavity, the first mounting frame 9 is located inside the high-temperature cavity, and the second mounting frame 10 is located inside the low-temperature cavity. The first mounting frame 9 and the second mounting frame 10 are located on the diagonal of the fixed block 5, and are located on both sides of the partition plate 6. A first baffle 23 is arranged inside the discharge port on the right side of the first mounting frame 9, and a second baffle 24 is arranged inside the discharge port on the left side of the second mounting frame 10. A discharge frame 25 is arranged at the bottom of the discharge port at the bottom of the first mounting frame 9 and the second mounting frame 10.

[0020] The temperature inside the low-temperature chamber and the high-temperature chamber is detected by a temperature detector, so that the heating block 7 and the refrigeration block 8 can control the temperature inside the low-temperature chamber and the high-temperature chamber, so that the semiconductor 16 can be tested under low-temperature and high-temperature environments. Since the first mounting frame 9 and the second mounting frame 10 are located on the diagonal of the fixed block 5 and are located on both sides of the partition plate 6, it is convenient for the rotating rod 18 to drive the first gear 17 to rotate. Under the action of the first rack 11 and the second rack 12, the first mounting frame 9 and the second mounting frame 10 move and switch positions to the inside of the low-temperature chamber or the high-temperature chamber, so as to facilitate low-temperature and high-temperature testing at the same time. The first baffle plate and the second baffle plate 24 cover the discharge port. Since the bottom of the discharge port at the bottom of the first mounting frame 9 and the second mounting frame 10 is provided with a discharge frame 25, the low-temperature chamber and the high-temperature chamber are kept sealed, so as to facilitate improving the test effect. The discharge frame 25 facilitates the collection of the semiconductor 16 after the test is completed, thereby improving convenience.

[0021] like Figure 3-5 As shown, two movable openings are opened on both sides of the partition plate 6, the bottom of the movable plate 21 is located at the top of the fixed block 5, the rotating rod 18, the first gear 17 and the two first electric push rods 20 are located inside the partition plate 6, the movable plate 21 and the two first electric push rods 20 are located on both sides of the rotating rod 18 and the first gear 17, and the movable plate 21 has a first movable opening on one side close to the first gear 17, and one end of the first rack 11 and the second rack 12 are both located inside the first movable opening.

[0022] The two movable openings facilitate the rotation of the drying structure 22, so that the drying structure 22 can be rotated from one side of the movable plate 21 to the top of the first mounting frame 9 and the second mounting frame 10, so as to dry the semiconductor 16 and improve the effect of the semiconductor 16 test. When the first gear 17 rotates through the first movable opening, the first rack 11 and the second rack 12 move through the first movable opening, thereby facilitating the first mounting frame 9 and the second mounting frame 10 to move from one side of the partition plate 6 to the other side, thereby facilitating the position conversion of the semiconductor 16 inside the first mounting frame 9 and the semiconductor 16 inside the second mounting frame 10 in the low-temperature chamber and the high-temperature chamber, and the semiconductor 16 does not need to be taken out to perform high-temperature and low-temperature tests simultaneously inside the box 1.

[0023] like Figure 3 , Figure 5 , Figure 7 As shown, the electric telescopic rod 14 close to the first rack 11 and the second rack 12 passes through one side of the first mounting frame 9 and the second mounting frame 10 and extends to the inside of the first mounting frame 9 and the second mounting frame 10, the rotating motor 13, the electric telescopic rod 14 and the clamping block 15 are symmetrically arranged with respect to the center of the first mounting frame 9 and the second mounting frame 10, the inner wall of the clamping block 15 is fixedly connected with a compression spring 26, one end of the compression spring 26 is fixedly connected with an extrusion block 27, one side of the extrusion block 27 is in contact with one side of the semiconductor 16, and the semiconductor 16 is located between the extrusion blocks 27.

[0024] The clamping block 15 is pushed to move toward both sides of the semiconductor 16 by the electric telescopic rod 14, so that one side of the extrusion block 27 is respectively in contact with both sides of the semiconductor 16, and the compression spring 26 is compressed, so that the semiconductor 16 is fixed between the clamping blocks 15. The semiconductor 16 is conveniently clamped and fixed by the symmetrically arranged rotating motor 13, the electric telescopic rod 14 and the clamping block 15, thereby improving the stability of the semiconductor 16 fixed in the first installation frame 9 and the second installation frame 10.

[0025] like Figure 4 , Figure 6 As shown, the drying structure 22 includes a dual-axis motor 221, a moving block 222 is fixedly installed at the bottom of the dual-axis motor 221, one side of the moving block 222 is slidably connected to the inner wall of the partition plate 6, a movable rod 223 is fixedly connected to the output end of the dual-axis motor 221, an arc groove 224 is opened on the inner wall of the top of the placement groove, the inner wall of the arc groove 224 is rotatably connected to the movable rod 223, a mounting plate 225 is fixedly connected to the bottom of the movable rod 223, a fan 226 is fixedly installed on one side of the mounting plate 225, the fan 226 is located inside the placement groove, and is equidistantly distributed on one side of the mounting plate 225, the mounting plate 225 is located at two movable openings, the dual-axis motor 221 is located between the movable plates 21, and is located on the front and rear sides of the rotating rod 18.

[0026] Since the bottom of the dual-axis motor 221 is fixedly connected with a moving block 222, the dual-axis motor 221 is fixed by the moving block 222, so that when the moving plate 21 moves, the moving block 222 can move along the inner wall of the partition plate 6, so that the dual-axis motor 221 can drive the movable rod 223 and the mounting plate 225 to move, and by starting the dual-axis motor 221 to drive the movable rod 223 to rotate in the arc groove 224, the movable rod 223 drives the mounting plate 225 to rotate from the two movable openings to a horizontal position, so that the fan 226 leaves the placement groove and moves to the top of the semiconductor 16 in the first mounting frame 9 and the second mounting frame 10. By starting the fans 226 distributed equidistantly, it is convenient to keep the semiconductor 16 dry, and prevent the water vapor in the high-temperature air from quickly condensing into water mist and adhering to the semiconductor 16 after the first mounting frame 9 and the second mounting frame 10 drive the semiconductor 16 to change position, thereby affecting the test effect.

[0027] like Figure 3 , Figure 8 As shown in the figure, a fixing plate 28 is connected to the bottom of the fixed block 5 and is located on the inner wall of the box body 1. A second motor 29 is fixedly installed on both sides of the fixed plate 28 and is located on the inner wall of the box body 1. A threaded rod 30 is fixedly connected to the output end of the second motor 29. One end of the threaded rod 30 is rotatably connected to a support block. The bottom of the support block is fixedly connected to the inner wall of the bottom of the box body 1. A sliding block 31 is threadedly connected to the outer surface of the threaded rod 30. Both sides of the sliding block 31 are fixedly connected to limiting blocks 32. One side of the limiting block 32 is slidably connected to the inner wall of the box body 1, and the other side is slidably connected to one side of the fixed plate 28. A second electric push rod 33 is fixedly connected to the top of the sliding block 31. The top of the second electric push rod 33 is fixedly connected to the blanking frame 25. The sliding block 31, the second electric push rod 33, and the blanking frame 25 are respectively arranged corresponding to the first installation frame 9 and the second installation frame 10.

[0028] The bottom of the box body 1 is divided into two unloading areas by the fixed plate 28, so that the two semiconductors 16 can be unloaded and taken out separately through the unloading frame 25. By starting the second motor 29 to drive the threaded rod 30 and the sliding block 31 to rotate, under the limiting action of the limiting block 32, the limiting block 32 moves along the inner wall of the box body 1 and one side of the fixed plate 28, so that the sliding block 31 drives the second electric push rod 33 and the unloading frame 25 to move along the threaded rod 30, so that the sliding block 31 drives the second electric push rod 33 and the unloading frame 25 to move to the bottom of the unloading port where the material is to be unloaded, and the semiconductors 16 are unloaded and collected. The unloading frame 25 is driven to move by the second electric push rod 33, so that the unloading frame 25 is convenient to move away from the fixed block 5 to facilitate the removal of the semiconductor 16, prevent the temperature of the semiconductor 16 that has just been tested from being too high or too low, which makes it inconvenient to take out the semiconductor 16, and prevent high and low temperature steam from rushing out of the box to cause burns, thereby improving the safety of use.

[0029] like Figure 8-10As shown, a movable groove is opened in the middle of the fixed block 5, and a second movable opening is set between two adjacent discharge openings. One end of the rotating rod 18 passes through the bottom of the partition plate 6, the top of the fixed block 5 and is rotatably connected to the inner wall of the bottom of the movable groove. The bottom end of the rotating rod 18 is fixedly connected to the second gear 34, and the third rack 35 is meshed on one side of the second gear 34, and the fourth rack 36 is meshed on the other side. The third rack 35 and the fourth rack 36 are fixedly connected to a connecting block 37 away from the second gear 34. One side of the connecting block 37 is fixedly connected to the first baffle 23 and the second baffle 24 close to the movable groove.

[0030] When the rotating rod 18 drives the first gear 17 to rotate, it will drive the movement of the first rack 11 and the second rack 12 meshing therewith, so that the first mounting frame 9 moves from the top of the discharge port of the high-temperature chamber to the top of the internal discharge port of the low-temperature chamber, and the second mounting frame 10 moves from the top of the discharge port of the low-temperature chamber to the top of the internal discharge port of the high-temperature chamber. At the same time, the rotating rod 18 drives the second gear 34 to rotate, and the third rack 35 drives the connecting block 37 and the first baffle 23 to move through the second moving port to the top of the discharge port inside the high-temperature chamber. The fourth rack 36 drives the connecting block 37 and the second baffle 24 to move through the second moving port to the top of the discharge port inside the low-temperature chamber. Therefore, after the first mounting frame 9 and the second mounting frame 10 switch positions, the low-temperature chamber and the high-temperature chamber remain sealed, which is convenient for high-temperature and low-temperature testing and improves the test effect.

[0031] like Figure 8-10 As shown, the second gear 34, the third rack 35 and the fourth rack 36 are all located inside the movable groove, the bottom of the third rack 35 and the fourth rack 36 are slidably connected to the inner wall of the bottom of the movable groove, the third rack 35 is located on one side of the first baffle 23, the fourth rack 36 is located on one side of the second baffle 24, and the first baffle 23 and the second baffle 24 are located on the diagonal line of the fixed block 5.

[0032] When the second rack 12 rotates, it drives the third rack 35 and the fourth rack 36 to move in the movable groove. Since the third rack 35 is located on one side of the first baffle 23, the fourth rack 36 is located on one side of the second baffle 24, and the first baffle 23 and the second baffle 24 are located on the diagonal line of the fixed block 5, the first baffle 23 and the second baffle 24 can move together with the movement of the first installation frame 9 and the second installation frame 10, so that the first baffle 23 and the second baffle 24 can cover the discharge openings inside the low-temperature cavity and the high-temperature cavity, so as to maintain the sealing of the high-temperature cavity and the low-temperature cavity.

[0033] Working principle: When in use, open the upper door 2 and place the semiconductor 16 inside the first installation frame 9 and the second installation frame 10, and drive the clamping block 15 to move to both sides of the semiconductor 16 through the electric telescopic rod 14, so that one side of the extrusion block 27 is respectively in contact with the two sides of the semiconductor 16, and the compression spring 26 is compressed, so that the semiconductor 16 is fixed between the clamping blocks 15, so that the clamping block 15 installs the semiconductor 16 inside the first installation frame 9 and the second installation frame 10, so that the two semiconductors 16 are respectively located inside the high-temperature cavity and the low-temperature cavity, and close the upper door 2, and use the controller 3 to heat the heating block 7 to increase the temperature inside the high-temperature cavity, so as to heat the semiconductor 16 inside the first installation frame 9. The high temperature test is carried out, and the temperature inside the low temperature chamber is controlled by the refrigeration block 8 to reduce the temperature inside the low temperature chamber, and the semiconductor 16 inside the second installation frame 10 is tested at a low temperature. At the same time, the rotating motor 13 is started to drive the electric telescopic rod 14 to rotate, so that the clamping block 15 drives the semiconductor 16 to rotate, so that the semiconductor 16 is heated and cooled evenly in the low temperature chamber and the high temperature chamber during the low temperature and high temperature tests. When the high temperature test of the semiconductor 16 inside the high temperature chamber is completed, the low temperature test of the semiconductor 16 inside the low temperature chamber is completed, and the two first electric push rods 20 are started to drive the moving plate 21 and the drying structure 22 to move upward, so that the bottom of the moving plate 21 leaves the top of the fixed block 5 to the first installation frame 9 and the drying structure 22. Above the second installation frame 10, the first motor 19 is started again to drive the rotating rod 18 and the first gear 17 to rotate, so that the first rack 11 drives the first installation frame 9 and the semiconductor 16 inside it to pass through the bottom of the moving plate 21 to move to the top of the internal discharge port of the low-temperature chamber, and the second rack 12 drives the second installation frame 10 and the semiconductor 16 inside it to pass through the bottom of the moving plate 21 to move to the top of the internal discharge port of the high-temperature chamber. When the first rack 11 and the second rack 12 move away from the first gear 17 through the first moving port to the bottom of the moving plate 21, the first installation frame 9 drives the semiconductor 16 to move to the top of the discharge port of the low-temperature chamber, and the second installation frame 10 drives the semiconductor 16 to move to the inside of the high-temperature chamber. The top of the discharge port, and then the second electric push rod 33 drives the movable plate 21 and the drying structure 22 to move to the original position, and the dual-axis motor 221 is started to drive the movable rod 223 to rotate in the arc groove 224, so that the movable rod 223 drives the mounting plate 225 to rotate from the two movable ports to a horizontal position, so that the fan 226 leaves the placement groove and moves to the top of the semiconductor 16 in the first installation frame 9 and the second installation frame 10, and the fan 226 is started to keep the semiconductor 16 dry. After drying is completed, the dual-axis motor 221 and the movable rod 223 are used to drive the mounting plate 225 and the fan 226 to move to the original position, and then the heating block 7 and the refrigeration block 8 are used to perform low-temperature and high-temperature tests on the moved semiconductor 16.

[0034] When the rotating rod 18 drives the first gear 17 to rotate, the meshing first rack 11 and the second rack 12 are moved, so that the first mounting frame 9 moves from the top of the discharge port of the high-temperature chamber to the top of the internal discharge port of the low-temperature chamber, and the second mounting frame 10 moves from the top of the discharge port of the low-temperature chamber to the top of the internal discharge port of the high-temperature chamber. At the same time, the rotating rod 18 drives the second gear 34 to rotate, and the third rack 35 drives the connecting block 37 and the first baffle 23 to move through the second moving port to the top of the discharge port inside the high-temperature chamber to block the discharge port inside the high-temperature chamber. The fourth rack 36 drives the connecting block 37 and the second baffle 24 to move through the second moving port to the top of the discharge port inside the low-temperature chamber to block the discharge port inside the low-temperature chamber. Start the second motor 29 to drive the threaded rod 30 and the sliding block 31 to rotate. Under the limiting action of the limiting block 32, the limiting block 32 moves along the inner wall of the box body 1 and one side of the fixed plate 28, so that the sliding block 31 drives the second electric push rod 33 and the blanking frame 25 to move along the threaded rod 30, so that the sliding block 31 drives the second electric push rod 33 and the blanking frame 25 to move to the bottom of the blanking port where the material is to be discharged, and the clamping block 15 is driven by the electric telescopic rod 14 to move away from the semiconductor 16, so that the extrusion block 27 no longer fixes the semiconductor 16, and the semiconductor 16 falls into the inside of the blanking frame 25 through the blanking port for collection, and then the second electric push rod 33 drives the blanking frame 25 to move away from the fixed block 5, and the box door 2 below is opened to take out the semiconductor 16.

[0035] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them.

Claims

1. A semiconductor functional testing device based on mechatronics, comprising a housing (1), It is characterized in that Two doors (2) are hingedly connected to one side of the box body (1); a controller (3) is arranged on one side of the upper door (2); an observation window (4) is arranged below the controller (3); a fixed block (5) is fixedly connected to the inside of the box body (1); a partition plate (6) is fixedly connected to the top of the fixed block (5); a high-temperature cavity is arranged on one side of the partition plate (6) and a low-temperature cavity is arranged on the other side; a heating block (7) is fixedly installed on the inner wall of the top of the high-temperature cavity; and a refrigeration block (8) is fixedly installed on the inner wall of the top of the low-temperature cavity. The top of the fixed block (5) is provided with four material discharge openings, wherein the tops of two of the material discharge openings are provided with a first mounting frame (9) and a second mounting frame (10), one side of the first mounting frame (9) is fixedly connected to a first rack (11), and one side of the second mounting frame (10) is fixedly connected to a second rack (12), and the inner wall of the first mounting frame (9) and the side of the first rack (11) close to the first mounting frame (9), and the inner wall of the second mounting frame (10) and the side of the second rack (12) close to the second mounting frame (10) are both provided with mounting grooves, A rotating motor (13) is fixedly installed inside the installation groove, and an electric telescopic rod (14) is fixedly connected to the output end of the rotating motor (13), and a clamping block (15) is fixedly connected to one end of the electric telescopic rod (14), and a semiconductor (16) is arranged in the middle of the clamping block (15); a first gear (17) is meshed on one side of the first rack (11), and a second gear (17) is meshed on one side of the first gear (17); the bottoms of the first rack (11) and the second rack (12) are evenly connected to the top of the fixed block (5) for sliding connection; a rotating rod (18) is fixedly connected to the middle of the first gear (17), and a first motor (19) is fixedly connected to the top of the rotating rod (18); the top of the first motor (19) is fixedly installed with the inner wall of the top of the partition plate (6); two first electric push rods (20) are fixedly connected to the inner wall of the top of the partition plate (6); the bottoms of the two first electric push rods (20) are fixedly connected to a moving plate (21); placement grooves are provided on both sides of the moving plate (21), and a drying structure (22) is provided on one side of the placement groove.

2. A semiconductor functional testing device based on mechatronics according to claim 1, It is characterized in that Temperature detectors are fixedly installed inside the high-temperature chamber and the low-temperature chamber, the first installation frame (9) is located inside the high-temperature chamber, and the second installation frame (10) is located inside the low-temperature chamber. The first installation frame (9) and the second installation frame (10) are located on the diagonal line of the fixed block (5) and are located on both sides of the partition plate (6). A first baffle (23) is arranged inside the feed opening located on the right side of the first installation frame (9), and a second baffle (24) is arranged inside the feed opening located on the left side of the second installation frame (10). A feed opening frame (25) is arranged at the bottom of the feed openings at the bottom of the first installation frame (9) and the second installation frame (10).

3. A semiconductor functional testing device based on mechatronics according to claim 1, It is characterized in that Two movable openings are provided on both sides of the partition plate (6); the bottom of the movable plate (21) is located at the top of the fixed block (5); the rotating rod (18), the first gear (17) and the two first electric push rods (20) are located inside the partition plate (6); the movable plate (21) and the two first electric push rods (20) are located on both sides of the rotating rod (18) and the first gear (17); a first movable opening is provided on a side of the movable plate (21) close to the first gear (17); and one end of the first rack (11) and the second rack (12) are both located inside the first movable opening.

4. A semiconductor functional testing device based on mechatronics according to claim 1, It is characterized in that The electric telescopic rod (14) close to the first rack (11) and the second rack (12) passes through one side of the first mounting frame (9) and the second mounting frame (10) and extends to the inside of the first mounting frame (9) and the second mounting frame (10); the rotating motor (13), the electric telescopic rod (14) and the clamping block (15) are symmetrically arranged around the center of the first mounting frame (9) and the second mounting frame (10); a compression spring (26) is fixedly connected to the inner wall of the clamping block (15); one end of the compression spring (26) is fixedly connected to an extrusion block (27); one side of the extrusion block (27) is in contact with one side of the semiconductor (16); and the semiconductor (16) is located between the extrusion blocks (27).

5. A semiconductor functional testing device based on mechatronics according to claim 1, It is characterized in that The drying structure (22) comprises a double-axis motor (221), a moving block (222) is fixedly mounted on the bottom of the double-axis motor (221), one side of the moving block (222) is slidably connected to the inner wall of the partition plate (6), an output end of the double-axis motor (221) is fixedly connected to a movable rod (223), an arc-shaped groove (224) is formed on the inner wall of the top of the placement groove, the inner wall of the arc-shaped groove (224) is rotatably connected to the movable rod (223), a mounting plate (225) is fixedly mounted on the bottom of the movable rod (223), and a fan (226) is fixedly mounted on one side of the mounting plate (225).

6. A semiconductor functional testing device based on mechatronics according to claim 5, It is characterized in that The fans (226) are located inside the placement slot and are evenly spaced on one side of the mounting plate (225). The mounting plate (225) is located at the two movable openings. The dual-axis motor (221) is located between the moving plates (21) and is located on both sides of the front and rear of the rotating rod (18).

7. A semiconductor functional testing device based on mechatronics according to claim 1, It is characterized in that A fixing plate (28) is connected to the bottom of the fixing block (5) and is located on the inner wall of the box body (1). A second motor (29) is fixedly installed on both sides of the fixing plate (28) and is located on the inner wall of the box body (1). A threaded rod (30) is fixedly connected to the output end of the second motor (29). One end of the threaded rod (30) is rotatably connected to a support block. The bottom of the support block is fixedly connected to the inner wall of the bottom of the box body (1). A sliding block (31) is threadedly connected to the outer surface of the threaded rod (30). Both sides of the sliding block (31) are fixedly connected to limiting blocks (32). One side of the limiting block (32) is slidably connected to the inner wall of the box body (1), and the other side is slidably connected to one side of the fixing plate (28). A second electric push rod (33) is fixedly connected to the top of the sliding block (31). The top of the second electric push rod (33) is fixedly connected to the blanking frame (25). The sliding block (31), the second electric push rod (33) and the blanking frame (25) are respectively arranged corresponding to the first installation frame (9) and the second installation frame (10).

8. The semiconductor functional testing device based on mechatronics according to claim 1, It is characterized in that A movable groove is provided in the middle of the fixed block (5), and a second movable opening is provided between the two adjacent material discharge openings. One end of the rotating rod (18) passes through the bottom of the partition plate (6), the top of the fixed block (5), and is rotatably connected to the inner wall of the bottom of the movable groove. The bottom end of the rotating rod (18) is fixedly connected to a second gear (34). A third rack (35) is meshed on one side of the second gear (34), and a fourth rack (36) is meshed on the other side. A connecting block (37) is fixedly connected to the side of the third rack (35) and the fourth rack (36) away from the second gear (34). One side of the connecting block (37) is fixedly connected to the first baffle plate (23) and the side of the second baffle plate (24) close to the movable groove.

9. A semiconductor functional testing device based on mechatronics according to claim 8, It is characterized in that The second gear (34), the third rack (35) and the fourth rack (36) are all located inside the movable groove; the bottoms of the third rack (35) and the fourth rack (36) are slidably connected to the inner wall of the bottom of the movable groove; the third rack (35) is located on one side of the first baffle (23); the fourth rack (36) is located on one side of the second baffle (24); and the first baffle (23) and the second baffle (24) are located on a diagonal line of the fixed block (5).

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