Display panel, display device and manufacturing method of display panel

Abstract

The embodiment of the invention provides a display panel, a display device and a manufacturing method of the display panel. The display panel comprises a substrate; the functional layer is arranged on one side of the substrate, the functional layer comprises a functional part and an opening defined by the functional part, and the opening comprises a first opening and a second opening; the light-emitting layer comprises a light-emitting unit located in the opening; wherein the surface roughness of the part, surrounding the first opening, of the functional part is smaller than that of the part, surrounding the second opening, of the functional part, so that the binding force between the light-emitting unit located in the second opening and the functional part is improved, and the risk of stripping between the light-emitting unit and the functional part is reduced; and the reliability of the display panel is improved, so that the processing property of the display panel is improved.

Description

Technical Field

[0001] The present application relates to the technical field of display devices, and in particular to a display panel, a display device, and a method for manufacturing a display panel. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream in display devices.

[0003] However, the process performance of current display products needs to be improved. Summary of the invention

[0004] The embodiments of the present application provide a display panel, a display device and a method for manufacturing a display panel, aiming to improve the process performance of the display panel.

[0005] An embodiment of the first aspect of the present application provides a display panel, comprising: a substrate; a functional layer, arranged on one side of the substrate, the functional layer comprising a functional portion and an opening formed by the functional portion, the opening comprising a first opening and a second opening; a light-emitting layer, the light-emitting layer comprising a light-emitting unit located in the opening; wherein the surface roughness of a portion of the functional portion surrounding the first opening is less than the surface roughness of a portion of the functional portion surrounding the second opening.

[0006] According to an embodiment of the present application, the opening further includes a third opening, and the surface roughness of the partial functional portion surrounding the second opening is smaller than the surface roughness of the partial functional portion surrounding the third opening.

[0007] According to an embodiment of the present application, the functional part includes an isolation structure, the opening includes an isolation opening formed by the isolation structure, the first opening includes a first isolation opening formed by the isolation structure, and the second opening includes a second isolation opening formed by the isolation structure; the surface of the isolation structure on one side facing away from the substrate has an edge area surrounding the isolation opening, the edge area includes a first area arranged around the first isolation opening and a second area arranged around the second isolation opening, and the first area and the second area are arranged at intervals; the surface roughness of the first area is less than the surface roughness of the second area.

[0008] According to an embodiment of the present application, the third opening includes a third isolation opening formed by an isolation structure, the edge area also includes a third area arranged around the third isolation opening, the first area, the second area and the third area are arranged at intervals, and the surface roughness of the second area is less than the surface roughness of the third area.

[0009] According to an embodiment of the present application, a packaging portion is provided on the side of the light emitting unit away from the substrate, the light emitting unit is located in the first isolation opening, the second isolation opening and the third isolation opening, and the packaging portion is provided on the side of the light emitting unit away from the substrate.

[0010] According to an embodiment of the present application, the packaging portion extends from the side of the light-emitting unit facing away from the substrate to the side of the isolation structure facing away from the substrate, and the orthographic projection of the portion of the packaging portion located on the side of the isolation structure facing away from the substrate on the substrate covers the orthographic projection of the edge area on the substrate.

[0011] According to an embodiment of the present application, a light-emitting material portion is disposed between the encapsulation portion and the edge region, and a material of the light-emitting material portion is the same as a material of the light-emitting unit.

[0012] According to an embodiment of the present application, the light emitting unit includes a first light emitting unit located in the first isolation opening, a second light emitting unit located in the second isolation opening, and a third light emitting unit located in the third isolation opening.

[0013] According to an embodiment of the present application, the light-emitting material portion includes a first light-emitting material portion located in the first region and between the packaging portion and the isolation structure on a side surface facing away from the substrate, a second light-emitting material portion located in the second region and between the packaging portion and the isolation structure on a side surface facing away from the substrate, and a third light-emitting material portion located in the third region and between the packaging portion and the isolation structure on a side surface facing away from the substrate, wherein the first light-emitting material portion is the same material as the first light-emitting unit, the second light-emitting material portion is the same material as the second light-emitting unit, and the third light-emitting material portion is the same material as the third light-emitting unit.

[0014] According to an embodiment of the present application, the packaging portion includes a first packaging portion located in the first isolation opening and a second packaging portion located in the second isolation opening, and the surface roughness of the first packaging portion facing away from the substrate is greater than the surface roughness of the second packaging portion facing away from the substrate.

[0015] According to an embodiment of the present application, the encapsulation portion further includes a third encapsulation portion located in the third isolation opening, and a surface roughness of the second encapsulation portion facing away from the substrate is greater than a surface roughness of the third encapsulation portion facing away from the substrate.

[0016] According to an embodiment of the present application, a surface of the isolation structure facing away from the substrate has a fourth region, an orthographic projection of the fourth region on the substrate is offset from an orthographic projection of the packaging portion on the substrate, and a surface roughness of the fourth region is greater than a surface roughness of the third region.

[0017] According to an embodiment of the present application, the fourth region includes a first sub-region located between the adjacent first region and the second region, a second sub-region located between the adjacent second region and the third region, and a third sub-region between the adjacent first region and the third region, and the roughness of the first sub-region, the second sub-region and the third sub-region are equal.

[0018] According to an embodiment of the present application, the functional part also includes a pixel definition layer, which is arranged between the isolation structure and the substrate, the pixel definition layer includes a pixel defining part, the first opening includes a first pixel opening formed by the pixel defining part, and the second opening includes a second pixel opening formed by the pixel defining part; the first pixel opening is connected to the first isolation opening, and the second pixel opening is connected to the second isolation opening.

[0019] According to an embodiment of the present application, the pixel defining portion includes a first sub-portion exposed by the first isolation opening and a second sub-portion exposed by the second isolation opening, and the surface roughness of the first sub-portion is smaller than the surface roughness of the second sub-portion.

[0020] According to an embodiment of the present application, the third opening includes a third pixel opening formed by enclosing a pixel defining portion, and the third pixel opening is connected to the third isolation opening.

[0021] According to an embodiment of the present application, the pixel defining portion further includes a third sub-portion exposed by the third isolation opening, and the surface roughness of the second sub-portion is smaller than the surface roughness of the third sub-portion.

[0022] According to an embodiment of the present application, the display panel also includes a first electrode layer, which is arranged between the light-emitting layer and the substrate, and the first electrode layer includes a first sub-electrode and a second sub-electrode, at least a portion of the first sub-electrode is exposed to the first pixel opening, and at least a portion of the second sub-electrode is exposed to the second pixel opening, wherein the surface roughness of the first sub-electrode is less than the surface roughness of the second sub-electrode.

[0023] According to an embodiment of the present application, the first electrode layer further includes a third sub-electrode, at least a portion of the third sub-electrode is exposed to the third pixel opening, and the surface roughness of the second sub-electrode is smaller than that of the third sub-electrode.

[0024] According to an embodiment of the present application, the first sub-electrode, the second sub-electrode and the third sub-electrode are respectively arranged on a side of the light-emitting unit facing the substrate.

[0025] According to an embodiment of the present application, the display panel further includes a second electrode layer, and the second electrode layer includes a second electrode located between the light emitting unit and the encapsulation part.

[0026] According to an embodiment of the present application, the second electrode layer further includes a second electrode material portion, and the second electrode material portion is disposed between the packaging portion and the light-emitting material portion.

[0027] According to an embodiment of the present application, the second electrode is electrically connected to the isolation structure.

[0028] According to an embodiment of the present application, the isolation structure includes a first sublayer and a second sublayer, the first sublayer is located on the side of the second sublayer facing the substrate, and the orthographic projection of the first sublayer on the substrate is located within the orthographic projection of the second sublayer on the substrate.

[0029] According to an embodiment of the present application, a surface of the second sub-layer facing away from the substrate comprises a first region, a second region and a third region.

[0030] According to an embodiment of the present application, the isolation structure further includes a third sublayer, and the third sublayer is arranged on a side of the first sublayer facing the substrate.

[0031] The first aspect embodiment of the present application also proposes a display panel, including: a substrate; an isolation structure, arranged on one side of the substrate, a first isolation opening and a second isolation opening formed by the isolation structure, a surface of the isolation structure on the side facing away from the substrate having an edge area surrounding the isolation opening, the edge area including a first area arranged around the first isolation opening and a second area arranged around the second isolation opening, the first area and the second area being arranged at intervals; a light-emitting layer, the light-emitting layer including light-emitting units located in the first isolation opening and the second isolation opening; wherein the surface roughness of the first area is less than the surface roughness of the second area.

[0032] The first aspect of the present application also proposes a display panel, comprising: a substrate; a pixel definition layer, arranged on one side of the substrate, the pixel definition layer including a pixel defining portion, the pixel defining portion enclosing a first pixel opening and a second pixel opening; an isolation structure, arranged on a side of the pixel definition layer away from the substrate, the first isolation opening and the second isolation opening formed by the isolation structure, the first pixel opening is connected to the first isolation opening, and the second pixel opening is connected to the second isolation opening; a light-emitting layer, the light-emitting layer including a light-emitting unit located in the first pixel opening and the second pixel opening; wherein the pixel defining portion includes a first section exposed by the first isolation opening and a second section exposed by the second isolation opening, and the surface roughness of the first section is less than the surface roughness of the second section.

[0033] The first aspect of the present application also proposes a display panel, comprising: a substrate; a pixel definition layer, arranged on one side of the substrate, the pixel definition layer comprising a pixel defining portion, the pixel defining portion enclosing a first pixel opening and a second pixel opening; an isolation structure, arranged on a side of the pixel definition layer away from the substrate, the first isolation opening and the second isolation opening formed by the isolation structure, the first pixel opening is connected to the first isolation opening, and the second pixel opening is connected to the second isolation opening; a light-emitting layer, the light-emitting layer comprising a light-emitting unit located in the first pixel opening and the second pixel opening; a first electrode layer, arranged between the light-emitting layer and the substrate, the first electrode layer comprising a first sub-electrode and a second sub-electrode, at least a portion of the first sub-electrode is exposed to the first pixel opening, and at least a portion of the second sub-electrode is exposed to the second pixel opening, wherein the surface roughness of the first sub-electrode is less than the surface roughness of the second sub-electrode.

[0034] The second aspect of the present application further provides a display device, comprising the display panel in any one of the embodiments of the first aspect.

[0035] The third aspect of the present application further provides a method for manufacturing a display panel, including:

[0036] Forming a functional layer on one side of the substrate, the functional layer comprising a functional portion and an opening formed by the functional portion, the opening comprising a first opening and a second opening;

[0037] preparing a first light emitting unit in the first opening;

[0038] A second light emitting unit is prepared in the second opening, wherein the surface roughness of a portion of the functional portion surrounding the first opening is smaller than the surface roughness of a portion of the functional portion surrounding the second opening.

[0039] According to an embodiment of the present application, the opening further includes a third opening, and after the step of preparing the second light-emitting unit in the second opening, the method further includes:

[0040] A third light emitting unit is prepared in the third opening, wherein the surface roughness of a portion of the functional portion surrounding the second opening is smaller than the surface roughness of a portion of the functional portion surrounding the third opening.

[0041] According to an embodiment of the present application, the step of preparing a first light-emitting unit in the first opening includes:

[0042] forming a first preparation material layer on a side of the opening and the functional layer facing away from the substrate;

[0043] forming a protective glue on a side of the first preparation material layer facing away from the substrate in the area where the first opening is located;

[0044] The second opening, the third opening and the first preparation material layer and the protective glue on the side of the functional part facing away from the substrate are removed by dry etching, and the first preparation material layer in the area where the first opening is located is retained. Part of the first preparation material layer forms a first light-emitting unit, so that the surface roughness of the part of the functional part surrounding the first opening is smaller than the surface roughness of the part of the functional part surrounding the second opening, and the surface roughness of the part of the functional part surrounding the first opening is smaller than the surface roughness of the part of the functional part surrounding the third opening.

[0045] According to an embodiment of the present application, the first preparation material layer includes a first organic light-emitting material layer, a second electrode material layer corresponding to the first light-emitting unit, and a first packaging material layer sequentially arranged in a direction away from the substrate; dry etching removes the second opening, the third opening, and the first preparation material layer on the side of the functional part away from the substrate and the protective glue, retains the first preparation material layer in the area where the first opening is located, and the step of forming a first light-emitting unit with part of the first preparation material layer includes:

[0046] Dry etching is used to remove the second opening, the third opening and the first packaging material layer on the side of the functional portion facing away from the substrate, and the first packaging material layer in the area where the first opening is located is retained to form a first packaging portion;

[0047] The second electrode material layer at the second opening, the third opening and the functional portion facing away from the substrate is removed, and the second electrode material layer at the first opening is retained to form a second electrode corresponding to the first light-emitting unit;

[0048] The second opening, the third opening and the first organic light-emitting material layer and the protective glue on the side of the functional part away from the substrate are removed by dry etching, and the first organic light-emitting material layer located in the first opening is retained to form a first light-emitting unit.

[0049] According to an embodiment of the present application, the step of preparing the second light-emitting unit in the second opening further includes:

[0050] forming a second preparation material layer on a side of the opening and the functional layer facing away from the substrate;

[0051] forming a protective glue on the side of the second preparation material layer facing away from the substrate in the area where the second opening is located;

[0052] The first opening, the third opening and the second preparation material layer and the protective glue on the side of the functional part facing away from the substrate are removed by dry etching, and the second preparation material layer in the area where the second opening is located is retained. Part of the second preparation material layer forms a second light-emitting unit, so that the surface roughness of the part of the functional part surrounding the first opening is smaller than the surface roughness of the part of the functional part surrounding the second opening; the surface roughness of the part of the functional part surrounding the second opening is smaller than the surface roughness of the part of the functional part surrounding the third opening.

[0053] According to an embodiment of the present application, the second preparation material layer includes a second organic light-emitting material layer, a second electrode material layer corresponding to the second light-emitting unit, and a second packaging material layer sequentially arranged in a direction away from the substrate; dry etching removes the first opening, the third opening, and the second preparation material layer on the side of the functional part away from the substrate and the protective glue, retains the second preparation material layer in the area where the second opening is located, and the step of forming a second light-emitting unit with part of the second preparation material layer includes:

[0054] Dry etching removes the first opening, the third opening and the second packaging material layer on the side of the functional portion away from the substrate, and retains the second packaging material layer in the area where the second opening is located to form a second packaging portion;

[0055] Removing the second electrode material layer at the first opening, the third opening and the functional portion away from the substrate, and retaining the second electrode material layer at the second opening to form a second electrode corresponding to the second light-emitting unit;

[0056] The first opening, the third opening and the second organic light-emitting material layer on the side of the functional part away from the substrate and the protective glue are removed by dry etching, and the second organic light-emitting material layer located in the second opening is retained to form a second light-emitting unit.

[0057] According to an embodiment of the present application, the step of preparing the third light-emitting unit in the third opening further includes:

[0058] forming a third preparation material layer on a side of the opening and the functional layer facing away from the substrate;

[0059] forming a protective glue on a side of the third preparation material layer facing away from the substrate in the area where the third opening is located;

[0060] The first opening, the second opening and the third preparation material layer and the protective glue on the side of the functional part away from the substrate are removed by dry etching, and the third preparation material layer in the area where the third opening is located is retained, and part of the third preparation material layer forms a third light-emitting unit.

[0061] According to an embodiment of the present application, the third preparation material layer includes a third organic light-emitting material layer, a second electrode material layer corresponding to the third light-emitting unit, and a third encapsulation material layer sequentially arranged in a direction away from the substrate; dry etching removes the first opening, the second opening, and the third preparation material layer on the side of the functional part away from the substrate and the protective glue, retains the third preparation material layer in the area where the third opening is located, and the step of forming a third light-emitting unit with part of the third preparation material layer includes:

[0062] Dry etching is used to remove the first opening, the second opening and the third packaging material layer on the side of the functional part away from the substrate, and the third packaging material layer in the area where the third opening is located is retained to form a third packaging part;

[0063] The second electrode material layer of the first opening, the second opening and the functional portion facing away from the substrate is removed, and the second electrode material layer located at the third opening is retained to form a second electrode corresponding to the third light-emitting unit;

[0064] The first opening, the second opening and the third organic light-emitting material layer on the side of the functional part away from the substrate and the protective glue are removed by dry etching, and the third organic light-emitting material layer located in the third opening is retained to form a third light-emitting unit.

[0065] In an embodiment of the present application, the surface roughness of some functional parts surrounding the first opening is smaller than the surface roughness of some functional parts surrounding the second opening, which is beneficial to improving the bonding force between the light-emitting unit located at the second opening and the functional part, reducing the risk of peeling between the light-emitting unit and the functional part, improving the reliability of the display panel, and thus improving the process performance of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0066] Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features.

[0067] Figure 1 is a schematic diagram of the structure of a display panel provided in an embodiment of the present application;

[0068] Figure 2a yes Figure 1 Cross-section at CC;

[0069] Figure 2b is a schematic diagram of the structure of another display panel of the present application;

[0070] Figure 3 This is an enlarged view of a local structure of a display panel provided in an embodiment of the present application;

[0071] Figure 4 is an enlarged view of a local structure of another display panel provided in an embodiment of the present application;

[0072] Figure 5 This is another enlarged view of a local structure of a display panel provided in an embodiment of the present application;

[0073] Figure 6 is a flow chart of a method for manufacturing a display panel provided in an embodiment of the present application;

[0074] Figures 7 to 9 is a schematic diagram of a method for manufacturing a display panel provided in an embodiment of the present application;

[0075] Fig.10 is a flow chart of another method for manufacturing a display panel provided in an embodiment of the present application;

[0076] Figures 11 to 14 is a schematic diagram of another method for manufacturing a display panel provided in an embodiment of the present application;

[0077] Fig.15 is a flow chart of another method for manufacturing a display panel provided in an embodiment of the present application;

[0078] Figure 16 to Figure 17 is a schematic diagram of a process of manufacturing another display panel provided in an embodiment of the present application;

[0079] Fig.18 is a flow chart of another method for manufacturing a display panel provided in an embodiment of the present application;

[0080] Figure 19 to Figure 20 It is a schematic diagram of a process of manufacturing another display panel provided in an embodiment of the present application.

[0081] Explanation of the reference numerals: 100, substrate; 200, functional part; 210, opening; 211, first opening; 212, second opening; 213, third opening; 300, light-emitting unit; 302, second electrode; 303, encapsulation part; 304, light-emitting material part; 305, second electrode material part; 310, first light-emitting unit; 312, first light-emitting material part; 313, first encapsulation part; 320, second light-emitting unit; 322, second light-emitting material part; 323, second encapsulation part; 330, third light-emitting unit; 332, third light-emitting material part; 333, third encapsulation part; 351, first sub-electrode; 352, second sub-electrode; 353, third sub-electrode; 400, isolation structure; 401, first sub-layer; 402, second sub-layer; 403, third sub-layer; 410, first isolation opening; 420, second isolation opening ; 430, third isolation opening; 440, edge area; 441, first area; 442, second area; 443, third area; 444, fourth area; 445, first sub-area; 446, second sub-area; 447, third sub-area; 500, pixel defining portion; 501, first division; 502, second division; 503, third division; 510, first pixel opening; 520, second pixel opening; 530, third pixel opening; 610, first preparation material layer; 611, first organic light-emitting material layer; 612, second electrode material layer; 613, first packaging material layer; 620, second preparation material layer; 621, second organic light-emitting material layer; 623, second packaging material layer; 630, third preparation material layer; 631, third organic light-emitting material layer; 633, third packaging material layer; 700, protective glue. DETAILED DESCRIPTION

[0082] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In the detailed description below, many specific details are proposed to provide a comprehensive understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating examples of the present application. In the accompanying drawings and the following description, at least some of the known structures and technologies are not shown to avoid unnecessary ambiguity in the present application; and, for clarity, the size of some structures may be exaggerated. In addition, the features, structures or characteristics described below may be combined in one or more embodiments in any suitable manner.

[0083] In the description of the present application, it should be noted that, unless otherwise specified, "multiple" means more than two; the terms "upper", "lower", "left", "right", "inner", "outer", etc., indicating directions or positional relationships, are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0084] The directional words appearing in the following description are all directions shown in the figures, and do not limit the specific structure of the embodiments of the present application. In the description of the present application, it should also be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0085] like Figure 1 and Figure 2a As shown, a display panel provided by an embodiment of the first aspect of the present application includes: a substrate 100, a functional layer and a light-emitting layer; the functional layer is arranged on one side of the substrate 100, the functional layer includes a functional part 200 and an opening 210 formed by the functional part 200, and the opening 210 includes a first opening 211 and a second opening 212; the light-emitting layer, the light-emitting layer includes a light-emitting unit 300 located in the opening 210; wherein the surface roughness of the part of the functional part 200 surrounding the first opening 211 is less than the surface roughness of the part of the functional part 200 surrounding the second opening 212.

[0086] In this embodiment, the light-emitting layer includes a light-emitting unit 300 located in the opening 210, and the opening 210 includes a first opening 211 and a second opening 212, that is, the light-emitting layer includes a light-emitting unit 300 located in the first opening 211 and the second opening 212, and the first opening 211 and the second opening 212 are formed by enclosing the functional part 200, and the functional part 200 can reduce the light crosstalk between different light-emitting units 300, thereby improving the display effect of the display panel. The surface roughness of the part of the functional part 200 surrounding the first opening 211 is less than the surface roughness of the part of the functional part 200 surrounding the second opening 212, thereby facilitating the improvement of the bonding force between the light-emitting unit 300 located in the second opening 212 and the functional part 200, reducing the risk of peeling between the light-emitting unit 300 and the functional part 200, improving the reliability of the display panel, and thus improving the process performance of the display panel.

[0087] In some embodiments, wet etching may cause the packaging film layer to fail and cause the drug solution to invade the light-emitting unit 300, causing damage to the light-emitting unit 300. The use of dry etching may reduce damage to the packaging film layer. During the dry etching process, plasma bombardment of the film surface will increase the surface roughness of the film, which is beneficial to improve the bonding strength between the film layers, thereby reducing the risk of film peeling.

[0088] When the light-emitting unit 300 in the first opening 211 and the light-emitting unit 300 in the second opening 212 are prepared in sequence, the material of the light-emitting unit 300 in the area where the first opening 211 is located is first covered with the protective glue 700. In the dry etching process, plasma will bombard the surface of the partial functional part 200 surrounding the second opening 212 and the material of the light-emitting unit 300 located in the second opening 212. The partial functional part 200 surrounding the first opening 211 is covered by the material of the light-emitting unit 300 and the protective glue 700 and is protected from plasma bombardment, which will cause the surface roughness of the partial functional part 200 surrounding the first opening 211 to be less than the surface roughness of the partial functional part 200 surrounding the second opening 212.

[0089] like Figure 1 and Figure 2a As shown, in some optional embodiments, the opening 210 further includes a third opening 213 , and the surface roughness of the portion of the functional portion 200 surrounding the second opening 212 is smaller than the surface roughness of the portion of the functional portion 200 surrounding the third opening 213 .

[0090] In these optional embodiments, the surface roughness of the portion of the functional portion 200 surrounding the second opening 212 is less than the surface roughness of the portion of the functional portion 200 surrounding the third opening 213, which is beneficial for improving the bonding force between the light-emitting unit 300 located in the third opening 213 and the functional portion 200, reducing the risk of peeling between the light-emitting unit 300 and the functional portion 200, and improving the reliability of the display panel.

[0091] like Figures 2a to 4 As shown, in some optional embodiments, the functional portion 200 includes an isolation structure 400, the opening 210 includes an isolation opening formed by the isolation structure 400, the first opening 211 includes a first isolation opening 410 formed by the isolation structure 400, and the second opening 212 includes a second isolation opening 420 formed by the isolation structure 400; the surface of the isolation structure 400 facing away from the substrate 100 has an edge area 440 surrounding the isolation opening, the edge area 440 includes a first area 441 arranged around the first isolation opening 410 and a second area 442 arranged around the second isolation opening 420, and the first area 441 and the second area 442 are arranged at intervals; the surface roughness of the first area 441 is less than the surface roughness of the second area 442.

[0092] In these optional embodiments, the first opening 211 includes a first isolation opening 410 formed by an isolation structure 400, the second opening 212 includes a second isolation opening 420 formed by an isolation structure 400, and the light-emitting unit 300 is located in the first isolation opening 410 and the second opening 212. The isolation structure 400 can reduce light crosstalk between different light-emitting units 300 and improve the display effect of the display panel. The surface of the side of the isolation structure 400 facing away from the substrate 100 has an edge area 440 surrounding the isolation opening, and the edge area 440 includes a first area 441 arranged around the first isolation opening 410 and a second area 442 arranged around the second isolation opening 420. The first area 441 and the second area 442 are annular, and the surface roughness of the first area 441 is less than the surface roughness of the second area 442. The light-emitting unit 300 is provided with a packaging part 303 on the side facing away from the substrate 100. The packaging part 303 extends from the isolation opening to the side of the isolation structure 400 facing away from the substrate 100 to cover the edge area 440. The surface roughness of the first area 441 is less than the surface roughness of the second area 442, which is beneficial to improving the bonding force between the second area 442 and the packaging part 303, reducing the risk of peeling between the packaging part 303 and the functional part 200, and improving the packaging effect of the packaging part 303.

[0093] Optional, such as Figures 2a to 5 As shown, the third opening 213 includes a third isolation opening 430 enclosed by the isolation structure 400, and the edge area 440 also includes a third area 443 arranged around the third isolation opening 430. The first area 441, the second area 442 and the third area 443 are arranged at intervals, and the surface roughness of the second area 442 is less than the surface roughness of the third area 443, which is beneficial to improving the bonding force between the third area 443 and the packaging part 303.

[0094] like Figure 2aAs shown, in some optional embodiments, a packaging portion 303 is provided on the side of the light-emitting unit 300 facing away from the substrate 100 , the light-emitting unit 300 is located in the first isolation opening 410 , the second isolation opening 420 and the third isolation opening 430 , and the packaging portion 303 is provided on the side of the light-emitting unit 300 facing away from the substrate 100 .

[0095] In these optional embodiments, the encapsulation portion 303 is located on the side of the light emitting unit 300 away from the substrate 100 for encapsulating the light emitting unit 300 . The encapsulation portion 303 can reduce the damage caused by water, oxygen, etc. invading the light emitting unit 300 .

[0096] Optional, such as Figures 2a to 5 As shown, the packaging part 303 extends from the side of the light-emitting unit 300 away from the substrate 100 to the side of the isolation structure 400 away from the substrate 100, and the part of the packaging part 303 located on the side of the isolation structure 400 away from the substrate 100 covers the orthographic projection of the edge area 440 on the substrate 100. The packaging part 303 extends from the isolation opening to the side of the isolation structure 400 away from the substrate 100, thereby improving the packaging effect.

[0097] Optional, such as Figures 2a to 5 As shown, a luminescent material portion 304 is provided between the encapsulation portion 303 and the edge region 440, and the material of the luminescent material portion 304 is the same as that of the luminescent unit 300. During the preparation of the luminescent unit 300, the organic luminescent material will cover the functional portion 200 and the isolation opening, and the encapsulation portion 303 is formed in the isolation opening and on the side of the organic luminescent material away from the edge region 440. During the process of removing the organic luminescent material outside the isolation opening by dry etching, the organic luminescent material located in the edge region 440 is shielded by the encapsulation portion 303, thereby preventing the organic luminescent material in the edge region 440 from being bombarded by plasma, thereby forming the luminescent material portion 304 and the luminescent unit 300, and the luminescent material portion 304 is the same as that of the luminescent unit 300 and is prepared and formed in the same preparation process.

[0098] like Figure 2a As shown, in some optional embodiments, the light emitting unit 300 includes a first light emitting unit 310 located in the first isolation opening 410 , a second light emitting unit 320 located in the second isolation opening 420 , and a third light emitting unit 330 located in the third isolation opening 430 .

[0099] In these optional embodiments, the first light emitting unit 310 is used to emit blue light, the second light emitting unit 320 is used to emit green light, and the third light emitting unit 330 is used to emit red light. The tolerance of the material of the first light emitting unit 310 to temperature, light, humidity, and pollutants is better than that of the material of the third light emitting unit 330 and the material of the second light emitting unit 320. The tolerance of the material of the second light emitting unit 320 to temperature, light, humidity, and pollutants is better than that of the material of the third light emitting unit 330. In this embodiment, the first light emitting unit 310, the second light emitting unit 320, and the third light emitting unit 330 are sequentially equipped to improve the overall yield of the display panel.

[0100] Optional, such as Figures 2a to 5 As shown, the light-emitting material portion 304 includes a first light-emitting material portion 312 located in the first region 441 and located between the surface of the packaging portion 303 and the isolation structure 400 on the side facing away from the substrate 100, a second light-emitting material portion 322 located in the second region 442 and located between the surface of the packaging portion 303 and the isolation structure 400 on the side facing away from the substrate 100, and a third light-emitting material portion 332 located in the third region 443 and located between the surface of the packaging portion 303 and the isolation structure 400 on the side facing away from the substrate 100, wherein the first light-emitting material portion 312 is made of the same material as the first light-emitting unit 310, the second light-emitting material portion 322 is made of the same material as the second light-emitting unit 320, and the third light-emitting material portion 332 is made of the same material as the third light-emitting unit 330. The first light-emitting material portion 312 is prepared and formed synchronously with the first light-emitting unit 310 in the same preparation process, the second light-emitting material portion 322 is prepared and formed synchronously with the second light-emitting unit 320 in the same preparation process, and the third light-emitting material portion 332 is prepared and formed synchronously with the third light-emitting unit 330 in the same preparation process.

[0101] like Figure 2a As shown, in some optional embodiments, the packaging portion 303 includes a first packaging portion 313 located in the first isolation opening 410 and a second packaging portion 323 located in the second isolation opening 420, and the surface roughness of the first packaging portion 313 facing away from the substrate 100 is greater than the surface roughness of the second packaging portion 323 facing away from the substrate 100.

[0102] In these optional embodiments, the surface roughness of the first packaging part 313 is greater than the surface roughness of the second packaging part 323, so that when other film layers are prepared on the surface of the first packaging part 313, the bonding force between other film layers and the first packaging part 313 can be improved, thereby reducing the risk of peeling.

[0103] In some embodiments, the use of a dry etching process to prepare the light-emitting unit 300 can reduce damage to the packaging material, and dry etching will affect the surface roughness of a portion of the packaging portion 303. When the light-emitting unit 300 in the first opening 211 and the light-emitting unit 300 in the second opening 212 are prepared in sequence, the light-emitting unit 300 in the first opening 211 is first prepared. When preparing the light-emitting unit 300 in the second opening 212, the second packaging portion 323 is first covered with a protective glue 700 on the side facing away from the substrate 100. Since over-etching by dry etching will cause plasma to bombard the first packaging portion 313, the surface roughness of the first packaging portion 313 on the side facing away from the substrate 100 will be greater than the surface roughness of the second packaging portion 323 on the side facing away from the substrate 100.

[0104] Optional, such as Figure 2a As shown, the packaging part 303 also includes a third packaging part 333 located in the third isolation opening 430, and the surface roughness of the second packaging part 323 facing away from the substrate 100 is greater than the surface roughness of the third packaging part 333 facing away from the substrate 100, thereby improving the bonding force between the second packaging layer and the second packaging part 323.

[0105] In these optional embodiments, the surface roughness of the second packaging part 323 is greater than the surface roughness of the third packaging part 333, so that when other film layers are prepared on the surface of the second packaging part 323, the bonding force between the other film layers and the second packaging part 323 can be improved, thereby reducing the risk of peeling.

[0106] like Figure 2a As shown, in some optional embodiments, the surface of the isolation structure 400 facing away from the substrate 100 has a fourth region 444, the orthographic projection of the fourth region 444 on the substrate 100 is offset from the orthographic projection of the packaging portion 303 on the substrate 100, and the surface roughness of the fourth region 444 is greater than the surface roughness of the third region 443.

[0107] In these optional embodiments, the orthographic projection of the fourth region 444 on the substrate 100 is misaligned with the orthographic projection of the packaging portion 303 on the substrate 100, that is, the fourth region 444 is not covered by the packaging portion 303. In the dry etching process, the fourth region 444 is subjected to multiple dry etchings so that the surface roughness of the fourth region 444 is greater than the surface roughness of the third region 443. The greater roughness of the fourth region 444 increases the bonding force between the second packaging layer and the fourth region 444.

[0108] like Figure 2bAs shown, in some optional embodiments, the fourth region 444 includes a first sub-region 445 located between the adjacent first region 441 and the second region 442, a second sub-region 446 located between the adjacent second region 442 and the third region 443, and a third sub-region 447 located between the adjacent first region 441 and the third region 443, and the first sub-region 445, the second sub-region 446, and the third sub-region 447 have the same roughness. The first sub-region 445, the second sub-region 446, and the third sub-region 447 are not covered by the encapsulation portion 303, so that the first sub-region 445, the second sub-region 446, and the third sub-region 447 have the same roughness.

[0109] like Figure 2a As shown, in some optional embodiments, the functional portion 200 also includes a pixel definition layer, which is arranged between the isolation structure 400 and the substrate 100, and the pixel definition layer includes a pixel defining portion 500, the first opening 211 includes a first pixel opening 510 formed by the pixel defining portion 500, and the second opening 212 includes a second pixel opening 520 formed by the pixel defining portion 500; the first pixel opening 510 is connected to the first isolation opening 410, and the second pixel opening 520 is connected to the second isolation opening 420.

[0110] In these optional embodiments, the first pixel opening 510 is connected with the first isolation opening 410 to form a first opening 211, the second pixel opening 520 is connected with the second isolation opening 420 to form a second opening 212, the light-emitting unit 300 is located in the first opening 211 and the second opening 212, and the isolation structure 400 and the pixel defining portion 500 can reduce light crosstalk between different light-emitting units 300.

[0111] Optional, such as Figure 2a As shown, the pixel defining portion 500 includes a first sub-portion 501 exposed by the first isolation opening 410 and a second sub-portion 502 exposed by the second isolation opening 420, and the surface roughness of the first sub-portion 501 is less than the surface roughness of the second sub-portion 502. Part of the pixel defining portion 500 is located in the first isolation opening 410 and the second isolation opening 420, and the first sub-portion 501 and the second sub-portion 502 are exposed by the isolation openings and thus are subjected to dry etching to cause a change in roughness, and the surface roughness of the first sub-portion 501 is less than the surface roughness of the second sub-portion 502, thereby improving the bonding force between the second sub-portion 502 and the light-emitting unit 300.

[0112] Optional, such as Figure 2a As shown, the third opening 213 includes a third pixel opening 530 formed by enclosing the pixel defining portion 500 , and the third pixel opening 530 is connected to the third isolation opening 430 to form the third opening 213 .

[0113] Optional, such as Figure 2a As shown, the pixel defining portion 500 further includes a third sub-portion 503 exposed by the third isolation opening 430 , and the surface roughness of the second sub-portion 502 is smaller than that of the third sub-portion 503 , thereby improving the bonding force between the third sub-portion 503 and the light emitting unit 300 .

[0114] like Figure 2a As shown, in some optional embodiments, the display panel also includes a first electrode layer, which is arranged between the light-emitting layer and the substrate 100, and the first electrode layer includes a first sub-electrode 351 and a second sub-electrode 352, at least a portion of the first sub-electrode 351 is exposed to the first pixel opening 510, and at least a portion of the second sub-electrode 352 is exposed to the second pixel opening 520, wherein the surface roughness of the first sub-electrode 351 is less than the surface roughness of the second sub-electrode 352.

[0115] In these optional embodiments, the first electrode layer is arranged between the light-emitting layer and the substrate 100, at least a portion of the first sub-electrode 351 is exposed to the first pixel opening 510, and at least a portion of the second sub-electrode 352 is exposed to the second pixel opening 520. After the light-emitting unit 300 is made in the first opening 211, the light-emitting unit 300 covers the first sub-electrode 351. During dry etching, the surface roughness of the second sub-electrode 352 exposed by the second pixel opening 520 will increase, thereby making the surface roughness of the first sub-electrode 351 smaller than the surface roughness of the second sub-electrode 352, which is beneficial to increase the bonding force between the second sub-electrode 352 and the light-emitting unit 300.

[0116] Optional, such as Figure 2a As shown, the first electrode layer further includes a third sub-electrode 353, at least a portion of the third sub-electrode 353 is exposed to the third pixel opening 530, and the surface roughness of the second sub-electrode 352 is less than that of the third sub-electrode 353. After the light-emitting unit 300 is manufactured in the first opening 211, the light-emitting unit 300 covers the first sub-electrode 351, and during dry etching, the surface roughness of the second sub-electrode 352 exposed by the second pixel opening 520 and the third sub-electrode 353 exposed by the third pixel opening 530 will increase. After the light-emitting unit 300 is manufactured in the second opening 212, the light-emitting unit 300 covers the second sub-electrode 352, and during dry etching, the surface roughness of the third sub-electrode 353 exposed by the third pixel opening 530 will further increase, so that the surface roughness of the second sub-electrode 352 is less than that of the third sub-electrode 353, which is conducive to increasing the bonding force between the third sub-electrode 353 and the light-emitting unit 300.

[0117] Optional, such as Figure 2aAs shown, the first sub-electrode 351, the second sub-electrode 352 and the third sub-electrode 353 are respectively disposed on the side of the light-emitting unit 300 facing the substrate 100. The first sub-electrode 351, the second sub-electrode 352 and the third sub-electrode 353 are used to drive the light-emitting unit 300 to emit light.

[0118] like Figure 2a As shown, in some optional embodiments, the display panel further includes a second electrode layer, and the second electrode layer includes a second electrode 302 located between the light-emitting unit 300 and the packaging portion 303. The second electrode 302 is disposed between the packaging portion 303 and the light-emitting electrode, and the second electrode 302 is located in the opening 210 for driving the light-emitting unit 300 to emit light.

[0119] Optional, such as Figure 2a and Figure 4 As shown, the second electrode layer also includes a second electrode material portion 305, and the second electrode material portion 305 is disposed between the encapsulation portion 303 and the light-emitting material portion 304. During the preparation of the light-emitting unit 300, the second electrode 302 material will cover the functional portion 200 and the opening 210 and be located on the side of the organic light-emitting material away from the substrate 100, and the encapsulation portion 303 is formed in the opening 210 and on the side of the second electrode 302 material away from the edge region 440. During the process of removing the organic light-emitting material and the second electrode 302 material outside the isolation opening by dry etching, the organic light-emitting material and the second electrode 302 material located in the edge region 440 are shielded by the encapsulation portion 303, thereby preventing the organic light-emitting material and the second electrode 302 material from being bombarded by ions, thereby forming the light-emitting material portion 304 and the light-emitting unit 300, as well as the second electrode 302 on the side of the light-emitting unit 300 away from the substrate 100 and the second electrode material portion 305 on the side of the light-emitting material portion 304 away from the substrate 100, and the second electrode 302 and the second electrode material portion 305 are made of the same materials and are prepared and formed in the same preparation process.

[0120] Optionally, the second electrode 302 is electrically connected to the isolation structure 400 , so that the second electrodes 302 in each isolation opening are electrically connected to each other through the isolation structure 400 .

[0121] like Figure 2a As shown, in some optional embodiments, the isolation structure 400 includes a first sublayer 401 and a second sublayer 402, the first sublayer 401 is located on the side of the second sublayer 402 facing the substrate 100, and the orthographic projection of the first sublayer 401 on the substrate 100 is located within the orthographic projection of the second sublayer 402 on the substrate 100.

[0122] In these optional embodiments, the orthographic projection size of the first sublayer 401 on the substrate 100 is smaller than the orthographic projection size of the second sublayer 402 on the substrate 100, so as to form a recess under the second sublayer 402. During the preparation of the light-emitting unit 300, the material of the light-emitting layer can be separated into mutually independent light-emitting units 300 by the isolation structure 400, and the precision mask plate evaporation process can be omitted, thereby reducing the preparation cost.

[0123] Optional, such as Figures 2a to 4 As shown, the second sublayer 402 has a first region 441, a second region 442 and a third region 443 on the surface facing away from the substrate 100. Part of the encapsulation portion 303 extends to cover the first region 441, the second region 442 and the third region 443 on the surface facing away from the substrate 100.

[0124] Optional, such as Figure 2a As shown, the isolation structure 400 further includes a third sublayer 403, which is disposed on the side of the first sublayer 401 facing the substrate 100. When etching to form the first sublayer 401, the third sublayer 403 is not easily affected by the etching and can provide better protection for the substrate 100. Optionally, the material of the third sublayer 403 includes molybdenum or titanium.

[0125] Optionally, the specific design of the isolation structure 400 may refer to existing patents, such as application numbers CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, and PCT / CN2024 / 099072, which record relevant contents of the isolation structure 400 (or partition structure or isolation column).

[0126] like Figures 1 to 5 As shown, the first aspect embodiment of the present application also proposes a display panel, including: a substrate 100; an isolation structure 400, which is arranged on one side of the substrate 100, and the first isolation opening 410 and the second isolation opening 420 are formed by the isolation structure 400, and the surface of the isolation structure 400 on the side facing away from the substrate 100 has an edge area 440 surrounding the isolation opening, and the edge area 440 includes a first area 441 arranged around the first isolation opening 410 and a second area 442 arranged around the second isolation opening 420, and the first area 441 and the second area 442 are arranged at intervals; a light-emitting layer, the light-emitting layer includes a light-emitting unit 300 located in the first isolation opening 410 and the second isolation opening 420; wherein the surface roughness of the first area 441 is less than the surface roughness of the second area 442.

[0127] In this embodiment, the surface of the side of the isolation structure 400 facing away from the substrate 100 has an edge area 440 surrounding the isolation opening, and the edge area 440 includes a first area 441 arranged around the first isolation opening 410 and a second area 442 arranged around the second isolation opening 420. The first area 441 and the second area 442 are annular, and the surface roughness of the first area 441 is smaller than the surface roughness of the second area 442. The surface roughness of the first area 441 is smaller than the surface roughness of the second area 442, which is beneficial to improving the bonding force between the second area 442 and other film layers arranged in the second area 442.

[0128] Optionally, a packaging portion 303 is provided on the side of the light-emitting unit 300 facing away from the substrate 100, and the packaging portion 303 extends from the first isolation opening 410 and the second isolation opening 420 to cover the first area 441 and the second area 442. The surface roughness of the first area 441 is less than the surface roughness of the second area 442, which is beneficial to improving the bonding force between the second area 442 and the packaging portion 303, reducing the risk of peeling between the packaging portion 303 and the functional portion 200, and improving the packaging effect of the packaging portion 303.

[0129] In some optional embodiments, the configuration and effects of the isolation structure 400, the pixel definition layer, etc. are as described above and will not be repeated here.

[0130] like Figures 1 to 5 As shown, the first aspect of the present application also proposes a display panel, including: a substrate 100; a pixel definition layer, arranged on one side of the substrate 100, the pixel definition layer includes a pixel definition portion 500, the pixel definition portion 500 encloses a first pixel opening 510 and a second pixel opening 520; an isolation structure 400, arranged on the side of the pixel definition layer away from the substrate 100, the isolation structure 400 encloses a first isolation opening 410 and a second isolation opening 420, the first pixel opening 510 is connected to the first isolation opening 410, and the second pixel opening 520 is connected to the second isolation opening 420; a light-emitting layer, the light-emitting layer includes a light-emitting unit 300 located in the first pixel opening 510 and the second pixel opening 520; wherein the pixel definition portion 500 includes a first sub-portion 501 exposed by the first isolation opening 410 and a second sub-portion 502 exposed by the second isolation opening 420, and the surface roughness of the first sub-portion 501 is less than the surface roughness of the second sub-portion 502.

[0131] In this embodiment, part of the pixel defining portion 500 is located within the first isolation opening 410 and the second isolation opening 420. The first section 501 and the second section 502 are exposed by the isolation openings and are thus subjected to dry etching, resulting in a change in roughness. The surface roughness of the first section 501 is less than that of the second section 502, thereby enhancing the bonding force between the second section 502 and the light-emitting unit 300 and reducing the risk of film peeling.

[0132] In some optional embodiments, the configuration and effects of the isolation structure 400, the pixel definition layer, etc. are as described above and will not be repeated here.

[0133] like Figures 1 to 5 As shown, the first embodiment of the present application further provides a display panel, comprising: a substrate 100; a pixel definition layer, arranged on one side of the substrate 100, the pixel definition layer comprising a pixel definition portion 500, the pixel definition portion 500 encloses a first pixel opening 510 and a second pixel opening 520; an isolation structure 400, arranged on a side of the pixel definition layer away from the substrate 100, the isolation structure 400 encloses a first isolation opening 410 and a second isolation opening 420, the first pixel opening 510 is connected to the first isolation opening 410, and the second pixel opening 520 is connected to the second pixel opening 520. 20 is connected to the second isolation opening 420; a light-emitting layer, the light-emitting layer includes a light-emitting unit 300 located in the first pixel opening 510 and the second pixel opening 520; a first electrode layer is arranged between the light-emitting layer and the substrate 100, the first electrode layer includes a first sub-electrode 351 and a second sub-electrode 352, at least a portion of the first sub-electrode 351 is exposed to the first pixel opening 510, and at least a portion of the second sub-electrode 352 is exposed to the second pixel opening 520, wherein the surface roughness of the first sub-electrode 351 is less than the surface roughness of the second sub-electrode 352.

[0134] In this embodiment, at least a portion of the second sub-electrode 352 is exposed to the second pixel opening 520. After the light-emitting unit 300 is formed in the first opening 211, the light-emitting unit 300 covers the first sub-electrode 351. During dry etching, the surface roughness of the second sub-electrode 352 exposed by the second pixel opening 520 will increase, thereby making the surface roughness of the first sub-electrode 351 smaller than the surface roughness of the second sub-electrode 352, which is beneficial to increase the bonding force between the second sub-electrode 352 and the light-emitting unit 300.

[0135] In some optional embodiments, the configuration and effects of the isolation structure 400, the pixel definition layer, etc. are as described above and will not be repeated here.

[0136] The embodiment of the second aspect of the present application also provides a display device, including the display panel of any of the above-mentioned embodiments of the first aspect. Since the display device provided by the embodiment of the second aspect of the present application includes the display panel of any of the above-mentioned embodiments of the first aspect, the display device provided by the embodiment of the second aspect of the present application has the beneficial effects of the display panel of any of the above-mentioned embodiments of the first aspect, which will not be repeated here.

[0137] The display device in the embodiments of the present application includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0138] The third aspect of the present application also provides a method for manufacturing a display panel. Figure 6 As shown, the following steps are included:

[0139] Step S01: Figure 7 As shown, a functional layer is formed on one side of the substrate 100 , and the functional layer includes a functional portion 200 and an opening 210 formed by the functional portion 200 . The opening 210 includes a first opening 211 and a second opening 212 .

[0140] Step S02: Figure 8 As shown, a first light emitting unit 310 is prepared in the first opening 211 .

[0141] Step S03: Fig. 9 As shown, the second light emitting unit 320 is prepared in the second opening 212 , wherein the surface roughness of the portion of the functional part 200 surrounding the first opening 211 is smaller than the surface roughness of the portion of the functional part 200 surrounding the second opening 212 .

[0142] In this embodiment, the first light-emitting unit 310 is sequentially prepared in the first opening 211, and the second light-emitting unit 320 is prepared in the second opening 212. The functional part 200 can reduce the light crosstalk between the first light-emitting unit 310 and the second light-emitting unit 320, thereby improving the display effect of the display panel. When the first light-emitting unit 310 is formed by dry etching, the surface of the part of the functional part 200 surrounding the first opening 211 is covered by the protective layer, and plasma bombards the surface of the part of the functional part 200 surrounding the second opening 212, so that the surface roughness of the part of the functional part 200 surrounding the first opening 211 is less than the surface roughness of the part of the functional part 200 surrounding the second opening 212, which is conducive to improving the bonding force between the second light-emitting unit 320 and the part of the functional part 200 surrounding the second opening 212, and reducing the risk of peeling.

[0143] In some optional embodiments, such as Figure 7As shown, the opening 210 further includes a third opening 213. After step S03, as shown in FIG. Figure 6 As shown, it also includes:

[0144] Step S04: Figure 2a As shown, a third light emitting unit 330 is prepared in the third opening 213 , wherein the surface roughness of the portion of the functional part 200 surrounding the second opening 212 is smaller than the surface roughness of the portion of the functional part 200 surrounding the third opening 213 .

[0145] In these optional embodiments, a first light-emitting unit 310 is prepared in the first opening 211, a second light-emitting unit 320 is prepared in the second opening 212, and a third light-emitting unit 330 is prepared in the third opening 213. The functional part 200 can reduce the light crosstalk between the first light-emitting unit 310, the second light-emitting unit 320 and the third light-emitting unit 330, thereby improving the display effect of the display panel.

[0146] When the first light-emitting unit 310 is formed by dry etching, the surface of the partial functional portion 200 surrounding the first opening 211 is covered by the protective layer, and plasma will bombard the surface of the partial functional portion 200 surrounding the second opening 212 and the third opening 213, so that the surface roughness of the partial functional portion 200 surrounding the first opening 211 is less than the surface roughness of the partial functional portion 200 surrounding the second opening 212 and the third opening 213. When the second light-emitting unit 320 is formed by dry etching, the surface of the partial functional portion 200 surrounding the first opening 211 is covered by the first light-emitting unit 310, and the surface of the partial functional portion 200 surrounding the second opening 212 is covered by the protective layer, and plasma will bombard the surface of the partial functional portion 200 surrounding the third opening 213, so that the surface roughness of the partial functional portion 200 surrounding the third opening 213 is greater than the surface roughness of the partial functional portion 200 surrounding the first opening 211 and the second opening 212, thereby facilitating the improvement of the bonding force between the third light-emitting unit 330 and the partial functional portion 200 surrounding the third opening 213 and reducing the risk of peeling.

[0147] In some optional embodiments, in step S02, as Fig.10 As shown, including:

[0148] Step S021: Fig.11 As shown, a first preparation material layer 610 is formed on the opening 210 and the side of the functional layer facing away from the substrate 100 .

[0149] Step S022: Fig.12 As shown, a protective glue 700 is formed on the side of the first preparation material layer 610 facing away from the substrate 100 in the area where the first opening 211 is located.

[0150] Step S023: Figure 8 As shown, the second opening 212, the third opening 213 and the first preparation material layer 610 and the protective glue 700 on the side of the functional part 200 facing away from the substrate 100 are removed by dry etching, and the first preparation material layer 610 in the area where the first opening 211 is located is retained. Part of the first preparation material layer 610 forms the first light-emitting unit 310, so that the surface roughness of the part of the functional part 200 surrounding the first opening 211 is smaller than the surface roughness of the part of the functional part 200 surrounding the second opening 212, and the surface roughness of the part of the functional part 200 surrounding the first opening 211 is smaller than the surface roughness of the part of the functional part 200 surrounding the third opening 213.

[0151] In these optional embodiments, the first preparation material layer 610 is evaporated on the side of each opening 210 and the functional layer away from the substrate 100, and a protective glue 700 is formed on the side of the first preparation material layer 610 in the area where the first opening 211 is located away from the substrate 100. The first preparation material layer 610 and the protective glue 700 on the side of the second opening 212, the third opening 213 and the functional part 200 away from the substrate 100 are removed by dry etching. Since the protective glue 700 covers the first preparation material layer 610 in the area where the first opening 211 is located, the first preparation material layer 610 in the area where the first opening 211 is located is not etched, and the first light-emitting unit 310 is formed. In order to completely remove the first preparation material layer 610, dry etching adopts an over-etching process. After bombarding and removing the first preparation material layer 610, the plasma continues to bombard the functional part 200. Since the partial functional part 200 surrounding the first opening 211 is covered by the first light-emitting unit 310, and the surface of the partial functional part 200 surrounding the second opening 212 and the third opening 213 is exposed to the plasma bombardment, the surface roughness of the partial functional part 200 surrounding the second opening 212 and the third opening 213 is increased, so that the surface roughness of the partial functional part 200 surrounding the first opening 211 is smaller than the surface roughness of the partial functional part 200 surrounding the second opening 212, and the surface roughness of the partial functional part 200 surrounding the first opening 211 is smaller than the surface roughness of the partial functional part 200 surrounding the third opening 213.

[0152] like Fig.11 As shown, in some optional embodiments, the first preparation material layer 610 includes a first organic light-emitting material layer 611, a second electrode material layer 612 corresponding to the first light-emitting unit 310, and a first packaging material layer 613 sequentially arranged in a direction away from the substrate 100; in step S023, it includes:

[0153] like Fig.13As shown, the second opening 212 , the third opening 213 and the first packaging material layer 613 on the side of the functional portion 200 away from the substrate 100 are removed by dry etching, and the first packaging material layer 613 in the area where the first opening 211 is located is retained to form the first packaging portion 313 .

[0154] like Fig.14 As shown, the second opening 212 , the third opening 213 and the second electrode material layer 612 on the side of the functional portion 200 away from the substrate 100 are removed, and the second electrode material layer 612 located at the first opening 211 is retained to form the second electrode 302 corresponding to the first light-emitting unit 310 .

[0155] like Figure 8 As shown, the second opening 212 , the third opening 213 , and the first organic light-emitting material layer 611 on the side of the functional portion 200 away from the substrate 100 and the protective glue 700 are removed by dry etching, and the first organic light-emitting material layer 611 located in the first opening 211 is retained to form the first light-emitting unit 310 .

[0156] In these optional embodiments, the first organic light-emitting material layer 611, the second electrode material layer 612 and the first packaging material layer 613 are stacked in sequence in the direction away from the substrate 100. The second opening 212, the third opening 213 and the first packaging material layer 613 on the side of the functional part 200 away from the substrate 100 are removed by dry etching to expose the second opening 212, the third opening 213 and the second electrode material layer 612 on the side of the functional part 200 away from the substrate 100. The first packaging part 313 that independently packages the first opening 211 is formed, which is conducive to improving the packaging effect. The second opening 212 and the third opening 213 and the second electrode material layer 612 on the side of the functional part 200 away from the substrate 100 are removed by dry etching or wet etching to form a second electrode 302 corresponding to the first light-emitting unit 310, so as to expose the second opening 212, the third opening 213 and the first organic light-emitting material layer 611 on the side of the functional part 200 away from the substrate 100. The second opening 212, the third opening 213 and the first organic light-emitting material layer 611 on the side of the functional part 200 away from the substrate 100 and the protective glue 700 are removed by dry etching, thereby retaining the first light-emitting unit 310, the second electrode 302 and the first encapsulation part 313.

[0157] In some optional embodiments, in step S03, as Fig.15 As shown, it also includes:

[0158] Step S031: Fig.16 As shown, a second preparation material layer 620 is formed on the opening 210 and the side of the functional layer facing away from the substrate 100 .

[0159] Step S032: Fig.17As shown, a protective glue 700 is formed on the side of the second preparation material layer 620 facing away from the substrate 100 in the area where the second opening 212 is located.

[0160] Step S033: Fig. 9 As shown, the first opening 211, the third opening 213 and the second preparation material layer 620 and the protective glue 700 on the side of the functional part 200 facing away from the substrate 100 are removed by dry etching, and the second preparation material layer 620 in the area where the second opening 212 is located is retained. Part of the second preparation material layer 620 forms the second light-emitting unit 320, so that the surface roughness of the part of the functional part 200 surrounding the first opening 211 is smaller than the surface roughness of the part of the functional part 200 surrounding the second opening 212; the surface roughness of the part of the functional part 200 surrounding the second opening 212 is smaller than the surface roughness of the part of the functional part 200 surrounding the third opening 213.

[0161] In these optional embodiments, the second preparation material layer 620 is evaporated on the side of each opening 210 and the functional layer away from the substrate 100, and a protective glue 700 is formed on the side of the second preparation material layer 620 in the area where the second opening 212 is located away from the substrate 100. The second preparation material layer 620 and the protective glue 700 on the side of the first opening 211, the third opening 213 and the functional part 200 away from the substrate 100 are removed by dry etching. Since the protective glue 700 covers the second preparation material layer 620 in the area where the second opening 212 is located, the second preparation material layer 620 in the area where the second opening 212 is located is not etched, and the second light-emitting unit 320 is formed. In order to completely remove the second preparation material layer 620, the dry etching adopts an over-etching process. After bombarding and removing the second preparation material layer 620, the plasma continues to bombard the functional part 200. Since the first light-emitting unit 310 covers the surface of the partial functional part 200 surrounding the first opening 211, and the second light-emitting unit 320 covers the surface of the partial functional part 200 surrounding the second opening 212, the surface of the partial functional part 200 surrounding the third opening 213 is exposed to the bombardment of the plasma, which further increases the surface roughness of the partial functional part 200 surrounding the third opening 213, so that the surface roughness of the partial functional part 200 surrounding the first opening 211 is smaller than the surface roughness of the partial functional part 200 surrounding the second opening 212; the surface roughness of the partial functional part 200 surrounding the second opening 212 is smaller than the surface roughness of the partial functional part 200 surrounding the third opening 213.

[0162] In some optional embodiments, such as Fig.16 As shown, the second preparation material layer 620 includes a second organic light-emitting material layer 621, a second electrode material layer 612 corresponding to the second light-emitting unit 320, and a second packaging material layer 623 sequentially arranged in a direction away from the substrate 100; in step S033, it includes:

[0163] Please refer to Fig.13 Combined with Fig.17 , the first opening 211 , the third opening 213 and the second packaging material layer 623 on the side of the functional portion 200 away from the substrate 100 are removed by dry etching, and the second packaging material layer 623 in the area where the second opening 212 is located is retained to form the second packaging portion 323 .

[0164] Please refer to Fig.14 Combined with Fig.17 , remove the first opening 211 and the third opening 213 and the second electrode material layer 612 on the side of the functional portion 200 away from the substrate 100, and retain the second electrode material layer 612 located at the second opening 212 to form the second electrode 302 corresponding to the second light-emitting unit 320.

[0165] like Fig. 9 As shown, the first opening 211 and the third opening 213 and the second organic light-emitting material layer 621 on the side of the functional portion 200 away from the substrate 100 and the protective glue 700 are removed by dry etching, and the second organic light-emitting material layer 621 located at the second opening 212 is retained to form the second light-emitting unit 320 .

[0166] In these optional embodiments, the second organic light-emitting material layer 621, the second electrode material layer 612, and the second encapsulation material layer 623 are stacked in sequence in a direction away from the substrate 100. The first opening 211, the third opening 213, and the second encapsulation material layer 623 on the side of the functional part 200 away from the substrate 100 are removed by dry etching to expose the first light-emitting unit 310, the third opening 213, and the second electrode material layer 612 on the side of the functional part 200 away from the substrate 100. The second encapsulation part 323 that independently encapsulates the second opening 212 is formed, which is conducive to improving the encapsulation effect. Dry etching or wet etching is used to remove the first light-emitting unit 310, the third opening 213, and the second electrode material layer 612 on the side of the functional part 200 away from the substrate 100 to form a second electrode 302 corresponding to the second light-emitting unit 320, so as to expose the first opening 211, the third opening 213, and the second organic light-emitting material layer 621 on the side of the functional part 200 away from the substrate 100. The first opening 211, the third opening 213, and the second organic light-emitting material layer 621 on the side of the functional part 200 away from the substrate 100 and the protective glue 700 are removed by dry etching, thereby retaining the second light-emitting unit 320 and the second electrode 302 and the second packaging part 323 on the side of the second light-emitting unit 320 away from the substrate 100.

[0167] In some optional embodiments, in step S04, as Fig.18 As shown, including:

[0168] Step S041: Fig.19As shown, a third preparation material layer 630 is formed on the opening 210 and the side of the functional layer facing away from the substrate 100 .

[0169] Step S042: Fig. 20 As shown, a protective glue 700 is formed on the side of the third preparation material layer 630 facing away from the substrate 100 in the area where the third opening 213 is located.

[0170] Step S043: Figure 2a As shown, dry etching is performed to remove the first opening 211 , the second opening 212 , and the third preparation material layer 630 and the protective glue 700 on the side of the functional part 200 facing away from the substrate 100 , and the third preparation material layer 630 in the area where the third opening 213 is located is retained, and part of the third preparation material layer 630 forms a third light-emitting unit 330 .

[0171] In these optional embodiments, the third preparation material layer 630 is evaporated on the side of each opening 210 and the functional layer away from the substrate 100, and a protective glue 700 is formed on the side of the third preparation material layer 630 in the area where the third opening 213 is located away from the substrate 100. The third preparation material layer 630 and the protective glue 700 on the side of the first opening 211, the second opening 212 and the functional part 200 away from the substrate 100 are removed by dry etching. Since the protective glue 700 covers the third preparation material layer 630 in the area where the third opening 213 is located, the third preparation material layer 630 in the area where the third opening 213 is located is not etched, and part of the third preparation material layer 630 forms the third light-emitting unit 330.

[0172] In some optional embodiments, such as Fig.19 As shown, the third preparation material layer 630 includes a third organic light-emitting material layer 631, a second electrode material layer 612 corresponding to the third light-emitting unit 330, and a third packaging material layer 633 sequentially arranged in a direction away from the substrate 100; in step S043, it includes:

[0173] Please refer to Fig.13 Combined with Fig. 20 , the first opening 211 , the second opening 212 and the third packaging material layer 633 on the side of the functional portion 200 away from the substrate 100 are removed by dry etching, and the third packaging material layer 633 in the area where the third opening 213 is located is retained to form a third packaging portion 333 .

[0174] Please refer to Fig.14 Combined with Fig. 20 , remove the first opening 211 , the second opening 212 and the second electrode material layer 612 on the side of the functional portion 200 away from the substrate 100 , and retain the second electrode material layer 612 located at the third opening 213 to form the second electrode 302 corresponding to the third light-emitting unit 330 .

[0175] like Figure 2a As shown, the first opening 211 , the second opening 212 and the third organic light-emitting material layer 631 on the side of the functional portion 200 away from the substrate 100 and the protective glue 700 are removed by dry etching, and the third organic light-emitting material layer 631 located in the third opening 213 is retained to form a third light-emitting unit 330 .

[0176] In these optional embodiments, the third organic light-emitting material layer 631, the second electrode material layer 612 and the third encapsulation material layer 633 are stacked in sequence in the direction away from the substrate 100. The first opening 211, the second opening 212 and the third encapsulation material layer 633 on the side of the functional part 200 away from the substrate 100 are removed by dry etching to expose the first light-emitting unit 310 and the second light-emitting unit 320 and the second electrode material layer 612 on the side of the functional part 200 away from the substrate 100. The third encapsulation part 333 that independently encapsulates the third opening 213 is formed to improve the encapsulation effect. Dry etching or wet etching is used to remove the first light-emitting unit 310, the second light-emitting unit 320 and the second electrode material layer 612 on the side of the functional part 200 away from the substrate 100 to form a second electrode 302 corresponding to the third light-emitting unit 330, so as to expose the first opening 211, the second opening 212 and the third organic light-emitting material layer 631 on the side of the functional part 200 away from the substrate 100, and dry etching is used to remove the first opening 211, the second opening 212 and the third organic light-emitting material layer 631 on the side of the functional part 200 away from the substrate 100 and the protective glue 700, so as to retain the third light-emitting unit 330 and the second electrode 302 and the third encapsulation part 333 on the side of the third light-emitting unit 330 away from the substrate 100.

[0177] Although the present application has been described with reference to preferred embodiments, various modifications may be made thereto and parts thereof may be replaced with equivalents without departing from the scope of the present application. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there are no structural conflicts. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display panel, characterized in that: include: substrate; A functional layer is disposed on one side of the substrate, the functional layer includes a functional portion and an opening formed by the functional portion, and the opening includes a first opening and a second opening; a light-emitting layer, the light-emitting layer comprising a light-emitting unit located in the opening; The surface roughness of the portion of the functional part surrounding the first opening is smaller than the surface roughness of the portion of the functional part surrounding the second opening.

2. The display panel according to claim 1, characterized in that: The opening further includes a third opening, and a surface roughness of a portion of the functional portion surrounding the second opening is smaller than a surface roughness of a portion of the functional portion surrounding the third opening.

3. The display panel according to claim 2, characterized in that: The functional part includes an isolation structure, the opening includes an isolation opening formed by the isolation structure, the first opening includes a first isolation opening formed by the isolation structure, and the second opening includes a second isolation opening formed by the isolation structure; The isolation structure has a side surface facing away from the substrate having an edge region surrounding the isolation opening, the edge region including a first region arranged around the first isolation opening and a second region arranged around the second isolation opening, the first region and the second region being arranged at intervals; the surface roughness of the first region is smaller than the surface roughness of the second region; Preferably, the third opening includes a third isolation opening formed by the isolation structure, the edge area also includes a third area arranged around the third isolation opening, the first area, the second area and the third area are arranged at intervals, and the surface roughness of the second area is less than the surface roughness of the third area.

4. The display panel according to claim 3, characterized in that: The display panel further includes a packaging portion, the packaging portion is located on a side of the light emitting unit away from the substrate, the light emitting unit is located in the first isolation opening, the second isolation opening and the third isolation opening, and the packaging portion is arranged on a side of the light emitting unit away from the substrate; Preferably, the packaging portion extends from a side of the light-emitting unit away from the substrate to a side of the isolation structure away from the substrate, and an orthographic projection of a portion of the packaging portion located on a side of the isolation structure away from the substrate on the substrate covers an orthographic projection of the edge region on the substrate; Preferably, a luminescent material portion is provided between the encapsulation portion and the edge region, and the material of the luminescent material portion is the same as that of the luminescent unit; Preferably, the light emitting unit comprises a first light emitting unit located in the first isolation opening, a second light emitting unit located in the second isolation opening, and a third light emitting unit located in the third isolation opening; Preferably, the light-emitting material portion includes a first light-emitting material portion located in the first region and between the packaging portion and the isolation structure on a surface side facing away from the substrate, a second light-emitting material portion located in the second region and between the packaging portion and the isolation structure on a surface side facing away from the substrate, and a third light-emitting material portion located in the third region and between the packaging portion and the isolation structure on a surface side facing away from the substrate, wherein the first light-emitting material portion is the same material as the first light-emitting unit, the second light-emitting material portion is the same material as the second light-emitting unit, and the third light-emitting material portion is the same material as the third light-emitting unit.

5. The display panel according to claim 4, characterized in that: The encapsulation portion comprises a first encapsulation portion located at the first isolation opening and a second encapsulation portion located at the second isolation opening, the surface roughness of the first encapsulation portion on a side away from the substrate being greater than the surface roughness of the second encapsulation portion on a side away from the substrate; Preferably, the packaging portion further includes a third packaging portion located in the third isolation opening, and the surface roughness of the second packaging portion on a side away from the substrate is greater than the surface roughness of the third packaging portion on a side away from the substrate.

6. The display panel according to claim 4, characterized in that: The isolation structure has a fourth region on a surface of a side facing away from the substrate, the orthographic projection of the fourth region on the substrate is staggered with the orthographic projection of the packaging portion on the substrate, and the surface roughness of the fourth region is greater than the surface roughness of the third region; Preferably, the fourth region includes a first sub-region located between the adjacent first region and the second region, a second sub-region located between the adjacent second region and the third region, and a third sub-region located between the adjacent first region and the third region, and the roughness of the first sub-region, the second sub-region and the third sub-region are equal.

7. The display panel according to claim 3, characterized in that: The functional part further includes a pixel definition layer, the pixel definition layer is arranged between the isolation structure and the substrate, the pixel definition layer includes a pixel definition part, the first opening includes a first pixel opening formed by the pixel definition part, and the second opening includes a second pixel opening formed by the pixel definition part; the first pixel opening is connected to the first isolation opening, and the second pixel opening is connected to the second isolation opening; Preferably, the pixel defining portion includes a first sub-portion exposed by the first isolation opening and a second sub-portion exposed by the second isolation opening, and a surface roughness of the first sub-portion is smaller than a surface roughness of the second sub-portion; Preferably, the third opening comprises a third pixel opening enclosed by the pixel defining portion, and the third pixel opening is connected to the third isolation opening; Preferably, the pixel defining portion further includes a third sub-portion exposed by the third isolation opening, and the surface roughness of the second sub-portion is smaller than the surface roughness of the third sub-portion.

8. The display panel according to claim 7, characterized in that: The display panel further includes a first electrode layer, the first electrode layer is disposed between the light emitting layer and the substrate, the first electrode layer includes a first sub-electrode and a second sub-electrode, at least a portion of the first sub-electrode is exposed to the first pixel opening, and at least a portion of the second sub-electrode is exposed to the second pixel opening, wherein a surface roughness of the first sub-electrode is smaller than a surface roughness of the second sub-electrode; Preferably, the first electrode layer further comprises a third sub-electrode, at least a portion of the third sub-electrode is exposed to the third pixel opening, and a surface roughness of the second sub-electrode is smaller than a surface roughness of the third sub-electrode; Preferably, the first sub-electrode, the second sub-electrode and the third sub-electrode are respectively arranged on a side of the light-emitting unit facing the substrate.

9. The display panel according to claim 4, characterized in that: The display panel further includes a second electrode layer, wherein the second electrode layer includes a second electrode located between the light emitting unit and the encapsulation part; Preferably, the second electrode layer further comprises a second electrode material portion, and the second electrode material portion is arranged between the packaging portion and the light-emitting material portion; Preferably, the second electrode is electrically connected to the isolation structure.

10. The display panel according to claim 3, characterized in that: The isolation structure comprises a first sublayer and a second sublayer, the first sublayer is located on a side of the second sublayer facing the substrate, and an orthographic projection of the first sublayer on the substrate is located within an orthographic projection of the second sublayer on the substrate; Preferably, the surface of the second sub-layer facing away from the substrate comprises the first region, the second region and the third region; Preferably, the isolation structure further includes a third sublayer, and the third sublayer is arranged on a side of the first sublayer facing the substrate.

11. A display panel, characterized in that: include: substrate; An isolation structure is disposed on one side of the substrate, the isolation structure encloses a first isolation opening and a second isolation opening, a surface of the isolation structure on a side facing away from the substrate has an edge region surrounding the isolation opening, the edge region includes a first region disposed around the first isolation opening and a second region disposed around the second isolation opening, and the first region and the second region are disposed at intervals; a light-emitting layer, the light-emitting layer comprising light-emitting units located in the first isolation opening and the second isolation opening; The surface roughness of the first region is smaller than the surface roughness of the second region.

12. A display panel, characterized in that: include: substrate; A pixel definition layer is disposed on one side of the substrate, the pixel definition layer includes a pixel definition portion, and the pixel definition portion encloses a first pixel opening and a second pixel opening; An isolation structure is disposed on a side of the pixel definition layer away from the substrate, the isolation structure encloses a first isolation opening and a second isolation opening, the first pixel opening is connected to the first isolation opening, and the second pixel opening is connected to the second isolation opening; a light-emitting layer, the light-emitting layer comprising light-emitting units located in the first pixel opening and the second pixel opening; The pixel defining portion includes a first sub-portion exposed by the first isolation opening and a second sub-portion exposed by the second isolation opening, and the surface roughness of the first sub-portion is smaller than the surface roughness of the second sub-portion.

13. A display panel, characterized in that: include: substrate; A pixel definition layer is disposed on one side of the substrate, the pixel definition layer includes a pixel definition portion, and the pixel definition portion encloses a first pixel opening and a second pixel opening; An isolation structure is disposed on a side of the pixel definition layer away from the substrate, the isolation structure encloses a first isolation opening and a second isolation opening, the first pixel opening is connected to the first isolation opening, and the second pixel opening is connected to the second isolation opening; a light-emitting layer, the light-emitting layer comprising light-emitting units located in the first pixel opening and the second pixel opening; A first electrode layer is arranged between the light-emitting layer and the substrate, the first electrode layer includes a first sub-electrode and a second sub-electrode, at least a portion of the first sub-electrode is exposed to the first pixel opening, and at least a portion of the second sub-electrode is exposed to the second pixel opening, wherein the surface roughness of the first sub-electrode is smaller than the surface roughness of the second sub-electrode.

14. A display device, characterized in that: A display panel comprising any one of claims 1-13.

15. A method for manufacturing a display panel, characterized in that: include: Forming a functional layer on one side of the substrate, the functional layer comprising a functional portion and an opening formed by the functional portion, the opening comprising a first opening and a second opening; preparing a first light-emitting unit in the first opening; A second light emitting unit is prepared in the second opening, wherein a surface roughness of a portion of the functional portion surrounding the first opening is smaller than a surface roughness of a portion of the functional portion surrounding the second opening.

16. The manufacturing method according to claim 15, characterized in that: The opening further includes a third opening, and after the step of preparing the second light-emitting unit in the second opening, the method further includes: A third light emitting unit is prepared in the third opening, wherein a surface roughness of a portion of the functional portion surrounding the second opening is smaller than a surface roughness of a portion of the functional portion surrounding the third opening.

17. The manufacturing method according to claim 16, characterized in that: The step of preparing the first light-emitting unit in the first opening includes: forming a first preparation material layer on a side of the opening and the functional layer facing away from the substrate; forming a protective glue on a side of the first preparation material layer facing away from the substrate in the area where the first opening is located; Dry etching removes the second opening, the third opening, and the first preparation material layer and the protective glue on the side of the functional part away from the substrate, retains the first preparation material layer in the area where the first opening is located, and forms the first light-emitting unit with a portion of the first preparation material layer, so that the surface roughness of the portion of the functional part surrounding the first opening is smaller than the surface roughness of the portion of the functional part surrounding the second opening, and the surface roughness of the portion of the functional part surrounding the first opening is smaller than the surface roughness of the portion of the functional part surrounding the third opening; Preferably, the first preparation material layer includes a first organic light-emitting material layer, a second electrode material layer corresponding to the first light-emitting unit, and a first packaging material layer arranged in sequence along a direction away from the substrate; the dry etching removes the second opening, the third opening, and the first preparation material layer on the side of the functional part away from the substrate and the protective glue, retains the first preparation material layer in the area where the first opening is located, and the step of forming the first light-emitting unit with part of the first preparation material layer includes: removing the second opening, the third opening and the first packaging material layer of the functional portion away from the substrate by dry etching, and retaining the first packaging material layer in the area where the first opening is located to form a first packaging portion; removing the second opening, the third opening and the second electrode material layer of the functional portion away from the substrate, and retaining the second electrode material layer located at the first opening to form a second electrode corresponding to the first light-emitting unit; The second opening, the third opening, the first organic light-emitting material layer at a side of the functional portion away from the substrate and the protective glue are removed by dry etching, and the first organic light-emitting material layer at the first opening is retained to form a first light-emitting unit.

18. The manufacturing method according to claim 17, characterized in that: The step of preparing the second light-emitting unit in the second opening further includes: forming a second preparation material layer on a side of the opening and the functional layer facing away from the substrate; forming a protective glue on a side of the second preparation material layer facing away from the substrate in the area where the second opening is located; Dry etching removes the first opening, the third opening, and the second preparation material layer on the side of the functional part away from the substrate and the protective glue, retains the second preparation material layer in the area where the second opening is located, and forms the second light-emitting unit with part of the second preparation material layer, so that the surface roughness of the part of the functional part surrounding the first opening is smaller than the surface roughness of the part of the functional part surrounding the second opening; the surface roughness of the part of the functional part surrounding the second opening is smaller than the surface roughness of the part of the functional part surrounding the third opening; Preferably, the second preparation material layer includes a second organic light-emitting material layer, a second electrode material layer corresponding to the second light-emitting unit, and a second packaging material layer sequentially arranged in a direction away from the substrate; the dry etching removes the first opening, the third opening, and the second preparation material layer on the side of the functional part away from the substrate and the protective glue, retains the second preparation material layer in the area where the second opening is located, and the step of forming the second light-emitting unit with part of the second preparation material layer includes: removing the first opening, the third opening and the second packaging material layer of the functional portion away from the substrate by dry etching, and retaining the second packaging material layer in the area where the second opening is located to form a second packaging portion; removing the second electrode material layer at the first opening, the third opening and the functional portion away from the substrate, and retaining the second electrode material layer at the second opening to form a second electrode corresponding to the second light-emitting unit; The first opening, the third opening, the second organic light-emitting material layer at a side of the functional portion away from the substrate and the protective glue are removed by dry etching, and the second organic light-emitting material layer at the second opening is retained to form a second light-emitting unit.

19. The manufacturing method according to claim 18, characterized in that: The step of preparing the third light-emitting unit in the third opening further includes: forming a third preparation material layer on a side of the opening and the functional layer facing away from the substrate; forming a protective glue on a side of the third preparation material layer in the area where the third opening is located away from the substrate; Dry etching removes the first opening, the second opening, and the third preparation material layer on the side of the functional portion away from the substrate and the protective glue, retains the third preparation material layer in the area where the third opening is located, and part of the third preparation material layer forms the third light-emitting unit; Preferably, the third preparation material layer includes a third organic light-emitting material layer, a second electrode material layer corresponding to the third light-emitting unit, and a third packaging material layer sequentially arranged in a direction away from the substrate; the dry etching removes the first opening, the second opening, and the third preparation material layer on the side of the functional part away from the substrate and the protective glue, retains the third preparation material layer in the area where the third opening is located, and the step of forming the third light-emitting unit with part of the third preparation material layer includes: Dry etching is used to remove the first opening, the second opening and the third packaging material layer on the side of the functional part away from the substrate, and the third packaging material layer in the area where the third opening is located is retained to form a third packaging part; removing the first opening, the second opening, and the second electrode material layer of the functional portion away from the substrate, and retaining the second electrode material layer located at the third opening to form a second electrode corresponding to the third light-emitting unit; The first opening, the second opening, the third organic light-emitting material layer on the side of the functional part away from the substrate and the protective glue are removed by dry etching, and the third organic light-emitting material layer located in the third opening is retained to form a third light-emitting unit.

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