Automatic testing method for optical module chips

Abstract

The present application discloses a method for automatically testing optical module chips, which includes the following steps: S1, the conveying mechanism conveys the material tray to the bottom of the suction cup, the cylinder clamping claw clamps the material tray and fixes the material tray, the three-axis mobile platform drives the suction cup to descend and adsorbs the optical module chip in the material tray, and then drives the optical module chip to rise and move to the top of the camera; by using multiple cameras to identify the position information of the optical module, and adjusting the angle and orientation of the optical module in real time and synchronously, it can ensure that the position of the optical module during the test is accurately aligned, eliminate the error caused by position offset, and make the docking of the optical module and the optical fiber connector more accurate, thereby improving the coupling efficiency of the optical signal and reducing the loss and reflection of the optical signal. This can significantly improve the test accuracy of the optical power (TX / RX), and can also ensure that the position of the optical module in each test is accurate and consistent, reducing the test fluctuation caused by position offset.

Description

Technical Field

[0001] The present application relates to the technical field of optical module testing, and specifically to an automatic testing method for optical module chips. Background Art

[0002] Optical module chips are core components in optical communication equipment and are responsible for the conversion of optical and electrical signals.

[0003] After the production of the optical module is completed, the performance of the optical module needs to be tested. In the prior art, an automatic test system is usually used to test the optical power of the optical module. However, since the automatic test system requires pre-setting of action instructions and distances, during high-speed, mass production, the optical module may be displaced during the test due to wear of the mechanical device, poor assembly, vibration, or poor contact of the optical fiber connector. If the position of the optical module is displaced, the docking of the optical fiber connector may not be precise enough, resulting in a decrease in the coupling efficiency of the optical signal, causing misjudgment. At the same time, the position offset will lead to inconsistencies between multiple test results, affecting the reliability and repeatability of the test data. Summary of the invention

[0004] The purpose of this application is to provide an automatic testing method for optical module chips to solve the technical problems raised in the above background technology.

[0005] To achieve the above purpose, the present application provides the following technical solution: an automatic testing method for optical module chips, comprising the following steps:

[0006] S1, the conveying mechanism conveys the material tray to the bottom of the suction cup, the cylinder clamps the material tray and fixes it, the three-axis mobile platform drives the suction cup to descend and adsorb the optical module chip in the material tray, and then drives the optical module chip to rise and move to the top of the camera, and the position of the optical module chip is detected by the camera to determine whether the position of the optical module chip on the suction cup is offset;

[0007] S2, the suction cup moves the optical module chip to the plate of the flipping mechanism, the suction nozzle on the plate sucks the optical module chip, and then controls the motor of the flipping mechanism to drive the plate to rotate, the rotation of the plate drives the optical module chip to flip, and the suction cup then sucks the flipped optical module chip and puts it on the turntable of the shifting mechanism;

[0008] S3, the shift mechanism drives the optical module chip to move to the bottom of the test camera, and the test camera detects the optical module chip to determine whether the position of the optical module chip on the shift mechanism is offset. If offset occurs, the optical module chip is adjusted to make the angle of the optical module chip consistent with the correct test angle;

[0009] S4, connect the optical fiber connector to the light source and the optical power meter through the optical fiber, and fix the optical fiber connector to the moving end of the axial moving mechanism, drive the optical fiber connector to move through the axial moving mechanism and insert the optical fiber connector into the interface of the optical module chip, input the optical signal into the optical module chip through the light source to simulate the signal transmission under actual working conditions, the optical module chip emits an optical signal of a certain wavelength and power, the optical signal is transmitted to the receiving end of the optical power meter through the optical fiber, and the optical power meter tests the optical power of the optical module chip.

[0010] Preferably, in step 1, when the camera detects that the position of the optical module chip is offset, the suction cup is driven to rotate by a motor to adjust the orientation of the optical module chip. The motor is fixedly connected to the Z-axis lifting end of the three-axis mobile platform, and the output shaft of the motor is connected to the suction cup.

[0011] Preferably, the shifting mechanism is an X-axis moving platform. In step 3, when the test camera detects that the position of the optical module chip on the shifting mechanism is offset, the turntable is driven to rotate by a motor fixed inside the moving end of the shifting mechanism to adjust the direction of the optical module chip.

[0012] Preferably, before inserting the optical fiber connector into the interface of the optical module chip in step 4, air is blown toward the surface of the optical fiber connector through an air nozzle to blow out dust on the surface of the optical fiber connector, thereby avoiding insertion loss image measurement accuracy when the optical fiber connector is inserted into the optical module chip, and the number of air nozzles is four, which are respectively fixed on one side of the moving end of the axial moving mechanism, and the four air nozzles are respectively located on the upper and lower sides and the front and back sides of the optical fiber connector. By adopting the above scheme, the attenuation of the optical signal caused by dust on the surface of the connector can be avoided, thereby causing a low measurement result.

[0013] Preferably, the bending angle of the optical fiber connecting the optical fiber connector to the light source and the optical power meter is less than 10°. By adopting the above scheme, it is ensured that the optical fiber remains above the minimum bending radius (usually based on the optical fiber specification requirements), avoiding excessive bending that increases bending loss, affects test accuracy, and reduces power fluctuations caused by optical fiber movement.

[0014] Preferably, before inserting the optical fiber connector into the optical module chip in step 4, the optical module chip is preheated by hot air, the preheating temperature of the optical module is 25-50°C, and the preheating time is 5-15min. The hot air is discharged from a hot air blower, and the hot air blower is fixedly connected to one side of the test camera. The air outlet end of the hot air blower and the test end of the test camera are both facing the optical module chip. By adopting the above scheme, it is ensured that the working state is stable before performing the power test. The power output of the optical module that has just been started may fluctuate, affecting the initial measurement results.

[0015] Preferably, after the optical module is preheated, when the optical fiber connector is inserted into the optical module chip for testing, the hot air still heats the optical module chip to keep the temperature of the optical module chip at 40-60°C, thereby preventing temperature fluctuations from affecting the output power of the optical module and the response of the optical power meter.

[0016] Preferably, after inserting the optical fiber connector into the optical module chip in step 4, an optical signal is input into the optical module chip through a light source to simulate signal transmission under actual working conditions, and the optical module chip emits an optical signal of a certain wavelength and power, and the optical signal is transmitted to the receiving end of the optical power meter through the optical fiber. The optical power meter tests the optical power of the optical module chip. After the test is completed, the optical fiber connector is unplugged from the interface of the optical module chip and inserted into the interface of the optical module chip again, and the test is performed again. The plugging and unplugging are repeated 5 times, and finally the data obtained by the 5 optical power meter measurements are averaged. By adopting the above scheme, the influence of accidental errors and environmental fluctuations on the test results can be eliminated. By performing multiple repeated measurements and then taking the average value, the accuracy and reliability of the measurement results can be improved.

[0017] Preferably, in step 4, before the optical power meter reads the optical signal power of the optical module chip, the light source inputs an optical signal into the optical module chip and maintains it for 3-5 minutes.

[0018] Compared with the prior art, the beneficial effects of this application are:

[0019] This application uses multiple cameras to identify the position information of the optical module and adjusts the angle and orientation of the optical module in real time and synchronously, which can ensure that the position of the optical module is accurately aligned during the test process, eliminate errors caused by position offset, and make the docking of the optical module and the optical fiber connector more accurate, thereby improving the coupling efficiency of the optical signal and reducing the loss and reflection of the optical signal. This can significantly improve the test accuracy of the optical power (TX / RX), and can also ensure that the position of the optical module in each test is accurate and consistent, reducing the test fluctuations caused by position offset. In this way, stable and repeatable test results can be obtained, errors between batches can be avoided, human intervention can be reduced, and the degree of automation can be further improved. At the same time, this application optimizes the optical module test process by using multiple methods such as dust removal, preheating, and heat preservation, reducing test deviations, improving test accuracy, and reducing the influence of variables in the automated test process of the optical module, making the test results more accurate and reliable. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 This is the flow chart of this application. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0022] In the description of the present application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0023] Example 1

[0024] See also Figure 1 , this application provides a technical solution: an automatic testing method for optical module chips, the steps are as follows:

[0025] S1, the conveying mechanism conveys the material tray to the bottom of the suction cup, the cylinder clamping claws clamp the material tray and fix the material tray, the three-axis mobile platform drives the suction cup to descend and adsorb the optical module chip in the material tray, and then drives the optical module chip to rise and move to the top of the camera, and the position of the optical module chip is detected by the camera to determine whether the position of the optical module chip on the suction cup is offset. When the camera detects that the position of the optical module chip is offset, the suction cup is driven to rotate by the motor to adjust the orientation of the optical module chip. The motor is fixed to the Z-axis lifting end of the three-axis mobile platform, and the output shaft of the motor is connected to the suction cup;

[0026] S2, the suction cup moves the optical module chip to the plate of the flipping mechanism, the suction nozzle on the plate sucks the optical module chip, and then controls the motor of the flipping mechanism to drive the plate to rotate, the rotation of the plate drives the optical module chip to flip, and the suction cup then sucks the flipped optical module chip and puts it on the turntable of the shifting mechanism;

[0027] S3, the shift mechanism drives the optical module chip to move to the bottom of the test camera, and the test camera detects the optical module chip to determine whether the position of the optical module chip on the shift mechanism is offset. If offset occurs, the optical module chip is adjusted to make the angle of the optical module chip consistent with the correct test angle. The shift mechanism is an X-axis moving platform. When the test camera detects that the position of the optical module chip on the shift mechanism is offset, the motor fixed inside the moving end of the shift mechanism drives the turntable to rotate to adjust the direction of the optical module chip.

[0028] S4, connect the optical fiber connector to the light source and the optical power meter through the optical fiber, the bending angle of the optical fiber is less than 10°, and fix the optical fiber connector to the moving end of the axial moving mechanism, drive the optical fiber connector to move through the axial moving mechanism and insert the optical fiber connector into the interface of the optical module chip, input the optical signal into the optical module chip through the light source to simulate the signal transmission under actual working conditions, the optical module chip emits an optical signal of a certain wavelength and power, the optical signal is transmitted to the receiving end of the optical power meter through the optical fiber, and the optical power meter tests the optical power of the optical module chip. Before the optical power meter reads the optical signal power of the optical module chip, the light source inputs the optical signal into the optical module chip and keeps it for 3 minutes; before inserting the optical fiber connector into the interface of the optical module chip, blow air to the surface of the optical fiber connector through the air nozzle to blow out the dust on the surface of the optical fiber connector to avoid the insertion loss image measurement accuracy when the optical fiber connector is inserted into the optical module chip, and the number of air nozzles is four, which are respectively fixed on one side of the moving end of the axial moving mechanism, and the four air nozzles are respectively located on the upper and lower sides and the front and back sides of the optical fiber connector;

[0029] In step 4, before inserting the optical fiber connector into the optical module chip, the optical module chip is preheated by hot air. The preheating temperature of the optical module is 25°C, and the preheating time is 5 minutes. The hot air is discharged from a hot air blower, and the hot air blower is fixed to one side of the test camera. The air outlet end of the hot air blower and the test end of the test camera are both facing the optical module chip. After the optical module is preheated, when the optical fiber connector is inserted into the optical module chip for testing, the hot air still heats the optical module chip to keep the temperature of the optical module chip at 40°C.

[0030] After the optical fiber connector is inserted into the optical module chip in step 4, an optical signal is input into the optical module chip through a light source to simulate signal transmission under actual working conditions. The optical module chip emits an optical signal of a certain wavelength and power. The optical signal is transmitted to the receiving end of the optical power meter through the optical fiber. The optical power meter tests the optical power of the optical module chip. After the test is completed, the optical fiber connector is unplugged from the interface of the optical module chip and inserted into the interface of the optical module chip again, and the test is performed again. The plugging and unplugging are repeated 5 times, and finally the data obtained by the 5 optical power meter measurements are averaged.

[0031] Example 2

[0032] The automatic testing method of optical module chip is as follows:

[0033] S1, the conveying mechanism conveys the material tray to the bottom of the suction cup, the cylinder clamping claws clamp the material tray and fix the material tray, the three-axis mobile platform drives the suction cup to descend and adsorb the optical module chip in the material tray, and then drives the optical module chip to rise and move to the top of the camera, and the position of the optical module chip is detected by the camera to determine whether the position of the optical module chip on the suction cup is offset. When the camera detects that the position of the optical module chip is offset, the suction cup is driven to rotate by the motor to adjust the orientation of the optical module chip. The motor is fixed to the Z-axis lifting end of the three-axis mobile platform, and the output shaft of the motor is connected to the suction cup;

[0034] S2, the suction cup moves the optical module chip to the plate of the flipping mechanism, the suction nozzle on the plate sucks the optical module chip, and then controls the motor of the flipping mechanism to drive the plate to rotate, the rotation of the plate drives the optical module chip to flip, and the suction cup then sucks the flipped optical module chip and puts it on the turntable of the shifting mechanism;

[0035] S3, the shift mechanism drives the optical module chip to move to the bottom of the test camera, and the test camera detects the optical module chip to determine whether the position of the optical module chip on the shift mechanism is offset. If offset occurs, the optical module chip is adjusted to make the angle of the optical module chip consistent with the correct test angle. The shift mechanism is an X-axis moving platform. When the test camera detects that the position of the optical module chip on the shift mechanism is offset, the motor fixed inside the moving end of the shift mechanism drives the turntable to rotate to adjust the direction of the optical module chip.

[0036] S4, connect the optical fiber connector to the light source and the optical power meter through the optical fiber, the bending angle of the optical fiber is less than 10°, and fix the optical fiber connector to the moving end of the axial moving mechanism, drive the optical fiber connector to move through the axial moving mechanism and insert the optical fiber connector into the interface of the optical module chip, input the optical signal into the optical module chip through the light source to simulate the signal transmission under actual working conditions, the optical module chip emits an optical signal of a certain wavelength and power, the optical signal is transmitted to the receiving end of the optical power meter through the optical fiber, and the optical power meter tests the optical power of the optical module chip. Before the optical power meter reads the optical signal power of the optical module chip, the light source inputs the optical signal into the optical module chip and keeps it for 4 minutes; before inserting the optical fiber connector into the interface of the optical module chip, blow air to the surface of the optical fiber connector through the air nozzle to blow out the dust on the surface of the optical fiber connector to avoid the insertion loss image measurement accuracy when the optical fiber connector is inserted into the optical module chip, and the number of air nozzles is four, which are respectively fixed on one side of the moving end of the axial moving mechanism, and the four air nozzles are respectively located on the upper and lower sides and the front and back sides of the optical fiber connector.

[0037] In step 4, before inserting the optical fiber connector into the optical module chip, the optical module chip is preheated by hot air. The preheating temperature of the optical module is 35°C, and the preheating time is 10 minutes. The hot air is discharged from a hot air blower, and the hot air blower is fixed to one side of the test camera. The air outlet end of the hot air blower and the test end of the test camera are both facing the optical module chip. After the optical module is preheated, when the optical fiber connector is inserted into the optical module chip for testing, the hot air still heats the optical module chip to keep the temperature of the optical module chip at 50°C.

[0038] After the optical fiber connector is inserted into the optical module chip in step 4, an optical signal is input into the optical module chip through a light source to simulate signal transmission under actual working conditions. The optical module chip emits an optical signal of a certain wavelength and power. The optical signal is transmitted to the receiving end of the optical power meter through the optical fiber. The optical power meter tests the optical power of the optical module chip. After the test is completed, the optical fiber connector is unplugged from the interface of the optical module chip and inserted into the interface of the optical module chip again, and the test is performed again. The plugging and unplugging are repeated 5 times, and finally the data obtained by the 5 optical power meter measurements are averaged.

[0039] Example 3

[0040] The automatic testing method of optical module chip is as follows:

[0041] S1, the conveying mechanism conveys the material tray to the bottom of the suction cup, the cylinder clamping claws clamp the material tray and fix the material tray, the three-axis mobile platform drives the suction cup to descend and adsorb the optical module chip in the material tray, and then drives the optical module chip to rise and move to the top of the camera, and the position of the optical module chip is detected by the camera to determine whether the position of the optical module chip on the suction cup is offset. When the camera detects that the position of the optical module chip is offset, the suction cup is driven to rotate by the motor to adjust the orientation of the optical module chip. The motor is fixed to the Z-axis lifting end of the three-axis mobile platform, and the output shaft of the motor is connected to the suction cup;

[0042] S2, the suction cup moves the optical module chip to the plate of the flipping mechanism, the suction nozzle on the plate sucks the optical module chip, and then controls the motor of the flipping mechanism to drive the plate to rotate, the rotation of the plate drives the optical module chip to flip, and the suction cup then sucks the flipped optical module chip and puts it on the turntable of the shifting mechanism;

[0043] S3, the shift mechanism drives the optical module chip to move to the bottom of the test camera, and the test camera detects the optical module chip to determine whether the position of the optical module chip on the shift mechanism is offset. If offset occurs, the optical module chip is adjusted to make the angle of the optical module chip consistent with the correct test angle. The shift mechanism is an X-axis moving platform. When the test camera detects that the position of the optical module chip on the shift mechanism is offset, the motor fixed inside the moving end of the shift mechanism drives the turntable to rotate to adjust the direction of the optical module chip.

[0044] S4, connect the optical fiber connector to the light source and the optical power meter through the optical fiber, the bending angle of the optical fiber is less than 10°, and fix the optical fiber connector to the moving end of the axial moving mechanism, drive the optical fiber connector to move through the axial moving mechanism and insert the optical fiber connector into the interface of the optical module chip, input the optical signal into the optical module chip through the light source to simulate the signal transmission under actual working conditions, the optical module chip emits an optical signal of a certain wavelength and power, the optical signal is transmitted to the receiving end of the optical power meter through the optical fiber, and the optical power meter tests the optical power of the optical module chip. Before the optical power meter reads the optical signal power of the optical module chip, the light source inputs the optical signal into the optical module chip and keeps it for 5 minutes; before inserting the optical fiber connector into the interface of the optical module chip, blow air to the surface of the optical fiber connector through the air nozzle to blow out the dust on the surface of the optical fiber connector to avoid the insertion loss image measurement accuracy when the optical fiber connector is inserted into the optical module chip, and the number of air nozzles is four, which are respectively fixed on one side of the moving end of the axial moving mechanism, and the four air nozzles are respectively located on the upper and lower sides and the front and back sides of the optical fiber connector.

[0045] In step 4, before inserting the optical fiber connector into the optical module chip, the optical module chip is preheated by hot air. The preheating temperature of the optical module is 50°C and the preheating time is 15 minutes. The hot air is discharged from a hot air blower, and the hot air blower is fixed to one side of the test camera. The air outlet end of the hot air blower and the test end of the test camera are both facing the optical module chip. After the optical module is preheated, when the optical fiber connector is inserted into the optical module chip for testing, the hot air still heats the optical module chip to keep the temperature of the optical module chip at 60°C.

[0046] After the optical fiber connector is inserted into the optical module chip in step 4, an optical signal is input into the optical module chip through a light source to simulate signal transmission under actual working conditions. The optical module chip emits an optical signal of a certain wavelength and power. The optical signal is transmitted to the receiving end of the optical power meter through the optical fiber. The optical power meter tests the optical power of the optical module chip. After the test is completed, the optical fiber connector is unplugged from the interface of the optical module chip and inserted into the interface of the optical module chip again, and the test is performed again. The plugging and unplugging are repeated 5 times, and finally the data obtained by the 5 optical power meter measurements are averaged.

[0047] The cameras and test cameras in Examples 1-3 of the present application detect the position of the optical module chip, including an image acquisition module, which is responsible for collecting image data transmitted back by the industrial camera; an image processing module, which pre-processes the image and extracts the edges and features of the optical module; an offset detection algorithm, which detects the offset between the actual position of the optical module and the standard position through a feature point or contour matching algorithm; and a correction control algorithm, which controls the motor rotation to adjust the position of the optical module according to the detection results.

[0048] The detection scheme is:

[0049] Step 1: Image preprocessing: Before detecting the position of the optical module, the image captured by the camera is preprocessed to improve the accuracy and efficiency of subsequent image analysis. The image preprocessing steps include:

[0050] Image grayscale: Convert color images into grayscale images to simplify calculations;

[0051] Denoising: Remove noise from the image through Gaussian filtering, mean filtering and other methods to ensure the accuracy of edge and contour detection;

[0052] Image enhancement: Improve the contrast of the image through histogram equalization, contrast enhancement, etc., making the edges and features of the optical module clearer.

[0053] Step 2: Edge detection. Edge detection is a key step in detecting the outline and positioning of the optical module. The edge detection algorithm includes:

[0054] Canny edge detection: The Canny algorithm is a classic edge detection algorithm that can detect edge features in an image. The algorithm includes the following steps:

[0055] Use Gaussian filter to smooth the image and reduce noise;

[0056] Calculate the gradient of the image to obtain the edge direction and intensity of each pixel;

[0057] Eliminate false edges through non-maximum suppression;

[0058] Use double threshold processing to classify edges into strong edges and weak edges, and remove irrelevant weak edges based on the connection relationship;

[0059] After using Canny edge detection, a clear outline of the optical module can be obtained, which serves as the basis for subsequent positioning.

[0060] Step 3: Shape matching and position detection. After edge detection, the position offset of the optical module can be determined by shape matching and position detection. The specific method is as follows: Use feature point detection algorithm: For optical modules with complex shapes or multiple features on the surface, feature point-based detection methods such as SIFT (Scale-Invariant Feature Transform) or ORB (Oriented FAST and Rotated BRIEF) can be used. The steps are as follows:

[0061] Extract feature points: Use SIFT or ORB to extract some key feature points on the surface of the optical module, such as fiber interfaces, edge corners, labels, etc.

[0062] Matching feature points: Match the extracted feature points with the feature points in the standard reference image and calculate the relative positions of the matching point pairs;

[0063] Calculate position offset: According to the result of feature point matching, calculate the rotation, translation and scaling of the optical module to obtain the displacement deviation of the optical module;

[0064] Step 4: Position offset calculation. Once the relationship between the current position and the standard position of the optical module is determined, the offset of the optical module can be obtained through simple geometric calculation.

[0065] Translation deviation: Calculate the horizontal and vertical offset (Δx, Δy) of the center point or key feature point of the optical module relative to the standard position;

[0066] Rotational deviation: If the optical module is rotated, the rotational angle deviation (Δθ) can be calculated by the angle change of the feature points or contour lines.

[0067] Scaling deviation: If the actual size of the optical module is proportional to the standard template, the scaling deviation (Δs) can be calculated by the change in the contour area;

[0068] Step 5: Feedback control and correction. According to the detected offset, the system can realize automatic correction of the optical module position through feedback control.

[0069] Motion controller adjusts position: If an offset is detected, the motion controller controls the manipulator or motor to accurately adjust the position of the optical module according to the calculated offset (Δx, Δy, Δθ);

[0070] Closed-loop feedback: The system continues to detect the position through the camera after each correction until the position of the optical module is completely aligned with the standard position and within the allowable accuracy range.

[0071] The above shows and describes the basic principles and main features of the present application and the advantages of the present application. For those skilled in the art, it is obvious that the present application is not limited to the details of the above exemplary embodiments, and the present application can be implemented in other specific forms without departing from the spirit or basic features of the present application; therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present application is limited by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims in the present application, and any figure marks in the claims should not be regarded as limiting the claims involved.

[0072] Although the embodiments of the present application have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. An automatic testing method for optical module chips, characterized in that: The following steps are involved: S1, the conveying mechanism conveys the material tray to the bottom of the suction cup, the cylinder clamps the material tray and fixes it, the three-axis mobile platform drives the suction cup to descend and adsorb the optical module chip in the material tray, and then drives the optical module chip to rise and move to the top of the camera, and the position of the optical module chip is detected by the camera to determine whether the position of the optical module chip on the suction cup is offset; S2, the suction cup moves the optical module chip to the plate of the flipping mechanism, the suction nozzle on the plate sucks the optical module chip, and then controls the motor of the flipping mechanism to drive the plate to rotate, the rotation of the plate drives the optical module chip to flip, and the suction cup then sucks the flipped optical module chip and puts it on the turntable of the shifting mechanism; S3, the shift mechanism drives the optical module chip to move to the bottom of the test camera, and the test camera detects the optical module chip to determine whether the position of the optical module chip on the shift mechanism is offset. If offset occurs, the optical module chip is adjusted to make the angle of the optical module chip consistent with the correct test angle; S4, connecting the optical fiber connector to the light source and the optical power meter through the optical fiber, and fixing the optical fiber connector to the moving end of the axial moving mechanism, driving the optical fiber connector to move through the axial moving mechanism and inserting the optical fiber connector into the interface of the optical module chip, inputting an optical signal into the optical module chip through the light source to simulate signal transmission under actual working conditions, the optical module chip emits an optical signal of a certain wavelength and power, the optical signal is transmitted to the receiving end of the optical power meter through the optical fiber, and the optical power meter tests the optical power of the optical module chip; In S1, when the camera detects that the position of the optical module chip is offset, the suction cup is driven to rotate by a motor to adjust the position of the optical module chip. The motor is fixed to the Z-axis lifting end of the three-axis mobile platform, and the output shaft of the motor is connected to the suction cup; The shift mechanism in S3 is an X-axis moving platform. When the test camera detects that the position of the optical module chip on the shift mechanism is offset, the motor fixed inside the moving end of the shift mechanism drives the turntable to rotate, thereby adjusting the direction of the optical module chip.

2. The optical module chip automatic testing method according to claim 1, characterized in that: Before inserting the optical fiber connector into the interface of the optical module chip in S4, air is blown toward the surface of the optical fiber connector through an air nozzle to blow out dust on the surface of the optical fiber connector, thereby avoiding insertion loss image measurement accuracy when the optical fiber connector is inserted into the optical module chip. There are four air nozzles, which are respectively fixed on one side of the moving end of the axial moving mechanism, and the four air nozzles are respectively located on the upper and lower sides and the front and back sides of the optical fiber connector.

3. The optical module chip automatic testing method according to claim 2, characterized in that: The bending angle of the optical fiber connecting the optical fiber connector to the light source and the optical power meter is less than 10°.

4. The optical module chip automatic testing method according to claim 3 is characterized in that: In S4, before inserting the optical fiber connector into the optical module chip, the optical module chip is preheated by hot air. The preheating temperature of the optical module is 25-50°C, and the preheating time is 5-15 minutes. The hot air is discharged from a hot air blower, and the hot air blower is fixedly connected to one side of the test camera. The air outlet end of the hot air blower and the test end of the test camera are both facing the optical module chip.

5. The optical module chip automatic testing method according to claim 4, characterized in that: After the optical module is preheated, when the optical fiber connector is inserted into the optical module chip for testing, the hot air still heats the optical module chip to keep the temperature of the optical module chip at 40-60°C.

6. The optical module chip automatic testing method according to claim 5, characterized in that: After the optical fiber connector is inserted into the optical module chip in S4, an optical signal is input into the optical module chip through a light source to simulate signal transmission under actual working conditions. The optical module chip emits an optical signal of a certain wavelength and power. The optical signal is transmitted to the receiving end of the optical power meter through the optical fiber. The optical power meter tests the optical power of the optical module chip. After the test is completed, the optical fiber connector is unplugged from the interface of the optical module chip and inserted into the interface of the optical module chip again, and the test is performed again. The plugging and unplugging are repeated 5 times, and finally the data obtained by the 5 optical power meter measurements are averaged.

7. The optical module chip automatic testing method according to claim 6, characterized in that: In S4, before the optical power meter reads the optical signal power of the optical module chip, the light source inputs the optical signal into the optical module chip and maintains it for 3-5 minutes.

Images