Heating method for PCB design and processing

Abstract

The invention discloses a heating method for PCB design and processing, and belongs to the field of PCB design and processing, and the method comprises the steps: determining hot process regions on a PCB, and a heating temperature range and a heating size range required by each hot process region; after the heating size range of each thermal process area is obtained, heating equipment with a proper size is selected, a feature reference point of each thermal process area is set, the heating equipment is aligned with the thermal process areas according to the feature reference points, the output temperature of the heating equipment is set according to the calculated heating temperature range, and the thermal process areas are heated. Correcting the relative position of the heating equipment and the thermal process area; and a temperature sensor on the heating equipment feeds back the real temperature value of the surface of the substrate material in real time when the heating equipment heats, and adjusts and corrects the output temperature of the heating equipment until the hot working of the substrate material is completed to form a PCB finished product. According to the invention, by designing a precise heating temperature calculation model, uniform and stable heating in the PCB processing process is ensured, and the quality and reliability of the PCB finished product are improved.

Description

Technical Field

[0001] The invention relates to the field of PCB design and processing, and in particular to a heating method for PCB design and processing. Background Art

[0002] In the production process of PCB boards, it is often necessary to process them at specific temperatures, such as welding, drying, welding, hot melt sealing, etc. However, traditional heating methods have problems such as uneven heating and inaccurate temperature control, which leads to unstable product quality and even affects the service life of the equipment. In the heating process, heating is carried out for different functional areas, and precise temperatures need to be set to avoid unstable deformation of the PCB board, which affects the quality of the finished PCB board. Therefore, it is of great significance to develop a new PCB design and processing heating method. Summary of the invention

[0003] In view of the above-mentioned deficiencies in the prior art, the present invention provides a heating method for PCB design and processing, which distinguishes different functional areas on the PCB board and implements precise heating temperature and heating range.

[0004] In order to achieve the above-mentioned object of the invention, the technical solution adopted by the present invention is: A heating method for PCB design processing is provided, which comprises: Step S1: determining the thermal process zones and the required heating temperature range and heating size range of each thermal process zone on the substrate material according to the shape and size parameters of the PCB board design, the thermal process zones including the thermal welding zone, the thermal bending zone and the thermal sealing zone; Step S2: After obtaining the heating size range of each thermal process zone, a heating device corresponding to the heating size range is selected, and a characteristic reference point of each thermal process zone is set. The heating device is aligned with the thermal process zone according to the characteristic reference point, and the output temperature of the heating device is set according to the calculated heating temperature range, and the thermal process zone is heated, and the relative position of the heating device and the thermal process zone is corrected in real time; Step S3: The temperature sensor on the heating device feeds back the actual temperature value of the substrate material surface when the heating device is heating, and adjusts and corrects the output temperature of the heating device until the thermal processing of the substrate material is completed to form a finished PCB board.

[0005] Further, step S1 includes: Step S11: selecting a substrate material suitable for PCB board processing, and determining a thermal process zone on the substrate material according to the shape and size parameters of the PCB board design, the thermal process zone including a thermal welding zone, a thermal bending zone and a thermal sealing zone; Step S12: Calculating the heating temperature range and heating size range required for heating the heat welding area, the heat bending area and the heat sealing area; For the heat welding area: Get the shape and size of the heat-welding area designed on the PCB; if the heat-welding area is circular, determine the center of the heat-welding area O , and dispersion radius R , then the heating size range is centered O is the center and radius R If the heat-welding area is a square, determine the center of the heat-welding area. A , and long L He Kuan H , then the heating size range is centered A ,long L He Kuan H within the square range; Calculate the heating temperature range of the thermal welding zone; According to the different welding depths of the heat welding zone in the substrate material h Calculate the heat transfer coefficient ; ; in, k 1 is the thermal conductivity coefficient, is the thermal conductivity of the substrate material, is the thermal expansion coefficient of the substrate material, g is the acceleration due to gravity, t 1 is the ambient temperature of the processing area, T 0 is the ideal temperature for hot welding in the hot welding zone. v is the dynamic viscosity coefficient of air; Using heat transfer coefficient Calculate the optimal temperature for the heating equipment to heat the heat welding area , get the heating temperature range of the heating equipment to heat the hot melt zone , is the error coefficient of the heating equipment; For hot bending area: Get the chamfer radius of each thermal bending area based on the shape and size parameters of the PCB board design r The center angle corresponding to the chamfer , calculate the heating size range inside and outside the hot bending zone; , ; The heating size range of the inner side of the hot bending zone is length × width = Within the range, the heating size range outside the heat bending zone is length × width = within the range of l The length of the bending part designed on the PCB board, d is the thickness of the substrate material; Calculate the heating temperature range for the heating equipment to heat the inner and outer sides of the hot bending zone respectively , T 2 is the optimal temperature for the heating equipment to heat the hot bending zone; For heat seal area: According to the heat sealing area designed on the PCB board, the size range of the heat sealing area is obtained as the heating size range during the heat sealing process; Calculate the heating temperature range for heat sealing processing in the heat sealing area according to the sealing medium used in different heat sealing areas , T 3 is the optimal temperature for the heating device to heat the heat sealing area.

[0006] Furthermore, in step S12, the optimal temperature is calculated T Method 2 is: ; in, is the heat transfer coefficient for heating the thermal bending zone, It is the ideal temperature for hot bending processing in the hot bending area. It is the fluctuation function of the thermal conductivity coefficient of the bent part during the hot bending process as the bending angle changes.

[0007] Furthermore, in step S12, the optimal temperature is calculated T The method of 3 is: ; in, is the heat transfer coefficient for heating the heat sealing area, It is the lowest temperature at which the substrate material melts during heat sealing process in the heat sealing area. The lowest temperature at which the sealing medium melts. D It is the minimum welding depth at which the sealing medium can be fixed on the substrate material.

[0008] Furthermore, the method for correcting the relative position of the heating device and the thermal process zone in real time in step S2 is: Step S21: After the characteristic reference point of the thermal process area is set, the heating device is aligned with the center of the characteristic reference point, and the initial thermal process area image before heating by the heating device is captured. After the characteristic reference point is identified on the initial thermal process area image, grayscale processing is performed to obtain the grayscale values ​​of all pixels at the location of the characteristic reference point. , The first feature reference point n The gray value of a pixel, n is the number of pixels at the feature reference point; Step S22: Calculate the initial positioning coordinates of the feature reference point based on the pixel coordinates of all pixels on the feature reference point ; ; in, The first feature reference point i The pixel coordinates of pixels; Step S23: using edge pixels on the feature reference point to form a target selection box of the feature reference point, and using pixel values ​​of pixels on the target selection box as positioning features; Step S24: when the heating device heats the thermal process area, a heating process image of the thermal process area is captured in real time, and grayscale processing is performed to form a heating process grayscale image, and the grayscale values ​​of pixels on the heating process grayscale image are compared with the positioning features on the target selection frame, the target selection frame after deformation of the thermal process area during the heating process is screened out, and the deformed feature reference point is located; Step S25: Obtain the pixel coordinates of the pixel points on the deformed target selection box , calculate the center pixel coordinates of the deformed feature reference point ; ; in, m The number of pixels on the selection box for the deformed target; Step S26: Calculate the new positioning coordinates of the feature reference point , the heating equipment references the heating process image from the initial positioning coordinates Move to new positioning coordinates , continue to heat the hot process area; .

[0009] The beneficial effects of the present invention are as follows: the present invention sets appropriate heating temperatures in different processing areas on the PCB board by designing a precise heating temperature calculation model, realizes fine adjustment of heating parameters, ensures uniform and stable heating during the processing of the PCB board, and avoids quality problems caused by uneven and unreasonable heating. The heating range of the heating equipment can be corrected in time according to the different deformation conditions of the substrate material during the heating process, the processing process has a high degree of automation, improves production efficiency, and improves the quality and reliability of the finished PCB board. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 Flowchart of heating method designed for PCB processing. DETAILED DESCRIPTION

[0011] The specific implementation modes of the present invention are described below so that those skilled in the art can understand the present invention. However, it should be clear that the present invention is not limited to the scope of the specific implementation modes. For those of ordinary skill in the art, as long as various changes are within the spirit and scope of the present invention as defined and determined by the attached claims, these changes are obvious, and all inventions and creations utilizing the concept of the present invention are protected.

[0012] like Figure 1 As shown, a heating method for PCB design processing includes: Step S1: Determine the thermal process zone and the required heating temperature range and heating size range of each thermal process zone on the substrate material according to the shape and size parameters of the PCB board design. The thermal process zone includes the thermal welding zone, the thermal bending zone and the thermal sealing zone. With the development of intelligence, the functions of PCB boards are becoming more and more abundant, and their internal and external structures are becoming more and more complex, and the processing technology is also becoming more and more complex. During the thermal process, the heating of the thermal process zone needs to ensure the accuracy of the heating temperature control and the rationality of the heating range to ensure high-precision processing.

[0013] Step S1 specifically includes: Step S11: Select a substrate material suitable for PCB board processing, and determine the thermal process zone on the substrate material according to the shape and size parameters of the PCB board design. The thermal process zone includes a thermal melting zone, a thermal bending zone and a thermal sealing zone; different thermal process zones in the thermal melting zone, the thermal bending zone and the thermal sealing zone need to provide different heating temperatures.

[0014] Step S12: Calculating the heating temperature range and heating size range required for heating the heat welding area, the heat bending area and the heat sealing area; For the heat welding area: Get the shape and size of the heat-welding area designed on the PCB; if the heat-welding area is circular, determine the center of the heat-welding area O , and dispersion radius R , then the heating size range is centered O is the center and radius R If the heat-welding area is a square, determine the center of the heat-welding area. A , and long L He Kuan H , then the heating size range is centered A ,long L He Kuan H within the square range; Calculate the heating temperature range of the thermal welding zone; According to the different welding depths of the heat welding zone in the substrate material h Calculate the heat transfer coefficient ; ; in, k 1 is the thermal conductivity coefficient, is the thermal conductivity of the substrate material, is the thermal expansion coefficient of the substrate material, g is the acceleration due to gravity, t 1 is the ambient temperature of the processing area, T 0 is the ideal temperature for hot welding in the hot welding zone. v is the dynamic viscosity coefficient of air; Using heat transfer coefficient Calculate the optimal temperature for the heating equipment to heat the heat welding area , get the heating temperature range of the heating equipment to heat the hot melt zone , is the error coefficient of the heating equipment; For hot bending area: Get the chamfer radius of each thermal bending area based on the shape and size parameters of the PCB board design r The center angle corresponding to the chamfer , calculate the heating size range inside and outside the hot bending zone; , ; The heating size range of the inner side of the hot bending zone is length × width = Within the range, the heating size range outside the heat bending zone is length × width = within the range of l The length of the bending part designed on the PCB board, d is the thickness of the substrate material; Calculate the heating temperature range for the heating equipment to heat the inner and outer sides of the hot bending zone respectively , T 2 is the optimal temperature for the heating equipment to heat the hot bending zone; Calculating the optimal temperature T Method 2 is: ; in, is the heat transfer coefficient for heating the thermal bending zone, It is the ideal temperature for hot bending processing in the hot bending area. It is the fluctuation function of the thermal conductivity coefficient of the bent part during the hot bending process as the bending angle changes.

[0015] During the thermal bending process of the bending portion on the PCB board, as the thermal bending process proceeds, the heat dissipation effect of the chamfered area changes, and the required heating temperature also changes. The present invention establishes an integral equation to represent the change of the thermal conductivity coefficient during the thermal bending process, and then dynamically controls the heating temperature of the thermal bending process. Generally, as the thermal bending angle increases, the heat exchange between the chamfered outer side of the thermal bending part and the air becomes easier, and the required heating temperature becomes greater, and the fluctuation function is the center angle The linear equation related to thermal conductivity coefficient, the central angle The larger the thermal conductivity, the larger the central angle The smaller it is, the smaller the thermal conductivity coefficient is.

[0016] For heat seal area: According to the heat sealing area designed on the PCB board, the size range of the heat sealing area is obtained as the heating size range during the heat sealing process; Calculate the heating temperature range for heat sealing processing in the heat sealing area according to the sealing medium used in different heat sealing areas , T 3 is the optimal temperature for the heating device to heat the heat sealing area.

[0017] Calculating the optimal temperature T The method of 3 is: ; in, is the heat transfer coefficient for heating the heat sealing area, It is the lowest temperature at which the substrate material melts during heat sealing process in the heat sealing area. The lowest temperature at which the sealing medium melts. D It is the minimum welding depth at which the sealing medium can be fixed on the substrate material.

[0018] Step S2: After obtaining the heating size range of each thermal process zone, select the heating device corresponding to the heating size range, set the characteristic reference point of each thermal process zone, align the heating device with the thermal process zone according to the characteristic reference point, and set the output temperature of the heating device according to the calculated heating temperature range to heat the thermal process zone, and correct the relative position of the heating device and the thermal process zone in real time.

[0019] The method for correcting the relative position of the heating device and the thermal process zone in real time in step S2 is: Step S21: After the characteristic reference point of the thermal process area is set, the heating device is aligned with the center of the characteristic reference point, and the initial thermal process area image before heating by the heating device is captured. After the characteristic reference point is identified on the initial thermal process area image, grayscale processing is performed to obtain the grayscale values ​​of all pixels at the location of the characteristic reference point. , The first feature reference point n The gray value of a pixel, n is the number of pixels at the feature reference point; Step S22: Calculate the initial positioning coordinates of the feature reference point based on the pixel coordinates of all pixels on the feature reference point ; ; in, The first feature reference point i The pixel coordinates of pixels; Step S23: using edge pixels on the feature reference point to form a target selection box of the feature reference point, and using pixel values ​​of pixels on the target selection box as positioning features; Step S24: when the heating device heats the thermal process area, a heating process image of the thermal process area is captured in real time, and grayscale processing is performed to form a heating process grayscale image, and the grayscale values ​​of pixels on the heating process grayscale image are compared with the positioning features on the target selection frame, the target selection frame after deformation of the thermal process area during the heating process is screened out, and the deformed feature reference point is located; Step S25: Obtain the pixel coordinates of the pixel points on the deformed target selection box , calculate the center pixel coordinates of the deformed feature reference point ; ; in, m The number of pixels on the selection box for the deformed target; Step S26: Calculate the new positioning coordinates of the feature reference point , the heating equipment references the heating process image from the initial positioning coordinates Move to new positioning coordinates , continue to heat the hot process area; .

[0020] Step S3: The temperature sensor on the heating device feeds back the actual temperature value of the substrate material surface when the heating device is heating, and adjusts and corrects the output temperature of the heating device until the thermal processing of the substrate material is completed to form a finished PCB board.

[0021] The present invention sets appropriate heating temperatures in different processing areas on the PCB board by designing a precise heating temperature calculation model, realizes fine adjustment of heating parameters, ensures uniform and stable heating during the processing of the PCB board, and avoids quality problems caused by uneven and unreasonable heating. The heating range of the heating equipment can be corrected in time according to the different deformation conditions of the substrate material during the heating process. The processing process has a high degree of automation, improves production efficiency, and improves the quality and reliability of the finished PCB board.

Claims

1. A heating method for PCB design and processing, characterized in that: include: Step S1: determining the thermal process zones and the required heating temperature range and heating size range of each thermal process zone on the substrate material according to the shape and size parameters of the PCB board design, the thermal process zones including the thermal welding zone, the thermal bending zone and the thermal sealing zone; Step S2: After obtaining the heating size range of each thermal process zone, a heating device corresponding to the heating size range is selected, and a characteristic reference point of each thermal process zone is set. The heating device is aligned with the thermal process zone according to the characteristic reference point, and the output temperature of the heating device is set according to the calculated heating temperature range, and the thermal process zone is heated, and the relative position of the heating device and the thermal process zone is corrected in real time; Step S3: The temperature sensor on the heating device feeds back the actual temperature value of the substrate material surface when the heating device is heating, and adjusts and corrects the output temperature of the heating device until the thermal processing of the substrate material is completed to form a finished PCB board.

2. The heating method for PCB design processing according to claim 1, characterized in that: The step S1 comprises: Step S11: selecting a substrate material suitable for PCB board processing, and determining a thermal process zone on the substrate material according to the shape and size parameters of the PCB board design, the thermal process zone including a thermal welding zone, a thermal bending zone and a thermal sealing zone; Step S12: Calculating the heating temperature range and heating size range required for heating the heat welding area, the heat bending area and the heat sealing area; For the heat welding area: Get the shape and size of the heat-welding area designed on the PCB; if the heat-welding area is circular, determine the center of the heat-welding area O , and dispersion radius R , the heating size range is centered O is the center and radius R If the heat-welding area is a square, determine the center of the heat-welding area. A , and long L He Kuan H , then the heating size range is centered A ,long L He Kuan H within the square range; Calculate the heating temperature range of the thermal welding zone; According to the different welding depths of the heat welding zone in the substrate material h Calculate the heat transfer coefficient ; ； in, k 1 is the thermal conductivity coefficient, is the thermal conductivity of the substrate material, is the thermal expansion coefficient of the substrate material, g is the acceleration due to gravity, t 1 is the ambient temperature of the processing area, T 0 is the ideal temperature for hot welding in the hot welding zone. v is the dynamic viscosity coefficient of air; Using heat transfer coefficient Calculate the optimal temperature for the heating equipment to heat the heat welding area , get the heating temperature range of the heating equipment to heat the hot melt zone , is the error coefficient of the heating equipment; For hot bending area: Get the chamfer radius of each thermal bending area according to the shape and size parameters of the PCB board design r The center angle corresponding to the chamfer , calculate the heating size range inside and outside the hot bending zone; ， ； Then the heating size range of the inner side of the hot bending zone is length × width = Within the range, the heating size range outside the heat bending zone is length × width = within the range of l The length of the bending part designed on the PCB board, d is the thickness of the substrate material; Calculate the heating temperature range for the heating equipment to heat the inner and outer sides of the hot bending zone respectively , T 2 is the optimal temperature for the heating equipment to heat the hot bending zone; For heat seal area: According to the heat sealing area designed on the PCB board, the size range of the heat sealing area is obtained as the heating size range during the heat sealing process; Calculate the heating temperature range for heat sealing processing in the heat sealing area according to the sealing medium used in different heat sealing areas , T 3 is the optimal temperature for the heating device to heat the heat sealing area.

3. The heating method for PCB design processing according to claim 1, characterized in that: The optimal temperature is calculated in step S12 T Method 2 is: ； in, is the heat transfer coefficient for heating the thermal bending zone, It is the ideal temperature for hot bending processing in the hot bending area. It is the fluctuation function of the thermal conductivity coefficient of the bent part during the hot bending process as the bending angle changes.

4. The heating method for PCB design processing according to claim 1, characterized in that: The optimal temperature is calculated in step S12 T The method of 3 is: ； in, is the heat transfer coefficient for heating the heat sealing area, It is the lowest temperature at which the substrate material melts during heat sealing process in the heat sealing area. The lowest temperature at which the sealing medium melts. D It is the minimum welding depth at which the sealing medium can be fixed on the substrate material.

5. The heating method for PCB design processing according to claim 1, characterized in that: The method for real-time correction of the relative position between the heating device and the thermal process zone in step S2 is: Step S21: After the characteristic reference point of the thermal process area is set, the heating device is aligned with the center of the characteristic reference point, and the initial thermal process area image before heating by the heating device is captured. After the characteristic reference point is identified on the initial thermal process area image, grayscale processing is performed to obtain the grayscale values ​​of all pixels at the location of the characteristic reference point. , The first feature reference point n The gray value of a pixel, n is the number of pixels at the feature reference point; Step S22: Calculate the initial positioning coordinates of the feature reference point based on the pixel coordinates of all pixels on the feature reference point ; ； in, The first feature reference point i The pixel coordinates of pixels; Step S23: using edge pixels on the feature reference point to form a target selection box of the feature reference point, and using pixel values ​​of pixels on the target selection box as positioning features; Step S24: when the heating device heats the thermal process area, a heating process image of the thermal process area is captured in real time, and grayscale processing is performed to form a heating process grayscale image, and the grayscale values ​​of pixels on the heating process grayscale image are compared with the positioning features on the target selection frame, the target selection frame after deformation of the thermal process area during the heating process is screened out, and the deformed feature reference point is located; Step S25: Obtain pixel coordinates of the pixel points on the deformed target selection box , calculate the center pixel coordinates of the deformed feature reference point ; ； in, m The number of pixels on the selection box for the deformed target; Step S26: Calculate the new positioning coordinates of the feature reference point , the heating equipment references the heating process image from the initial positioning coordinates Move to new positioning coordinates , continue to heat the hot process area; 。

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