Double-sided water-cooling radiator based on silver sintering connection process

Abstract

The invention discloses a silver sintering connection process-based double-sided water-cooling radiator, which comprises a first radiating unit group, a second radiating unit group and a third radiating unit group, and is characterized in that the first radiating unit group comprises a first radiating body A and a second radiating body A which are communicated with each other, and the second radiating unit group comprises a first radiating body B and a second radiating body B which are communicated with each other; the third heat dissipation unit group comprises a first heat dissipation body C and a second heat dissipation body C which are communicated, and cooling inner cavities in the first heat dissipation body A, the second heat dissipation body A, the first heat dissipation body B, the second heat dissipation body B, the first heat dissipation body C and the second heat dissipation body C are communicated. The defects of connection by adopting a traditional heat-conducting silicone grease process are overcome, the cooling efficiency can be improved, and high-power-density output of the power unit is realized; the parallel connection of the radiating units realizes the modularization and combination of the radiator, and can shorten the product development cycle.

Description

Technical Field

[0001] The invention relates to the technical field of power semiconductor heat dissipation, and in particular to a double-sided water-cooled radiator based on a silver sintering connection process. Background Art

[0002] With the rapid development of new energy vehicles, motor controllers are developing towards higher efficiency, smaller size, greater power density, higher operating temperature range, and lower cost. As a heat source, if the power module cannot take away the generated heat in time, it will cause the power chip to operate at a high temperature, the loss will further increase, and the controller efficiency will be low, which will directly affect the reliability and service life of the power unit. Compared with the traditional single-sided cooling power module packaging, double-sided cooling can significantly improve the heat dissipation capacity, power chip utilization, and reduce electrical parasitic parameters. Therefore, how to give full play to the heat dissipation effect and manufacturability of double-sided water-cooled power modules is a new task facing the field of semiconductor heat dissipation technology.

[0003] The existing double-sided water-cooled radiator is made by coating the substrates on both sides of the power module with thermal grease, which is then fixed on the radiator. Under the long-term impact of hot and cold temperatures, the thermal grease of the radiator with this connection method will partially decompose into oily raw materials and fillers, which will damage the long-term stability of the grease. At the same time, in an environment with alternating hot and cold temperatures, the size of the gaps in the original thermal grease coating will also change with temperature, resulting in an air extraction effect. The air extraction effect can easily extract the thermal grease with lower viscosity between the substrate and the radiator. All of these will cause the thermal resistance Rth to slowly increase over time, resulting in a decrease in heat dissipation capacity.

[0004] To this end, we propose a double-sided water-cooled radiator based on silver sintering connection process to solve the above problems. Summary of the invention

[0005] The present invention provides a double-sided water-cooled radiator based on a silver sintering connection process, which overcomes the defects of traditional thermal conductive silicone grease as a thermal interface material (TIM), has good thermal conductivity, high cooling efficiency, and long power cycle life, ensuring that semiconductor power modules can work reliably and improving product service life.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] A double-sided water-cooled radiator based on a silver sintering connection process comprises a first heat dissipation unit group, a second heat dissipation unit group, and a third heat dissipation unit group, wherein the first heat dissipation unit group comprises a connected heat dissipation body A1 and a heat dissipation body A2, the second heat dissipation unit group comprises a connected heat dissipation body B1 and a heat dissipation body B2, and the third heat dissipation unit group comprises a connected heat dissipation body C1 and a heat dissipation body C2, wherein the heat dissipation body A1, the heat dissipation body A2, the heat dissipation body B1, the heat dissipation body B2, the heat dissipation body C1, and the heat dissipation body C2 all have cooling cavities inside, and the cooling cavities inside the heat dissipation body A1, the heat dissipation body A2, the heat dissipation body B1, the heat dissipation body B2, the heat dissipation body C1, and the heat dissipation body C2 are connected, and a double-sided water-cooled power module is arranged between the heat dissipation body A1 and the heat dissipation body A2, between the heat dissipation body B1 and the heat dissipation body B2, and between the heat dissipation body C1 and the heat dissipation body C2.

[0008] Preferably, the bottom of the heat sink A is connected to two insert pipes A, and the two insert pipes A are both connected to the cooling inner cavity inside the heat sink A;

[0009] The top of the heat sink A2 is connected to two sleeves A, and the two sleeves A are connected to the cooling cavity inside the heat sink A2;

[0010] The two insert pipes 1 are respectively mated with the two sleeve pipes 1;

[0011] By plugging and connecting the insert pipe 1 and the sleeve pipe 1, specifically inserting the insert pipe 1 into the sleeve pipe 1, the cooling inner cavity inside the heat sink A1 and the heat sink A2 can be connected.

[0012] Preferably, the bottom of the heat sink A2 is connected to two plug-in tubes 2, and both of the two plug-in tubes 2 are connected to the cooling inner cavity inside the heat sink A2;

[0013] The top of the heat sink B1 is connected to two sleeves 2, and both sleeves 2 are connected to the cooling inner cavity inside the heat sink B1;

[0014] The two second insert pipes are respectively mated with the two second sleeve pipes;

[0015] The plug-in tube 2 is connected with the sleeve 2 by plugging, specifically the plug-in tube 2 is inserted into the sleeve 2, so that the cooling inner cavity inside the heat sink A2 and the heat sink B1 can be connected.

[0016] Preferably, the bottom of the heat sink B1 is connected to two insert pipes 3, and the two insert pipes 3 are both connected to the cooling inner cavity inside the heat sink B1;

[0017] The top of the heat sink B2 is connected to two sleeves 3, and the two sleeves 3 are both connected to the cooling inner cavity inside the heat sink B2;

[0018] The two insert pipes three are respectively mated with the two sleeve pipes three;

[0019] By inserting the insert pipe three into the sleeve pipe three and connecting them, the cooling inner cavity inside the heat sink B1 and the heat sink B2 can be connected.

[0020] Preferably, the bottom of the heat sink B2 is connected to two insert pipes 4, and the two insert pipes 4 are both connected to the cooling inner cavity inside the heat sink B2;

[0021] The top of the heat sink C- is connected to two sleeves four, and both sleeves four are connected to the cooling inner cavity inside the heat sink C-;

[0022] The two inserting pipes four are respectively plugged and connected with the two sleeve pipes four in correspondence;

[0023] By inserting the insert tube four into the sleeve tube four, the cooling inner cavity inside the heat sink B2 can be connected with the cooling inner cavity inside the heat sink C1.

[0024] Preferably, the bottom of the heat sink C- is connected to two insert pipes 5, and the two insert pipes 5 are both connected to the cooling inner cavity inside the heat sink C-;

[0025] The top of the heat sink C2 is connected to two sleeves 5, and the two sleeves 5 are connected to the cooling inner cavity inside the heat sink C2;

[0026] The two inserting tubes 5 are respectively plugged and connected with the two sleeve tubes 5;

[0027] By inserting the insert tube five into the sleeve tube five, the cooling inner cavity inside the heat sink C1 can be connected with the cooling inner cavity inside the heat sink C2.

[0028] Preferably, two insert pipes six are connected to the bottom of the heat sink C2, and both insert pipes six are connected to the inside of the heat sink C2.

[0029] Preferably, the cooling cavities of the heat sink A1, heat sink A2, heat sink B1, heat sink B2, heat sink C1 and heat sink C2 are all provided with pin-fin heat sinks, and the pin needle heat dissipation mode is adopted to increase the heat dissipation area. In addition, the PIN heat sink needle body divides the cooling cavity into two parts to form two flow cavities.

[0030] Preferably, the heat sink A1 is provided with a boss 1, the heat sink A2 is provided with a boss 2, and the double-sided water-cooling power module between the heat sink A1 and the heat sink A2 is connected between the opposite surfaces of the boss 1 and the boss 2;

[0031] The heat sink B1 is provided with a boss 3, the heat sink B2 is provided with a boss 4, and the double-sided water-cooled power module between the heat sink B1 and the heat sink B2 is connected between the opposite surfaces of the boss 3 and the boss 4;

[0032] The heat sink C1 is provided with a boss 5, the heat sink C2 is provided with a boss 6, and the double-sided water-cooled power module between the heat sink C1 and the heat sink C2 is connected between the opposite surfaces of the boss 5 and the boss 6.

[0033] Nano silver solder paste is printed on the substrate of the double-sided water-cooled power module 4 described above.

[0034] A pin-fin heat sink 5 is provided in the cooling inner cavity of the heat sink A-11, the heat sink A-12, the heat sink B-21, the heat sink B-22, the heat sink C-31 and the heat sink C-32.

[0035] The pin-fin heat sink 5 is cylindrical or elliptical.

[0036] Compared with the prior art, the present invention overcomes the shortcomings of traditional thermal conductive silicone grease as TIM, adopts silver sintering process to connect the power module base and the heat sink, reduces the thickness of TIM, reduces thermal resistance, and at the same time enhances the overall power cycle capability of the power module unit, improves the reliability of the system, and is also the technical trend of heat dissipation of double-sided water-cooled modules in the future. It utilizes pipe fittings that can be connected in a limited position and adopts the reflow soldering process to connect the inlet and outlet water channels between modules, which overcomes the complex process flow of using sealing rings in traditional processes, and has the characteristics of high degree of automated production and good product consistency.

[0037] In addition, the invention needs to emphasize the following advantages: 1. It is relatively flexible and can be freely combined and stacked, that is, connected in parallel; 2. Silver sintering process;

[0038] Among them, silver sintering replaces traditional soldering technology and has the following characteristics:

[0039] 1) Excellent thermal conductivity. Silver itself has high thermal conductivity, which helps to quickly transfer heat, reduce heat accumulation in power devices, and improve equipment reliability and operating life;

[0040] 2) Excellent electrical conductivity. Silver, as a conductive connection layer, can effectively reduce resistance, improve equipment efficiency, reduce heat generation and improve operational reliability;

[0041] 3) Improve the reliability of power devices. The melting point of silver is as high as 961°C. Compared with other soft solder connection layers with low melting points, it has typical anti-fatigue properties. Especially in the field of high-temperature power electronics, silver sintering technology performs particularly well;

[0042] 4) Environmentally friendly. The sintered material does not contain lead and is an environmentally friendly material that complies with modern environmental standards and the concept of sustainable development, reducing the negative impact on the environment during the production process;

[0043] 5) Reduce the overall system cost. The silver sintering process has good thermal and electrical conductivity, which can reduce loop resistance and improve efficiency, reduce the heat generation of devices, and extend the service life of equipment; at the same time, it has high temperature resistance and reliability, which further exerts the high temperature resistance potential of power semiconductors, especially third-generation wide bandgap semiconductors, thereby improving the current output capacity of power devices, reducing the derating margin in selection, and thus reducing system costs: BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 This is a schematic diagram of the overall structure of a double-sided water-cooled radiator based on a silver sintering connection process proposed by the present invention;

[0045] Figure 2 for Figure 1 A disassembled diagram of the first cooling unit group, the second cooling unit group, and the third cooling unit group of the double-sided water-cooling radiator;

[0046] Figure 3 for Figure 2 Structural split of the first cooling unit group Figure 1 ;

[0047] Figure 4 for Figure 2 Structural split of the first cooling unit group Figure 2 ;

[0048] Figure 5 for Figure 2 Structural splitting of the second cooling unit group Figure 1 ;

[0049] Figure 6 for Figure 2 Structural splitting of the second cooling unit group Figure 2 ;

[0050] Figure 7 for Figure 2 Structural split of the third cooling unit group Figure 1 ;

[0051] Figure 8 for Figure 2 Structural split of the third cooling unit group Figure 2 ;

[0052] Fig. 9 for Figure 2 A cross-sectional view of the heat sink A1 and the heat sink A2;

[0053] Fig.10 for Figure 1 A perspective view of a double-sided water-cooling radiator based on a silver sintering connection process is shown.

[0054] In the figure: 1. the first heat dissipation unit group; 11. heat sink A1; 111. plug one; 112. boss one; 12. heat sink A2; 121. sleeve one; 122. plug two; 123. boss two; 2. the second heat dissipation unit group; 21. heat sink B1; 211. sleeve two; 212. plug three; 213. boss three; 22. heat sink B2; 221. sleeve three; 222. plug four; 223. boss four; 3. the third heat dissipation unit group; 31. heat sink C1; 311. sleeve four; 312. plug five; 313. boss five; 32. heat sink C2; 321. sleeve five; 322. plug six; 323. boss six; 4. double-sided water-cooled power module; 5. PIN heat dissipation needle body. DETAILED DESCRIPTION

[0055] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0056] In the description of the present invention, “plurality” means two or more than two, unless otherwise clearly and specifically defined.

[0057] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "mounted / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0058] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0059] Reference Figure 1-10A double-sided water-cooled radiator based on a silver sintering connection process includes a first heat dissipation unit group 1, a second heat dissipation unit group 2, and a third heat dissipation unit group 3. The first heat dissipation unit group 1, the second heat dissipation unit group 2, and the third heat dissipation unit group 3 can be connected in series to achieve a stacked arrangement so as to freely expand the radiator. Each heat dissipation unit group has two heat dissipations and clamps a double-sided water-cooled power module 4.

[0060] The first heat dissipation unit group 1 includes a connected heat dissipation body A-11 and a heat dissipation body A-212, the second heat dissipation unit group 2 includes a connected heat dissipation body B-21 and a heat dissipation body B-22, and the third heat dissipation unit group 3 includes a connected heat dissipation body C-31 and a heat dissipation body C-232. The heat dissipation body A-11, the heat dissipation body A-12, the heat dissipation body B-21, the heat dissipation body B-22, the heat dissipation body C-31 and the heat dissipation body C-232 are all composed of a bottom box and an end cover. The PIN heat dissipation pin body 5 is placed in the bottom box, and the end cover can be connected to the top of the bottom box by screws to form a complete heat dissipation body, and can also be connected by stir friction welding, laser The connection between the end cover and the base box is achieved by welding or brazing process. There are cooling cavities inside the heat sink A-11, heat sink A-12, heat sink B-21, heat sink B-22, heat sink C-31 and heat sink C-32. The cooling cavities inside the heat sink A-11, heat sink A-12, heat sink B-21, heat sink B-22, heat sink C-31 and heat sink C-32 are connected. Double-sided water-cooled power modules 4 are provided between the heat sink A-11 and the heat sink A-12, between the heat sink B-21 and the heat sink B-22, and between the heat sink C-31 and the heat sink C-32.

[0061] Nano silver solder paste is printed on the substrate of the double-sided water-cooled power module 4. After printing the solder paste, the device is placed on a heating table to dry. The drying temperature is preferably 120°C and the drying time is preferably 30 minutes. After drying, solvent is dripped on the surface of the solder paste to moisten it. The double-sided water-cooled power module 4 is placed on the boss on the heat sink, and the connecting pipe fittings coated with solder paste on the limiting part are placed at the corresponding water inlet or outlet position of the heat sink, and then another heat sink is stacked in sequence to form a heat sink unit group. Through the tooling fixture, force is applied to the two heat sinks to clamp the double-sided water-cooled power module 4.

[0062] Reference Figure 1-10A double-sided water-cooled radiator based on a silver sintering connection process, wherein two insert tubes 111 are connected to the bottom of a heat sink A-11, and the two insert tubes 111 are connected to a cooling inner cavity inside the heat sink A-11, and two sleeve tubes 121 are connected to the top of a heat sink A-12, and the two sleeve tubes 121 are connected to the cooling inner cavity inside the heat sink A-12, and the two insert tubes 111 are respectively plugged with the two sleeve tubes 121, wherein the insert tube 11 is plugged and connected with the sleeve tube 121, specifically, the insert tube 11 is inserted into the sleeve tube 121, so that the heat sink A-11 can be connected with the cooling inner cavity inside the heat sink A-12.

[0063] Reference Figure 1-10 A double-sided water-cooled radiator based on a silver sintering connection process, wherein two insert tubes 122 are connected to the bottom of a heat sink A212, and the two insert tubes 122 are both connected to the cooling inner cavity inside the heat sink A212; two sleeve tubes 211 are connected to the top of a heat sink B21, and the two sleeve tubes 211 are both connected to the cooling inner cavity inside the heat sink B21; the two insert tubes 122 are respectively plugged into the two sleeve tubes 211 correspondingly, and by plugging and connecting the insert tube 122 with the sleeve tube 211, specifically inserting the insert tube 122 into the sleeve tube 211, the heat sink A212 can be connected to the cooling inner cavity inside the heat sink B21.

[0064] Two insert tubes 3 212 are connected to the bottom of the heat sink B-21, and both insert tubes 3 212 are connected to the cooling inner cavity inside the heat sink B-21. Two sleeve tubes 3 221 are connected to the top of the heat sink B-22, and both sleeve tubes 3 221 are connected to the cooling inner cavity inside the heat sink B-22. The two insert tubes 3 212 are respectively plugged into the two sleeve tubes 3 221 correspondingly. By inserting the insert tube 3 212 into the sleeve tube 3 221 and connecting them, the cooling inner cavity inside the heat sink B-21 and the heat sink B-22 can be connected.

[0065] Two insert tubes 222 are connected to the bottom of the heat sink B22, and the two insert tubes 222 are connected to the cooling inner cavity inside the heat sink B22. Two sleeves 2311 are connected to the top of the heat sink C31, and the two sleeves 2311 are connected to the cooling inner cavity inside the heat sink C31. The two insert tubes 222 are respectively plugged into and connected with the two sleeves 2311. By inserting the insert tube 222 into the sleeve 2311, the cooling inner cavity inside the heat sink B22 can be connected to the cooling inner cavity inside the heat sink C31.

[0066] Two insert tubes 5 312 are connected to the bottom of the heat sink C-31, and both insert tubes 5 312 are connected to the cooling inner cavity inside the heat sink C-31. Two sleeve tubes 5 321 are connected to the top of the heat sink C-32, and both sleeve tubes 5 321 are connected to the cooling inner cavity inside the heat sink C-32. The two insert tubes 5 312 are respectively plugged into and connected with the two sleeve tubes 5 321. By inserting the insert tube 5 312 into the sleeve tube 5 321, the cooling inner cavity inside the heat sink C-31 can be connected with the cooling inner cavity inside the heat sink C-32.

[0067] Two six plug-in tubes 322 are connected to the bottom of the heat sink C2 32, and the two six plug-in tubes 322 are connected to the inside of the heat sink C2 32. The two six plug-in tubes 322 can be used as a water inlet pipe and a water outlet pipe respectively. If the third heat sink group 3 where the water inlet pipe and the water outlet pipe are located is regarded as the first heat sink, the two six plug-in tubes 322 of the first heat sink are longer, which is convenient for connecting the system pipeline; the top end cover of the first heat sink group 1 as the last heat sink is closed; the plug-in tubes and sleeves on the second heat sink group 2 in the middle are consistent, but it should be noted that if a six plug-in tube 322 is used as a water inlet pipe, then the middle one where the six plug-in tube 322 is located The channels and circulation cavities of the insert tube and the sleeve on the center line are all water inlet routes, and the other opposite insert tube six 322 is used as a water outlet pipe. The channels and circulation cavities of the insert tube and the sleeve on a center line where the insert tube six 322 is located are water outlet routes, so that cooling water enters from one insert tube six 322 into the circulation cavities on each vertical center line, and then enters into the circulation cavity on another vertical center line, and finally flows out from the other insert tube six 322. In this way, the cooling liquid or cooling water can flow in each cooling cavity to form heat exchange with the clamped double-sided water-cooled power module 4, thereby achieving the purpose of cooling the double-sided water-cooled power module 4.

[0068] Among the multiple plugs and sleeves mentioned above, each plug and each sleeve used in conjunction with it form a connecting pipe fitting, so there are multiple connecting pipe fittings used in conjunction, and the connecting pipe fittings have a limited connection effect, that is, each plug is limitedly connected to each sleeve, and its limited connection method is the connection method of the prior art. For example, it can be connected by a clamping method, a quick connector connection method, or a flange connection method. The connection method between the plug and the sleeve is not limited to the connection methods listed above, as long as it is a method that can realize the connection of the pipe fittings. The distance between each heat dissipation unit group is determined by the thickness of the double-sided water-cooled power module 4 and the silver paste, and has nothing to do with the connecting pipe fittings, so as to adapt to double-sided water-cooled power modules 4 of different thicknesses. In addition, the connecting pipe fittings with limits are connected to the heat dissipation unit by solder paste welding, which can make the entire structure more stable and also reduce the production process steps.

[0069] The heat dissipation unit group of the present invention includes two heat dissipation units and a connecting pipe with a limit. The heat dissipation unit groups can be stacked by connecting in series, and the heat sink can be freely expanded. For example, two heat dissipation units are connected in one group, clamping a double-sided water-cooled power module, and interconnecting through a double-sided silver sintering process to dissipate heat for the power module; specifically, each heat dissipation unit has a through water inlet and a water outlet, and a cooling inner cavity and a cooling channel are formed between the water inlet and the water outlet; each heat dissipation unit group is also connected by a pipe with a limit; on the one hand, the connecting pipe with a limit connects the above-mentioned multiple heat dissipation unit groups to form a coolant flow channel, and the coolant enters and flows into the water inlet of each heat dissipation unit in turn, and then is discharged from the water outlet in turn. In the process of the coolant flowing in each cooling cavity, heat exchange is formed with the clamped double-sided water-cooled power module, thereby achieving the purpose of cooling the power module; on the other hand, since the connecting pipe has a limit, the distance between each scattered unit group is determined by the thickness of the power module and the silver paste, and has nothing to do with the connecting pipe, so as to adapt to power modules of different thicknesses. In addition, the connecting pipe with a limiter is connected to the heat dissipation unit by soldering with solder paste, which can make the entire structure more stable and also reduce the production process steps.

[0070] Reference Figure 1-10 A double-sided water-cooled radiator based on a silver sintering connection process, wherein a pin-fin radiator 5 is arranged in the cooling inner cavity of the radiator A-11, the radiator A-12, the radiator B-21, the radiator B-22, the radiator C-31 and the radiator C-32, and the pin-fin radiator 5 is cylindrical or elliptical, and the pin-fin radiator 5 includes a copper plate and a plurality of pins arranged on the copper plate, and the pin-fin radiator 5 adopts a pin-needle heat dissipation mode, and the pin-needle heat dissipation is to increase the heat dissipation area by using a fine needle structure, thereby improving the heat dissipation area. High heat dissipation efficiency. In addition, the PIN heat sink needle body 5 divides the cooling inner cavity into two parts to form two flow cavities. It should be noted that the pin-fin heat sink 5 does not completely block the cooling inner cavity. The needles on the PIN heat sink needle body 5 do not contact each other. In this way, when cooling water enters a flow cavity in the cooling inner cavity, the cooling water in the flow cavity will slowly flow into another flow cavity through the non-contact PIN heat sink needle bodies 5, but the cooling water in the flow cavity will quickly enter the flow cavity of another heat sink on the next vertical line.

[0071] The present invention provides a double-sided water-cooled radiator based on a silver sintering connection process, which can be composed of multiple heat dissipation units. The two sides of the radiator are provided with water inlet and outlet channels to realize parallel connection of multiple heat dissipation units. Two heat dissipation units and a double-sided water-cooled power module form a "sandwich" structure, and a semiconductor power heat dissipation unit is formed through a silver sintering process. The heat dissipation unit is composed of a heat dissipation base plate with a pin fin and a top end cover, and a cooling inner cavity is formed between the two, and the coolant flows through the pin fin on the cooling channel.

[0072] The present invention adopts a silver sintering process to achieve connection with the heat dissipation unit, which overcomes the defects of the traditional thermal conductive silicone grease process connection, can improve the cooling efficiency, and achieve high power density output of the power unit; the parallel connection of the heat dissipation units realizes the modularization and combination of the radiator, which can shorten the product development cycle.

[0073] Reference Figure 1-10 A double-sided water-cooled radiator based on a silver sintering connection process, a boss 112 is provided on a heat sink A-11, a boss 2 123 is provided on a heat sink A-12, and a double-sided water-cooled power module 4 between the heat sink A-11 and the heat sink A-12 is connected between the opposite surfaces of the boss 112 and the boss 2 123.

[0074] A boss three 213 is provided on the heat sink B-21, a boss four 223 is provided on the heat sink B-22, and a double-sided water-cooled power module 4 between the heat sink B-21 and the heat sink B-22 is connected between the opposite surfaces of the boss three 213 and the boss four 223.

[0075] A fifth boss 313 is provided on the heat sink C-31, a sixth boss 323 is provided on the heat sink C-32, and the double-sided water-cooled power module 4 between the heat sink C-31 and the heat sink C-32 is connected between the opposite surfaces of the fifth boss 313 and the sixth boss 323.

[0076] The above-mentioned bosses need to be pre-processed with silver plating, and the above-mentioned double-sided water-cooled power module 4 is connected to the opposite surface of the bosses through a double-sided silver sintering process to dissipate heat for the power module.

[0077] The double-sided water-cooled radiator based on the silver sintering connection process provided by the present invention can be used in the fields of power units, electric vehicles, etc.

[0078] Compared with the prior art, the present invention has the following advantages:

[0079] 1) Excellent thermal conductivity. Silver itself has high thermal conductivity, which helps to quickly transfer heat, reduce heat accumulation in power devices, and improve equipment reliability and operating life;

[0080] 2) Excellent electrical conductivity. Silver, as a conductive connection layer, can effectively reduce resistance, improve equipment efficiency, reduce heat generation and improve operational reliability;

[0081] 3) Improve the reliability of power devices. The melting point of silver is as high as 961°C. Compared with other soft solder connection layers with low melting points, it has typical anti-fatigue properties. Especially in the field of high-temperature power electronics, silver sintering technology performs particularly well.

[0082] 4) Environmentally friendly. The sintered material does not contain lead and is an environmentally friendly material that complies with modern environmental standards and the concept of sustainable development, reducing the negative impact on the environment during the production process.

[0083] 5) Reduce the overall system cost. The silver sintering process has good thermal and electrical conductivity, which can reduce loop resistance and improve efficiency, reduce the heat generation of devices, and extend the service life of equipment; at the same time, it has high temperature resistance and reliability, which further exerts the high temperature resistance potential of power semiconductors, especially third-generation wide bandgap semiconductors, thereby improving the current output capacity of power devices, reducing the derating margin in selection, and thus reducing system costs.

[0084] The above embodiments are preferred implementation modes of the present invention, but the implementation modes of the present invention are not limited to the above embodiments. Any other changes, modifications, substitutions, combinations, and simplifications that do not deviate from the spirit and principles of the present invention should be equivalent replacement methods and are included in the protection scope of the present invention.

[0085] In the description of the present invention, it is necessary to understand that the terms indicating orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

Claims

1. A double-sided water-cooled radiator based on a silver sintering connection process, comprising a first heat dissipation unit group (1), a second heat dissipation unit group (2), and a third heat dissipation unit group (3), characterized in that: The first heat dissipation unit group (1), the second heat dissipation unit group (2), and the third heat dissipation unit group (3) can be connected in series to achieve a stacked arrangement, so as to allow free expansion of the heat sink. Each heat dissipation unit group has two heat dissipating bodies and clamps a double-sided water-cooled power module (4).

2. A double-sided water-cooled radiator based on silver sintering connection technology according to claim 1, characterized in that: The first heat dissipation unit group (1) comprises a heat dissipation body A1 (11) and a heat dissipation body A2 (12) which are connected to each other, the second heat dissipation unit group (2) comprises a heat dissipation body B1 (21) and a heat dissipation body B2 (22) which are connected to each other, and the third heat dissipation unit group (3) comprises a heat dissipation body C1 (31) and a heat dissipation body C2 (32) which are connected to each other; The heat sink A1 (11), the heat sink A2 (12), the heat sink B1 (21), the heat sink B2 (22), the heat sink C1 (31) and the heat sink C2 (32) all have cooling cavities inside; The cooling inner cavity inside the heat sink A1 (11), the heat sink A2 (12), the heat sink B1 (21), the heat sink B2 (22), the heat sink C1 (31) and the heat sink C2 (32) are connected; A double-sided water-cooling power module (4) is provided between the heat sink A1 (11) and the heat sink A2 (12), between the heat sink B1 (21) and the heat sink B2 (22), and between the heat sink C1 (31) and the heat sink C2 (32).

3. A double-sided water-cooled radiator based on silver sintering connection technology according to claim 1, characterized in that: The bottom of the heat sink A-(11) is connected to two insert pipes-1 (111), and the two insert pipes-1 (111) are both connected to the cooling inner cavity inside the heat sink A-(11); The top of the heat sink A2 (12) is connected to two sleeves A1 (121), and the two sleeves A1 (121) are both connected to the cooling inner cavity inside the heat sink A2 (12); The two insert tubes 1 (111) are respectively plugged into the two sleeve tubes 1 (121) correspondingly; The bottom of the heat sink A2 (12) is connected to two second plug-in tubes (122), and the two second plug-in tubes (122) are both connected to the cooling inner cavity inside the heat sink A2 (12); The top of the heat sink B1 (21) is connected to two sleeves 2 (211), and the two sleeves 2 (211) are both connected to the cooling inner cavity inside the heat sink B1 (21); The two second insertion tubes (122) are respectively mated with the two second sleeve tubes (211) correspondingly; The bottom of the heat sink B-(21) is connected to two insert pipes 3 (212), and the two insert pipes 3 (212) are both connected to the cooling inner cavity inside the heat sink B-(21); The top of the heat sink B2 (22) is connected to two sleeves 3 (221), and the two sleeves 3 (221) are both connected to the cooling inner cavity inside the heat sink B2 (22); The two insertion tubes three (212) are respectively mated with the two sleeve tubes three (221) correspondingly.

4. A double-sided water-cooled radiator based on silver sintering connection technology according to claim 1, characterized in that: The bottom of the heat sink B2 (22) is connected to two insert pipes 4 (222), and the two insert pipes 4 (222) are both connected to the cooling inner cavity inside the heat sink B2 (22); The top of the heat sink C-(31) is connected to two sleeves four (311), and the two sleeves four (311) are both connected to the cooling inner cavity inside the heat sink C-(31); The two inserting tubes four (222) are respectively plugged and connected with the two sleeve tubes four (311); The bottom of the heat sink C-(31) is connected to two insert pipes five (312), and the two insert pipes five (312) are both connected to the cooling inner cavity inside the heat sink C-(31); The top of the heat sink C2 (32) is connected to two sleeves 5 (321), and the two sleeves 5 (321) are both connected to the cooling inner cavity inside the heat sink C2 (32); The two inserting tubes 5 (312) are respectively plugged and connected with the two sleeve tubes 5 (321); The bottom of the heat sink C2 (32) is connected to two insert pipes 6 (322), and both insert pipes 6 (322) are connected to the inside of the heat sink C2 (32).

5. The double-sided water-cooled radiator based on the silver sintering connection process according to claim 1, characterized in that: Pin-fin heat sinks (5) are provided in the cooling inner cavities of the heat sink A1 (11), the heat sink A2 (12), the heat sink B1 (21), the heat sink B2 (22), the heat sink C1 (31) and the heat sink C2 (32).

6. A double-sided water-cooled radiator based on silver sintering connection technology according to claim 5, characterized in that: The heat sink A1 (11) is provided with a boss 1 (112), and the heat sink A2 (12) is provided with a boss 2 (123); The double-sided water-cooled power module (4) between the heat sink A1 (11) and the heat sink A2 (12) is connected between the opposite surfaces of the boss 1 (112) and the boss 2 (123); The heat sink B1 (21) is provided with a boss 3 (213), and the heat sink B2 (22) is provided with a boss 4 (223); The double-sided water-cooled power module (4) between the heat sink B1 (21) and the heat sink B2 (22) is connected between the opposite surfaces of the boss three (213) and the boss four (223); The heat sink C1 (31) is provided with a boss 5 (313), and the heat sink C2 (32) is provided with a boss 6 (323); The double-sided water-cooled power module (4) between the heat sink C1 (31) and the heat sink C2 (32) is connected between the opposite surfaces of the boss five (313) and the boss six (323).

7. The double-sided water-cooled radiator based on the silver sintering connection process according to claim 1, characterized in that: Nano silver solder paste is printed on the substrate of the double-sided water-cooled power module (4).

8. The double-sided water-cooled radiator based on the silver sintering connection process according to claim 6, characterized in that: Pin-fin heat sinks (5) are provided in the cooling inner cavities of the heat sink A1 (11), the heat sink A2 (12), the heat sink B1 (21), the heat sink B2 (22), the heat sink C1 (31) and the heat sink C2 (32).

9. The double-sided water-cooled radiator based on the silver sintering connection process according to claim 5, characterized in that: The pin-fin heat sink (5) is cylindrical or elliptical.

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