LED packaging device

Abstract

The invention relates to the technical field of packaging equipment, in particular to an LED packaging device.The LED packaging device is provided with a rack, a heating table and a pressure supply module, the heating table is fixed to the rack, a base of a packaging structure can be placed on the heating table, the heating table can heat the base, and the base is bonded with a lens by heating the base; according to the LED chip packaging device, packaging of the LED chip in the base is achieved, the packaging device is provided with the pressure supply module, when the LED chip is packaged, the pressing module presses the lens, then the lens can be prevented from floating upwards under the pressure of gas expansion in the base, and the packaging quality of the LED chip is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of packaging equipment, and in particular to an LED packaging device. Background Art

[0002] The existing UV LED packaging structure is to coat the surface of the monomer substrate with adhesive, then cover it with a light-transmitting protective cover, and solidify the adhesive by high temperature; in actual production, the air in the cavity between the monomer substrate and the light-transmitting protective cover expands after high temperature heating, causing the light-transmitting cover to float up and form air holes between the light-transmitting cover and the base, resulting in reduced air tightness of the product.

[0003] In order to solve the problem of the light cover floating up due to the expansion of air after being heated at high temperature, the patent document with announcement number CN217691166U proposes a packaging structure to solve the silicone pores in the lens of UV LED lamp beads. The packaging structure is provided with a bracket, an LED chipset, and a lens. The edge of the bracket is extended to form a mounting step. The LED chipset is fixed on the bracket, and the lens is fixed to the mounting step so that the LED chipset is encapsulated between the bracket and the lens. The bracket is provided with a through hole connected to the outside; when the bracket and the LED chipset are heated, the expanded gas inside them can be discharged through the through hole to maintain the internal air pressure stable and prevent the internal air pressure from rising.

[0004] Although the problem of the light-transmitting mirror floating up due to high temperature can be solved to a certain extent by setting through holes on the bracket, in order to prevent external dust and other pollutants from entering the bracket and causing contamination of the LED chip, after the LED chipset is packaged, the through holes need to be sealed with a fixing film, which affects the packaging efficiency of the LED chip. Summary of the invention

[0005] The purpose of the present invention is to overcome the above technical deficiencies and provide an LED packaging device to solve the technical problem in the prior art that during the LED packaging process, the lens is prone to float due to high temperature, which affects the quality of LED packaging.

[0006] In order to achieve the above technical objectives, the present invention adopts the following technical solutions: In a first aspect, the present invention provides an LED packaging device, which is used to package an LED chip with a base and a lens, wherein the base is used to mount the LED chip, and the lens is bonded to the base. The LED packaging device comprises: frame; A heating platform, which is fixed to the frame and is used to place the base and heat the base; and A pressure supply module is installed on the frame and opposite to the heating platform, and is used for pressing the lens.

[0007] In some embodiments, the pressure supply module includes a pressing unit and a driving unit, the pressing unit is opposite to the heating platform, and the driving unit is installed on the frame and connected to the pressing unit for driving the pressing unit to move toward or away from the heating platform.

[0008] In some embodiments, the pressing unit includes a mounting seat and a plurality of ejector pins, the mounting seat is connected to the driving unit, and the ejector pins are fixed at intervals on a side of the mounting seat close to the heating platform, and are used to press the lens by moving the mounting seat toward the heating platform.

[0009] In some embodiments, the ejector pin is provided with a pressing piece and a buffer spring, the pressing piece is slidably connected to one end of the ejector pin close to the heating platform, and the buffer spring is provided on the inner side of the ejector pin and abuts against the pressing piece.

[0010] In some embodiments, the mounting seat is provided with a mounting plate, the mounting plate is detachably fixed to the inner side of the mounting seat, and each of the ejector pins is fixed to the mounting plate.

[0011] In some embodiments, a threaded column is disposed on the inner side of the mounting seat, and the mounting plate is fixed to the threaded column by bolts.

[0012] In some embodiments, the driving unit includes a cylinder, which is fixed to the frame and connected to the pressing unit via a driving shaft.

[0013] In some embodiments, the heating platform is provided with an infrared sensor, which is electrically connected to a controller and is used to sense the base so that the controller controls the cylinder.

[0014] In some embodiments, the heating platform is further provided with a positioning column, which is located on the conveying path of the base and is used to connect to the positioning hole of the base.

[0015] In some embodiments, the heating platform is further provided with a plurality of limit blocks, each of which is fixed on two sides of the heating platform and is used to limit the two sides of the base.

[0016] Compared with the prior art, the beneficial effects of the LED packaging device provided by the present invention include: the LED packaging device is provided with a frame, a heating platform and a pressure supply module, the heating platform is fixed to the frame, the heating platform can be used to place the base of the packaging structure, and the base is heated, and the base is bonded to the lens by heating the base, so as to realize the packaging of the LED chip inside the base; the packaging device is provided with a pressure supply module, and when the LED chip is packaged, the pressing module presses the lens, thereby preventing the lens from floating up under the pressure of the gas expansion inside the base, thereby improving the packaging quality of the LED chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a schematic structural diagram of an LED packaging device provided by an embodiment of the present invention; Figure 2 yes Figure 1 A partial enlarged view of point A in the middle.

[0018] Description of reference numerals: 10—Frame 11—Base 12—Top Plate 13—column 20—heating table 21—positioning hole 22—heating tube 23—limiting block 24—infrared sensor 30—pressure supply module 31—pressing unit 32—driving unit 111—positioning column 311—mounting seat 312—thimble 321—Cylinder 3111—Mounting plate 3112—Threaded column 3121—Pressing piece 10a—Lens. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0020] In order to solve the technical problem in the prior art that the lens 10a is prone to float due to high temperature during the LED chip packaging process, thus affecting the LED packaging quality, the present invention provides an LED packaging device, which can prevent the lens 10a from floating under the pressure of the gas expansion inside the base by pressing the lens 10a during the LED chip packaging process, thereby ensuring the packaging quality of the LED chip.

[0021] In order to achieve the above technical objectives, the present invention adopts the following technical solutions: The LED packaging device provided in the embodiment of the present invention is used to package the LED chip with the base (not shown in the figure) and the lens 10a. The base is used to install the LED chip, and the lens 10a is bonded to the base. Figure 1 As shown, the LED packaging device includes a frame 10, a heating platform 20 and a pressure supply module 30. The heating platform 20 is fixed to the frame 10, and is used to place the base and heat the base; the pressure supply module 30 is installed on the frame 10 and opposite to the heating platform 20, and is used to press the lens 10a.

[0022] Specifically, the LED packaging device is provided with a frame 10, a heating platform 20 and a pressure supply module 30. The heating platform 20 is fixed to the frame 10. The heating platform 20 can be used to place the base of the packaging structure and heat the base. By heating the base, the base is bonded to the lens 10a, thereby realizing the packaging of the LED chip inside the base. The packaging device is provided with a pressure supply module 30. When packaging the LED chip, the pressing module presses the lens 10a, thereby preventing the lens 10a from floating up under the pressure of the gas expansion inside the base, thereby improving the packaging quality of the LED chip.

[0023] It can be understood that the frame 10 can be any frame structure that can realize the installation of the heating platform 20 and the pressure supply module 30.

[0024] In this embodiment, Figure 1 As shown, the frame 10 includes a base 11, a top plate 12 and a plurality of columns 13. The base 11 and the top plate 12 are arranged opposite to each other, and the columns 13 are arranged at intervals and fixed to the base 11 and the top plate 12. The heating table 20 is placed on the base 11 to provide support for the base 11.

[0025] It can be understood that the base can be placed on the base 11 manually or under the control of a robot.

[0026] In one embodiment, if Figure 1-2 As shown, the rack 10 is also provided with a positioning column 111, which is located on the conveying path of the base and is used to connect the positioning hole 21 of the heating platform 20. Specifically, the heating platform 20 can achieve accurate positioning of the heating platform 20 through the cooperation of the positioning column 111 and the positioning hole 21, thereby ensuring the packaging quality of the LED chip.

[0027] In this embodiment, the positioning column 111 is disposed on the base 11 .

[0028] In this embodiment, the base is placed on a material rack, and when the LED chip packaging work is performed, the push rod on the side of the base pushes the base from the bracket to the conveyor belt; and then the base is transported to the heating table 20 through the conveyor belt.

[0029] In this embodiment, a heating tube 22 is disposed inside the heating platform 20 , and the heating tube 22 supplies heat to the base by generating heat.

[0030] In one embodiment, if Figure 1-2 As shown, the heating platform 20 is also provided with a plurality of limit blocks 23, each of which is fixed on both sides of the heating platform 20, and is used to limit the two sides of the base. Specifically, the limit blocks 23 can limit the base on both sides of the base, thereby preventing the base from shifting during the pressing process, and improving the packaging quality of the LED chip.

[0031] It can be understood that the pressing unit 31 can be any pressing structure such as a pressing rod or a pressing spring disposed on the frame 10 that can press the lens 10 a .

[0032] In one embodiment, if Figure 1 As shown, the pressure supply module 30 includes a pressing unit 31 and a driving unit 32. The pressing unit 31 is opposite to the heating platform 20. The driving unit 32 is installed on the frame 10 and connected to the pressing unit 31, and is used to drive the pressing unit 31 to move toward or away from the heating platform 20. Specifically, when the LED chip packaging work is performed, the driving unit 32 drives the pressing unit 31 to move toward the heating platform 20, so that the pressing unit 31 can press the lens 10a, thereby realizing automatic pressing of the lens 10a.

[0033] It can be understood that the pressing unit 31 can be any pressing structure such as a pressing plate, a pressing rod, etc. that can press the lens 10a.

[0034] In one embodiment, if Figure 1-2 As shown, the pressing unit 31 includes a mounting seat 311 and a plurality of ejector pins 312. The mounting seat 311 is connected to the driving unit 32. Each ejector pin 312 is fixed at intervals on a side of the mounting seat 311 close to the heating platform 20, and is used to press the lens 10a by moving the mounting seat 311 toward the heating platform 20. Specifically, when the LED chip is packaged, the driving unit 32 drives the mounting seat 311 to move toward the heating platform 20, so that each ejector pin 312 presses the lens 10a, thereby achieving uniform pressing force at each pressing part of the lens 10a, thereby improving the packaging quality of the LED chip.

[0035] In one embodiment, if Figure 1-2 As shown, the ejector pin 312 is provided with a pressing piece 3121 and a buffer spring (not marked in the figure), the pressing piece 3121 is slidably connected to one end of the ejector pin 312 close to the heating platform 20, and the buffer spring is provided on the inner side of the ejector pin 312 and abuts against the pressing piece 3121. Specifically, the driving unit 32 drives the mounting seat 311 to move toward the heating platform 20, which drives the pressing piece 3121 on each ejector pin 312 to contact the surface of the lens 10a, and makes the pressing piece 3121 press the lens 10a against the elastic force of the buffer spring. Through the buffering of the buffer spring, the pressing force of the pressing piece 3121 is prevented from being too large, which may cause damage to the lens 10a. At the same time, since the buffer spring has a certain buffer margin, if the internal air pressure of the base is too large, the lens 10a can also overcome the pressure rise of the buffer spring driven by the internal air pressure of the base, so as to prevent the lens 10a from being broken due to excessive air pressure.

[0036] In one embodiment, if Figure 1-2As shown, the mounting seat 311 is provided with a mounting plate 3111, and the mounting plate 3111 is detachably fixed to the inner side of the mounting seat 311, and each ejector pin 312 is fixed to the mounting plate 3111. Specifically, the mounting plate 3111 can realize the connection between each ejector pin 312 and the mounting seat 311, and the mounting plate 3111 can be detachably connected to the mounting seat 311, so that the mounting plate 3111 can be adaptively replaced for packaging structures of different sizes and shapes, thereby improving the practicality of the packaging device.

[0037] It can be understood that the mounting plate 3111 can be fixed to the mounting seat 311 by snap-fitting or the like.

[0038] In this embodiment, Figure 1-2 As shown, a threaded column 3112 is provided on the inner side of the mounting seat 311, and the mounting plate 3111 is fixed to the threaded column 3112 by bolts. Specifically, the mounting seat 311 can be fixed on the mounting seat 311 by bolts.

[0039] It can be understood that the pressing unit 31 can be any driving component such as a cylinder 321, a motor screw module, etc. that can drive the pressing unit 31.

[0040] In one embodiment, if Figure 1 As shown, the driving unit 32 includes a cylinder 321, which is fixed to the frame 10 and connected to the pressing unit 31 through a driving shaft. Specifically, when the LED chip is packaged, the pressing unit 31 is driven by the cylinder 321.

[0041] In this embodiment, the cylinder 321 is fixed to the top plate 12 .

[0042] In one embodiment, if Figure 1-2 As shown, the heating table 20 is provided with an infrared sensor 24, which is electrically connected to the controller and is used to sense the base so that the controller controls the cylinder 321. Specifically, when the conveyor belt conveys the base to the infrared sensor 24, the infrared sensor 24 senses that the base is approaching. At this time, the controller controls the cylinder 321 to move, so that the cylinder 321 drives the pressing unit 31 to move toward the heating table 20 and press the lens 10a, thereby realizing automatic pressing of the lens 10a and providing convenience for the packaging of the LED chip.

[0043] In order to better understand the present invention, the following Figure 1 to Figure 2The technical solution of the present invention is described in detail: when encapsulating the LED chip, the push rod on the side of the base pushes the base out of the bracket and onto the conveyor belt; then it is transported to the heating table 20 through the conveyor belt, and the limit blocks 23 are located on both sides of the base. At this time, the infrared sensor 24 senses that the base is approaching, and the controller controls the cylinder 321 to move, so that the cylinder 321 drives the mounting seat 311 to move toward the heating table 20, so that the pressing piece 3121 on each ejector pin 312 presses the lens 10a, and then the heating table 20 heats the base to encapsulate the LED chip. The pressing piece 3121 presses the lens 10a during the encapsulation process to prevent the lens 10a from rising under the air pressure inside the base, thereby ensuring the encapsulation quality of the LED chip.

[0044] The specific implementation of the present invention described above does not constitute a limitation on the protection scope of the present invention. Any other corresponding changes and modifications made based on the technical concept of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. An LED packaging device, used to package an LED chip with a base and a lens, wherein the base is used to mount the LED chip, and the lens is bonded to the base, characterized in that: include: frame; A heating platform, which is fixed to the frame and is used to place the base and heat the base; and A pressure supply module is installed on the frame and opposite to the heating platform, and is used for pressing the lens.

2. The LED packaging device according to claim 1, characterized in that: The pressure supply module includes a pressing unit and a driving unit. The pressing unit is opposite to the heating platform. The driving unit is installed on the frame and connected to the pressing unit to drive the pressing unit to move toward or away from the heating platform.

3. The LED packaging device according to claim 2, characterized in that: The pressing unit includes a mounting seat and a plurality of ejectors, the mounting seat is connected to the driving unit, and the ejectors are fixed at intervals on a side of the mounting seat close to the heating platform, and are used to press the lens by moving the mounting seat toward the heating platform.

4. The LED packaging device according to claim 3, characterized in that: The ejector pin is provided with a pressing piece and a buffer spring. The pressing piece is slidably connected to one end of the ejector pin close to the heating platform. The buffer spring is arranged on the inner side of the ejector pin and abuts against the pressing piece.

5. The LED packaging device according to claim 3, characterized in that: The mounting seat is provided with a mounting plate, the mounting plate is detachably fixed to the inner side of the mounting seat, and each of the ejector pins is fixed to the mounting plate.

6. The LED packaging device according to claim 5, characterized in that: A threaded column is arranged on the inner side of the mounting seat, and the mounting plate is fixed to the threaded column by bolts.

7. The LED packaging device according to claim 2, characterized in that: The driving unit includes a cylinder, which is fixed to the frame and connected to the pressing unit via a driving shaft.

8. The LED packaging device according to claim 7, characterized in that: The heating platform is provided with an infrared sensor, which is electrically connected to the controller and is used to sense the base so that the controller controls the cylinder.

9. The LED packaging device according to any one of claims 1 to 8, characterized in that: The heating platform is also provided with a positioning column, which is located on the conveying path of the base and is used to connect with the positioning hole of the base.

10. The LED packaging device according to any one of claims 1 to 8, characterized in that: The heating platform is also provided with a plurality of limit blocks, each of which is fixed on two sides of the heating platform and is used to limit the two sides of the base.

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