High-activity chemical copper plating solution and chemical copper plating method

Abstract

The invention discloses a high-activity chemical copper plating solution and a chemical copper plating method, and relates to the technical field of chemical copper plating, and the chemical copper plating solution comprises the following components: a copper ion source, a biological enzyme, a natural polymer complexing agent, a pH regulator and a stabilizer; according to the method, the specific bio-enzyme is adopted as the chemical copper plating catalyst, the remarkable catalytic effect is shown, the bio-enzyme has efficient selectivity and catalytic activity, reduction and deposition of copper ions can be accelerated under the mild condition, and therefore reaction energy consumption and equipment requirements are reduced, meanwhile, use of chemical reagents is reduced, and the cost is reduced. In addition, natural polymer complexing agents such as chitosan and sodium alginate have good biocompatibility and degradability and can form a stable complex with copper ions, the stability and the copper plating effect of the plating solution are enhanced, and by designing the natural polymer complexing agent with a specific structure such as a hyperbranched structure, the copper plating effect of the plating solution is improved. And the complexing ability and the performance of the copper plating solution are further improved.

Description

Technical Field

[0001] The invention relates to the technical field of chemical copper plating, in particular to a high-activity chemical copper plating solution and a chemical copper plating method. Background Art

[0002] With the rapid development of modern industrial technology, chemical copper plating technology, as an important surface treatment technology, has been widely used in the fields of electronics, communications, and aerospace. This technology can significantly improve the electrical conductivity, thermal conductivity, and corrosion resistance of the substrate by depositing a uniform and dense copper layer on the surface of the substrate, thereby meeting the use requirements under various complex working conditions. However, traditional chemical copper plating technology still has some problems and challenges in practical applications, such as high reaction energy consumption, strict equipment requirements, large amounts of chemical reagents used, and poor stability of the plating solution. These problems limit the further development and application of chemical copper plating technology.

[0003] There are several significant disadvantages in the traditional chemical copper plating technology. First, the traditional copper plating solution often uses inorganic chelating agents, which are insufficient in environmental protection and biocompatibility, easily pollute the environment, and may have adverse effects on human health during the treatment process. Secondly, the traditional copper plating solution lacks efficient catalysts or promoters, resulting in low activity of the copper plating reaction, requiring longer reaction time and higher temperature, which not only increases energy consumption, but also may lead to unstable coating quality.

[0004] In addition, traditional chemical copper plating methods often ignore the pretreatment process of the substrate surface, resulting in insufficient adhesion between the copper plating layer and the substrate, which is prone to peeling or cracking problems. At the same time, the lack of precise control measures during the copper plating process, such as the synergistic effect of electric and magnetic fields, makes it difficult to ensure the uniformity and density of the copper plating layer.

[0005] Therefore, developing a highly active chemical copper plating solution and a chemical copper plating method can improve the activity of the copper plating reaction, the quality of the coating, and the environmental friendliness and stability of the plating solution. Summary of the invention

[0006] The purpose of the present invention is to make up for the deficiencies of the prior art and to provide a high-activity chemical copper plating solution and a chemical copper plating method. The solution is composed of a copper ion source, a biological enzyme, a natural polymer complexing agent, a pH regulator and a stabilizer, and has the characteristics of environmental protection, high efficiency and stability. By adopting specific biological enzymes and natural polymer complexing agents, the activity of the copper plating reaction and the quality of the coating are improved. At the same time, combined with laser pretreatment and the synergistic effect of electric field and magnetic field, the copper plating process is further optimized and precise control of the copper plating layer is achieved.

[0007] In order to solve the above technical problems, the present invention provides the following technical solutions: On the one hand, a highly active chemical copper plating solution, the components of which are: a copper ion source, a biological enzyme, a natural polymer complexing agent, a pH regulator and a stabilizer; The copper ion source is copper sulfate, and the concentration is controlled at 0.08 mol / L; The biological enzyme is extracted from Bacillus; The natural polymer complexing agent is chitosan, sodium alginate and a hyperbranched natural polymer complexing agent; The pH regulator is sodium hydroxide, which is used to adjust the pH value of the solution; The stabilizer is thiourea.

[0008] Furthermore, the biological enzyme can also be extracted from Bacillus thuringiensis, with an addition amount of 8 g per liter of solution, and change the electronic state of copper ions by combining with copper ions under mild conditions of 30-40°C.

[0009] Furthermore, the chitosan in the natural polymer complexing agent is extracted from shrimp and crab shells, with a concentration of 15 g per liter of solution, and the amino and hydroxyl groups in the molecules form a stable complex by coordinating with copper ions.

[0010] Furthermore, the sodium alginate in the natural polymer complexing agent is extracted from algae plants, with a concentration of 12 g per liter of solution. The carboxyl and hydroxyl functional groups in the sodium alginate molecules form a stable complex by coordinating with copper ions.

[0011] Furthermore, the hyperbranched natural polymer complexing agent in the natural polymer complexing agent is obtained by etherification and grafting modification reaction of starch, and the concentration is 18g per liter of solution. It has a large number of branches and end groups, which provide more binding sites for copper ions.

[0012] Furthermore, the preparation method of the copper plating solution is: Prepare copper ion solution: according to the volume of chemical copper plating solution to be prepared, weigh a certain amount of copper sulfate at a concentration of 0.08 mol / L, use a corrosion-resistant container, first add a portion of deionized water, stir the copper sulfate in the deionized water with a magnetic stirrer, and gradually add the remaining deionized water until the copper sulfate is completely dissolved; Add biological enzyme: slowly add the extracted biological enzyme to the copper ion solution, use a magnetic stirrer to stir while adding, and add the biological enzyme at a moderate speed to avoid adding too quickly to cause excessive local concentration and affect the activity of the enzyme. After adding the biological enzyme, continue stirring for a while to allow the biological enzyme to fully react with the copper ions; Adding natural polymer complexing agent: Chitosan: weigh chitosan at a concentration of 15 g / L and gradually add chitosan powder into the solution, stirring with a stirrer to allow it to fully dissolve and coordinate with copper ions; Sodium alginate: weigh sodium alginate at a concentration of 12 g / L, add it to the solution, and stir it evenly with a stirrer to form a stable complex with copper ions; Hyperbranched natural polymer complexing agent: weigh a hyperbranched natural polymer complexing agent at a concentration of 18 g / L, slowly stir and add it to the solution to allow it to fully combine with the copper ions; Adjust the pH value: slowly add sodium hydroxide as a pH adjuster, stir while adding, use a pH meter to monitor the pH value of the solution in real time, and adjust the pH value of the solution to 12; Add stabilizer: weigh thiourea at a concentration of 3 mg per liter of solution, add it into the solution and stir evenly with a stirrer to fully dissolve the thiourea.

[0013] On the other hand, a chemical copper plating method, the specific steps of the chemical copper plating method are: Matrix preparation: Select the matrix material, use organic solvent cleaning and ultrasonic cleaning to remove oil and dust on the surface of the matrix; Laser pretreatment: By controlling the power and scanning speed of the laser, a microstructure of a certain depth is etched on the surface of the substrate to increase the surface roughness. Through laser irradiation, the molecular structure of the substrate surface is changed, the active sites on the surface are increased, and the adhesion of the copper plating layer is improved; Electric field and magnetic field are set in coordination: electric field and magnetic field are applied simultaneously during the chemical copper plating process. The electric field strength is set to 5-10V / cm and the magnetic field strength is set to 0.5-1T. The chemical copper plating process can be precisely controlled by adjusting the parameters. Chemical copper plating operation: Place the laser pre-treated substrate into the chemical copper plating solution, ensure that the substrate is completely immersed, turn on the electric field and magnetic field, and carry out chemical copper plating reaction at a temperature of 30-50°C and a pH value of 11-13. The reaction time is 30-90 minutes; Post-treatment: After the reaction is completed, take out the plated parts, rinse with clean water to remove the residual plating solution on the surface, perform ultrasonic cleaning and hot air drying, and conduct quality inspection on the plated parts.

[0014] Furthermore, the settings of the relevant parameters in the laser pretreatment are as follows: the laser power is set to 50-100W, the wavelength is set to 1064nm, and the scanning speed is set to 500-1500mm / s.

[0015] Furthermore, the electric field is set in a coordinated manner with the magnetic field, and the migration and directional deposition of copper ions are promoted by the electric field. The electric field strength can be adjusted according to the substrate material and copper plating requirements, between 5-10V / cm, and the direction of the electric field is perpendicular to the substrate surface or at a certain angle.

[0016] Furthermore, in the coordinated setting of the electric field and the magnetic field, the magnetic field affects the ion movement and chemical reaction in the plating solution, changes the structure and performance of the copper plating layer, the magnetic field strength is adjusted between 0.5-1T, and the direction of the magnetic field is perpendicular to the substrate surface or at a certain angle to the direction of the electric field.

[0017] Compared with the prior art, the highly active chemical copper plating solution and the chemical copper plating method have the following beneficial effects: 1. The present invention exhibits a significant catalytic effect by adopting a specific biological enzyme as a catalyst for chemical copper plating. The biological enzyme has high selectivity and catalytic activity, and can accelerate the reduction and deposition of copper ions under mild conditions, thereby reducing reaction energy consumption and equipment requirements, while reducing the use of chemical reagents and improving the environmental friendliness of the plating solution. In addition, natural polymer complexing agents such as chitosan and sodium alginate have good biocompatibility and degradability, can form stable complexes with copper ions, and enhance the stability of the plating solution and the copper plating effect. By designing a natural polymer complexing agent with a specific structure, such as a hyperbranched structure, the complexing ability and the performance of the copper plating solution are further improved.

[0018] 2. The present invention further improves the quality and performance of the copper-plated layer through the synergistic effect of the electric field and the magnetic field during the laser pretreatment and chemical copper plating process. The laser pretreatment, with its high precision and high energy density, can form a specific microstructure on the surface of the substrate, increase the surface roughness and active sites, and improve the adhesion and uniformity of the copper-plated layer. At the same time, the electric field can promote the migration and directional deposition of copper ions, while the magnetic field can affect the ion movement and chemical reaction in the plating solution. By adjusting the parameters of the electric field and the magnetic field, the chemical copper plating process can be precisely controlled to obtain a copper-plated layer with special properties to meet different application requirements.

[0019] Other advantages, objectives and features of the present invention will be set forth in part in the following description and, in part, will be apparent to those skilled in the art based on an examination of the following or may be taught from the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0021] Figure 1 is a flow chart of a chemical copper plating method; Figure 2 The present invention is a flow chart of a method for preparing a highly active chemical copper plating solution. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Embodiment 1

[0023] Application of high-activity chemical copper plating in automotive parts manufacturing scenarios: Substrate preparation, select automotive parts as the substrate material, first use organic solvent to carefully clean them to remove oil stains on the surface, then perform ultrasonic cleaning to further remove dust, ensure that the substrate surface is clean and free of dirt, and prepare for subsequent copper plating.

[0024] Laser pretreatment: Place the cleaned auto parts into the laser equipment, set the laser power to 80W, the wavelength to 1064nm, and the scanning speed to 1000mm / s. By precisely controlling the laser, a microstructure of a certain depth is etched on the surface of the substrate, effectively increasing the surface roughness. At the same time, laser irradiation changes the molecular structure of the substrate surface, increases a large number of active sites, and greatly improves the adhesion of the copper plating layer.

[0025] The electric field and magnetic field are set in coordination. The electric field strength is set to 7V / cm, and the direction of the electric field is at a certain angle to the substrate surface. At the same time, the magnetic field strength is set to 0.7T, and the direction of the magnetic field is perpendicular to the substrate surface and also at a certain angle to the direction of the electric field. The electric field promotes the migration and directional deposition of copper ions, and the magnetic field affects the ion movement and chemical reaction in the plating solution, thereby achieving precise control of the chemical copper plating process.

[0026] Preparation of chemical copper plating solution: Prepare a copper ion solution. According to the volume of the chemical copper plating solution to be prepared, weigh copper sulfate at a concentration of 0.08 mol / L. Use a corrosion-resistant container, first add a portion of deionized water, add copper sulfate thereto and stir with a glass rod, then gradually add the remaining deionized water until the copper sulfate is completely dissolved to obtain a clear copper ion solution.

[0027] Add the biological enzyme, slowly add the biological enzyme extracted from Bacillus to the copper ion solution, use a magnetic stirrer to add and stir at the same time, control the addition speed to avoid excessive local concentration affecting the activity of the enzyme, and continue stirring for a while after adding the biological enzyme to allow the biological enzyme to fully react with the copper ions.

[0028] A natural high molecular weight complexing agent is added. Chitosan powder extracted from shrimp and crab shells is weighed at a concentration of 15 g / L, and gradually added to the solution. The mixture is stirred with a stirrer to fully dissolve. Sodium alginate extracted from algae is weighed at a concentration of 12 g / L, and added to the solution. The mixture is stirred evenly with a stirrer to form a stable complex with copper ions. A hyperbranched natural high molecular weight complexing agent obtained by etherification and grafting modification of starch is weighed at a concentration of 18 g / L, and slowly added to the solution and stirred. Due to its complex structure, the stirring time is extended to allow it to fully combine with the copper ions.

[0029] Adjust the pH value by slowly adding sodium hydroxide as a pH adjuster while stirring, and use a pH meter to monitor the pH value of the solution in real time to adjust the pH value of the solution to 12.

[0030] Add a stabilizer, weigh thiourea at a concentration of 3 mg per liter of solution, add it to the solution, and stir evenly with a stirrer to fully dissolve the thiourea.

[0031] Chemical copper plating operation: Place the laser pre-treated automotive parts into the chemical copper plating solution to ensure that the substrate is completely immersed. Turn on the electric and magnetic fields and carry out the chemical copper plating reaction at a temperature of 40°C and a pH value of 12 for 60 minutes. During this process, the biological enzyme combines with the copper ions at a mild temperature of 30-40°C to change its electronic state, making it easy to accept electrons and be reduced to copper. The natural polymer chelating agent forms a stable complex with the copper ions to prevent the precipitation of copper ions.

[0032] After post-treatment, the plated parts are taken out and rinsed with clean water to remove the residual plating solution on the surface, and then ultrasonic cleaning and hot air drying are carried out. Finally, the plated parts are quality inspected to ensure that the copper plating layer is uniform and firm, meets the use requirements of automotive parts, and improves the corrosion resistance and conductivity of automotive parts.

[0033] In summary, in the manufacturing of automotive parts, through substrate preparation, laser pretreatment, coordinated setting of electric and magnetic fields, preparation of chemical copper plating solution, chemical copper plating operation and post-processing steps, chemical copper plating is carried out using specific parameters and components to obtain a copper plating layer with good performance that meets the use requirements of automotive parts. Embodiment 2

[0034] Application of high-activity chemical copper plating in electronic circuit board manufacturing scenarios: Matrix preparation: select electronic circuit board as the matrix material, use organic solvent to clean it, remove surface oil, and then perform ultrasonic cleaning to thoroughly remove dust to ensure that the matrix surface is clean and tidy. Laser pretreatment: Place the cleaned electronic circuit board into the laser equipment, set the laser power to 80W, the wavelength to 1064nm, and the scanning speed to 1000mm / s. Use the laser to etch a microstructure of a certain depth on the surface of the substrate to increase the surface roughness. At the same time, laser irradiation changes the molecular structure of the substrate surface, produces more active sites, and improves the adhesion of the subsequent copper plating layer.

[0035] The electric field and magnetic field are set in coordination. The electric field strength is set to 8V / cm, and the direction of the electric field is at a certain angle to the substrate surface. At the same time, the magnetic field strength is set to 0.8T, and the direction of the magnetic field is perpendicular to the substrate surface and also at a certain angle to the direction of the electric field. By adjusting the electric field and magnetic field parameters, precise control of the chemical copper plating process can be achieved.

[0036] Preparation of chemical copper plating solution: Prepare a copper ion solution. According to the volume of the chemical copper plating solution to be prepared, weigh copper sulfate at a concentration of 0.08 mol / L. Use a corrosion-resistant container, first add a portion of deionized water, add copper sulfate thereto and stir with a glass rod, then gradually add the remaining deionized water until the copper sulfate is completely dissolved to obtain a clear copper ion solution.

[0037] Add the biological enzyme, slowly add the biological enzyme extracted from Bacillus to the copper ion solution, use a magnetic stirrer to add and stir at the same time, control the addition speed to avoid excessive local concentration affecting the activity of the enzyme, and continue stirring for a while after adding the biological enzyme to allow the biological enzyme to fully react with the copper ions.

[0038] A natural high molecular weight complexing agent is added. Chitosan powder extracted from shrimp and crab shells is weighed at a concentration of 15 g / L, and gradually added to the solution. The mixture is stirred with a stirrer to fully dissolve. Sodium alginate extracted from algae is weighed at a concentration of 12 g / L, and added to the solution. The mixture is stirred evenly with a stirrer to form a stable complex with copper ions. A hyperbranched natural high molecular weight complexing agent obtained by etherification and grafting modification of starch is weighed at a concentration of 18 g / L, and slowly added to the solution and stirred. Due to its complex structure, the stirring time is extended to allow it to fully combine with the copper ions.

[0039] Adjust the pH value by slowly adding sodium hydroxide as a pH adjuster while stirring, and use a pH meter to monitor the pH value of the solution in real time to adjust the pH value of the solution to 12.

[0040] Add a stabilizer, weigh thiourea at a concentration of 3 mg per liter of solution, add it to the solution, and stir evenly with a stirrer to fully dissolve the thiourea.

[0041] Chemical copper plating operation: Place the electronic circuit board that has been pre-treated by laser into the chemical copper plating solution, ensure that the substrate is completely immersed, turn on the electric field and magnetic field, and carry out the chemical copper plating reaction at a temperature of 40°C and a pH value of 12. The reaction time is 60 minutes. During this process, the biological enzyme combines with the copper ions under mild conditions to change its electronic state, making it easy to be reduced to copper element, and the natural polymer chelating agent forms a stable complex with the copper ions to prevent the precipitation of copper ions.

[0042] After post-treatment, the plated parts are taken out and rinsed with clean water to remove the residual plating solution on the surface, and then ultrasonic cleaning and hot air drying are carried out. Finally, the plated parts are quality inspected to ensure that the copper plating layer is uniform and firm, meets the use requirements of electronic circuit boards, and improves the conductivity and reliability of electronic circuit boards.

[0043] In summary, in the manufacture of electronic circuit boards, through substrate preparation, laser pretreatment, coordinated setting of electric field and magnetic field, preparation of chemical copper plating solution, chemical copper plating operation and post-processing steps, chemical copper plating is carried out using specific parameters and components to obtain a high-quality copper plating layer that meets the requirements for the use of electronic circuit boards. Embodiment 3

[0044] Application of high-activity chemical copper plating in the manufacturing of precision instrument parts: Matrix preparation: Select precision instrument parts as the matrix material, use organic solvents to carefully clean the oil on the surface, and then perform ultrasonic cleaning to remove dust and impurities to ensure that the surface of the matrix is ​​clean and ready for subsequent copper plating.

[0045] Laser pretreatment: Place the cleaned parts into the laser equipment, set the laser power to 80W, the wavelength to 1064nm, and the scanning speed to 1000mm / s. Use the laser to etch a microstructure on the surface of the substrate to increase the surface roughness. At the same time, laser irradiation changes the molecular structure of the substrate surface, increases active sites, and improves the adhesion of the copper plating layer.

[0046] The electric field and magnetic field are set in coordination. The electric field strength is set to 7V / cm, and the direction of the electric field is at a certain angle to the substrate surface. At the same time, the magnetic field strength is set to 0.8T, and the direction of the magnetic field is perpendicular to the substrate surface and also at a certain angle to the direction of the electric field. By adjusting the electric field and magnetic field parameters, precise control of the chemical copper plating process can be achieved.

[0047] Preparation of chemical copper plating solution: Prepare a copper ion solution. According to the volume of the chemical copper plating solution to be prepared, weigh copper sulfate at a concentration of 0.08 mol / L. Add copper sulfate to part of the deionized water, stir with a glass rod, and then gradually add the remaining deionized water until it is completely dissolved to obtain a clear copper ion solution.

[0048] Add biological enzymes, slowly add the biological enzymes extracted from Bacillus into the copper ion solution, stir with a magnetic stirrer while adding, control the adding speed to avoid excessive local concentration affecting the activity of the enzyme, continue stirring for a while after adding to allow the biological enzymes to fully react with the copper ions.

[0049] A natural high molecular weight complexing agent is added, chitosan powder extracted from shrimp and crab shells is weighed, and gradually added into the solution at a concentration of 15 g / L, and stirred with a stirrer to fully dissolve it, sodium alginate extracted from algae is weighed at a concentration of 12 g / L, and added into the solution, and stirred evenly to form a stable complex with copper ions, and a hyperbranched natural high molecular weight complexing agent obtained by etherification and grafting modification of starch is weighed at a concentration of 18 g / L, and slowly added into the solution and the stirring time is extended to allow it to fully combine with the copper ions.

[0050] Adjust the pH value by slowly adding sodium hydroxide as a pH adjuster while stirring. Use a pH meter to monitor the pH value of the solution in real time and adjust it to 12.

[0051] Add stabilizer: weigh thiourea at a concentration of 3 mg per liter of solution, add it to the solution, and stir evenly to fully dissolve the thiourea.

[0052] Chemical copper plating operation: Place the precision instrument parts that have been pre-treated by laser into the chemical copper plating solution, ensure that the substrate is completely immersed, turn on the electric field and magnetic field, and carry out the chemical copper plating reaction at a temperature of 38°C and a pH value of 12. The reaction time is 70 minutes. The biological enzyme combines with the copper ions under mild conditions, changing its electronic state, making it easy to be reduced to copper element. The natural polymer chelating agent forms a stable complex with the copper ions to prevent the precipitation of copper ions.

[0053] After post-treatment, the plated parts are taken out, rinsed with clean water to remove the residual plating solution on the surface, ultrasonic cleaning and hot air drying are carried out, and finally the plated parts are quality inspected to ensure that the copper plating layer is uniform and firm, meeting the use requirements of precision instrument parts and improving its corrosion resistance and conductivity.

[0054] In summary, in the manufacturing of precision instrument parts, high-activity chemical copper plating can be achieved through substrate preparation, laser pretreatment, coordinated setting of electric field and magnetic field, preparation of chemical copper plating solution, chemical copper plating operation and post-processing steps, using specific components and parameters. This method can enable precision instrument parts to obtain a uniform and firm copper plating layer, improve their corrosion resistance and conductivity, and meet the use requirements of precision instruments.

[0055] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

Claims

1. A highly active chemical copper plating solution, characterized in that: The copper plating solution comprises: a copper ion source, a biological enzyme, a natural polymer complexing agent, a pH regulator and a stabilizer; The copper ion source is copper sulfate, and the concentration is controlled at 0.08 mol / L; The biological enzyme is extracted from Bacillus; The natural polymer complexing agent is chitosan, sodium alginate and a hyperbranched natural polymer complexing agent; The pH regulator is sodium hydroxide, which is used to adjust the pH value of the solution; The stabilizer is thiourea.

2. A highly active chemical copper plating solution according to claim 1, characterized in that: The biological enzyme can also be extracted from unicellular bacteria, and the added amount is 8g per liter of solution. Under mild conditions of a temperature of 30-40°C, it changes the electronic state of the copper ions by combining with the copper ions.

3. A highly active chemical copper plating solution according to claim 1, characterized in that: The chitosan in the natural high molecular weight complexing agent is extracted from shrimp and crab shells, with a concentration of 15 g per liter of solution. The amino groups and hydroxyl groups in the molecules coordinate with copper ions to form a stable complex.

4. A highly active chemical copper plating solution according to claim 1, characterized in that: The sodium alginate in the natural polymer complexing agent is extracted from algae plants, with a concentration of 12 g per liter of solution. The carboxyl and hydroxyl functional groups in the sodium alginate molecules form a stable complex through coordination with copper ions.

5. A highly active chemical copper plating solution according to claim 1, characterized in that: The hyperbranched natural polymer complexing agent in the natural polymer complexing agent is obtained by etherification and grafting modification reaction of starch, and has a concentration of 18 g per liter of solution. It has a large number of branches and end groups, which provide more binding sites for copper ions.

6. A highly active chemical copper plating solution according to claim 1, characterized in that: The preparation method of the copper plating solution is: Prepare copper ion solution: according to the volume of chemical copper plating solution to be prepared, weigh a certain amount of copper sulfate at a concentration of 0.08 mol / L, use a corrosion-resistant container, first add a portion of deionized water, stir the copper sulfate in the deionized water with a magnetic stirrer, and gradually add the remaining deionized water until the copper sulfate is completely dissolved; Add biological enzyme: slowly add the extracted biological enzyme to the copper ion solution, use a magnetic stirrer to stir while adding, and add the biological enzyme at a moderate speed to avoid adding too quickly to cause excessive local concentration and affect the activity of the enzyme. After adding the biological enzyme, continue stirring for a while to allow the biological enzyme to fully react with the copper ions; Adding natural polymer complexing agent: Chitosan: weigh chitosan at a concentration of 15 g / L and gradually add chitosan powder into the solution, stirring with a stirrer to allow it to fully dissolve and coordinate with copper ions; Sodium alginate: weigh sodium alginate at a concentration of 12 g / L, add it to the solution, and stir it evenly with a stirrer to form a stable complex with copper ions; Hyperbranched natural polymer complexing agent: weigh a hyperbranched natural polymer complexing agent at a concentration of 18 g / L, slowly stir and add it to the solution to allow it to fully combine with the copper ions; Adjust the pH value: slowly add sodium hydroxide as a pH adjuster, stir while adding, use a pH meter to monitor the pH value of the solution in real time, and adjust the pH value of the solution to 12; Add stabilizer: weigh thiourea at a concentration of 3 mg per liter of solution, add it into the solution and stir evenly with a stirrer to fully dissolve the thiourea.

7. A chemical copper plating method according to any one of claims 1 to 6, characterized in that: The specific steps of the chemical copper plating method are: Matrix preparation: Select the matrix material, use organic solvent cleaning and ultrasonic cleaning to remove oil and dust on the surface of the matrix; Laser pretreatment: By controlling the power and scanning speed of the laser, a microstructure of a certain depth is etched on the surface of the substrate to increase the surface roughness. Through laser irradiation, the molecular structure of the substrate surface is changed, the active sites on the surface are increased, and the adhesion of the copper plating layer is improved; Electric field and magnetic field are set in coordination: electric field and magnetic field are applied simultaneously during the chemical copper plating process. The electric field strength is set to 5-10V / cm and the magnetic field strength is set to 0.5-1T. The chemical copper plating process can be precisely controlled by adjusting the parameters. Chemical copper plating operation: Place the laser pre-treated substrate into the chemical copper plating solution, ensure that the substrate is completely immersed, turn on the electric field and magnetic field, and carry out chemical copper plating reaction at a temperature of 30-50°C and a pH value of 11-13. The reaction time is 30-90 minutes; Post-treatment: After the reaction is completed, take out the plated parts, rinse with clean water to remove the residual plating solution on the surface, perform ultrasonic cleaning and hot air drying, and conduct quality inspection on the plated parts.

8. A chemical copper plating method according to claim 7, characterized in that: The relevant parameters in the laser pretreatment are as follows: the laser power is set to 50-100 W, the wavelength is set to 1064 nm, and the scanning speed is set to 500-1500 mm / s.

9. A chemical copper plating method according to claim 7, characterized in that: The electric field is set in the coordinated setting of the electric field and the magnetic field, and the migration and directional deposition of copper ions are promoted by the electric field. The electric field strength can be adjusted according to the substrate material and copper plating requirements, and is between 5-10V / cm. The direction of the electric field is perpendicular to the substrate surface or at a certain angle.

10. A chemical copper plating method according to claim 7, characterized in that: In the coordinated setting of the electric field and the magnetic field, the magnetic field affects the ion movement and chemical reaction in the plating solution, changes the structure and performance of the copper plating layer, the magnetic field strength is adjusted between 0.5-1T, and the direction of the magnetic field is perpendicular to the substrate surface or at a certain angle to the direction of the electric field.

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