Optical module

Abstract

The embodiment of the invention provides an optical module which comprises a circuit board, the circuit board is provided with a first avoiding opening and a narrow board area, and the first avoiding opening and the narrow board area are located in the width direction of the circuit board in parallel. The light emitting component is located in the first avoiding opening, and the light receiving component is located on the upper surface of the narrow plate area. The optical module further comprises a base plate, the light emitting component is located on the base plate, and the narrow plate area of the base plate is located below the circuit board corresponding to the light receiving component. An electric connector is arranged at one end of the light emitting component, a second bonding pad area of the electric connector protrudes out of the emitting shell, the second bonding pad area is in routing connection with a signal pin area of the circuit board, impedance is reduced, and signal transmission quality is improved. The base plate comprises a first supporting part and a second supporting part, the shell bottom of the transmitting shell is welded to the first supporting part, and the second supporting part is located below the signal pin area.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to an optical module. Background Art

[0002] Optical communication technology is used in new business models and application models such as cloud computing, mobile Internet, and video. In optical communication, optical modules are tools for converting photoelectric signals into each other and are one of the key components in optical communication equipment. With the rapid development of 5G networks, optical modules, which are at the core of optical communication, have made great progress.

[0003] The optical module is provided with a light emitting component for converting electrical signals into optical signals. The connection quality between the light emitting component and the circuit board affects the signal transmission quality. Summary of the invention

[0004] The present application provides an optical module to improve the high-frequency transmission performance of the optical module.

[0005] In order to solve the above technical problems, the embodiments of the present application disclose the following technical solutions:

[0006] The present application embodiment discloses an optical module, including:

[0007] A circuit board, comprising a first avoidance opening and a narrow board area, wherein the first avoidance opening and the narrow board area are arranged side by side in the width direction of the circuit board; the circuit board is provided with a signal pin area;

[0008] A light emitting component is located at the first avoidance, an electrical connector is provided at one end of the light emitting component, a second pad area of ​​the electrical connector is located outside the light emitting component; the second pad area is connected to the signal pin area through a metal key; the thickness of the electrical connector is greater than the thickness of the circuit board;

[0009] A light receiving component, located in the narrow plate area;

[0010] A pad, comprising: a first supporting portion and a second supporting portion, wherein upper surfaces of the second supporting portion and the third supporting portion are higher than an upper surface of the first supporting portion;

[0011] The light emitting component is located above the first supporting portion; the side wall of the electrical connector abuts against the side wall of the second supporting portion, and the second supporting portion supports the signal pin area so that the signal pin area is flush with the second pad area.

[0012] Compared with the prior art, the present invention has the following advantages:

[0013] The present application provides an optical module, wherein a circuit board is provided with a first avoidance opening, and a light emitting component is located in the first avoidance opening. The light emitting component and the light receiving component are both located on the upper surface of the circuit board. The second pad area is connected to the signal pin area by a metal key. The thickness of the electrical connector is less than the thickness of the circuit board. The optical module also has a pad, the light emitting component is located on the pad, and the narrow plate area of ​​the pad is located below the circuit board corresponding to the light receiving component. An electrical connector is provided at one end of the light emitting component, the second pad area of ​​the electrical connector protrudes from the outside of the transmitting shell, and the second pad area is wired to the signal pin area of ​​the circuit board to reduce impedance and improve signal transmission quality. The pad includes a first support portion, a second support portion and a third support portion, the shell bottom of the transmitting shell is welded to the first support portion, and the second support portion is located below the signal pin area so that the signal pin area is flush with the second pad area, shortening the wire bonding length between the second pad area and the signal pin area of ​​the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0015] Figure 1 is a partial architecture diagram of an optical communication system according to some embodiments;

[0016] Figure 2 is a partial structural diagram of a host computer according to some embodiments;

[0017] Figure 3 is a structural diagram of an optical module according to some embodiments;

[0018] Figure 4 is an exploded view of an optical module according to some embodiments;

[0019] Figure 5 A schematic diagram of an exploded view of a light emitting component, a light receiving component and a circuit board provided according to some embodiments of the present disclosure;

[0020] Figure 6 It is a schematic diagram of an exploded view of a light emitting component, a light receiving component, and a circuit board provided according to some embodiments of the present disclosure;

[0021] Figure 7 A schematic diagram of an exploded view of a light emitting component provided according to some embodiments of the present disclosure;

[0022] Figure 8 It is a schematic diagram of the structure of a launch shell provided according to some embodiments of the present disclosure;

[0023] Fig. 9 It is a schematic diagram of the structure of an electrical connector provided according to some embodiments of the present disclosure;

[0024] Fig.10 It is a schematic diagram of the structure of a pad provided according to some embodiments of the present disclosure;

[0025] Fig.11 A partial cross-sectional view of a light emitting component and a circuit board provided according to some embodiments of the present disclosure Figure 1 ;

[0026] Fig.12 A partial cross-sectional view of a light emitting component and a circuit board provided according to some embodiments of the present disclosure Figure 2 ;

[0027] Fig.13 It is a schematic diagram of another exploded view of a light emitting component provided according to some embodiments of the present disclosure;

[0028] Fig.14 It is a schematic structural diagram of another launch shell provided according to some embodiments of the present disclosure;

[0029] Fig.15 A partial cross-sectional view of a light emitting component and a circuit board provided according to some embodiments of the present disclosure Figure 3 ;

[0030] Fig.16 A partial cross-sectional view of a light emitting component and a circuit board provided according to some embodiments of the present disclosure Figure 4 . DETAILED DESCRIPTION

[0031] Optical communication technology establishes information transmission between information processing devices. Optical communication technology loads information onto light and uses the propagation of light to achieve information transmission. Light loaded with information is an optical signal. When optical signals propagate in information transmission equipment, they can reduce the loss of optical power and achieve high-speed, long-distance, and low-cost information transmission. Information that can be processed by information processing equipment exists in the form of electrical signals. Optical network terminals / gateways, routers, switches, mobile phones, computers, servers, tablets, and televisions are common information processing devices, and optical fibers and optical waveguides are common information transmission equipment.

[0032] The mutual conversion of optical signals and electrical signals between information processing equipment and information transmission equipment is realized through optical modules. For example, an optical fiber is connected to the optical signal input end and / or the optical signal output end of the optical module, and an optical network terminal is connected to the electrical signal input end and / or the electrical signal output end of the optical module; the first optical signal from the optical fiber is transmitted into the optical module, the optical module converts the first optical signal into a first electrical signal, and the optical module transmits the first electrical signal into the optical network terminal; the second electrical signal from the optical network terminal is transmitted into the optical module, the optical module converts the second electrical signal into a second optical signal, and the optical module transmits the second optical signal into the optical fiber. Since information processing devices can be connected to each other through an electrical signal network, at least one type of information processing device needs to be directly connected to the optical module, and it is not necessary for all types of information processing devices to be directly connected to the optical module. The information processing device directly connected to the optical module is called the host computer of the optical module.

[0033] Figure 1 FIG. 1 is a partial architecture diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system is partially presented as a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0034] One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end is connected to the optical interface of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal is totally reflected multiple times in the optical fiber 101, and the optical signal from the direction of the remote information processing device 1000 is transmitted into the optical module 200, or the light from the optical module 200 is propagated toward the remote information processing device 1000, so as to realize long-distance and low-power-loss information transmission.

[0035] The number of optical fibers 101 may be one or more (two or more); the optical fiber 101 and the optical module 200 may be connected in a pluggable movable manner or in a fixed manner.

[0036] The host computer 100 has an optical module interface 102, which is configured to access the optical module 200, so that the host computer 100 establishes a unidirectional / bidirectional electrical signal connection with the optical module 200; the host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor and control the working status of the optical module 200.

[0037] The host computer 100 has an external electrical interface, such as a Universal Serial Bus (USB) interface and a network cable interface 104, which can be connected to an electrical signal network. For example, the network cable interface 104 is configured to connect to the network cable 103, so that the host computer 100 and the network cable 103 establish a unidirectional / bidirectional electrical signal connection.

[0038] Optical Network Unit (ONU), Optical Line Terminal (OLT), Optical Network Equipment (ONT) and Data Center Server are common host computers.

[0039] One end of the network cable 103 is connected to the local information processing device 2000 , and the other end is connected to the host computer 100 . The network cable 103 establishes an electrical signal connection between the local information processing device 2000 and the host computer 100 .

[0040] For example, the third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal. The optical module 200 transmits the second optical signal into the optical fiber 101. The second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101.

[0041] For example, a first optical signal from the direction of a remote information processing device 1000 propagates through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted into the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal into the host computer 100, the host computer 100 generates a fourth electrical signal based on the first electrical signal, and the host computer 100 transmits the fourth electrical signal to the local information processing device 2000.

[0042] The optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the conversion process between optical signals and electrical signals, the information does not change, but the encoding and decoding method of the information can change.

[0043] Figure 2 FIG. 1 is a partial structural diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structures related to the host computer 100 and the optical module 200 are shown. Figure 2As shown, the host computer 100 also includes a PCB circuit board 105 arranged in the shell, a cage 106 arranged on the surface of the PCB circuit board 105, a heat sink 107 arranged on the cage 106, and an electrical connector (not shown in the figure) arranged inside the cage 106. The heat sink 107 has a protruding structure that increases the heat dissipation area, and the fin-shaped structure is a common protruding structure.

[0044] The optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical interface of the optical module 200 is connected to the electrical connector inside the cage 106.

[0045] Figure 3 is a structural diagram of an optical module according to some embodiments, Figure 4 FIG. 1 is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, the optical module 200 includes a shell, a circuit board 300 disposed in the shell, a light emitting component 400 and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the light emitting component 400 and the light receiving component 500.

[0046] The housing comprises an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square body.

[0047] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0048] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and vertically arranged with the cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.

[0049] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3The opening 205 is also located at the end of the optical module 200 ( Figure 3 Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical interface, and the gold finger 301 of the circuit board 300 extends from the electrical interface and is inserted into the electrical connector of the host computer; the opening 205 is an optical port, which is configured to access the optical fiber 101 so that the optical fiber 101 is connected to the optical emitting component 400 and / or the optical receiving component 500 in the optical module 200.

[0050] The assembly method of combining the upper shell 201 and the lower shell 202 is adopted, so that the components such as the circuit board 300, the light emitting component 400, and the light receiving component can be easily installed in the above shell, and the upper shell 201 and the lower shell 202 can encapsulate and protect the shapes of these components. In addition, when assembling the components such as the circuit board 300, the light emitting component 400 and the light receiving component, it is convenient to deploy the positioning components, heat dissipation components, and electromagnetic shielding components of these devices, which is conducive to the automated production.

[0051] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.

[0052] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0053] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit ​​component that matches the cage 106 of the host computer. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the snap-fit ​​component and the host computer, so as to release the snap-fit ​​fixed connection between the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0054] The circuit board 300 includes circuit traces, electronic components and chips, etc. The electronic components and chips are connected together according to the circuit design through the circuit traces to realize the functions of power supply, electrical signal transmission and grounding. The electronic components may include capacitors, resistors, triodes, metal-oxide-semiconductor field-effect transistors (MOSFET), etc. The chips may include microcontroller units (MCU), laser driver chips, transimpedance amplifiers (TIA), limiting amplifiers, clock and data recovery chips (CDR), power management chips, and digital signal processing (DSP) chips.

[0055] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board is also easy to insert into the electrical connector in the upper computer cage.

[0056] The circuit board 300 further includes a gold finger 301 formed on the end surface thereof, and the gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 can be provided on only one side of the circuit board 300 (e.g. Figure 4 The gold finger 301 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, I2C signal transmission, data signal transmission, etc.

[0057] Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0058] The light emitting component 400 and / or the light receiving component 500 are located on a side of the circuit board 300 away from the gold finger 301; in some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors; in some embodiments, the light emitting component and / or the light receiving component can be directly set on the circuit board 300, can be set on the surface of the circuit board, and can also be set on the side of the circuit board.

[0059] In some embodiments, the light emitting component 400 includes a tube shell, and the electrical connection between the tube shell and the circuit board 300 is achieved through an electrical connector and a flexible circuit board. For example, one end of the electrical connector is electrically connected to the tube shell, and the other end is electrically connected to one end of the flexible circuit board, and the other end of the flexible circuit board is point-connected to the circuit board 300, thereby achieving electrical connection between the tube shell and the circuit board 300.

[0060] In the electrical connection method between the electrical connector and the flexible circuit board, exemplarily, the flexible circuit board and the electrical connector are connected by soldering. In this method, it is difficult to control the uniformity of the solder thickness between the connecting surface of the flexible circuit board and the electrical connector, resulting in uneven solder coating. When the solder thickness is uneven, the quality of high-frequency signal transmission is easily reduced. For example, the quality of high-frequency signal transmission is poor at the location where the solder thickness is large. The uneven solder thickness affects the stability of the high-frequency signal transmission quality, thereby affecting the transmission performance of the high-frequency signal.

[0061] In order to improve the transmission quality of high-frequency signals and ensure the transmission performance of high-frequency signals, in some embodiments, the electrical connector and the circuit board may be connected by metal wires to reduce impedance.

[0062] Figure 5 A schematic diagram of an exploded view of a light emitting component, a light receiving component and a circuit board provided according to some embodiments of the present disclosure. Figure 6 The following is a schematic diagram of an optical emitting component, an optical receiving component, and a circuit board according to some embodiments of the present disclosure. Figure 5 and Figure 6 As shown, the circuit board 300 is provided with a first avoidance opening 310, and the light emitting component is located in the first avoidance opening 310. The light emitting component and the light receiving component are both located on the upper surface of the circuit board. The optical module also has a pad 420, the light emitting component is located on the pad 420, and a part of the pad 420 is located below the circuit board corresponding to the light receiving component.

[0063] In some embodiments, the first avoidance opening 310 is located on one side of the circuit board, and its opening is connected to the outside. A signal pin area 320 is provided on the circuit board, and the light emitting component is connected to the signal pin area 320 by wire bonding. A narrow plate area 330 is located on one side of the first avoidance opening 310, and the narrow plate area 330 and the first avoidance opening 310 are located in parallel in the width direction of the circuit board, and the light receiving component 500 is located in the narrow plate area 330.

[0064] The width of the narrow board area 330 is less than or equal to 1 / 3 of the width of other areas of the circuit board 300 .

[0065] Figure 7 FIG. 1 is a schematic diagram of an exploded view of a light emitting component provided according to some embodiments of the present disclosure. Figure 7As shown, the light emitting component includes a emitting housing 410a and an electrical connector 430. A first through hole 4103 is provided on one side wall of the emitting housing 410a, and an electrical connector 430 is provided on the side wall opposite to the first through hole 4103. A light emitting assembly is provided in the emitting housing 410a.

[0066] Exemplarily, the transmitting shell 410a is a transmitting tube shell, and an optical transmitting assembly is arranged inside, including: a laser array 411, a lens array 412, and an optical multiplexing assembly 413. The laser array 411 emits light of different wavelengths, and each light beam is sequentially processed by a converging lens in the lens array 412, and is converted from a divergent state to a convergent state, and then is combined by the optical multiplexing assembly 413 to combine the light of different wavelengths into one beam of light, which is converted into parallel light after being collimated by a collimating lens in the optical fiber adapter 700, and is emitted from the transmitting shell 410a in the form of parallel light.

[0067] Figure 8 FIG. 1 is a schematic diagram of the structure of a launch housing provided according to some embodiments of the present disclosure. Figure 8 As shown, a first through hole 4103 is provided on the transmitting housing 410 a , the first through hole 4103 is connected to the inner cavity of the transmitting housing 410 a , and the first through hole 4103 is connected to the optical fiber adapter 700 .

[0068] A first opening 4101 is disposed on the launch shell 410a, and the first through hole 4103 and the first opening 4101 are located on opposite sides of the launch shell.

[0069] In some embodiments, the electrical connector 430 is located at the first opening 4101, and one side of the electrical connector 430 is inserted into the launch housing 410a, and the other side is exposed outside the launch housing 410a, so that the launch housing 410a and the electrical connector are assembled to form a light emission cavity. One end of the electrical connector 430 located inside the launch housing is connected to the laser array 411 through a gold wire, and the other end of the electrical connector 430 located outside the launch housing is connected to the circuit board through a gold wire, and the electrical signals, working signals, etc. generated by the circuit board 300 are transferred to the laser array 411 to drive each laser to emit laser beams of different wavelengths.

[0070] In some embodiments, the housing bottom 4102 of the transmitting housing 410a is connected to the electrical connector 430 to support the electrical connector 430. The lower surface of the electrical connector 430 is higher than the housing bottom 4102.

[0071] Fig. 9 Schematic diagram of the structure of an electrical connector provided according to some embodiments of the present disclosure. Fig. 9As shown, a first pad area 431 is formed on the surface of the electrical connector 430 located inside the launch shell 410a, and a second pad area 432 is formed on the surface of the electrical connector 430 located outside the launch shell 410a. The first pad area 431 is electrically connected to the second pad area 432, thereby realizing signal transmission inside and outside the launch shell 410a, including transmission of low-frequency signals and high-frequency signals. The second pad area 432 includes a low-frequency signal line and a high-frequency signal line, the low-frequency signal line is used for transmission of low-frequency signals, and the high-frequency signal line is used for transmission of high-frequency signals.

[0072] A signal pin area 320 is formed on the surface of the circuit board 300. The signal pin area 320 includes pads for transmitting low-frequency signals and high-frequency signals. The signal pin area 320 is connected to the second pad area 432 by wire bonding, thereby realizing the transmission of low-frequency signals and high-frequency signals between the circuit board and the electrical connector 430. When the surfaces of the signal pin area 320 and the second pad area 432 are flush, the wire bonding time between the two is short, and the transmission quality of the high-frequency signal is better at this time.

[0073] In order to provide a certain supporting force for the metal bond between the launch housing 410a and the electrical connector 430, the pad 420 has a first supporting portion 421, a second supporting portion 422 and a third supporting portion 423. For example, the first supporting portion 421, the second supporting portion 422 and the third supporting portion 423 are an integrated structure.

[0074] The thickness of the electrical connector 430 is greater than the thickness of the circuit board 300. In order to shorten the length of the metal wire between the electrical connector 430 and the signal pin area 320, a second support portion 422 is provided between the signal pin area 320 and the lower housing. The second support portion 422 raises the height of the signal pin area 320 so that the upper surface of the electrical connector 430 is flush with the upper surface of the signal pin area 320. In some embodiments, the upper surface of the electrical connector 430 is flush with the upper surface of the signal pin area 320 means that the height difference between the upper surface of the electrical connector 430 and the upper surface of the signal pin area 320 is less than 0.2 mm.

[0075] Fig.10 Schematic diagram of the structure of the pad provided according to some embodiments of the present disclosure. Fig.10 As shown, the upper surfaces of the second support portion 422 and the third support portion 423 are connected to the circuit board for supporting the circuit board. The upper surface of the second support portion 422 protrudes from the upper surface of the first support portion 421, and the second support portion 422 is located below the signal pin area 320. The second support portion 422 supports the circuit board so that the signal pin area 320 and the second pad area 432 are located in the same plane.

[0076] The second support portion 422 is located on one side of the first support portion 421, and the third support portion 423 is located on a side adjacent to the second support portion 422. The light receiving component 500 is located within the projection range of the third support portion 423. The width of the circuit board 300 is narrow at the position where the first avoidance opening 310 is provided, which causes the circuit board to be easily deformed under force. The third support portion 423 is located on one side of the first avoidance opening 310, and the third support portion 423 strengthens the narrow plate area 330 of the circuit board. At the same time, the light receiving component is connected to the circuit board, the upper surface of the third support portion 423 is connected to the circuit board, and the lower surface of the pad 420 is connected to the lower shell, which increases the heat dissipation effect of the light receiving component and the light receiving component.

[0077] For example, the third support portion 423 has an avoidance groove 4231 , and the avoidance groove 4231 accommodates the electrical components on the circuit board.

[0078] In some embodiments of the present application, the second support portion 422 is located below the signal pin area 320 , and the hardness of the second support portion 422 is greater than the hardness of the circuit board, providing rigid support for the metal of the signal pin area 320 and the second pad area 432 .

[0079] Fig.11 A partial cross-sectional view of a light emitting component and a circuit board provided according to some embodiments of the present disclosure Figure 1 . Fig.12 A partial cross-sectional view of a light emitting component and a circuit board provided according to some embodiments of the present disclosure Figure 2 .like Fig.11 and Fig.12 As shown from different angles, the upper surface of the second pad area 432 of the electrical connector 430 is higher than the upper surface of the second support portion 422, so that the signal pin area 320 and the second pad area 432 are located in the same plane. The signal pin area 320 and the second pad area 432 are connected by wire bonding, which is conducive to reducing impedance.

[0080] In some embodiments, the second support portion, the third support portion and the circuit board are glued and fixed. The first support portion and the shell bottom 4102 can be glued or welded.

[0081] In some embodiments, in order to reduce the length of the gold wire between the electrical connector 430 and the circuit board 300, the side wall of the electrical connector 430 is against the side wall of the second support portion 422. The lower surface of the electrical connector 430 is higher than the shell bottom 4102, and the second pad area 432 of the electrical connector 430 is located outside the launch shell. A first gap 424 is formed between the shell bottom 4102 and the second support portion 422. The first gap 424 receives the overflow solder or glue when the launch shell is welded to the first support portion 421, prevents the launch shell from tilting due to excessive solder or glue, and helps to improve the coupling efficiency. The second pad area 432 is located above the first gap 424, and the side wall of the electrical connector 430 is against the side wall of the second support portion 422. The side wall of the launch shell 410a is connected to the third support portion 423.

[0082] The third support part 423 is connected to the lower surface of the circuit board to provide support for the circuit board 300. At the same time, the light receiving component is connected to the circuit board, and the upper surface of the third support part 423 is connected to the circuit board. The lower surface of the pad 420 is connected to the lower housing, and the pad 420 is thermally connected to the light emitting component to increase the heat dissipation area and improve the heat dissipation effect of the light receiving component and the light emitting component.

[0083] Therefore, the present application provides an optical module, wherein the circuit board, the circuit board 300 is provided with a first avoidance opening 310, and the optical emitting component is located in the first avoidance opening. The optical emitting component and the optical receiving component are both located on the upper surface of the circuit board. The optical module also has a pad 420, the optical emitting component is located on the pad 420, and a part of the pad 420 is located below the circuit board corresponding to the optical receiving component. An electrical connector is provided at one end of the optical emitting component, the second pad area 432 of the electrical connector protrudes outside the transmitting shell, and the second pad area 432 is wired and connected to the signal pin area of ​​the circuit board to reduce impedance and improve signal transmission quality. The pad includes a first support portion, a second support portion and a third support portion, the shell bottom of the transmitting shell is welded to the first support portion, the second support portion is located below the signal pin area, and the third support portion is located below the circuit board below the optical receiving component. The upper surfaces of the second support portion and the third support portion are higher than the upper surface of the first support portion. The shell bottom of the transmitting shell is located between the pad and the electrical connector, and the electrical connector is in contact with one side of the second support portion.

[0084] There is a first gap 424 between the shell bottom and the second support part, which receives the overflow welding when the launch shell is welded to the first support part 421. There is a second gap 425 between the shell bottom and the third support part 423, which receives the overflow welding when the launch shell is welded to the first support part 421.

[0085] Fig.13 FIG. 1 is another exploded schematic diagram of a light emitting component according to some embodiments of the present disclosure. Fig.13As shown, the light emitting component includes a emitting housing 410b and an electrical connector 430. A first through hole 4103 is provided on one side wall of the emitting housing 410b, and an electrical connector 430 is provided on the side wall opposite to the first through hole 4103. A light emitting assembly is provided in the emitting housing 410b.

[0086] Exemplarily, the transmitting shell 410b is a transmitting tube shell, and an optical transmitting assembly is arranged inside, including: a laser array 411, a lens array 412, and an optical multiplexing assembly 413. The laser array 411 emits light of different wavelengths, and each light beam is sequentially processed by a converging lens in the lens array 412, and is converted from a divergent state to a convergent state, and then is combined by the optical multiplexing assembly 413 to combine the light of different wavelengths into one beam of light, which is converted into parallel light after being collimated by a collimating lens in the optical fiber adapter 700, and is emitted from the transmitting shell 410b in the form of parallel light.

[0087] In order to provide a certain support force for bonding between the launch housing 410b and the electrical connector 430, the pad 420 has a first support portion 421, a second support portion 422 and a third support portion 423. For example, the first support portion 421, the second support portion 422 and the third support portion 423 are an integrated structure.

[0088] The upper surfaces of the second support portion 422 and the third support portion 423 are connected to the circuit board for supporting the circuit board. The upper surface of the second support portion 422 protrudes from the upper surface of the first support portion 421, and the second support portion 422 is located below the signal pin area 320. The second support portion 422 supports the circuit board so that the signal pin area 320 and the second pad area 432 are located in the same plane.

[0089] The second support portion 422 is located on one side of the first support portion 421, and the third support portion 423 is located on a side adjacent to the second support portion 422. The light receiving component 500 is located within the projection range of the third support portion 423. The width of the circuit board 300 where the first avoidance opening 310 is provided is relatively narrow, which causes the circuit board to be easily deformed under force. The third support portion 423 is located on one side of the first avoidance opening 310, and the third support portion 423 strengthens the narrow plate area 330 of the circuit board. At the same time, the light receiving component is connected to the circuit board, the upper surface of the third support portion 423 is connected to the circuit board, and the lower surface of the gasket 420 is connected to the lower shell, which increases the heat dissipation effect of the light receiving component and the light emitting component.

[0090] For example, the pad 420 is provided with a groove 4221, and the groove 4221 is located at the connection between the second support portion and the third support portion. The groove 4221 can be used for installation and positioning, or the groove 4221 can be used to carry overflow glue or overflow solder.

[0091] For example, the groove 4221 is arc-shaped, and the groove 4221 is recessed toward the second support portion and the third support portion. The groove 4221 can also be other shapes, and the groove 4221 is a chamfered structure at the connection between the second support portion and the third support portion, which is convenient for preparation and molding.

[0092] Fig.14 FIG. 1 is a schematic diagram of the structure of another launch housing provided according to some embodiments of the present disclosure. Fig.14 As shown, a first through hole 4103 is provided on the transmitting housing 410 b , the first through hole 4103 is connected to the inner cavity of the transmitting housing 410 b , and the first through hole 4103 is connected to the optical fiber adapter 700 .

[0093] A first opening 4101 is disposed on the launch shell 410b, and the first through hole 4103 and the first opening 4101 are located on opposite sides of the launch shell.

[0094] In some embodiments, the bottom of the launch shell 410 b is an opening, which is referred to as the bottom opening 4104 for convenience, and the pad 420 is located below the launch shell 410 b. The bottom opening 4104 is connected to the first opening 4101.

[0095] The launch housing 410b includes a first side wall 4107 and a second side wall 4105 and a third side wall 4106 respectively located on both sides of the first side wall. The first through hole 4103 is located on the first side wall 4107 , and the first opening 4101 is located on the opposite side of the first side wall 4107 .

[0096] In some embodiments, the electrical connector 430 is located at the first opening 4101, and one side of the electrical connector 430 is inserted into the launch housing 410b, and the other side is exposed outside the launch housing 410b, so that the launch housing 410b and the electrical connector are assembled to form a light emission cavity. One end of the electrical connector 430 located inside the launch housing 410b is connected to the laser array 411 through a gold wire, and one end of the electrical connector 430 located outside the launch housing is connected to the circuit board through a gold wire, and the electrical signals, working signals, etc. generated by the circuit board 300 are transferred to the laser array 411 to drive each laser to emit laser beams of different wavelengths.

[0097] After the pad 420 is connected to the launch shell 410b, the first support portion 421 blocks the bottom opening 4104. The electrical connector 430 is located at the first opening 4101. The side walls of the electrical connector 430 are respectively connected to the second side wall 4105 and the third side wall 4106 of the launch shell 410b, and the bottom of the electrical connector 430 is connected to the first support portion 421.

[0098] Fig.15 A partial cross-sectional view of a light emitting component and a circuit board provided according to some embodiments of the present disclosure Figure 3 . Fig.16A partial cross-sectional view of a light emitting component and a circuit board provided according to some embodiments of the present disclosure Figure 4 .like Fig.15 and Fig.16 As shown from different angles, the upper surface of the second pad area 432 of the electrical connector 430 is higher than the upper surface of the second support portion 422, so that the signal pin area 320 and the second pad area 432 are located in the same plane. The signal pin area 320 and the second pad area 432 are connected by wire bonding, which is conducive to reducing impedance.

[0099] In some embodiments, in order to reduce the length of the gold wire between the electrical connector 430 and the circuit board 300, the side wall of the electrical connector 430 is close to the side wall of the second support portion 422. However, in order to prevent the overflow glue or overflow solder generated when the electrical connector is connected to the pad 420 from flowing out and to prevent the excess glue or solder from affecting the optical module, a third gap is provided between the side wall of the electrical connector 430 and the side wall of the second support portion 422. The third gap 425 receives the overflow solder when the electrical connector is welded to the first support portion 421, preventing the transmitting housing from tilting due to excessive solder, and helping to improve the coupling efficiency.

[0100] There is a second gap 425 between the third side wall 4106 and the third support part 423. The second gap 425 receives the overflow solder or glue when the launch housing is welded to the first support part 421, prevents the launch housing from tilting due to excessive solder, provides a platform for the optoelectronic device of the light emitting component, and helps to improve the coupling efficiency. The circuit board 300 abuts against the side wall 4106 of the launch housing 410b to achieve the positioning of the launch housing 410b.

[0101] The third support part 423 is connected to the lower surface of the circuit board to provide support for the circuit board 300. At the same time, the light receiving component is connected to the circuit board, and the upper surface of the third support part 423 is connected to the circuit board. The lower surface of the pad 420 is connected to the lower housing, and the pad 420 is thermally connected to the light emitting component to increase the heat dissipation area and improve the heat dissipation effect of the light receiving component and the light emitting component.

[0102] Therefore, the present application provides an optical module, wherein the circuit board, the circuit board 300 is provided with a first avoidance opening 310, and the optical emitting component is located in the first avoidance opening. The optical emitting component and the optical receiving component are both located on the upper surface of the circuit board. The optical module also has a pad 420, the optical emitting component is located on the pad 420, and a part of the pad 420 is located below the circuit board corresponding to the optical receiving component. An electrical connector is provided at one end of the optical emitting component, the second pad area 432 of the electrical connector protrudes outside the transmitting shell, and the second pad area 432 is wired and connected to the signal pin area of ​​the circuit board to reduce impedance and improve signal transmission quality. The pad includes a first support part, a second support part and a third support part, the shell bottom of the transmitting shell is welded to the first support part, the second support part is located below the signal pin area, and the third support part is located below the circuit board below the optical receiving component. The upper surfaces of the second support part and the third support part are higher than the upper surface of the first support part. A pad is provided at the bottom opening of the transmitting shell, and a third gap is provided on one side of the electrical connector and the second support part. There is a second gap 425 between the side wall of the launch shell and the third support part, and the second gap 425 receives the overflow welding when the launch shell is welded to the first support part 421. There is a second gap 425 between the shell bottom and the third support part 423, and the second gap 425 receives the overflow welding when the launch shell is welded to the first support part 421.

[0103] Since the above embodiments are all described by citing and combining with other embodiments, different embodiments have the same parts, and the same and similar parts between the embodiments in this specification can be referred to each other. No further detailed description is given here.

[0104] It should be noted that, in this specification, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a circuit structure, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such circuit structure, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the circuit structure, article or device including the element.

[0105] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the disclosure of the present application. The present application is intended to cover any variation, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the content of the claims.

[0106] The above-described embodiments of the present application do not constitute a limitation on the protection scope of the present application.

Claims

1. An optical module, characterized in that: include: A circuit board having a first avoidance opening, wherein the circuit board is provided with a signal pin area; A light emitting component is located at the first avoidance, an electrical connector is provided at one end of the light emitting component, and the electrical connector has a second pad area; the second pad area is connected to the signal pin area through a metal key; The thickness of the electrical connector is greater than the thickness of the circuit board; A light receiving component, located in the narrow plate area; A pad, comprising: a first supporting portion and a second supporting portion, wherein an upper surface of the second supporting portion is higher than an upper surface of the first supporting portion; The light emitting component is located above the first supporting portion; and the second supporting portion supports the signal pin region so that the signal pin region is flush with the second pad region.

2. The optical module according to claim 1, characterized in that: The light emitting component has a first through hole, the first through hole is on the opposite side of the electrical connector, and the optical fiber adapter is located in the first through hole.

3. The optical module according to claim 1 or 2, characterized in that: The side wall of the electrical connector abuts against the side wall of the second supporting portion; the lower surface of the light emitting component is lower than the lower surface of the electrical connector, and a first gap is provided between the second pad area, the shell bottom and the second supporting portion; The light emitting component abuts against a side wall of the third supporting portion.

4. The optical module according to claim 1, characterized in that: The circuit board has a narrow board area, and the first avoidance opening and the narrow board area are located side by side in the width direction of the circuit board; The pad further comprises a third support portion, wherein the third support portion is located below the narrow plate area, and an upper surface of the third support portion is higher than an upper surface of the first support portion.

5. The optical module according to claim 1, characterized in that: The light emitting component comprises: a laser array, a lens array and an optical multiplexing component; The lens array is located between the laser array and the optical multiplexing assembly; The laser array is electrically connected to the electrical connector.

6. The optical module according to claim 4, characterized in that: The electrical connector has a first pad area, which is electrically connected to the laser array; the second pad area includes a low-frequency signal line and a high-frequency signal line, the low-frequency signal line is used for transmitting low-frequency signals, and the high-frequency signal line is used for transmitting high-frequency signals.

7. The optical module according to claim 1, characterized in that: The light emitting member is welded to the first supporting portion.

8. The optical module according to claim 1, characterized in that: The pad is provided with a groove, and the groove is located at the connection between the second supporting part and the third supporting part.

9. The optical module according to claim 1, characterized in that: Also includes: Upper shell; Lower housing; The circuit board is located between the upper housing and the lower housing; The light receiving component is located between the narrow plate area and the upper housing; The upper surface of the third supporting portion is connected to the narrow plate area, and the lower surface of the pad is thermally connected to the lower shell.

10. The optical module according to claim 1, characterized in that: The width of the narrow board area is less than or equal to 1 / 3 of the width of the circuit board.

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