Electronic equipment, display module, supporting piece and preparation method of supporting piece

Abstract

The invention provides electronic equipment, a display module, a supporting piece and a preparation method of the supporting piece. The supporting piece comprises a first fixing part, a first connecting part, a first bending part and a second fixing part, and the first bending part is provided with at least one groove and / or through hole; the first fixing part is made of a first metal material, the first bending part is made of a second metal material, the first connecting part comprises the first metal material and the second metal material, the hardness of the second metal material is larger than that of the first metal material, and the density of the first metal material is smaller than that of the second metal material; the second fixing part is made of a third metal material, the hardness of the second metal material is larger than or equal to that of the third metal material, and the density of the third metal material is smaller than or equal to that of the second metal material. The supporting piece is of a composite structure of the first fixing part and the first bending part, the material hardness of the first bending part is large, the material hardness of the first fixing part is small, the density of the first fixing part is small, and high reliability and light weight of the supporting piece can be achieved.

Description

Technical Field

[0001] The present application relates to the technical field of foldable electronic products, and in particular to an electronic device, a display module, a support member and a method for preparing the same. Background Art

[0002] In foldable electronic products, a support member is usually provided at the bottom of the display panel to support the display panel. In addition, the bendability of the bend zone of the support member is enhanced by providing through holes and / or grooves in the bend zone of the support member. However, since the bend zone of the support member is provided with through holes or grooves, the hardness of the bend zone of the traditional support member is relatively low, and thus when the electronic device is in the unfolded state, it is difficult for the bend zone of the support member to provide good rigid support for the display panel. In order to ensure that the bend zone of the support member has a high hardness, if the traditional support member adopts some materials with higher hardness (such as stainless steel or aluminum alloy), the density of the non-bending zone of the support member is relatively high and the mass is heavier. Therefore, the traditional support member cannot ensure good bendability while taking into account high hardness and light weight. Summary of the invention

[0003] The present application provides a support member, a display module, an electronic device and a method for preparing the support member, which can achieve both high hardness and light weight while ensuring better bendability.

[0004] In a first aspect, an embodiment of the present application provides a support member. The support member is applied to a flexible display module and is used to be fixedly connected to a non-display surface of a display panel of the display module. The support member includes a first fixing portion, a first connecting portion, a first bending portion, and a second fixing portion arranged in sequence, the first bending portion is provided with at least one groove and / or through hole, and the support member can be bent at the first bending portion;

[0005] The first fixing portion is made of a first metal material, the first bending portion is made of a second metal material, the first connecting portion includes the first metal material and the second metal material, the hardness of the second metal material is greater than the hardness of the first metal material, and the density of the first metal material is less than the density of the second metal material;

[0006] The second fixing portion is made of a third metal material, the hardness of the second metal material is greater than or equal to the hardness of the third metal material, and the density of the third metal material is less than or equal to the density of the second metal material.

[0007] It can be understood that since the first fixing portion adopts the first metal material, the first bending portion adopts the second metal material, the first connecting portion includes the first metal material and the second metal material, and the first connecting portion is connected between the first fixing portion and the first bending portion, the first connecting portion can enhance the interface bonding strength between the first fixing portion and the first bending portion, so that the connection strength between the first fixing portion and the first bending portion is high, and the overall structure of the integrated structural component formed by the first fixing portion, the first connecting portion and the first bending portion is stable and reliable.

[0008] It is understandable that by providing at least one groove and / or through hole in the first bending portion, the support member can be bent at the first bending portion, thereby ensuring that the support member has better bendability. In addition, by setting the hardness of the second metal material to be greater than the hardness of the first metal material, the hardness of the second metal material is greater than or equal to the hardness of the third metal material, thereby ensuring that the support member can also have a certain hardness to provide rigid support to the display panel, thereby improving the support strength of the display panel.

[0009] It can be understood that by setting the density of the first metal material to be smaller than the density of the second metal material, and the density of the third metal material to be smaller than or equal to the density of the second metal material, the overall density of the support member is lower, that is, the mass is smaller, which is beneficial to the lightweight of the support member.

[0010] In this embodiment, the support member adopts a composite structure of a first fixed portion and a first bent portion. The material hardness of the first bent portion is relatively large, while the material hardness and density of the first fixed portion are relatively small, which is beneficial for the support member to achieve high reliability and lightweight, and also beneficial for the support member to obtain lower processing costs and higher production yields.

[0011] In a possible implementation, the support member includes a second connecting portion, and the second connecting portion connects the first bending portion and the second fixing portion;

[0012] The second connecting portion includes the second metal material and the third metal material. The hardness of the second metal material is greater than that of the second metal material. The density of the third metal material is less than that of the second metal material.

[0013] It can be understood that since the second fixing portion adopts the third metal material, the first bending portion adopts the second metal material, the second connecting portion includes the third metal material and the second metal material, and the second connecting portion is connected between the second fixing portion and the first bending portion, the second connecting portion can enhance the interface bonding strength between the second fixing portion and the first bending portion, so that the connection strength between the second fixing portion and the first bending portion is high, and the overall structure of the integrated structural component formed by the second fixing portion, the second connecting portion and the first bending portion is stable and reliable.

[0014] In a possible implementation, the thermal conductivity of the first metal material is greater than the thermal conductivity of the second metal material; and / or the thermal conductivity of the third metal material is greater than the thermal conductivity of the second metal material; and / or the elastic modulus of the second metal material is greater than the elastic modulus of the first metal material; and / or the elastic modulus of the second metal material is greater than the elastic modulus of the third metal material.

[0015] It is understandable that when the first fixing portion of the support member adopts a first metal material with a large thermal conductivity, the first fixing portion has a high thermal conductivity, which is beneficial to improving the heat dissipation performance of the support member. When the second fixing portion of the support member adopts a third metal material with a large thermal conductivity, the second fixing portion has a high thermal conductivity, which is beneficial to improving the heat dissipation performance of the support member. When the elastic modulus of the second metal material is greater than the elastic modulus of the first metal material, the second metal material has a stronger ability to resist elastic deformation. When the elastic modulus of the second metal material is greater than the elastic modulus of the third metal material, the second metal material has a stronger ability to resist elastic deformation.

[0016] In one possible implementation, the first metal material is a particle-reinforced aluminum-based composite material or a particle-reinforced magnesium-based composite material; and / or, the second metal material is stainless steel or a titanium alloy; and / or; and / or, the third metal material is a particle-reinforced aluminum-based composite material or a particle-reinforced magnesium-based composite material.

[0017] In a possible implementation, the first metal material and the third metal material are the same material. In this way, the first fixing portion, the first connecting portion, the first bending portion, the second connecting portion and the second fixing portion can be formed by a single sintering process, that is, the forming process of the support member is relatively small.

[0018] In a possible implementation, the support member includes a first embedded portion, which is embedded in the first fixed portion; the first embedded portion is made of a fourth metal material, the hardness of the fourth metal material is greater than the hardness of the first metal material; and / or the thermal conductivity of the fourth metal material is greater than the thermal conductivity of the first metal material.

[0019] It can be understood that by embedding the first embedded part in the first fixed part, and when the hardness of the fourth metal material used in the first embedded part is greater than the hardness of the first metal material, it is beneficial to improve the local hardness of the first fixed part, so that when the support is applied to an electronic device, the first embedded part can effectively resist the extrusion of internal components of the electronic device, thereby significantly improving reliability.

[0020] It can be understood that by embedding the first embedded part in the first fixed part, and when the thermal conductivity of the fourth metal material is greater than the thermal conductivity of the first metal material, it is beneficial to improve the local thermal conductivity of the first fixed part, so that when the support is applied to an electronic device, the first embedded part can quickly transfer the heat generated by the internal components of the electronic device to the outside of the electronic device.

[0021] In a possible implementation, the support member includes a first sub-connection portion, which connects the first embedded portion and the first fixing portion; and the first sub-connection portion includes the first metal material and the fourth metal material.

[0022] It can be understood that since the first fixing part adopts the first metal material, the first embedded part adopts the fourth metal material, the first sub-connecting part includes the first metal material and the fourth metal material, and the first sub-connecting part is connected between the first fixing part and the first embedded part, the first sub-connecting part can enhance the interface bonding strength between the first fixing part and the first embedded part, so that the connection strength between the first fixing part and the first embedded part is high, and the overall structure of the integrated structural part formed by the first fixing part, the first sub-connecting part and the first embedded part is stable and reliable.

[0023] In a possible implementation, the first metal material is a particle-reinforced aluminum-based composite material or a particle-reinforced magnesium-based composite material; and / or the fourth metal material is stainless steel or a titanium alloy.

[0024] In a possible implementation manner, the fourth metal material and the first metal material include the same chemical components, and the mass fraction of each chemical component of the fourth metal material is different from the mass fraction of each chemical component of the first metal material.

[0025] In a possible implementation manner, in a first direction, a thickness H1 of the first connecting portion satisfies: 0.1 μm≤H1≤30 μm, and the first direction is a direction from the first fixing portion to the second fixing portion.

[0026] In a possible implementation, the content of the main group elements of the first metal material in the first connecting portion decreases in the first direction, and the content of the main group elements of the second metal material increases in the first direction, and the first direction is the direction from the first fixing portion to the second fixing portion.

[0027] In a possible implementation, a first interface is formed between the first fixing portion and the first connecting portion, and a second interface is formed between the first bending portion and the first connecting portion. The first interface and the second interface are visible in the metallographic structure of the support member.

[0028] In a possible implementation, the first fixing portion, the first connecting portion and the first bending portion are formed by an insert powder metallurgy process;

[0029] The first fixing portion is formed by sintering powder of the first metal material, the first bending portion is formed by an insert of the second metal material, and the first connecting portion is formed by mutual diffusion of the first metal material and the second metal material.

[0030] It can be understood that in this embodiment, since the first fixed part, the first connecting part and the first bending part of the support member are integrally formed structural parts formed by the insert powder metallurgy process, based on the metal interdiffusion effect during the sintering process, an interdiffusion layer with a composition gradient can be formed between the first bending part formed by the insert and the first fixed part formed by the powder, that is, a first connecting part where the second metal material and the first metal material diffuse with each other is formed. At this time, the formation of the first connecting part significantly improves the interface bonding strength between the first fixed part and the first bending part, so that the connection strength between the first fixed part and the first bending part is high, and the overall structure of the first fixed part, the first connecting part and the first bending part is stable and reliable.

[0031] In a possible implementation, the thickness of the support member is in a range from 0.05 mm to 0.4 mm.

[0032] In a possible implementation, the first bending portion includes a first sub-bending portion, a main bending portion, and a second sub-bending portion, and the main bending portion connects the first sub-bending portion and the second sub-bending portion;

[0033] The stiffness of the first sub-bending portion and the second sub-bending portion are both greater than the stiffness of the main bending portion, and the main bending portion is provided with at least one groove and / or through hole.

[0034] In a possible implementation, the support member further includes a second bending portion and a third fixing portion, the second bending portion connects the second fixing portion and the third fixing portion, the second bending portion is provided with at least one groove and / or through hole, and the support member can be bent at the second bending portion;

[0035] The second bending portion is made of a fifth metal material, and the third fixing portion is made of a sixth metal material. The hardness of the fifth metal material is greater than the hardness of the third metal material and the hardness of the sixth metal material. The density of the third metal material and the density of the sixth metal material are both less than the density of the fifth metal material.

[0036] It is understandable that by providing at least one groove and / or through hole in the second bending portion, the support member can be bent at the second bending portion, thereby ensuring that the support member has better bendability. Therefore, the support member of this embodiment can be bent at the first bending portion or at the second bending portion. The support member of this implementation can be applied to the display module of a multi-fold electronic device. The application of the support member is relatively wide, and it can effectively solve the problem that the support member in a multi-fold electronic device cannot ensure good bendability while taking into account high hardness and light weight.

[0037] In addition, by setting the hardness of the fifth metal material to be greater than the hardness of the third metal material and the hardness of the sixth metal material, it is ensured that the support member can also have a certain hardness to provide rigid support to the display panel, thereby improving the support strength of the display panel.

[0038] It can be understood that by setting the density of the third metal material and the density of the sixth metal material to be smaller than the density of the fifth metal material, the overall density of the support member is lower, that is, the mass is smaller, which is conducive to lightweighting of the support member.

[0039] In a possible implementation, the support member further includes a third connecting portion, the third connecting portion connects the second fixing portion and the second bending portion, and the third connecting portion includes the third metal material and the fifth metal material;

[0040] It can be understood that since the second fixing portion adopts the third metal material, the second bending portion adopts the fifth metal material, the third connecting portion includes the third metal material and the fifth metal material, and the third connecting portion connects the second fixing portion and the second bending portion, the third connecting portion can enhance the interface bonding strength between the second fixing portion and the second bending portion, so that the connection strength between the second fixing portion and the second bending portion is high, and the overall structure of the integrated structural component formed by the second fixing portion, the third connecting portion and the second bending portion is stable and reliable.

[0041] In a possible implementation, the support member further includes a fourth connecting portion, the fourth connecting portion is connected between the third fixing portion and the second bending portion, and the fourth connecting portion includes the fifth metal material and the sixth metal material.

[0042] It can be understood that since the third fixing portion adopts the sixth metal material, the second bending portion adopts the fifth metal material, the fourth connecting portion includes the sixth metal material and the fifth metal material, and the fourth connecting portion is connected to the third fixing portion and the second bending portion, the fourth connecting portion can enhance the interface bonding strength between the third fixing portion and the second bending portion, so that the connection strength between the third fixing portion and the second bending portion is high, and the overall structure of the integrated structural component formed by the third fixing portion, the fourth connecting portion and the second bending portion is stable and reliable.

[0043] In a second aspect, the present application provides a display module. The display module is a flexible screen, and the display module includes a display panel and a support member as described in any one of the above items, and the support member is fixed to the non-display surface of the display panel. The display module can ensure good bendability while taking into account high hardness and light weight.

[0044] In a third aspect, the present application provides an electronic device. The electronic device includes a housing device and a display module as shown above, wherein the display module is mounted on the housing device, and the housing device is used to drive the display module to be relatively unfolded or folded. The electronic device can ensure high hardness and light weight while ensuring better bendability.

[0045] In a fourth aspect, the present application provides an electronic device. A first housing, a second housing, a first folding mechanism, and a display module, wherein the first folding mechanism connects the first housing and the second housing, and the first folding mechanism is used to make the first housing and the second housing relatively unfold or fold;

[0046] The display module includes a display panel and a support member, wherein the support member is fixed to the non-display surface of the display panel;

[0047] The support member comprises a first fixing portion, a first connecting portion, a first bending portion and a second fixing portion arranged in sequence along a first direction, the first bending portion is provided with at least one groove and / or through hole, and the support member can be bent at the first bending portion, wherein the first direction is the direction in which the first shell points to the second shell when the electronic device is in an unfolded state;

[0048] The first fixing portion is made of a first metal material, the first bending portion is made of a second metal material, the first connecting portion includes the first metal material and the second metal material, the hardness of the second metal material is greater than the hardness of the first metal material, and the density of the first metal material is less than the density of the second metal material;

[0049] The second fixing portion is made of a third metal material, the hardness of the second metal material is greater than or equal to the hardness of the second metal material, and the density of the third metal material is less than or equal to the density of the second metal material;

[0050] The display panel comprises a first display area, a second display area and a third display area arranged along the first direction, the first surface of the first fixing portion is fixedly connected to the first display area, the first surface of the first bending portion is fixedly connected to the second display area, and the first surface of the second fixing portion is fixedly connected to the third display area;

[0051] The second surface of the first fixing portion is fixedly connected to the first shell, and the second surface of the second fixing portion is fixedly connected to the second shell, wherein the first surface of the first fixing portion and the second surface of the first fixing portion are opposite to each other, and the first surface of the second fixing portion and the second surface of the second fixing portion are opposite to each other.

[0052] It can be understood that since the first fixing portion adopts the first metal material, the first bending portion adopts the second metal material, the first connecting portion includes the first metal material and the second metal material, and the first connecting portion is connected between the first fixing portion and the first bending portion, the first connecting portion can enhance the interface bonding strength between the first fixing portion and the first bending portion, so that the connection strength between the first fixing portion and the first bending portion is high, and the overall structure of the integrated structural component formed by the first fixing portion, the first connecting portion and the first bending portion is stable and reliable.

[0053] It is understandable that by providing at least one groove and / or through hole in the first bending portion, the support member can be bent at the first bending portion, thereby ensuring that the support member has better bendability. In addition, by setting the hardness of the second metal material to be greater than the hardness of the first metal material, the hardness of the second metal material is greater than or equal to the hardness of the third metal material, thereby ensuring that the support member can also have a certain hardness to provide rigid support to the display panel, thereby improving the support strength of the display panel.

[0054] It can be understood that by setting the density of the first metal material to be smaller than the density of the second metal material, and the density of the third metal material to be smaller than or equal to the density of the second metal material, the overall density of the support member is lower, that is, the mass is smaller, which is beneficial to the lightweight of the support member.

[0055] In this embodiment, the support member adopts a composite structure of a first fixed portion and a first bent portion. The material hardness of the first bent portion is relatively large, while the material hardness and density of the first fixed portion are relatively small, which is beneficial for the support member to achieve high reliability and lightweight, and also beneficial for the support member to obtain lower processing costs and higher production yields.

[0056] In a possible implementation, the support member includes a second connecting portion, which connects the first bending portion and the second fixing portion; the second connecting portion includes the second metal material and the third metal material, the hardness of the second metal material is greater than the hardness of the second metal material, and the density of the third metal material is less than the density of the second metal material.

[0057] It can be understood that since the second fixing portion adopts the third metal material, the first bending portion adopts the second metal material, the second connecting portion includes the third metal material and the second metal material, and the second connecting portion is connected between the second fixing portion and the first bending portion, the second connecting portion can enhance the interface bonding strength between the second fixing portion and the first bending portion, so that the connection strength between the second fixing portion and the first bending portion is high, and the overall structure of the integrated structural component formed by the second fixing portion, the second connecting portion and the first bending portion is stable and reliable.

[0058] In a possible implementation, the thermal conductivity of the first metal material is greater than the thermal conductivity of the second metal material; and / or the thermal conductivity of the third metal material is greater than the thermal conductivity of the second metal material; and / or the elastic modulus of the second metal material is greater than the elastic modulus of the first metal material; and / or the elastic modulus of the second metal material is greater than the elastic modulus of the third metal material.

[0059] It is understandable that when the first fixing portion of the support member adopts a first metal material with a large thermal conductivity, the first fixing portion has a high thermal conductivity, which is beneficial to improving the heat dissipation performance of the support member. When the second fixing portion of the support member adopts a third metal material with a large thermal conductivity, the second fixing portion has a high thermal conductivity, which is beneficial to improving the heat dissipation performance of the support member. When the elastic modulus of the second metal material is greater than the elastic modulus of the first metal material, the second metal material has a stronger ability to resist elastic deformation. When the elastic modulus of the second metal material is greater than the elastic modulus of the third metal material, the second metal material has a stronger ability to resist elastic deformation.

[0060] In one possible implementation, the first metal material is a particle-reinforced aluminum-based composite material or a particle-reinforced magnesium-based composite material; and / or, the second metal material is stainless steel or a titanium alloy; and / or; and / or, the third metal material is a particle-reinforced aluminum-based composite material or a particle-reinforced magnesium-based composite material.

[0061] In a possible implementation, the first metal material and the third metal material are the same material. In this way, the first fixing portion, the first connecting portion, the first bending portion, the second connecting portion and the second fixing portion can be formed by a single sintering process, that is, the forming process of the support member is relatively small.

[0062] In a possible implementation, the support member includes a first embedded portion, which is embedded in the first fixed portion; the first embedded portion is made of a fourth metal material, the hardness of the fourth metal material is greater than the hardness of the first metal material; and / or the thermal conductivity of the fourth metal material is greater than the thermal conductivity of the first metal material.

[0063] It can be understood that by embedding the first embedded part in the first fixed part, and when the hardness of the fourth metal material used in the first embedded part is greater than the hardness of the first metal material, it is beneficial to improve the local hardness of the first fixed part, so that when the support is applied to an electronic device, the first embedded part can effectively resist the extrusion of internal components of the electronic device, thereby significantly improving reliability.

[0064] It can be understood that by embedding the first embedded part in the first fixed part, and when the thermal conductivity of the fourth metal material is greater than the thermal conductivity of the first metal material, it is beneficial to improve the local thermal conductivity of the first fixed part, so that when the support is applied to an electronic device, the first embedded part can quickly transfer the heat generated by the internal components of the electronic device to the outside of the electronic device.

[0065] In a possible implementation, the support member includes a first sub-connection portion, which connects the first embedded portion and the first fixing portion; and the first sub-connection portion includes the first metal material and the fourth metal material.

[0066] It can be understood that since the first fixing part adopts the first metal material, the first embedded part adopts the fourth metal material, the first sub-connecting part includes the first metal material and the fourth metal material, and the first sub-connecting part is connected between the first fixing part and the first embedded part, the first sub-connecting part can enhance the interface bonding strength between the first fixing part and the first embedded part, so that the connection strength between the first fixing part and the first embedded part is high, and the overall structure of the integrated structural part formed by the first fixing part, the first sub-connecting part and the first embedded part is stable and reliable.

[0067] In a possible implementation, the first metal material is a particle-reinforced aluminum-based composite material or a particle-reinforced magnesium-based composite material; and / or the fourth metal material is stainless steel or a titanium alloy.

[0068] In a possible implementation manner, the fourth metal material and the first metal material include the same chemical components, and the mass fraction of each chemical component of the fourth metal material is different from the mass fraction of each chemical component of the first metal material.

[0069] In a possible implementation manner, a thickness H1 of the first connection portion in the first direction satisfies: 0.1 μm≤H1≤30 μm.

[0070] In a possible implementation, the content of the main group elements of the first metal material in the first connecting portion decreases in the first direction, and the content of the main group elements of the second metal material increases in the first direction, and the first direction is the direction from the first fixing portion to the second fixing portion.

[0071] In a possible implementation, a first interface is formed between the first fixing portion and the first connecting portion, and a second interface is formed between the first bending portion and the first connecting portion. The first interface and the second interface are visible in the metallographic structure of the support member.

[0072] In a possible implementation, the first fixing portion, the first connecting portion and the first bending portion are formed by an insert powder metallurgy process;

[0073] The first fixing portion is formed by sintering powder of a first metal material, the first bending portion is formed by an insert of a second metal material, and the first connecting portion is formed by mutual diffusion of the first metal material and the second metal material.

[0074] It can be understood that since the first fixed part, the first connecting part and the first bending part of the support member are integrally formed structural parts formed by the insert powder metallurgy process, based on the metal interdiffusion effect during the sintering process, an interdiffusion layer with a composition gradient can be formed between the first bending part formed by the insert and the first fixed part formed by the powder, that is, a first connecting part where the second metal material and the first metal material diffuse with each other is formed. At this time, the formation of the first connecting part significantly improves the interface bonding strength between the first fixed part and the first bending part, so that the connection strength between the first fixed part and the first bending part is high, and the overall structure of the first fixed part, the first connecting part and the first bending part is stable and reliable.

[0075] In a possible implementation, the thickness of the support member is in a range from 0.05 mm to 0.4 mm.

[0076] In a possible implementation, the first bending portion includes a first sub-bending portion, a main bending portion, and a second sub-bending portion, and the main bending portion connects the first sub-bending portion and the second sub-bending portion;

[0077] The stiffness of the first sub-bending portion and the second sub-bending portion are both greater than the stiffness of the main bending portion, and the main bending portion is provided with at least one groove and / or through hole.

[0078] In a possible implementation, the electronic device includes a third housing and a second folding mechanism, the second folding mechanism connects the second housing and the third housing, and the second folding mechanism is used to make the second housing and the third housing relatively unfold or fold;

[0079] The support member further comprises a second bending portion and a third fixing portion, the second bending portion connects the second fixing portion and the third fixing portion, the second bending portion is provided with at least one groove and / or through hole, and the support member can be bent at the second bending portion;

[0080] The second bending portion is made of a fifth metal material, the third fixing portion is made of a sixth metal material, the hardness of the fifth metal material is greater than the hardness of the third metal material and the hardness of the sixth metal material, the density of the third metal material is less than the density of the fifth metal material, and the density of the sixth metal material is less than the density of the fifth metal material;

[0081] The display panel further includes a fourth display area and a fifth display area, the fourth display area connects the third display area and the fifth display area, the first surface of the second bent portion is fixedly connected to the fourth display area, and the first surface of the third fixing portion is fixedly connected to the fifth display area;

[0082] The second surface of the third fixing portion is fixedly connected to the third shell, and the first surface of the third fixing portion and the second surface of the third fixing portion are opposite to each other.

[0083] It is understandable that by providing at least one groove and / or through hole in the second bending portion, the support member can be bent at the second bending portion, thereby ensuring that the support member has better bendability. Therefore, the support member of this embodiment can be bent at the first bending portion or at the second bending portion. The support member of this implementation can be applied to the display module of a multi-fold electronic device. The application of the support member is relatively wide, and it can effectively solve the problem that the support member in a multi-fold electronic device cannot ensure good bendability while taking into account high hardness and light weight.

[0084] In addition, by setting the hardness of the fifth metal material to be greater than the hardness of the third metal material and the hardness of the sixth metal material, it is ensured that the support member can also have a certain hardness to provide rigid support to the display panel, thereby improving the support strength of the display panel.

[0085] It can be understood that by setting the density of the third metal material and the density of the sixth metal material to be smaller than the density of the fifth metal material, the overall density of the support member is lower, that is, the mass is smaller, which is conducive to lightweighting of the support member.

[0086] In a possible implementation, the support member further includes a third connecting portion, the third connecting portion connects the second fixing portion and the second bending portion, and the third connecting portion includes the third metal material and the fifth metal material.

[0087] It can be understood that since the second fixing portion adopts the third metal material, the second bending portion adopts the fifth metal material, the third connecting portion includes the third metal material and the fifth metal material, and the third connecting portion connects the second fixing portion and the second bending portion, the third connecting portion can enhance the interface bonding strength between the second fixing portion and the second bending portion, so that the connection strength between the second fixing portion and the second bending portion is high, and the overall structure of the integrated structural component formed by the second fixing portion, the third connecting portion and the second bending portion is stable and reliable.

[0088] In a possible implementation, the support member further includes a fourth connecting portion, the fourth connecting portion is connected between the third fixing portion and the second bending portion, and the fourth connecting portion includes the fifth metal material and the sixth metal material.

[0089] It can be understood that since the third fixing portion adopts the sixth metal material, the second bending portion adopts the fifth metal material, the fourth connecting portion includes the sixth metal material and the fifth metal material, and the fourth connecting portion is connected to the third fixing portion and the second bending portion, the fourth connecting portion can enhance the interface bonding strength between the third fixing portion and the second bending portion, so that the connection strength between the third fixing portion and the second bending portion is high, and the overall structure of the integrated structural component formed by the third fixing portion, the fourth connecting portion and the second bending portion is stable and reliable.

[0090] In a fifth aspect, the present application provides a method for preparing a support member. The method comprises:

[0091] preparing an insert, wherein the insert is made of a second metal material;

[0092] The insert is placed in a jig, and a first powder and a second powder are filled into the jig, wherein the first powder and the second powder are respectively located on both sides of the insert and are in contact with the insert to form a part to be sintered, wherein the first powder is made of a first metal material and the second powder is made of a third metal material;

[0093] Sintering the part to be sintered to form a sintered part;

[0094] The sintered part is processed to form a support part, wherein a portion of the insert is used to form a first bending portion of the support part, another portion of the insert and a portion of the first powder are used to jointly form a first connecting portion of the support part, a portion of the first powder is used to form a first fixing portion of the support part, a portion of the insert and a portion of the second powder are used to jointly form a second connecting portion of the support part, and another portion of the second powder is used to form a second fixing portion of the support part.

[0095] It can be understood that in this embodiment, since the first fixed part, the first connecting part, the first bending part, the second connecting part and the second fixed part of the support member are integrally formed structural parts formed by the insert powder metallurgy process, based on the metal interdiffusion effect during the sintering process, an interdiffusion layer with a composition gradient can be formed between the first bending part formed by the insert and the first fixed part formed by the powder, that is, a first connecting part in which the second metal material and the first metal material diffuse with each other is formed. At this time, the formation of the first connecting part significantly improves the interface bonding strength between the first fixed part and the first bending part, so that the connection strength between the first fixed part and the first bending part is high, and the overall structure of the first fixed part, the first connecting part and the first bending part is stable and reliable. In addition, an interdiffusion layer with a composition gradient can be formed between the first bending part formed by the insert and the second fixed part formed by the powder, that is, a second connecting part in which the second metal material and the third metal material diffuse with each other is formed. At this time, the formation of the second connecting part significantly improves the interface bonding strength between the second fixed part and the first bending part, so that the connection strength between the second fixed part and the first bending part is high, and the overall structure of the second fixed part, the first connecting part and the first bending part is stable and reliable.

[0096] In a possible implementation, during the sintering of the part to be sintered, the sintering pressure P1 satisfies: P1 ≥ 100 MPa, the sintering temperature T1 satisfies: 500° C. ≤ T1 ≤ 660° C., and the sintering time t1 satisfies: 2 h ≤ t1 ≤ 5 h. BRIEF DESCRIPTION OF THE DRAWINGS

[0097] In order to illustrate the technical solution of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be described below.

[0098] Figure 1 This is a structural schematic diagram of an implementation method of an electronic device provided in an embodiment of the present application in an unfolded state;

[0099] Figure 2 yes Figure 1 A schematic structural diagram of an implementation method of the electronic device shown in a closed state;

[0100] Figure 3 yes Figure 1A partially exploded view of one embodiment of the electronic device shown;

[0101] Figure 4 yes Figure 2 A partial cross-sectional view of an embodiment of the electronic device shown at line AA;

[0102] Figure 5 yes Figure 3 A partially exploded view of one embodiment of the display module shown;

[0103] Figure 6 yes Figure 2 A partially exploded view of one embodiment of the display module shown;

[0104] Figure 7 yes Figure 3 A partial cross-sectional view of an embodiment of the display module shown at line BB;

[0105] Figure 8 yes Figure 4 A schematic structural diagram of an implementation scheme of a display module is shown;

[0106] Fig. 9 yes Figure 5 An enlarged view of one embodiment of the support member shown at M1;

[0107] Fig.10 yes Figure 6 A partial enlarged view of an embodiment of the support member shown;

[0108] Fig.11 yes Figure 5 A schematic diagram of the contents of the main group elements of the first metal material and the second metal material at different positions of the first connecting portion of the support member;

[0109] Fig.12 yes Figure 5 Schematic diagram of metallographic structure of a partial structure of the support member in some possible implementations;

[0110] Fig.13 is a schematic flow chart of a method for preparing a support member provided in an embodiment of the present application;

[0111] Figures 14 to 17 yes Fig.13 Structural schematic diagram of some steps in the method for preparing a support member in some embodiments Figures 1 to 4 ;

[0112] Fig.18 yes Figure 5 The structural schematic diagram of the support member shown in another embodiment;

[0113] Fig.19and Fig. 20 yes Fig.13 Structural schematic diagram of some steps in the method for preparing a support member in some embodiments Figures 1 to 2 ;

[0114] Fig.21 yes Figure 5 The structural schematic diagram of the support member shown in yet another embodiment;

[0115] Figure 22 to Figure 24 yes Fig.13 Structural schematic diagram of some steps in the method for preparing a support member in some embodiments Figures 1 to 2 ;

[0116] Fig.25 is a schematic diagram of the structure of an electronic device provided by an embodiment of the present application in an unfolded state;

[0117] Fig.26 yes Fig.25 A schematic structural diagram of an implementation of the electronic device shown in the first folding state;

[0118] Fig. 27 yes Fig.25 A schematic structural diagram of an implementation of the electronic device shown in the second folding state;

[0119] Fig.28 yes Fig.25 A partially exploded view of one embodiment of the electronic device shown;

[0120] Fig.29 yes Fig. 27 A partial cross-sectional view of an embodiment of the electronic device shown at line BB;

[0121] Fig.30 yes Fig.28 An exploded view of an embodiment of the display module shown;

[0122] Fig.31 yes Fig.30 The structure diagram of the display module shown is in a first folding state;

[0123] Fig.32 yes Fig.30 The structure diagram of the display module shown is in the second folding state. DETAILED DESCRIPTION

[0124] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense, for example, "connection" can be detachably connected or non-detachably connected; it can be directly connected or indirectly connected through an intermediate medium. Among them, "fixed connection" can be connected to each other and the relative position relationship after connection remains unchanged. "Rotational connection" can be connected to each other and can rotate relatively after connection. "Sliding connection" can be connected to each other and can slide relatively after connection. The orientation terms mentioned in the embodiments of the present application, such as "upper", "lower", "inner", "outer", etc., are only reference directions of the accompanying drawings. Therefore, the orientation terms used are for better and clearer explanation and understanding of the embodiments of the present application, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application. In the following, the terms "first", "second", etc. are used only for descriptive purposes, and cannot be understood as implying or suggesting relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" can explicitly or implicitly include one or more of the features. In addition, multiple refers to at least two. In the embodiments of the present application, "and / or" is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the front and back associated objects are in an "or" relationship. In addition, two components are obtained by an integrated structure through an integrated molding process, which means that in the process of forming one of the two components, the component is connected to the other component, and there is no need to connect the two components together through reprocessing (such as bonding, welding, snap connection, screw connection).

[0125] In addition, in the embodiments of the present application, the mathematical concepts mentioned are parallel, perpendicular, etc. These limitations are all for the current state of the art, rather than being absolutely strict definitions in a mathematical sense, and a small amount of deviation is allowed, and it is possible to be approximately parallel, approximately perpendicular, etc. For example, A and B are parallel, which means that A and B are parallel or approximately parallel, and the angle between A and B can be between 0 and 10 degrees. For example, A and B are perpendicular, which means that A and B are perpendicular or approximately perpendicular, and the angle between A and B can be between 80 and 100 degrees.

[0126] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application.

[0127] Figure 1 It is a structural diagram of an implementation method of the electronic device 1000 provided in an embodiment of the present application in an unfolded state. Figure 2 yes Figure 1The structure diagram of an implementation example of an electronic device 1000 in a closed state is shown.

[0128] like Figure 1 and Figure 2 As shown, the present application provides a foldable electronic device 1000. The electronic device 1000 may be a foldable device such as a mobile phone, a tablet computer, a personal computer, a notebook computer, a vehicle-mounted device, or a wearable device. Figure 1 and Figure 2 The electronic device 1000 of the embodiment shown is described by taking a mobile phone as an example. It is understandable that the number of times the electronic device 1000 can be folded is not limited to Figure 1 and Figure 2 The electronic device 1000 is not limited to Figure 1 and Figure 2 The electronic device 1000 is folded twice. In other embodiments, the electronic device 1000 can be folded more than once, that is, the electronic device 1000 can be folded more than twice.

[0129] For ease of description, illustratively, the thickness direction of the electronic device 1000 is defined as the Z-axis direction, and the extension direction of the rotation axis of the electronic device 1000 is the Y-axis direction, that is, the width direction of the electronic device 1000 is the Y-axis direction. The direction perpendicular to the Y-axis direction and the Z-axis direction is the X-axis direction, that is, the length direction of the electronic device 1000 is the X-axis. It is understood that the coordinate system of the electronic device 1000 can also be flexibly set according to specific needs. Exemplarily, the X-axis direction is defined as the first direction, and the Y-axis direction is defined as the second direction. In other embodiments, the first direction and the second direction can also be flexibly set according to needs, ensuring that the first direction and the second direction are different. It is understood that in this embodiment, when the direction of the rotation axis of the electronic device 1000 is the Y-axis direction, the electronic device 1000 can be relatively unfolded or folded along the Y-axis direction. In this way, when the electronic device 1000 is in a closed state, the size of the electronic device 1000 in the X-axis direction becomes smaller.

[0130] Figure 3 yes Figure 1 A partially exploded view of one embodiment of an electronic device 1000 is shown. Figure 4 yes Figure 2 The electronic device 1000 is shown as a partial cross-sectional view of one embodiment at line AA.

[0131] See also Figure 3 and Figure 4 , and combined with Figure 1 and Figure 2As shown, the electronic device 1000 includes a display module 100, a first housing 210, a second housing 220 and a first folding mechanism 310. The first housing 210, the second housing 220 and the first folding mechanism 310 may constitute a housing device 300 of the electronic device 1000.

[0132] In addition, the first folding mechanism 310 connects the first shell 210 and the second shell 220. The first folding mechanism 310 is used to make the first shell 210 and the second shell 220 unfold or fold relative to each other. It can be understood that in the present application, the first folding mechanism 310 can be an inner folding mechanism or an outer folding mechanism. The inner folding mechanism refers to a folding mechanism that can fold at least part of the display module 100 between the two shells. The outer folding mechanism refers to a folding mechanism that can fold at least part of the display module 100 to the outside of the shell. The present application does not specifically limit the first folding mechanism 310. In this embodiment, the first folding mechanism 310 is described as an inner folding mechanism.

[0133] See also Figure 3 , and combined with Figure 1 As shown, when the first housing 210, the second housing 220 and the first folding mechanism 310 are relatively unfolded to the unfolded state, the electronic device 1000 is in the unfolded state. Exemplarily, when the electronic device 1000 is in the unfolded state, the first housing 210, the second housing 220 and the first folding mechanism 310 can be arranged along the X-axis direction and can be approximately 180° (slight deviation is allowed, such as 165°, 177° or 185°, etc.).

[0134] See also Figure 4 , and combined with Figure 2 As shown, when the first housing 210, the second housing 220 and the first folding mechanism 310 are relatively folded to a folded state, the electronic device 1000 is in a folded state. Exemplarily, when the electronic device 1000 is in a folded state, the first housing 210 and the second housing 220 can be close to each other, and the first housing 210 and the second housing 220 are stacked in the thickness direction of the electronic device 1000 (that is, the Z-axis direction). When the first housing 210 and the second housing 220 are converted from the unfolded state to the folded state, the first folding mechanism 310 can enclose an accommodating space 3104. It can be understood that first folding mechanisms 310 with different structures have accommodating spaces 3104 of different shapes.

[0135] See also Figure 3 and Figure 4 , and combined with Figure 1 and Figure 2As shown, the display module 100 includes a first portion 100A, a second portion 100B and a third portion 100C connected in sequence. The second portion 100B is connected between the first portion 100A and the third portion 100C. For example, Figure 1 and Figure 3 The arrangement of the first part 100A, the second part 100B and the third part 100C along the X-axis direction is taken as an example for illustration.

[0136] Among them, the first part 100A of the display module 100 can be fixed on the first housing 210. The third part 100C can be fixed on the second housing 220. It can be understood that when the first folding mechanism 310 makes the first housing 210 and the second housing 220 relatively unfold or fold, the first housing 210 can drive the first part 100A of the display module 100 to unfold or fold relative to the third part 100C, and the second housing 220 can drive the third part 100C of the display module 100 to unfold or fold relative to the first part 100A. At this time, the second part 100B of the display module 100 can be bent.

[0137] In one embodiment, the first portion 100A of the display module 100 may be fixedly connected to the first housing 210 via a first adhesive layer (not shown). The third portion 100C may be fixed to the second housing 220 via a second adhesive layer (not shown). It is understood that the shape, position, and size of the first adhesive layer and the second adhesive layer are not specifically limited.

[0138] like Figure 1 and Figure 3 As shown, when the electronic device 1000 is in the unfolded state, the display module 100 can be in the unfolded state. Exemplarily, the first part 100A, the second part 100B and the third part 100C of the display module 100 can be approximately 180° (slight deviation is allowed, such as 165°, 177° or 185°). At this time, the display module 100 has a continuous large display area, that is, the display module 100 can achieve large-screen display, and the user experience is better.

[0139] For example, when the electronic device 1000 is in the unfolded state, at least part of the first folding mechanism 310 can be used to support the second part 100B. In this way, when the second part 100B of the display module 100 is subjected to pressing force, squeezing force or impact force, the first folding mechanism 310 can be used to improve the pressure resistance and impact resistance of the second part 100B, that is, to ensure that the second part 100B is not prone to dents and other problems.

[0140] like Figure 2 and Figure 4As shown, when the electronic device 1000 is in a folded state, the display module 100 can be in a folded state. For example, the first part 100A and the third part 100C of the display module 100 are arranged close to each other. At this time, the first part 100A and the third part 100C of the display module 100 can be arranged along the Z-axis direction. In addition, the second part 100B of the display module 100 is bent.

[0141] Exemplarily, when the electronic device 1000 is in the folded state, the first part 100A, the second part 100B and the third part 100C of the display module 100 are all located between the first housing 210 and the second housing 220, and the second part 100B is located in the accommodation space 3104 of the first folding mechanism 310. When the electronic device 1000 is in the folded state, since the first part 100A, the second part 100B and the third part 100C of the display module 100 are all located between the first housing 210 and the second housing 220, the display surface of the first part 100A faces the display surface of the third part 100C, the second part 100B is bent and arranged between the first part 100A and the third part 100C, and the second part 100B is located in the accommodation space 3104 of the first folding mechanism 310, the first part 100A, the second part 100B and the third part 100C of the display module 100 can be called the inner screen of the display module 100. When the first shell 210 and the second shell 220 are folded, the first part 100A, the second part 100B and the third part 100C are folded into the space formed by the first shell 210, the second shell 220 and the first folding mechanism 310, and the first part 100A, the second part 100B and the third part 100C can therefore be called the inner screen of the display module 100.

[0142] The structure of the display module 100 and the configuration of the display module 100 in a first folding mechanism 310 will be described in detail below with reference to the relevant drawings.

[0143] Figure 5 yes Figure 3 A partially exploded view of an embodiment of a display module 100 is shown. Figure 6 yes Figure 2 A partially exploded view of an embodiment of a display module 100 is shown.

[0144] like Figure 5 and Figure 6As shown, the display module 100 includes a display panel 10 and a support member 20. The display panel 10 is used to display images, etc. The display panel 10 can be a flexible display panel. For example, the display panel 10 can be an organic light-emitting diode (OLED) display panel, an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED) display panel, a mini organic light-emitting diode (mini organic light-emitting diode) display panel, a micro organic light-emitting diode (micro organic light-emitting diode) display panel, or a quantum dot light emitting diode (QLED) display panel, etc.

[0145] Exemplarily, the display module 100 may further include a back film (not shown), a polarizer (POL) (not shown), a protective cover (not shown), etc. In one embodiment, the display module 100 may further include a touch panel (not shown), etc.

[0146] Exemplarily, the thickness of the support member 20 in the Z-axis direction is in the range of 0.05 mm to 0.4 mm. For example, the thickness of the support member 20 in the Z-axis direction can be 0.05 mm, 0.08 mm, 0.1 mm, 0.2 mm, 0.3 mm or 0.4 mm, etc. It can be understood that the thin thickness of the support member 20 is conducive to realizing the thinning setting of the display module 100.

[0147] like Figure 5 and Figure 6 As shown, the display panel 10 includes a first display area 11, a second display area 12 and a third display area 13 which are sequentially connected along the X-axis direction. In other words, the second display area 12 is connected between the first display area 11 and the third display area 13. It can be understood that Figure 5 The first display area 11 , the second display area 12 , and the third display area 13 are schematically distinguished by dotted lines.

[0148] like Figure 5 and Figure 6As shown, the support member 20 includes a first fixed portion 21, a first bent portion 22, a second fixed portion 23, a first connecting portion 24 and a second connecting portion 25. Among them, the first connecting portion 24 is connected between the first fixed portion 21 and the first bent portion 22. The second connecting portion 25 is connected between the first bent portion 22 and the second fixed portion 23. In this way, the first bent portion 22 is connected between the first connecting portion 24 and the second connecting portion 25. It can be understood that since the first connecting portion 24 and the second connecting portion 25 of this embodiment are formed by mutual diffusion of two metals, the width of the first connecting portion 24 and the second connecting portion 25 in the X-axis direction is relatively small. In order to conveniently illustrate the positions of the first connecting portion 24 and the second connecting portion 25, Figure 5 and Figure 6 The positions of the first connection portion 24 and the second connection portion 25 are schematically shown by dashed lines. Of course, the positions of the first connection portion 24 and the second connection portion 25 are not limited to Figure 5 and Figure 6 The formation process of the first connection portion 24 and the second connection portion 25 will be described in detail below in conjunction with the relevant drawings. The details will not be repeated here.

[0149] Exemplarily, the first fixing portion 21, the first connecting portion 24, the first bending portion 22, the second connecting portion 25 and the second fixing portion 23 may be arranged in sequence along the X-axis direction. It is understandable that, although the arrangement direction of each part of the support member 20 is the same as the arrangement direction of each part of the display panel 10, within the range of process error or tolerance, the arrangement direction of each part of the support member 20 and the arrangement direction of each part of the display panel 10 may be different, that is, the two are not strictly parallel.

[0150] It can be understood that the first fixing portion 21, the first bending portion 22, the second fixing portion 23, the first connecting portion 24 and the second connecting portion 25 are an integral structure, that is, the support member 20 is an integrally formed structural member. At this time, the connection firmness between the first fixing portion 21, the first bending portion 22, the second fixing portion 23, the first connecting portion 24 and the second connecting portion 25 is better. In addition, the first fixing portion 21, the first bending portion 22, the second fixing portion 23, the first connecting portion 24 and the second connecting portion 25 are formed in fewer steps, which can reduce the cost of preparing the support member 20.

[0151] Figure 7 yes Figure 3 The display module 100 is shown as a partial cross-sectional view of an embodiment at line BB. Figure 8 yes Figure 4 A schematic structural diagram of an implementation manner of a display module 100 is shown.

[0152] See also Figure 7 and Figure 8, and combined with Figure 5 and Figure 6 As shown, the support member 20 is fixed to the non-display surface of the display panel 10. Exemplarily, the first surface 21a of the first fixing portion 21 of the support member 20 is fixedly connected to the first display area 11 of the display panel 10. The first surface 22a of the first bending portion 22 of the support member 20 is fixedly connected to the second display area 12 of the display panel 10. The first surface 23a of the second fixing portion 23 of the support member 20 is fixedly connected to the third display area 13 of the display panel 10. In this way, the first fixing portion 21 is arranged opposite to the first display area 11. The first bending portion 22 is arranged opposite to the second display area 12. The second fixing portion 23 is arranged opposite to the third display area 13.

[0153] For example, the first surface 24a of the first connection portion 24 may be fixedly connected to the first display area 11 of the display panel 10, or may be fixedly connected to the second display area 12 of the display panel 10, or may be partially fixedly connected to the first display area 11 of the display panel 10, and partially fixedly connected to the second display area 12 of the display panel 10. This application does not limit this in detail.

[0154] Exemplarily, the first surface 25a of the second connection portion 25 may be fixedly connected to the third display area 13 of the display panel 10, or may be fixedly connected to the second display area 12 of the display panel 10, or may be partially fixedly connected to the third display area 13 of the display panel 10, and partially fixedly connected to the second display area 12 of the display panel 10. This application does not make any specific limitation.

[0155] See also Figure 7 , and combined with Figure 5 As shown, when the electronic device 1000 is in the unfolded state, the first surface 21a of the first fixing portion 21, the first surface 22a of the first bending portion 22, the first surface 23a of the second fixing portion 23, the first surface 24a of the first connecting portion 24 and the first surface 25a of the second connecting portion 25 can be located on the same surface.

[0156] It is understandable that the first display area 11 of the display panel 10 and the first fixing portion 21 of the support member 20 may constitute the first portion 100A of the display module 100 (see Figure 3 and Figure 4 The second display area 12 of the display panel 10 and the first bent portion 22 of the support member 20 may constitute a second portion 100B of the display module 100 (see Figure 3 and Figure 4 The third display area 13 of the display panel 10 and the second fixing portion 23 of the support member 20 may constitute a third portion 100C of the display module 100 (see Figure 3 and Figure 4In addition, the ownership of the first connection part 24 and the second connection part 25 can be determined according to the connection position of the first connection part 24 and the second connection part 25.

[0157] It is understandable that the support member 20 can be used to provide rigid support for the display panel 10 to improve the support strength of the display panel 10. In addition, while ensuring a certain hardness, the support member 20 can also be bent under the action of an external force, that is, the support member 20 also has a certain bendability.

[0158] See also Figure 5 , and combined with Figure 3 and Figure 4 As shown, the second surface 21b of the first fixing portion 21 is fixedly connected to the first shell 210. The second surface 23b of the second fixing portion 23 is fixedly connected to the second shell 220. The first surface 21a of the first fixing portion 21 and the second surface 21b of the first fixing portion 21 are opposite to each other. The first surface 23a of the second fixing portion 23 and the second surface 23b of the second fixing portion 23 are opposite to each other. The second surface 22b of the first bending portion 22 can be fixedly connected to the first folding mechanism 310, or it can be not fixed to the first folding mechanism 310.

[0159] See also Figure 7 , and combined with Figure 5 As shown, when the electronic device 1000 is in the unfolded state, the display panel 10 and the support member 20 can both be in the unfolded state. Exemplarily, the first display area 11, the second display area 12 and the third display area 13 of the display panel 10 can be approximately 180° (allowing slight deviations, such as 165°, 177° or 185°). In addition, the first fixing portion 21, the first connecting portion 24, the first bending portion 22, the second connecting portion 25 and the second fixing portion 23 of the support member 20 can form a plate-like structure. In other words, the first fixing portion 21, the first connecting portion 24, the first bending portion 22, the second connecting portion 25 and the second fixing portion 23 can be approximately 180° (allowing slight deviations, such as 165°, 177° or 185°).

[0160] See also Figure 8 , and combined with Figure 6 As shown, when the electronic device 1000 is in a folded state, the display panel 10 can be in a folded state. Among them, the first display area 11, the second display area 12, and the third display area 13 of the display panel 10 are located on the inner side of the electronic device 1000. Exemplarily, the first display area 11 and the third display area 13 of the display panel 10 are arranged close to each other. At this time, the first display area 11 and the third display area 13 of the display panel 10 can be arranged along the Z-axis direction. In addition, the second display area 12 of the display panel 10 is bent.

[0161] In addition, when the electronic device 1000 is in a folded state, the support member 20 can be in a folded state. Exemplarily, the first fixing portion 21 and the second fixing portion 23 of the support member 20 are arranged close to each other. At this time, the first fixing portion 21 and the second fixing portion 23 of the support member 20 can be stacked along the Z-axis direction. In addition, the first bending portion 22 of the support member 20 is bent. Among them, the first fixing portion 21, the first bending portion 22 and the second fixing portion 23 of the support member 20 form a receiving space 206. The first display area 11, the second display area 12, and the third display area 13 of the display panel 10 are located in the receiving space 206. It can be understood that when the first connecting portion 24 is fixedly connected to the first display area 11, the state of the first connecting portion 24 when the electronic device 1000 is in a folded state can refer to the state of the first fixing portion 21. When the first connecting portion 24 is fixedly connected to the second display area 12, the state of the first connecting portion 24 when the electronic device 1000 is in a folded state can refer to the state of the first bending portion 22.

[0162] The state of the second connection portion 25 is substantially the same as that of the first connection portion 24. The details will not be described in detail here.

[0163] The above description in conjunction with the related drawings specifically describes that the support member 20 includes a first fixing portion 21, a first connecting portion 24, a first bending portion 22, a second connecting portion 25 and a second fixing portion 23. The following description in conjunction with the related drawings specifically describes an implementation of the first bending portion 22.

[0164] Fig. 9 yes Figure 5 An enlarged view of one embodiment of the support member 20 is shown at M1. Fig.10 yes Figure 6 A partially enlarged view of an embodiment of the support member 20 is shown.

[0165] like Fig. 9 and Fig.10 As shown, the first bending portion 22 includes a first sub-bending portion 221, a first connecting portion 222, a main bending portion 223, a second connecting portion 224, and a second sub-bending portion 225 arranged in sequence along the X-axis direction. In other words, the first connecting portion 222 is located between the first sub-bending portion 221 and the main bending portion 223. The main bending portion 223 is connected between the first connecting portion 222 and the second connecting portion 224. The second connecting portion 224 is located between the main bending portion 223 and the second sub-bending portion 225. In addition, the first sub-bending portion 221 is connected to the first connecting portion 24 of the support member 20 (see Figure 5 and Figure 6 ) is connected to the first fixing portion 21 of the support member 20. The second sub-bending portion 225 is connected to the second connecting portion 25 of the support member 20 (see Figure 5 and Figure 6) is connected to the second fixing portion 23.

[0166] It is understandable that, although the arrangement direction of each part of the first bending portion 22 is the same as the arrangement direction of each part of the display panel 10, within the range of process error or tolerance, the arrangement direction of each part of the first bending portion 22 and the arrangement direction of each part of the display panel 10 may be different, that is, the two may not be strictly parallel. In other embodiments, the first bending portion 22 may not include the first sub-bending portion 221 and / or the first connecting portion 222 and / or the second connecting portion 224 and / or the second sub-bending portion 225. In other embodiments, the first bending portion 22 may also include more sub-bending portions and more connecting portions.

[0167] It is understood that the first sub-bend portion 221 and the second sub-bend portion 225 can be the same or similar structure, symmetrical or partially symmetrical structure, or different structure. The first connecting portion 222 and the second connecting portion 224 can be the same or similar structure, symmetrical or partially symmetrical structure, or different structure. Exemplarily, the first sub-bend portion 221 and the second sub-bend portion 225 are symmetrical structures. The first connecting portion 222 and the second connecting portion 224 are symmetrical structures.

[0168] See also Figure 7 and Fig. 9 As shown, when the electronic device 1000 is in the unfolded state, the first sub-bending portion 221, the first connecting portion 222, the main bending portion 223, the second connecting portion 224 and the second sub-bending portion 225 of the first bending portion 22 can form a plate-like structure. In other words, the first sub-bending portion 221, the first connecting portion 222, the main bending portion 223, the second connecting portion 224 and the second sub-bending portion 225 of the first bending portion 22 can be approximately 180° (slight deviations are allowed, such as 165°, 177° or 185°).

[0169] like Fig.10 As shown, when the electronic device 1000 is in a folded state, the main bending portion 223 bends in the folding direction, the first sub-bending portion 221 and the second sub-bending portion 225 are close to each other, and the first connecting portion 222 and the second connecting portion 224 are close to each other. The first sub-bending portion 221, the first connecting portion 222, the main bending portion 223, the second connecting portion 224 and the second sub-bending portion 225 of the first bending portion 22 together form a receiving space 207. The receiving space 207 is used to accommodate at least part of the second display area 12 (see Figure 8 ).

[0170] like Fig. 9 and Fig.10As shown, the hardness of the main bending portion 223 is less than the hardness of the first sub-bending portion 221. The hardness of the first sub-bending portion 221 is less than the hardness of the first connecting portion 222. In this way, the hardness of the main bending portion 223 is also less than the hardness of the first connecting portion 222. In other words, among the first sub-bending portion 221, the first connecting portion 222 and the main bending portion 223, the hardness of the first connecting portion 222 is the largest, and the hardness of the main bending portion 223 is the smallest. Since the first sub-bending portion 221 and the second sub-bending portion 225 are symmetrical structures, and the first connecting portion 222 and the second connecting portion 224 are symmetrical structures, the hardness of the main bending portion 223 is the smallest among the first sub-bending portion 221, the first connecting portion 222, the main bending portion 223, the second connecting portion 224 and the second sub-bending portion 225. In this way, when the electronic device 1000 is in a folded state, the main bending portion 223 can be bent well.

[0171] It is understandable that there are various implementations for achieving the hardness of the main bending portion 223 being less than the hardness of the first sub-bending portion 221 .

[0172] In one embodiment, both the main bending portion 223 and the first sub-bending portion 221 are provided with through holes or grooves. The through holes are used as an example for explanation. In this case, the hardness of the main bending portion 223 can be made smaller than that of the first sub-bending portion 221 by setting the number of holes of the main bending portion 223 to be different from the number of through holes of the first sub-bending portion 221, the size of the through holes of the main bending portion 223 to be different from the size of the through holes of the first sub-bending portion 221, and / or the shape of the through holes of the main bending portion 223 to be different from the shape of the through holes of the first sub-bending portion 221.

[0173] In another embodiment, a through hole or a groove may be provided in the main bending portion 223 , while the first sub-bending portion 221 is not provided with a through hole or a groove, so that the hardness of the main bending portion 223 is smaller than that of the first sub-bending portion 221 .

[0174] The structure of an implementation of the main bending portion 223 is described in detail below in conjunction with relevant drawings.

[0175] like Fig. 9 and Fig.10 As shown, the main bending portion 223 of the first bending portion 22 is provided with multiple rows of through hole groups 228. The multiple rows of through hole groups 228 can be arranged from the top to the bottom of the main bending portion 223, that is, the multiple rows of through hole groups 228 can be arranged along the Y-axis direction. Among them, the through hole group 228 includes multiple through holes 2281 arranged at intervals. The multiple through holes 2281 are arranged at intervals from the left side to the right side of the main bending portion 223, that is, the multiple through holes 2281 can be arranged at intervals along the X-axis direction. It can be understood that Fig. 9Three dotted lines with double arrows are shown. The through holes 2281 passed through by the dotted lines aa with double arrows constitute the first row of through hole groups 228. The through holes 2281 passed through by the dotted lines bb with double arrows constitute the second row of through hole groups 228. The through holes 2281 passed through by the dotted lines cc with double arrows constitute the third row of through hole groups 228.

[0176] Exemplarily, the through hole 2281 is in the shape of a long strip. The length of the through hole 2281 may extend in the Y-axis direction. In other embodiments, the through hole 2281 may also be in the shape of a dumbbell, a diamond, a square, or a round waist, etc., and the present application does not make a strict limitation on this.

[0177] like Fig. 9 and Fig.10 As shown, a plurality of through holes 2281 penetrates the two plate surfaces of the main bending portion 223 along the Z-axis direction. In addition, one row of through hole groups 228 in the plurality of rows of through hole groups 228 penetrates at least one side edge of the main bending portion 223 along the Y-axis direction. In this way, the main bending portion 223 has better bendability.

[0178] like Fig. 9 and Fig.10 As shown, the entire area of ​​the main bending portion 223 is provided with a through hole group 228, that is, the end and the middle of the main bending portion 223 are provided with a through hole group 228. In other embodiments, the main bending portion 223 can also be provided with a through hole group 228 in a local area, for example, the through hole group 228 is only provided in the middle of the main bending portion 223. The present application does not make any specific limitations.

[0179] Exemplarily, the multiple through holes 2281 of two adjacent through hole groups 228 are arranged in a staggered manner. In one embodiment, one end of a through hole 2281 of a through hole group 228 in the second row may be located between two adjacent through holes 2281 of a through hole group 228 in the first row. The other end of a through hole 2281 of a through hole group 228 in the second row may be located between two adjacent through holes 2281 of a through hole group 228 in the third row. That is, two upper and lower adjacent through hole groups 228 may reuse part of the space in the Y-axis direction. In this embodiment, when the main bending portion 223 is cross-sectioned along the X-axis direction, the main bending portion 223 is divided into multiple parts by the through hole 2281, that is, the main bending portion 223 has no continuous part. At this time, the bendability of the main bending portion 223 is further improved. In this way, when the electronic device 1000 is unfolded or folded, the main bending portion 223 has better bendability.

[0180] In other embodiments, the main bending portion 223 of the first bending portion 22 is provided with multiple rows of third groove groups. Among them, the opening of the third groove can form an opening on one surface of the first bending portion 22. The multiple rows of third groove groups include multiple third grooves. The arrangement of the multiple third groove groups can refer to the arrangement of the multiple rows of through hole groups 228. The details are not repeated here.

[0181] It can be understood that the first sub-bending portion 221, the first connecting portion 222, the second connecting portion 224 and the second sub-bending portion 225 can also be provided with through holes or grooves, and the hardness can be distinguished from the main bending portion 223 by the arrangement, number, size and shape of the through holes.

[0182] It can be understood that the main bending portion 223 is the main bending portion of the support member 20 when the electronic device 1000 is in a folded state. Therefore, the main bending portion 223 is provided with a plurality of grooves or through holes so that the main bending portion 223 can be roughly in a "bamboo book structure", thereby greatly reducing the hardness of the main bending portion 223. In this way, the main bending portion 223 can also be called the "bamboo book area" of the support member 20. The first sub-bending portion 221 of the first bending portion 22, the second sub-bending portion 225, the first connecting portion 222 and the second connecting portion 224, the first fixing portion 21, the second fixing portion 23, the first connecting portion 24 and the second connecting portion 25 of the support member 20 are also called the "non-bamboo book area" of the support member 20.

[0183] It is understandable that in the conventional support, since the main bending portion of the first bending portion is provided with a through hole or a groove, the hardness of the first bending portion of the conventional support is relatively low. In this way, when the electronic device is in the unfolded state, it is difficult for the first bending portion of the support to provide a good rigid support for the second display area. In addition, since the main bending portion of the first bending portion is provided with a through hole or a groove, the elastic modulus of the first bending portion of the support is low, and the ability of the first bending portion of the support to resist deformation is poor. However, in order to ensure that the first bending portion has a high hardness and elastic modulus, if the conventional support adopts some materials with high hardness and high elastic modulus (such as stainless steel or aluminum alloy), the density and thermal conductivity of the first fixed portion and the second fixed portion of the support are relatively low. It is difficult for the conventional support to achieve a lightweight and high thermal conductivity design. Therefore, the conventional support cannot take into account high hardness, better bendability, lightweight and high thermal conductivity at the same time. Based on the bottleneck problems encountered by traditional support members, the present application proposes a support member 20 that can simultaneously take into account high hardness, better bendability, light weight and high thermal conductivity. In this way, when the electronic device 1000 is in an unfolded state or a folded state, the support member 20 has sufficient hardness to provide rigid support for the display panel 10, thereby improving the support strength of the display panel 10. When the electronic device 1000 is in a folded state, the support member 20 also has sufficient bendability to bend along with the display panel 10. In addition, the support member 20 has a light weight performance, which is conducive to the lightweight design of the electronic device 1000. Finally, the support member 20 also has sufficient thermal conductivity to conduct the heat generated by the display panel 10 to the outside of the electronic device. The structure of the support member 20 will be described in detail below in conjunction with the relevant drawings.

[0184] like Figures 5 to 7 As shown, the first fixing portion 21 is made of a first metal material, and the first bending portion 22 is made of a second metal material. The first metal material and the second metal material are different materials. The first connecting portion 24 includes the first metal material and the second metal material.

[0185] It can be understood that since the first fixing portion 21 adopts the first metal material, the first bending portion 22 adopts the second metal material, the first connecting portion 24 includes the first metal material and the second metal material, and the first connecting portion 24 is connected between the first fixing portion 21 and the first bending portion 22, the first connecting portion 24 can enhance the interface bonding strength between the first fixing portion 21 and the first bending portion 22, so that the connection strength between the first fixing portion 21 and the first bending portion 22 is high, and the overall structure of the integrated structural component formed by the first fixing portion 21, the first connecting portion 24 and the first bending portion 22 is stable and reliable.

[0186] In addition, the first metal material used in the first fixed portion 21 is different from the second metal material used in the first bending portion 22. Therefore, through the combination of the first metal material and the second metal material, the first fixed portion 21 and the first bending portion 22 of the support member 20 can simultaneously take into account the advantages of high hardness, better bendability, light weight and high thermal conductivity.

[0187] Exemplarily, the second fixing portion 23 is made of a third metal material. The third metal material and the second metal material are different materials. The second connecting portion 25 includes the second metal material and the third metal material.

[0188] It can be understood that since the second fixing portion 23 adopts the third metal material, the first bending portion 22 adopts the second metal material, the second connecting portion 25 includes the third metal material and the second metal material, and the second connecting portion 25 is connected between the second fixing portion 23 and the first bending portion 22, the second connecting portion 25 can enhance the interface bonding strength between the second fixing portion 23 and the first bending portion 22, so that the connection strength between the second fixing portion 23 and the first bending portion 22 is high, and the overall structure of the integrated structural component formed by the second fixing portion 23, the second connecting portion 25 and the first bending portion 22 is stable and reliable.

[0189] In addition, the third metal material used in the second fixed portion 23 is different from the second metal material used in the first bending portion 22. Therefore, through the combination of the third metal material and the second metal material, the second fixed portion 23 and the first bending portion 22 of the support member 20 can simultaneously take into account the advantages of high hardness, better bendability, light weight and high thermal conductivity.

[0190] For example, the third metal material may be the same as or different from the first metal material. In this embodiment, the third metal material is the same as the first metal material, so the following is an example of the material difference design of the first fixing portion 21 and the first bending portion 22.

[0191] In other embodiments, the support member 20 may not include the second connecting portion 25. In this case, the third metal material used in the second fixing portion 23 and the second metal material used in the first bending portion 22 may be the same material. In this case, the second fixing portion 23 and the first bending portion 22 are a plate (such as stainless steel or titanium alloy). In this way, the hardness of the second metal material is equal to the hardness of the third metal material, and the density of the third metal material is equal to the density of the second metal material. The details are not repeated here.

[0192] In some embodiments, the hardness of the second metal material is greater than the hardness of the first metal material. Among them, hardness is a performance indicator to measure the hardness of a material, which can be understood as the ability to resist elastic deformation, plastic deformation, residual deformation, resistance and anti-destructive force. Hardness is not a simple physical concept, but the mechanical properties of the material such as elasticity, plasticity, strength and toughness. Exemplarily, the hardness of the second metal material can be greater than or equal to 130HV, for example, 130HV, 160HV, 180HV, 200HV, 250HV, 280HV, etc. Among them, HV is the Vickers hardness unit.

[0193] It is understandable that the support member 20 adopts a composite structure of the first fixing portion 21 and the first bending portion 22, and the material hardness of the first bending portion 22 is greater than the material hardness of the first fixing portion 21, that is, the first bending portion 22 adopts the second metal material with higher hardness. In this way, the hardness of the first bending portion 22 will not be significantly reduced due to the opening of the groove or through hole, thereby ensuring that the first bending portion 22 has a certain bending performance while also having a certain hardness to provide rigid support to the display panel 10, thereby improving the support strength of the display panel 10.

[0194] In some embodiments, the elastic modulus of the second metal material is greater than the elastic modulus of the first metal material. Exemplarily, the elastic modulus of the second metal material is greater than or equal to 80GPa, for example, 80GPa, 100GPa, 110GPa, 130GPa, 180GPa, etc. Wherein, 1GPa = 1000MPa (megapascals). Among them, the elastic modulus (Elastic Modulus) refers to the stress required for a material to produce a unit elastic deformation under the action of an external force. It is an indicator of the material's ability to resist elastic deformation. The elastic modulus can be regarded as an indicator of the ease with which a material produces elastic deformation. The larger its value, the greater the stress that causes the material to undergo a certain elastic deformation, that is, the greater the hardness of the material, that is, under a certain stress, the smaller the elastic deformation.

[0195] It is understandable that the first bending portion 22 of the support member 20 is made of the second metal material with a large elastic modulus, so that the first bending portion 22 has a strong ability to resist elastic deformation. In this way, the first bending portion 22 will not have its hardness significantly reduced due to the opening of the groove or through hole, thereby ensuring that the first bending portion 22 has a certain bending performance while also having a certain hardness to provide rigid support to the display panel 10, thereby improving the support strength of the display panel 10.

[0196] In some embodiments, the yield strength of the second metal material is greater than the yield strength of the first metal material. Exemplarily, the yield strength of the second metal material is greater than or equal to 200 MPa (megapascals), such as 400 MPa, 450 MPa, 500 MPa, 600 MPa, 665 MPa, etc. Yield strength is the yield limit of a metal material when yielding occurs, that is, the stress that resists micro plastic deformation.

[0197] It is understandable that the first bending portion 22 of the support member 20 is made of the second metal material with a large yield strength, so that the first bending portion 22 has a strong ability to resist slight plastic deformation. In this way, the first bending portion 22 will not have its hardness significantly reduced due to the opening of the groove or through hole, thereby ensuring that the first bending portion 22 has a certain bending performance while also having a certain hardness to provide rigid support to the display panel 10, thereby improving the support strength of the display panel 10.

[0198] In some embodiments, the density of the first metal material is less than the density of the second metal material. For example, the density of the first metal material can be less than or equal to 4.0 g / cm3 (grams per cubic centimeter), for example, 1.8 g / cm 3 , 1.9g / cm 3 , 2.0g / cm 3 , 2.69g / cm 3 , 2.70g / cm 3 , 2.73g / cm 3 , 2.8g / cm 3 , 2.95g / cm 3 wait.

[0199] It is understandable that the first fixing portion 21 of the support member 20 is made of a first metal material with a relatively low density, so that the mass of the first fixing portion 21 is relatively small, which is conducive to the lightweight of the support member 20. In this embodiment, the support member 20 adopts a composite structure of the first fixing portion 21 and the first bending portion 22, the material hardness of the first bending portion 22 is relatively high, and the material hardness and density of the first fixing portion 21 are relatively low, which is conducive to the support member 20 to achieve high reliability and lightweight, and also conducive to the support member 20 to obtain a lower processing cost and a higher production yield.

[0200] In some embodiments, the thermal conductivity of the first metal material is greater than the thermal conductivity of the second metal material. Exemplarily, the thermal conductivity of the first metal material is greater than or equal to 50 W / m·K (watt / meter·degree), for example, 50 W / m·K, 80 W / m·K, 90 W / m·K, 120 W / m·K, 130 W / m·K, 150 W / m·K, 160 W / m·K, 200 W / m·K, etc.

[0201] It can be understood that the first fixing portion 21 of the support member 20 is made of a first metal material with a large thermal conductivity coefficient, so that the first fixing portion 21 has a high thermal conductivity property, which is beneficial to improving the heat dissipation performance of the support member 20 .

[0202] Exemplarily, the thermal conductivity of the first metal material is greater than or equal to 90 W / m·K (watt / meter·degree), for example, 90 W / m·K, 150 W / m·K, 160 W / m·K, 200 W / m·K, etc.

[0203] In some embodiments, the second metal material can be stainless steel or titanium alloy. For example, titanium alloys such as TA2, TA4, TC4, TB18, or stainless steels such as SUS301, SUS304, SUS316, SUS410, plates or powders, etc. At this time, the first bending portion 22 has a higher hardness, a higher elastic modulus and a higher yield strength. Exemplarily, the first metal material can be a particle-reinforced aluminum-based composite material, a magnesium alloy or a particle-reinforced magnesium-based composite material. At this time, the first fixing portion 21 has a smaller density and a higher thermal conductivity.

[0204] Among them, particle reinforced aluminum matrix composite materials can be made of silicon carbide (SiC), carbon nanotubes (CNT), chromium (Cr), aluminum oxide (Al 2 O 3 ), titanium carbide (TiC), boron carbide (B 4 C), silicon boride (SiB 6 ), titanium boride (TiB) and other reinforcing particles. Particle-reinforced magnesium-based composites can be made of silicon carbide (SiC), carbon nanotubes (CNT), chromium (Cr), aluminum oxide (Al 2 O 3 )、Titanium carbide (TiC), Boron carbide (B 4 C), silicon boride (SiB 6 ), titanium boride (TiB) and other reinforcing particles.

[0205] For example, the particle-reinforced aluminum-based composite material can use 50% by mass SiC (silicon carbide) particle reinforcement phase + 50% by mass 6013 aluminum alloy matrix, 20% by mass SiC (silicon carbide) particle reinforcement phase + 80% by mass 6013 aluminum alloy matrix, etc. The particle-reinforced magnesium-based composite material can use 20% by mass SiC (silicon carbide) particle reinforcement phase + 80% by mass AZ91 magnesium alloy matrix, etc.

[0206] In some embodiments of the present application, the first bending portion 22 of the support member 20 is made of stainless steel or titanium alloy material, and the first fixing portion 21 is made of particle-reinforced aluminum-based composite material or particle-reinforced magnesium-based composite material, so that the support member 20 can simultaneously take into account high hardness, better bendability, light weight and high thermal conductivity.

[0207] The specific implementation of the first metal material and the second metal material is described below by way of example.

[0208] The first implementation mode: The first metal material adopts a particle-reinforced aluminum-based composite material of SiC (silicon carbide) particle reinforcement phase + 6013 aluminum alloy matrix. The second metal material adopts TA4 titanium alloy. Among them, the mass fraction of SiC (silicon carbide) particle reinforcement phase is in the range of 10% to 60%. For example, the mass fraction of SiC (silicon carbide) particle reinforcement phase is 10%, 20%, 50%, 55%, 60%, etc. Correspondingly, the mass fraction of 6013 aluminum alloy matrix is ​​in the range of 90% to 40%.

[0209] For example, the first metal material is a particle-reinforced aluminum-based composite material of 50% by mass of SiC (silicon carbide) particle reinforcement phase + 50% by mass of 6013 aluminum alloy matrix. The second metal material is TA4 titanium alloy.

[0210] It can be understood that the hardness of the particle-reinforced aluminum-based composite material with a mass fraction of 50% SiC (silicon carbide) particle reinforcement phase + a mass fraction of 50% 6013 aluminum alloy matrix can be about 280HV, the elastic modulus can be about 180GPa, the density can be about 2.95g / cm3, and the thermal conductivity can be about 200W / m·K. In addition, the hardness of TA4 titanium alloy can be about 280HV, the elastic modulus can be about 110GPa, the density can be about 4.5g / cm3, and the thermal conductivity can be about 6.8W / m·K. Among them, the above parameters of the particle-reinforced aluminum-based composite material with a mass fraction of 50% SiC (silicon carbide) particle reinforcement phase + a mass fraction of 50% 6013 aluminum alloy matrix and the TA4 titanium alloy may be slightly different due to factors such as specific production processes, material conditions and test methods.

[0211] It can be understood that, compared with the solution in which both the first metal material and the second metal material use TA4 titanium alloy, in this embodiment, the first metal material uses a particle-reinforced aluminum-based composite material of 50% by mass SiC (silicon carbide) particle reinforcement phase + 50% by mass 6013 aluminum alloy matrix, and the second metal material uses TA4 titanium alloy. In this way, on the one hand, it is ensured that the first bending portion 22 can use a second metal material with high hardness, high elastic modulus and high density. The first bending portion 22 will not cause a significant reduction in hardness due to the opening of a groove or a through hole, thereby ensuring that the first bending portion 22 has a certain bending performance while also having a certain hardness to provide rigid support to the display panel 10, thereby improving the support strength of the display panel 10. On the other hand, it is ensured that the first fixing portion 21 can use a first metal material with low density and high thermal conductivity, which is conducive to the support member 20 to achieve lightweight and high thermal conductivity characteristics. In this way, the support member 20 can simultaneously take into account the advantages of high hardness, better bendability, lightweight and high thermal conductivity.

[0212] For example, the first metal material is a particle-reinforced aluminum-based composite material of 20% by mass SiC (silicon carbide) particle reinforcement phase + 80% by mass 6013 aluminum alloy matrix. The second metal material is TA4 titanium alloy. The hardness, elastic modulus, density and thermal conductivity of TA4 titanium alloy can refer to the parameters of the above implementation method. The details are not repeated here.

[0213] It is understandable that the hardness of the particle reinforced aluminum matrix composite material of 20% SiC (silicon carbide) particle reinforcement phase + 80% 6013 aluminum alloy matrix by mass fraction can be about 160HV, the elastic modulus can be about 100GPa, the density can be about 2.8g / cm3, and the thermal conductivity can be about 150W / m·K. Among them, the above parameters of the particle reinforced aluminum matrix composite material of 20% SiC (silicon carbide) particle reinforcement phase + 80% 6013 aluminum alloy matrix by mass fraction may be slightly different due to factors such as specific production process, material state and test method.

[0214] It can be understood that, compared with the solution in which both the first metal material and the second metal material use TA4 titanium alloy, in this embodiment, the first metal material uses a particle-reinforced aluminum-based composite material of 20% by mass SiC (silicon carbide) particle reinforcement phase + 80% by mass 6013 aluminum alloy matrix, and the second metal material uses TA4 titanium alloy. In this way, on the one hand, it is ensured that the first bending portion 22 can use a second metal material with high hardness, high elastic modulus and high density. The first bending portion 22 will not cause a significant reduction in hardness due to the opening of a groove or a through hole, thereby ensuring that the first bending portion 22 has a certain bending performance while also having a certain hardness to provide rigid support to the display panel 10, thereby improving the support strength of the display panel 10. On the other hand, it is ensured that the first fixing portion 21 can use a first metal material with low density and high thermal conductivity, which is conducive to the support member 20 to achieve lightweight and high thermal conductivity characteristics. In this way, the support member 20 can simultaneously take into account the advantages of high hardness, better bendability, lightweight and high thermal conductivity.

[0215] Second implementation mode: The first metal material adopts a particle-reinforced aluminum-based composite material of SiC (silicon carbide) particle reinforcement phase + 6013 aluminum alloy matrix. The second metal material adopts SUS316 stainless steel. Among them, the mass fraction of SiC (silicon carbide) particle reinforcement phase is in the range of 10% to 60%. For example, the mass fraction of SiC (silicon carbide) particle reinforcement phase is 10%, 20%, 50%, 55%, 60%, etc. Correspondingly, the mass fraction of SUS316 stainless steel is in the range of 90% to 40%.

[0216] Exemplarily, the first metal material uses a particle-reinforced aluminum-based composite material of 50% by mass SiC (silicon carbide) particle reinforcement phase + 50% by mass 6013 aluminum alloy matrix. The second metal material uses SUS316 stainless steel. Among them, the hardness, elastic modulus, density and thermal conductivity of the particle-reinforced aluminum-based composite material of 50% by mass SiC (silicon carbide) particle reinforcement phase + 50% by mass 6013 aluminum alloy matrix can refer to the parameters of the above embodiment. The specific details are not repeated here.

[0217] It is understood that the hardness of SUS316 stainless steel may be about 250 HV, the elastic modulus may be about 193 GPa, the density may be about 7.92 g / cm3, and the thermal conductivity may be about 15.9 W / m·K. The above parameters of SUS316 stainless steel may vary slightly due to factors such as specific production processes, material conditions, and test methods.

[0218] It can be understood that, compared with the solution that both the first metal material and the second metal material use SUS316 stainless steel, in this embodiment, the first metal material uses a particle-reinforced aluminum-based composite material of 50% by mass SiC (silicon carbide) particle reinforcement phase + 50% by mass 6013 aluminum alloy matrix, and the second metal material uses SUS316 stainless steel. In this way, on the one hand, it is ensured that the first bending portion 22 can use a second metal material with high hardness, high elastic modulus and high density. The first bending portion 22 will not cause a significant reduction in hardness due to the opening of a groove or a through hole, thereby ensuring that the first bending portion 22 has a certain bending performance while also having a certain hardness to provide rigid support to the display panel 10, thereby improving the support strength of the display panel 10. On the other hand, it is ensured that the first fixing portion 21 can use a first metal material with low density and high thermal conductivity, which is conducive to the support member 20 to achieve lightweight and high thermal conductivity characteristics. In this way, the support member 20 can simultaneously take into account the advantages of high hardness, better bendability, lightweight and high thermal conductivity.

[0219] Exemplarily, the first metal material uses a particle-reinforced aluminum-based composite material of 20% by mass SiC (silicon carbide) particle reinforcement phase + 80% by mass 6013 aluminum alloy matrix. The second metal material uses SUS316 stainless steel. Among them, the hardness, elastic modulus, density and thermal conductivity of the particle-reinforced aluminum-based composite material of 20% by mass SiC (silicon carbide) particle reinforcement phase + 80% by mass 6013 aluminum alloy matrix and SUS316 stainless steel can refer to the parameters of the above embodiment. The specific details are not repeated here.

[0220] The third embodiment: The first metal material adopts a particle-reinforced magnesium-based composite material of SiC (silicon carbide) particle reinforcement phase + AZ91 magnesium alloy matrix. The second metal material adopts TA4 titanium alloy. Among them, the mass fraction of SiC (silicon carbide) particle reinforcement phase is in the range of 10% to 60%. For example, the mass fraction of SiC (silicon carbide) particle reinforcement phase is 10%, 20%, 50%, 55%, 60%, etc. Correspondingly, the mass fraction of AZ91 magnesium alloy matrix is ​​in the range of 90% to 40%.

[0221] Exemplarily, the first metal material is a particle-reinforced magnesium-based composite material of 20% by mass SiC (silicon carbide) particle reinforcement phase + 80% by mass AZ91 magnesium alloy matrix. The second metal material is TA4 titanium alloy. The hardness, elastic modulus, density and thermal conductivity of TA4 titanium alloy can refer to the parameters of the above implementation method. The details are not repeated here.

[0222] It is understandable that the hardness of the particle-reinforced magnesium-based composite material of 20% by mass SiC (silicon carbide) particle reinforcement phase + 80% by mass AZ91 magnesium alloy matrix can be about 130HV, the elastic modulus can be about 80GPa, the density can be about 1.9g / cm3, and the thermal conductivity can be about 80W / m·K. Among them, the above parameters of the particle-reinforced magnesium-based composite material of 20% by mass SiC (silicon carbide) particle reinforcement phase + 80% by mass AZ91 magnesium alloy matrix may be slightly different due to factors such as specific production process, material state and test method.

[0223] It can be understood that, compared with the solution in which both the first metal material and the second metal material use TA4 titanium alloy, in this embodiment, the first metal material uses a particle-reinforced magnesium-based composite material of 20% by mass SiC (silicon carbide) particle reinforcement phase + 80% by mass AZ91 magnesium alloy matrix, and the second metal material uses TA4 titanium alloy. In this way, on the one hand, it is ensured that the first bending portion 22 can use a second metal material with high hardness, high elastic modulus and high density. The first bending portion 22 will not cause a significant reduction in hardness due to the opening of a groove or a through hole, thereby ensuring that the first bending portion 22 has a certain bending performance while also having a certain hardness to provide rigid support to the display panel 10, thereby improving the support strength of the display panel 10. On the other hand, it is ensured that the first fixing portion 21 can use a first metal material with low density and high thermal conductivity, which is conducive to the support member 20 to achieve lightweight and high thermal conductivity characteristics. In this way, the support member 20 can simultaneously take into account the advantages of high hardness, better bendability, lightweight and high thermal conductivity.

[0224] The fourth embodiment: The first metal material adopts a particle-reinforced magnesium-based composite material of SiC (silicon carbide) particle reinforcement phase + AZ91 magnesium alloy matrix. The second metal material adopts SUS316 stainless steel. Among them, the mass fraction of SiC (silicon carbide) particle reinforcement phase is in the range of 10% to 60%. For example, the mass fraction of SiC (silicon carbide) particle reinforcement phase is 10%, 20%, 50%, 55%, 60%, etc. Correspondingly, the mass fraction of AZ91 magnesium alloy matrix is ​​in the range of 90% to 40%.

[0225] Exemplarily, the first metal material adopts a particle-reinforced magnesium-based composite material of 20% by mass SiC (silicon carbide) particle reinforcement phase + 80% by mass AZ91 magnesium alloy matrix. The second metal material adopts SUS316 stainless steel. Among them, the hardness, elastic modulus, density and thermal conductivity of the particle-reinforced magnesium-based composite material of 20% by mass SiC (silicon carbide) particle reinforcement phase + 80% by mass AZ91 magnesium alloy matrix and SUS316 stainless steel can refer to the parameters of the above embodiment. The specific details are not repeated here.

[0226] Please refer again Figures 5 to 7 In some embodiments, the first fixing portion 21, the first connecting portion 24 and the first bending portion 22 of the support member 20 can be formed by an insert powder metallurgy process. In the manufacturing process of the insert powder metallurgy process, an insert is first manufactured, and then the insert and the powder connecting the insert are sintered together to finally form an integrally formed structural member. Exemplarily, the first bending portion 22 is formed by an insert made of a second metal material, the first fixing portion 21 is formed by sintering a powder of a first metal material, and the first connecting portion 24 is formed by mutual diffusion of the second metal material and the first metal material.

[0227] In this embodiment, since the first fixing portion 21, the first connecting portion 24 and the first bending portion 22 of the support member 20 are integrally formed structural parts formed by the insert powder metallurgy process, based on the metal interdiffusion effect during the sintering process, an interdiffusion layer with a composition gradient can be formed between the first bending portion 22 formed by the insert and the first fixing portion 21 formed by the powder, that is, a first connecting portion 24 in which the second metal material and the first metal material diffuse with each other is formed. At this time, the formation of the first connecting portion 24 significantly improves the interface bonding strength between the first fixing portion 21 and the first bending portion 22, so that the connection strength between the first fixing portion 21 and the first bending portion 22 is high, and the overall structure of the first fixing portion 21, the first connecting portion 24 and the first bending portion 22 is stable and reliable.

[0228] In some other embodiments, the support member 20 can also be formed by a dissimilar metal composite plate through a stamping and forging process. Among them, the dissimilar metal composite plate is formed by stacking two dissimilar metal plates together and then forming a composite plate with an integrated structure by rolling. Since the dissimilar metal composite plate is a plate structure, it needs to be processed by a stamping and forging process to form a product component of a corresponding shape. In this embodiment, the support member 20 can be formed into a first component and a second component by two metals of the dissimilar metal plate. However, since the bonding interface width of the above-mentioned dissimilar metal composite structural member is extremely narrow (a structure similar to the first connecting portion 24 described above is not seen in the metallographic structure), there is a risk of interface cracking between the first component and the second component during the stamping and forging process, and the shape of the bonding interface is difficult to control, and the dimensional tolerance is large, which easily leads to poor connection strength and low processing accuracy between the first component and the second component of the support member 20. However, since the shape of the bonding interface is difficult to control, in order to make the metal structures on both sides of the bonding interface meet the design requirements (for example, the first component structure is complete, the second component structure is complete, the first component covers the outer surface of the second component, etc.), it is usually necessary to thicken the metal structures on both sides of the bonding interface in the actual product to reduce the occurrence of gaps and fractures that are not required by the design. This will result in a larger thickness of the first component, a larger thickness of the second component, and a larger thickness and a larger weight of the final support member 20.

[0229] In the embodiment where the first fixing portion 21, the first bending portion 22 and the first connecting portion 24 are formed by insert powder metallurgy process, the first connecting portion 24 as the bonding interface is formed during the sintering process due to the metal interdiffusion effect, and the thickness of the first connecting portion 24 is relatively large, so the connection strength of the first fixing portion 21, the first bending portion 22 and the first connecting portion 24 is high. In some possible implementations, the shear strength of the first connecting portion 24 at the bonding interface between the first fixing portion 21 and the first bending portion 22 is greater than or equal to 100 MPa, and in some implementations it can be as high as 300 MPa, which is much higher than the interface shear strength of the support member 20 formed by the heterogeneous metal composite plate through the stamping and forging process. Furthermore, during the manufacturing process, the support member 20 can control the shape of the bonding interface between the first fixing portion 21 and the first bending portion 22 by controlling the shape of the surface of the insert for contacting the powder. The shape control of the bonding interface is easy to implement, highly flexible, and highly accurate, so that the first fixing portion 21, the first bending portion 22, and the first connecting portion 24 have high processing accuracy when they have high connection strength. In addition, since the shape of the bonding interface is easy to control, the actual thickness of the first fixing portion 21 and the first bending portion 22 can be close to or equal to the designed thickness when the design requirements are met, so that the thickness of the support member 20 can be reasonably controlled.

[0230] In some embodiments, Figure 5 and Figure 6 As shown, the first connection portion 24 includes a first interface 241 and a second interface 242, and the second interface 242 is arranged opposite to the first interface 241. The first interface 241 is connected to the first fixing portion 21, and the second interface 242 is connected to the first bending portion 22. For the convenience of the following description, the direction from the first interface 241 of the first connection portion 24 to the second interface 242 is defined as the thickness direction of the first connection portion 24.

[0231] Fig.11 yes Figure 5 The diagram is a schematic diagram of the contents of the main group elements of the first metal material and the second metal material at different positions of the first connecting portion 24 of the support member 20.

[0232] In some embodiments, Fig.11The diagram shows the variation trend of the content of the main group elements of the first metal material and the content of the main group elements of the second metal material at different positions of the first connection part 24. The X-axis represents the distance from each part of the first connection part 24 to the first interface 241 in the thickness direction of the first connection part 24, and the value X1 corresponds to the distance from the second interface 242 to the first interface 241; the Y-axis represents the content ratio of the material, and the value 1 is 100%. The second metal material and the first metal material are mostly alloy materials, and the main group element of the alloy material refers to the element with the highest content in the alloy. In alloys, some other elements are usually added to change their performance and characteristics, but the content of the main group elements is the highest and plays a leading role in the properties of the alloy. The selection and content of the main group elements determine the chemical composition and basic properties of the alloy. For example, for stainless steel, iron is the main group element, and other added elements such as chromium and nickel play a role in improving corrosion resistance. In addition, for titanium alloys, titanium is the main group element; for aluminum alloys and particle-reinforced aluminum-based composites, aluminum is the main group element; for magnesium alloys and particle-reinforced magnesium-based composites, magnesium is the main group element.

[0233] See also Fig.11 , and combined with Figure 5 and Figure 6 As shown, the content of the main group element of the first metal material of the first connecting portion 24 decreases in the direction from the first fixing portion 21 to the first bending portion 22, and the content of the main group element of the second metal material increases in the direction from the first fixing portion 21 to the first bending portion 22. The direction from the first fixing portion 21 to the first bending portion 22 is parallel to the thickness direction of the first connecting portion 24.

[0234] In this embodiment, the first fixing portion 21 adopts a first metal material, and the content of the main group elements of the first metal material of the first connecting portion 24 changes from high to low in the direction from the first fixing portion 21 to the first bending portion 22. The first bending portion 22 adopts a second metal material, and the content of the main group elements of the second metal material of the first connecting portion 24 changes from low to high in the direction from the first fixing portion 21 to the first bending portion 22. Therefore, the first fixing portion 21 and the first connecting portion 24 have a good bonding effect, and the first bending portion 22 and the first connecting portion 24 have a good bonding effect. A higher connection strength can be obtained between the first fixing portion 21 and the first bending portion 22 through the first connecting portion 24, so that the overall structure of the support member 20 is more stable and reliable.

[0235] Fig.12 yes Figure 5 Schematic diagram of the metallographic structure of a partial structure of the support member 20 in some possible implementations.

[0236] In some embodiments, Fig.11As shown, the first interface 241 and the second interface 242 are visible in the metallographic structure of the support member 20. The metallographic structure of the support member 20 is the internal organizational structure of the support member 20 seen under a metallographic (optical) microscope. The resolution of the metallographic microscope can be in the micron level, for example, 0.1 micron to 0.5 micron. Since the first connecting portion 24 is an interdiffusion layer formed during the sintering process, the first metal material of the first fixing portion 21 and the second metal material of the first bending portion 22 are dissimilar metal materials, the first interface 241 connecting the first connecting portion 24 and the first fixing portion 21, and the second interface 242 connecting the first connecting portion 24 and the first bending portion 22 can be clearly observed in the metallographic structure.

[0237] Exemplarily, the first interface 241 and the second interface 242 of the first connection portion 24 can be relatively smooth interfaces, and slight bumps are allowed on the first interface 241 and the second interface 242. The overall shape of the first interface 241 and the second interface 242 can be designed according to the shape of the support member 20, for example, it can include a curved surface. Among them, since the first connection portion 24 is formed by the metal interdiffusion effect during the sintering process, the multiple regions of the first connection portion 24 arranged in its layer direction (i.e., perpendicular to the thickness direction of the first connection portion 24) are subjected to a relatively uniform force during the sintering process, so the thickness of the multiple regions is equal or approximately equal, the overall thickness of the first connection portion 24 is equal or approximately equal, and the first interface 241 and the second interface 242 can be parallel to each other or approximately parallel to each other.

[0238] like Fig.11 As shown, in the metallographic structure of the support member 20, the first interface 241 can be parallel to or approximately parallel to the second interface 242. At this time, since the various parts of the first connecting portion 24 are of equal thickness, the diffusion degree between the second metal material and the first metal material in the various parts of the first connecting portion 24 is equivalent, the bonding strength between the various parts of the first connecting portion 24 and the first fixing portion 21 is the same or approximately the same, and the bonding strength between the various parts of the first connecting portion 24 and the first bending portion 22 is also the same or approximately the same, so that the support member 20 can be effectively prevented from cracking at the place where the bonding strength between the first connecting portion 24 and the first fixing portion 21 is weak, or at the place where the bonding strength between the first connecting portion 24 and the first bending portion 22 is weak, which is beneficial to improve the overall structural stability of the support member 20 and extend the service life of the support member 20.

[0239] In some embodiments, the thickness H1 of the first connection portion 24 may satisfy: 0.1 μm (micrometer) ≤ H1 ≤ 30 μm. For example, the thickness of the first connection portion 24 may be 0.8 μm, 2 μm, 3.6 μm, 5 μm, 6 μm, 8 μm, 12 μm, 15 μm, 20 μm, etc.

[0240] In this embodiment, since the first fixing portion 21 and the first bending portion 22 are connected together by the first connecting portion 24, the thickness of the first connecting portion 24 can be greater than or equal to 0.1 μm. The first connecting portion 24 is thicker, so that the first fixing portion 21 and the first bending portion 22 can be better combined through the first connecting portion 24, which is conducive to improving the bonding strength between the first fixing portion 21 and the first bending portion 22 of the support member 20, thereby improving the overall structural stability of the support member 20. In addition, the thickness of the first connecting portion 24 can also be less than or equal to 30 μm, so that the support member 20 can meet the bonding strength requirements between the first fixing portion 21 and the first bending portion 22, while the production time is short and the production cost is low, which is conducive to large-scale production.

[0241] The thickness of the first connection part 24 can be controlled by the sintering process during the manufacturing process of the support member 20, for example, by the sintering temperature and the sintering time. When the sintering temperature is higher and the sintering time is longer, the thickness of the first connection part 24 is greater. In addition, the thickness of the first connection part 24 affects the connection strength between the first fixing part 21 and the first bending part 22. When no brittle phase is generated in the first connection part 24, the greater the thickness of the first connection part 24, the better. Of course, the thickness design of the first connection part 24 can also take into account the processing efficiency, processing cost and processing difficulty at the same time, and control the thickness of the first connection part 24 within a certain range.

[0242] In some examples, the thickness of the first connecting portion 24 may be in the range of 2 μm to 30 μm. In this case, the thickness of the first connecting portion 24 is relatively large, that is, the thickness of the bonding interface between the first fixing portion 21 and the first bending portion 22 is relatively large, so that the interface bonding strength between the first fixing portion 21 and the first bending portion 22 is high, and the risk of interface cracking is low. Therefore, the connection strength between the first fixing portion 21 and the first bending portion 22 is high, and the overall structure of the first fixing portion 21, the first connecting portion 24 and the first bending portion 22 is stable and reliable. In other examples, the thickness of the first connecting portion 24 may also be greater than or equal to 6 μm.

[0243] In some embodiments, the first fixing portion 21 may be formed by sintering powder under a hot isostatic pressing process. For example, the first fixing portion 21 may be formed by sintering powder at a sintering temperature of 500° C. to 660° C., a sintering time of 2 hours to 5 hours, and a sintering pressure greater than or equal to 100 MPa.

[0244] In this embodiment, during the process of sintering the first fixing portion 21 by powder, the first connecting portion 24 is formed by mutual diffusion of metal materials between the insert and the powder. Therefore, the first fixing portion 21 is formed under high temperature and high pressure for a relatively long time. The first connecting portion 24 can have a larger thickness so that the connection between the first fixing portion 21 and the first bending portion 22 is reliable.

[0245] In the embodiment of the present application, since the thickness of the first connection portion 24 will be affected when the first metal material and the second metal material are combined with different materials, when selecting the metal for combination of the first metal material and the second metal material, in addition to considering the requirements described above, the mutual diffusion coefficient between the metals can also be considered to meet the reliability and quantification requirements of the product, so that the first connection portion 24 can achieve a reliable connection between the first fixing portion 21 and the first bending portion 22. It can be understood that the combination of the first metal material and the second metal material can have other schemes in addition to the above-mentioned example scheme, and the embodiment of the present application does not strictly limit this.

[0246] like Figure 5 and Figure 6 As shown, in some embodiments, the third metal material used in the second fixing portion 23 is the same as the first metal material used in the first fixing portion 21. The setting method of the third metal material can refer to the setting method of the first metal material. The details are not repeated here. In addition, the structures and formation principles of the first bending portion 22, the second fixing portion 23 and the second connecting portion 25 can all refer to the structures and formation principles of the first fixing portion 21, the first bending portion 22 and the first connecting portion 24 above (according to Fig.10 and Fig.11 The details will not be described here.

[0247] In the following, several embodiments in which the third metal material is different from the first metal material will be given. It can be understood that although the third metal material used in the second fixing portion 23 is different from the first metal material used in the first fixing portion 21, the formation principles of the first bending portion 22, the second fixing portion 23 and the second connecting portion 25 are the same as the formation principles of the first fixing portion 21, the first bending portion 22 and the first connecting portion 24 described above (according to Fig.10 and Fig.11 The details are the same as those described in the previous section. The details will not be described here in detail.

[0248] It is understandable that the first metal material and the third metal material are different in the following cases:

[0249] In one case, the first metal material and the third metal material are made of the same particle-reinforced composite material, but the mass fractions of the components of the particle-reinforced composite material are different.

[0250] Exemplarily, the first metal material adopts a particle-reinforced aluminum-based composite material of 20% by mass SiC (silicon carbide) particle reinforcement phase + 80% by mass 6013 aluminum alloy matrix. The third metal material adopts a particle-reinforced aluminum-based composite material of 70% by mass SiC (silicon carbide) particle reinforcement phase + 30% by mass 6013 aluminum alloy matrix. Among them, the hardness, elastic modulus, density and thermal conductivity of the particle-reinforced aluminum-based composite material of 20% by mass SiC (silicon carbide) particle reinforcement phase + 80% by mass 6013 aluminum alloy matrix can refer to the parameters of the above implementation method. The specific details will not be repeated here.

[0251] It is understandable that the hardness of the particle reinforced aluminum-based composite material with 70% SiC (silicon carbide) particle reinforcement phase + 30% 6013 aluminum alloy matrix by mass fraction can be about 350HV, the elastic modulus can be about 240GPa, the density can be about 3.05g / cm3, and the thermal conductivity can be about 210W / m·K. Among them, the above parameters of the particle reinforced magnesium-based composite material with 20% SiC (silicon carbide) particle reinforcement phase + 80% AZ91 magnesium alloy matrix by mass fraction may be slightly different due to factors such as specific production process, material state and test method.

[0252] In another case, the first metal material and the third metal material are made of different types of particle-reinforced composite materials.

[0253] Exemplarily, the first metal material is a particle-reinforced magnesium-based composite material of SiC (silicon carbide) particle-reinforced phase + AZ91 magnesium alloy matrix. The third metal material is a particle-reinforced aluminum-based composite material of SiC (silicon carbide) particle-reinforced phase + 6013 aluminum alloy matrix.

[0254] In one embodiment, the first metal material adopts a particle-reinforced magnesium-based composite material with a SiC (silicon carbide) particle reinforcement phase of 20% by mass + a particle-reinforced magnesium-based composite material with a mass fraction of 80% of an AZ91 magnesium alloy matrix. The third metal material adopts a particle-reinforced aluminum-based composite material with a SiC (silicon carbide) particle reinforcement phase of 20% by mass + a particle-reinforced aluminum-based composite material with a mass fraction of 80% of a 6013 aluminum alloy matrix. Among them, the hardness, elastic modulus, density and thermal conductivity of the particle-reinforced magnesium-based composite material with a SiC (silicon carbide) particle reinforcement phase of 20% by mass + a particle-reinforced aluminum-based composite material with a mass fraction of 80% of an AZ91 magnesium alloy matrix and the particle-reinforced aluminum-based composite material with a mass fraction of 20% of a SiC (silicon carbide) particle reinforcement phase + a particle-reinforced aluminum-based composite material with a mass fraction of 80% of a 6013 aluminum alloy matrix can refer to the parameters of the above embodiment. The details will not be repeated here.

[0255] The above specifically introduces the structure and components of the support member 20 in some embodiments, and the following will continue to introduce the method of preparing the support member 20 in conjunction with the relevant drawings.

[0256] Fig.13 is a schematic flow chart of a method for preparing a support member 20 provided in an embodiment of the present application. Figures 14 to 17 yes Fig.13 The structure diagram of some steps in the method for preparing the support member 20 in some embodiments is shown in FIG. Figures 1 to 4 .

[0257] In some embodiments, the present application also provides a method for preparing a support member 20, which can be used to prepare the support member 20 described above (such as Figure 5 and Figure 6 The method includes but is not limited to steps S110 to S140 provided below. Figures 13 to 17 , the various steps of the method for preparing the support member 20 are introduced:

[0258] Step S110: preparing the insert 301. The insert 301 includes a first side surface 3011 and a second side surface 3012 which are arranged in opposite directions.

[0259] In some examples, such as Fig.14 As shown, the insert 301 can be obtained by stamping a metal plate. In some other examples, the insert 301 can also be obtained by other processing techniques, which is not strictly limited in the present embodiment of the application.

[0260] Step S120: Fig.15 and Fig.16 As shown, the insert 301 is placed in a jig 304 , and the first powder 302 and the second powder 303 are filled in the jig 304 . The first powder 302 and the second powder 303 are respectively located on both sides of the insert 301 and are in contact with the insert 301 to form a sintered part 30 .

[0261] For example, Fig.16 As shown, the sintered part 30 includes a first powder 302, a second powder 303 and an insert 301, wherein the first powder 302 and the second powder 303 are respectively located on both sides of the insert 301 and are respectively in contact with the first side surface 3011 and the second side surface 3012 of the insert 301. At this time, the overall shape of the first powder 302 and the second powder 303 after being filled changes with the shape of the jig 304. Therefore, by selecting a jig 304 of a suitable shape, the overall shape of the first powder 302 and the second powder 303 after being filled into the jig 304 can be controlled, and the shape of the contact interface between the insert 301 and the first powder 302 and the second powder 303 can also be controlled. The embodiment of the present application does not strictly limit the stacking shape of the first powder 302 and the second powder 303.

[0262] In some examples, the first powder 302 and the second powder 303 can be obtained through powder making, powder blending and powder mixing processes. In other examples, the first powder 302 and the second powder 303 can also be obtained through other processes, which are not strictly limited in the present embodiment.

[0263] For example, the insert 301 may be made of the second metal material. In this case, the metal sheet used to form the insert 301 is made of the second metal material. The first powder 302 is made of the first metal material. The second powder 303 is made of the third metal material.

[0264] Exemplarily, the hardness of the second metal material is greater than the hardness of the first metal material.

[0265] Exemplarily, the elastic modulus of the second metal material is greater than the elastic modulus of the first metal material.

[0266] Exemplarily, the density of the first metal material is less than the density of the second metal material.

[0267] Exemplarily, the thermal conductivity of the first metal material is greater than the thermal conductivity of the second metal material.

[0268] Exemplarily, the hardness of the second metal material may be greater than or equal to 130 HV.

[0269] Exemplarily, the elastic modulus of the second metal material is greater than or equal to 80 GPa.

[0270] Illustratively, the density of the first metal material may be less than or equal to 4.0 g / cm 3 (grams per cubic centimeter).

[0271] Exemplarily, the thermal conductivity of the first metal material is greater than or equal to 50 W / m·K (watt / meter·degree).

[0272] Exemplarily, the second metal material can be stainless steel or titanium alloy. For example, titanium alloys such as TA2, TA4, TC4, TB18, or stainless steels such as SUS301, SUS304, SUS316, SUS410, plates or powders, etc. At this time, the first bending portion 22 has a higher hardness, a higher elastic modulus and a higher yield strength. Exemplarily, the first metal material can be a particle-reinforced aluminum-based composite material, a magnesium alloy or a particle-reinforced magnesium-based composite material. At this time, the first metal material has a smaller density and a higher thermal conductivity. Among them, the particle-reinforced aluminum-based composite material can be made of silicon carbide (SiC), carbon nanotubes (CNT), chromium (Cr), aluminum oxide (Al 2 O 3 )、Titanium carbide (TiC), Boron carbide (B 4 C), silicon boride (SiB 6), titanium boride (TiB) and other reinforcing particles. Particle-reinforced magnesium-based composites can be made of silicon carbide (SiC), carbon nanotubes (CNT), chromium (Cr), aluminum oxide (Al 2 O 3 )、Titanium carbide (TiC), Boron carbide (B 4 C), silicon boride (SiB 6 ), titanium boride (TiB) and other reinforcing particles. For other details of the first metal material and the second metal material, please refer to the relevant description above and will not be repeated here.

[0273] Step S130: sintering the part to be sintered 30 to form a sintered part 40. It is to be understood that, hereinafter, the process of sintering the part to be sintered 30 may be referred to as a sintering process.

[0274] For example, Fig.17 As shown, the sintered part 40 includes a first portion 401, a second portion 402, a third portion 403, a first transition layer 404 and a second transition layer 405. The first transition layer 404 is connected between the first portion 401 and the second portion 402. The second transition layer 405 is connected between the second portion 402 and the third portion 403.

[0275] The material of the first part 401 is the first metal material, the material of the second part 402 is the second metal material, and the material of the third part 403 is the third metal material. The material of the first transition layer 404 includes the first metal material and the second metal material. The material of the second transition layer 405 includes the second metal material and the third metal material.

[0276] Exemplarily, the content of the main group elements of the first metal material in the first transition layer 404 gradually decreases in the direction from the first part 401 to the second part 402 , and the content of the main group elements of the second metal material gradually increases in the direction from the first part 401 to the second part 402 .

[0277] Exemplarily, the content of the main group elements of the second metal material in the second transition layer 405 gradually decreases in the direction from the second part 402 to the third part 403 , and the content of the main group elements of the third metal material gradually increases in the direction from the second part 402 to the third part 403 .

[0278] In this embodiment, the sintered part 30 is formed into an integrally formed sintered part 40 by an insert powder metallurgy process, the second part 402 of the sintered part 40 is formed by the insert 301, the first part 401 is formed by the first powder 302, and the third part 403 is formed by the second powder 303. The first transition layer 404 is formed at the contact interface between the insert 301 and the first powder 302, and is formed by the mutual diffusion of the first metal material and the second metal material during the sintering process. The first transition layer 404 is an interdiffusion layer with a composition gradient, so that the interface bonding strength between the first part 401 and the second part 402 can be significantly improved, so that the connection strength between the two is high, and the overall structure of the sintered part 40 is stable and reliable. In addition, the second transition layer 405 is formed at the contact interface between the insert 301 and the second powder 303, and is formed by the mutual diffusion of the second metal material and the third metal material during the sintering process. The second transition layer 405 is an interdiffusion layer with a composition gradient, which can significantly improve the interface bonding strength between the second part 402 and the third part 403, so that the connection strength between the two is high, and the overall structure of the sintered part 40 is stable and reliable.

[0279] It is understandable that the formation principle of the second transition layer 405 is the same as the formation principle of the first transition layer 404. The following description will be made by taking the first transition layer 404 as an example. The configuration of the second transition layer 405 can refer to the configuration of the first transition layer 404. The details will not be described in detail below.

[0280] It can be understood that, since the first transition layer 404 is formed by the metal interdiffusion effect during the sintering process, the multiple regions of the first transition layer 404 arranged in the layer direction (i.e., perpendicular to the thickness direction of the first transition layer 404) are subjected to relatively uniform force during the sintering process, so the thickness of the multiple regions is equal or approximately equal, the overall thickness of the first transition layer 404 is equal or approximately equal, and the two interfaces of the first transition layer 404 respectively connecting the first part 401 and the second part 402 can be parallel or approximately parallel to each other. Among them, the two interfaces of the first transition layer 404 respectively connecting the first part 401 and the second part 402 can be relatively smooth interfaces, and slight convexity and concavity are allowed to exist on the interfaces.

[0281] Exemplarily, the thickness H1 of the first transition layer 404 in the direction from the first portion 401 to the second portion 402 may satisfy: 0.1 μm (micrometer) ≤ H1 ≤ 30 μm. For example, the thickness of the first transition layer 404 may be 0.8 μm, 2 μm, 3.6 μm, 5 μm, 6 μm, 8 μm, 12 μm, 15 μm, 20 μm, etc.

[0282] In this embodiment, since the first part 401 and the second part 402 are connected together through the first transition layer 404, the thickness of the first transition layer 404 can be greater than or equal to 0.1 μm. The first transition layer 404 is thicker, so that the first part 401 and the second part 402 can be better combined through the first transition layer 404, and the connection strength between the two is high and the connection is stable. In addition, the thickness of the first transition layer 404 can also be less than or equal to 30 μm, which is conducive to shortening the production time of the sintered part 40, thereby reducing the production cost and facilitating large-scale production.

[0283] For example, in step S130, the sintered part 30 may be sintered by hot isostatic pressing (HIP). During the sintering process, the sintering pressure P1 satisfies: P1 ≥ 100 MPa, the sintering temperature T1 satisfies: 500°C (degrees Celsius) ≤ T1 ≤ 660°C, and the sintering time t1 satisfies: 2h (hours) ≤ t1 ≤ 5h.

[0284] For example, in step S110, when making the insert 301, the surface roughness of the end face of the insert 301 can be increased to increase the contact area between the insert 301 and the first powder 302, thereby increasing the bonding strength between the first part 401 and the second part 402 of the sintered part 40 formed after step S130, so as to improve the overall structural stability of the support part 20 formed subsequently.

[0285] Exemplarily, after step S120 and before step S130, the method may further include: performing cold isostatic pressing on the part to be sintered 30. After the part to be sintered 30 is subjected to cold isostatic pressing (CIP), the first powder 302 is pre-pressed to facilitate the subsequent sintering process. The pressure during the cold isostatic pressing process may be greater than or equal to 100 MPa, for example, in the range of 100 MPa to 630 MPa, the temperature may be room temperature, and the duration may be between 1 hour and 3 hours. In some other embodiments, after the part to be sintered 30 is subjected to the cold isostatic pressing process, the part to be sintered 30 may also be vacuum degassed to release the residual gas in the part to be sintered 30, thereby facilitating the subsequent sintering process.

[0286] Exemplarily, after step S130, the method may further include a step of performing a solution aging treatment on the sintered part 40. In this embodiment, after the solution aging treatment, the first portion 401 of the sintered part 40 can obtain a higher yield strength and / or hardness.

[0287] The solution aging treatment step includes: performing a solution treatment on the sintered part 40; cooling the sintered part 40; and performing an aging treatment on the sintered part 40. For example, the sintered part 40 may be firstly subjected to a solution treatment; then the sintered part 40 subjected to the solution treatment may be water quenched at room temperature to cool the sintered part 40; after the sintered part 40 is cooled to room temperature, it is then subjected to an aging treatment.

[0288] In some examples, the first metal material is an aluminum alloy or a particle-reinforced aluminum-based composite material. In the solution aging treatment, the solution temperature T2 of the solution treatment satisfies: 500°C ≤ T2 ≤ 550°C, and the solution time t2 satisfies: 15min (minutes) ≤ t2 ≤ 60min; and / or, the aging temperature T3 of the aging treatment satisfies: 170°C ≤ T3 ≤ 200°C, and the aging time t3 satisfies: 4h ≤ t3 ≤ 24h.

[0289] In other examples, the first metal material is a magnesium alloy or a particle-reinforced magnesium-based composite material. In the solution aging treatment, the solution temperature T2 of the solution treatment satisfies: 380°C ≤ T2 ≤ 420°C, and the solution time t2 satisfies: 0.5h ≤ t2 ≤ 12h; and / or, the aging temperature T3 of the aging treatment satisfies: 180°C ≤ T3 ≤ 220°C, and the aging time t3 satisfies: 1h ≤ t3 ≤ 8h.

[0290] Step S140 : processing the sintered component 40 to form the support component 20 .

[0291] For example, see Figure 5 and Figure 6 , and combined with Fig.17 As shown, in step S140, the step of processing the sintered part 40 may include: machining the sintered part 40 to form the first fixing part 21, the first bending part 22, the second fixing part 23, the first connecting part 24 and the second connecting part 25. At this time, through the step of machining, the shape and / or size of the sintered part 40 can be changed to form the first fixing part 21, the first bending part 22, the second fixing part 23, the first connecting part 24 and the second connecting part 25 with the designed shape. Among them, the first fixing part 21 is formed by the first part 401, the first bending part 22 is formed by the second part 402, and the second fixing part 23 is formed by the third part 403. The first connecting part 24 is formed by the first transition layer 404. The second connecting part 25 is formed by the second transition layer 405.

[0292] Specifically, the remaining part of the first part 401 after mechanical processing forms the first fixing part 21. The remaining part of the second part 402 after mechanical processing forms the first bending part 22. The remaining part of the third part 403 after mechanical processing forms the second fixing part 23. The remaining part of the first transition layer 404 after mechanical processing forms the first connecting part 24. The remaining part of the second transition layer 405 after mechanical processing forms the second connecting part 25. At this time, the material of the first fixing part 21 is the first metal material, the material of the first bending part 22 is the second metal material, the material of the second fixing part 23 is the third metal material, the material of the first connecting part 24 includes the first metal material and the second metal material, and the material of the second connecting part 25 includes the second metal material and the third metal material. Among them, the content of the main group element of the first metal material of the first connecting part 24 gradually decreases in the direction from the first fixing part 21 to the first bending part 22, and the content of the main group element of the second metal material gradually increases in the direction from the first fixing part 21 to the first bending part 22. The content of the main group elements of the second metal material of the second connecting portion 25 gradually decreases in the direction from the first bending portion 22 to the second fixing portion 23 , and the content of the main group elements of the third metal material gradually increases in the direction from the first bending portion 22 to the second fixing portion 23 .

[0293] In some examples, the step of machining may include an etching process. A plurality of through holes or grooves are etched in the second portion 402 of the sintered part 40, thereby forming a "bamboo writing area" and a portion of a "non-bamboo writing area" in the second portion 402 of the sintered part 40. It is understood that in other embodiments, the etching process may also be completed in step S110. Specifically, in step S110, preparing the insert 301 includes: etching a plurality of through holes or grooves in the insert 301, thereby forming a "bamboo writing area" and a portion of a "non-bamboo writing area" in the insert 301.

[0294] In some examples, the machining step may include CNC machining, mechanical polishing, and other steps. For example, CNC machining can be used to trim and slice the sintered part 40 to machine the basic shape and / or size, and then further fine-machining can be performed by mechanical polishing. In this embodiment, since the support member 20 is a one-piece sintered part 40 that is CNC machined to obtain basic structural features, there is no need to assemble multiple parts (such as conventional frames and middle plates) by riveting, welding, screwing, etc. in subsequent steps, so the dimensional accuracy and flatness accuracy of the support member 20 are relatively high.

[0295] In addition, mechanical polishing can be performed by sandblasting, wire drawing, CD grain processing and other processes. Mechanical polishing can make the surface of the support member 20 formed subsequently smoother. In the mechanical processing step, the thickness of the sintered member 40 can also be reduced so that the final support member 20 has a smaller thickness. In some other examples, the mechanical processing step may not include mechanical polishing, and the embodiment of the present application does not strictly limit this.

[0296] In some examples, the mechanical processing step may also include grinding. Then, further finishing may be performed by grinding to make the surface of the support member 20 formed subsequently smoother. The grinding process and the mechanical polishing process may be flexibly set as needed, and one of the grinding process or the mechanical polishing process may be used, or both may be used at the same time.

[0297] For example, Fig.17 As shown, in step S140, after the sintered part 40 is machined, the step of machining the sintered part 40 may further include: performing PVD treatment on at least part of the surface of the support part 20 to form an appearance decoration layer. The appearance decoration layer may decorate the support part 20 in terms of color, texture, texture, etc.

[0298] For example, Fig.17 As shown, in step S140, after the sintered part 40 is machined, the step of machining the sintered part 40 may further include: performing surface anti-corrosion treatment on at least part of the surface of the support member 20 to form a surface anti-corrosion layer. The surface anti-corrosion layer can improve the corrosion resistance and durability of the support member 20, so as to improve the reliability and service life of the support member 20.

[0299] Among them, the surface anti-corrosion treatment can adopt a chemical passivation process to form a layer of anti-corrosion chemical film, that is, a surface anti-corrosion layer, on the surface of the support member 20. The cost of chemical passivation is low. In some other examples, the surface anti-corrosion treatment can also adopt processes such as spraying, electrophoresis, and anodizing to form a coating or plating on the surface of the support member 20, which is used as a surface anti-corrosion layer.

[0300] It is understandable that in step S140, the PVD treatment process and the surface anti-corrosion treatment process are both optional processes and non-essential processes. In some other embodiments, the method for preparing the shell may not include one or more of these processes.

[0301] In the method for preparing a support member in the embodiment of the present application, a portion of the insert 301 is used to form the first bending portion 22 of the support member 20, a portion of the insert 301 and a portion of the first powder 302 are used to form the first connecting portion 24 of the support member 20, a portion of the insert 301 and a portion of the second powder 303 are used to form the second connecting portion 25 of the support member 20, another portion of the first powder 302 is used to form the first fixing portion 21 of the support member 20, and another portion of the second powder 303 is used to form the second fixing portion 23 of the support member 20. The first fixing portion 21, the first bending portion 22, the second fixing portion 23, the first connecting portion 24 and the second connecting portion 25 of the support member 20 are structural members formed in one piece by an insert powder metallurgy process. Based on the metal interdiffusion effect during the sintering process, an interdiffusion layer with a composition gradient can be formed between the first fixing portion 21 and the first bending portion 22, that is, a first connecting portion 24 in which the first metal material and the second metal material diffuse with each other can be formed, and an interdiffusion layer with a composition gradient can be formed between the first bending portion 22 and the second fixing portion 23, that is, a second connecting portion 25 in which the second metal material and the third metal material diffuse with each other can be formed. The existence of the first connecting portion 24 significantly improves the interface bonding strength between the first fixing portion 21 and the first bending portion 22, so that the connection strength between the first fixing portion 21 and the first bending portion 22 is high, and the overall structure of the first fixing portion 21, the first connecting portion 24 and the first bending portion 22 is stable and reliable. The existence of the second connecting portion 25 significantly improves the interface bonding strength between the first bending portion 22 and the second fixing portion 23, so that the connection strength between the first bending portion 22 and the second fixing portion 23 is high, and the overall structure of the first bending portion 22, the second fixing portion 23 and the second connecting portion 25 is stable and reliable.

[0302] In addition, by hot isostatic pressing the sintered part 30 in step S130, the mutual diffusion degree of the first metal material and the second metal material is effectively improved, so that the thickness of the first transition layer 404 of the sintered part 40 is relatively large, so the thickness of the first connecting part 24 of the support part 20 is relatively large, and the thickness of the bonding interface between the first fixing part 21 and the first bending part 22 is relatively large, so that the interface bonding strength between the first fixing part 21 and the first bending part 22 is high, and the risk of interface cracking is low, so the connection strength between the first fixing part 21 and the first bending part 22 is high, and the overall structure of the first fixing part 21, the first connecting part 24 and the first bending part 22 is stable and reliable. In some possible implementations, the shear strength of the first connecting part 24 at the bonding interface between the first fixing part 21 and the first bending part 22 is greater than or equal to 100 MPa, and in some implementations it can be as high as 300 MPa, which is much higher than the interface shear strength of the support part 20 formed by the stamping and forging process of the heterogeneous metal composite plate. Similarly, the first bending portion 22, the second fixing portion 23 and the second connecting portion 25 also have the same effect, which will not be described in detail here.

[0303] Furthermore, during the manufacturing process of the support member 20, the support member 20 can control the shape of the bonding interface between the first fixing portion 21 and the first bending portion 22, and the shape of the bonding interface between the first bending portion 22 and the second fixing portion 23 by controlling the shape of the jig 304. The shape control of the bonding interface is easy to implement, highly flexible, and highly accurate, so that the first fixing portion 21, the first bending portion 22, and the first connecting portion 24 have high processing accuracy when they have high connection strength, and can also make the first bending portion 22, the second fixing portion 23, and the second connecting portion 25 have high processing accuracy when they have high connection strength. In addition, since the shape of the bonding interface is easy to control, the actual thickness of the first fixing portion 21, the first bending portion 22, and the second fixing portion 23 can be close to or equal to the designed thickness when the design requirements are met, so that the thickness of the support member 20 can be reasonably controlled.

[0304] In the embodiment of the present application, the support member 20 adopts a composite structure of a first fixing portion 21, a second fixing portion 23, and a first bending portion 22. The first fixing portion 21 adopts a first metal material, the first bending portion 22 adopts a second metal material, and the second fixing portion 23 adopts a third metal material. By setting the first metal material, the second metal material, and the third metal material, the support member 20 can simultaneously take into account the characteristics of high hardness, better bendability, light weight, and high thermal conductivity.

[0305] In the embodiment of the present application, by performing solution aging treatment on the sintered part 40 after step S130, the yield strength and / or hardness of the first part 401 and the third part 403 of the sintered part 40 can be effectively improved, so that the yield strength and / or hardness of the first fixed part 21 and the second fixed part 23 of the support part 20 can be improved, and the mechanical reliability of the support part 20 is higher and the service life is longer.

[0306] Several configurations of the support member 20 are introduced above. Among them, the first fixing portion 21 and the second fixing portion 23 of the support member 20 introduced above are both a complete structural member, that is, no other structural members of different materials are embedded in the first fixing portion 21 and the second fixing portion 23. The following will further introduce several configurations of the support member 20 in detail in conjunction with the relevant drawings. New components will be embedded inside the first fixing portion 21 and the second fixing portion 23 of the support member 20 below. Specifically, the following will be described in detail in conjunction with the relevant drawings. In the following, the same technical contents as above will not be repeated.

[0307] Fig.18 yes Figure 5 The support member 20 shown is a schematic structural diagram in another embodiment.

[0308] like Fig.18As shown, the support member 20 further includes a first embedded portion 25. The first embedded portion 25 is embedded in the first fixing portion 21. The first embedded portion 25 is made of a fourth metal material. The hardness of the fourth metal material is higher than that of the first metal material, and / or the thermal conductivity of the fourth metal material is higher than that of the first metal material.

[0309] It can be understood that the first embedded portion 25 is embedded in the first fixed portion 21, including the following situations: in one situation, the entire periphery of the first embedded portion 25 is surrounded by the first fixed portion 21, that is, the entire periphery of the first embedded portion 25 is connected to the first fixed portion 21; in another situation, part of the periphery of the first embedded portion 25 is surrounded by the first fixed portion 21, that is, part of the periphery of the first embedded portion 25 is surrounded by the first fixed portion 21.

[0310] It can be understood that there are various implementations for achieving a solution in which the hardness of the fourth metal material is higher than the hardness of the first metal material, and / or the thermal conductivity of the fourth metal material is higher than the thermal conductivity of the first metal material.

[0311] In one embodiment, the fourth metal material and the first metal material include the same chemical components, and the mass fractions of the chemical components of the fourth metal material are different from the mass fractions of the chemical components of the first metal material. In other words, when the fourth metal material and the first metal material include the same chemical components, the mass fractions of the chemical components of the first metal material can be changed so that the hardness of the fourth metal material is higher than that of the first metal material, and / or the thermal conductivity of the fourth metal material is higher than that of the first metal material.

[0312] Exemplarily, the first metal material adopts a particle-reinforced aluminum-based composite material of 50% by mass SiC (silicon carbide) particle reinforcement phase + 50% by mass 6013 aluminum alloy matrix. The fourth metal material adopts a particle-reinforced aluminum-based composite material of 70% by mass SiC (silicon carbide) particle reinforcement phase + 30% by mass 6013 aluminum alloy matrix. Alternatively, the first metal material adopts a particle-reinforced aluminum-based composite material of 20% by mass SiC (silicon carbide) particle reinforcement phase + 80% by mass 6013 aluminum alloy matrix. The fourth metal material adopts a particle-reinforced aluminum-based composite material of 70% by mass SiC (silicon carbide) particle reinforcement phase + 30% by mass 6013 aluminum alloy matrix. In this way, compared with the mass fraction of the SiC (silicon carbide) particle reinforcement phase of the first metal material, the mass fraction of the SiC (silicon carbide) particle reinforcement phase of the fourth metal material is higher, which is conducive to greatly improving the hardness and thermal conductivity of the first embedded portion 25.

[0313] In one embodiment, the first embedded portion 25 uses a fourth metal material. The chemical composition of the fourth metal material is different from that of the first metal material, that is, the fourth metal material and the first metal material are different materials. Exemplarily, the first metal material uses a particle-reinforced aluminum-based composite material of 50% by mass SiC (silicon carbide) particle reinforcement phase + 50% by mass 6013 aluminum alloy matrix. The fourth metal material uses TA4 titanium alloy. Or the first metal material uses a particle-reinforced aluminum-based composite material of 50% by mass SiC (silicon carbide) particle reinforcement phase + 50% by mass 6013 aluminum alloy matrix. The fourth metal material uses SUS316 stainless steel. In this way, the fourth metal material of this embodiment adopts a material with higher hardness or higher elastic modulus.

[0314] It is understandable that the above text specifically introduces the material setting of the first embedded portion 25 in combination with the relevant drawings. It is understandable that the first embedded portion 25 has different formation methods according to different material settings.

[0315] In one embodiment, when the fourth metal material and the first metal material include the same chemical components, and the mass fractions of the chemical components of the fourth metal material are different from the mass fractions of the chemical components of the first metal material, the fourth metal material can be integrated with the first metal material and formed with the insert by an insert powder metallurgy process. Exemplarily, the first bending portion 22 is formed by an insert made of the second metal material, the first fixing portion 21 is formed by sintering the powder of the first metal material, the first embedded portion 25 is formed by sintering the powder of the fourth metal material, and the first connecting portion 24 is formed by mutual diffusion of the second metal material and the first metal material.

[0316] Fig.19 and Fig. 20 yes Fig.13 The structure diagram of some steps in the method for preparing the support member 20 in some embodiments is shown in FIG. Figures 1 to 2 .

[0317] It can be understood that the preparation method of the support member 20 of this embodiment is roughly the same as the preparation method of the support member 20 provided above ( Figures 13 to 17 ) are roughly the same. The same technical contents will not be repeated:

[0318] like Fig.19 As shown, in step S120 , the step of forming the to-be-sintered part 30 may include: filling the third powder 305 into the jig 304 , wherein the first powder 302 surrounds the third powder 305 , and the first powder 302 is connected to the third powder 305 .

[0319] In this embodiment, the sintered component 30 further includes a third powder 305. The first powder 302 surrounds the third powder 305, and the first powder 302 is connected to the third powder 305. Exemplarily, the third powder 305 is made of a fourth metal material.

[0320] like Fig. 20 As shown, after step S130: sintering the to-be-sintered part 30, a sintered part 40 is formed. In this way, the sintered part 40 includes a fourth part 406. The first part 401 surrounds the fourth part 406, and the first part 401 is connected to the fourth part 406. It can be understood that, since the fourth metal material and the first metal material include the same chemical components, the fourth part 406 formed by the fourth metal material and the first part 401 formed by the first metal material have a better interface bonding strength, so that the connection strength between the fourth part 406 and the first part 401 is high, and the overall structure of the fourth part 406 and the first part 401 is stable and reliable.

[0321] like Fig.18 As shown, after step S140: processing the sintered part 40, the support part 20 is formed. In this way, the support part 20 includes a first embedded part 25. The first fixing part 21 surrounds the first embedded part 25, and the first fixing part 21 is connected to the first embedded part 25, that is, the first embedded part 25 is embedded on the first fixing part 21.

[0322] Exemplarily, the step of machining the sintered part 40 may include: machining the fourth portion 406 of the sintered part 40 to form the first embedded portion 25. At this time, the shape and / or size of the fourth portion 406 of the sintered part 40 may be changed through the machining step to form the first embedded portion 25 having a designed shape. At this time, the material of the first embedded portion 25 is the fourth metal material.

[0323] Fig.21 yes Figure 5 The support member 20 shown is a schematic structural diagram in yet another embodiment.

[0324] In another embodiment, if Fig.21 As shown, the first embedded portion 25 adopts a fourth metal material. The fourth metal material and the first metal material are different materials. The fourth metal material and the first metal material can be formed by an insert powder metallurgy process. Exemplarily, the first embedded portion 25 is formed by an insert using the fourth metal material, and the first fixed portion 21 is formed by sintering the powder of the first metal material. It can be understood that when the fourth metal material and the first metal material are formed by the insert powder metallurgy process, a first sub-connection portion 26 is formed between the first embedded portion 25 and the first fixed portion 21. Among them, the first sub-connection portion 26 is formed by the mutual diffusion of the fourth metal material and the first metal material. The first sub-connection portion 26 includes a fourth metal material and a first metal material.

[0325] It can be understood that in this embodiment, since the first fixing portion 21, the first sub-connecting portion 26 and the first embedded portion 25 of the support member 20 are integrally formed structural parts formed by the insert powder metallurgy process, based on the metal interdiffusion effect during the sintering process, an interdiffusion layer with a composition gradient can be formed between the first embedded portion 25 formed by the insert and the first fixing portion 21 formed by the powder, that is, the first sub-connecting portion 26 in which the fourth metal material and the first metal material diffuse with each other is formed. At this time, the formation of the first sub-connecting portion 26 significantly improves the interface bonding strength between the first fixing portion 21 and the first embedded portion 25, so that the connection strength between the first fixing portion 21 and the first embedded portion 25 is high, and the overall structure of the first fixing portion 21, the first sub-connecting portion 26 and the first embedded portion 25 is stable and reliable. In this embodiment, the structure and formation principle of the first fixing portion 21, the first sub-connecting portion 26 and the first embedded portion 25 can refer to the structure and formation principle of the first fixing portion 21, the first connecting portion 24 and the first bending portion 22 of the support member 20 above. The details will not be repeated here.

[0326] Figure 22 to Figure 24 yes Fig.13 The structure diagram of some steps in the method for preparing the support member 20 in some embodiments is shown in FIG. Figures 1 to 2 .

[0327] The method for preparing the support member 20 of this embodiment is roughly the same as the method for preparing the support member 20 provided above ( Figures 13 to 17 ) are roughly the same. The same technical contents will not be repeated:

[0328] like Fig. 22 As shown, after step S110, the step of preparing the insert 301 may further include: preparing a first sub-insert 901. Exemplarily, the first sub-insert 901 may be obtained by stamping a metal sheet. In some other examples, the first sub-insert 901 may also be obtained by other processing techniques, which is not strictly limited in the present embodiment of the application. Of course, in other embodiments, the step of preparing the first sub-insert 901 may also be before the step of preparing the insert 301.

[0329] like Fig. 22 and Fig.23As shown, in step S120, the step of forming the sintered part 30 may include: placing the first sub-insert 901 in the jig 304 and being located on one side of the insert 301. The first powder 302 surrounds the first sub-insert 901 and contacts the first sub-insert 901. Exemplarily, the first sub-insert 901 is made of a fourth metal material. The fourth metal material may be stainless steel or a titanium alloy. For example, titanium alloys such as TA2, TA4, TC4, and TB18, or stainless steels such as SUS301, SUS304, SUS316, and SUS410, the fourth metal material is a plate structure.

[0330] In this embodiment, the to-be-sintered component 30 further includes a first sub-insert 901 . The first powder 302 surrounds the first sub-insert 901 , and the first powder 302 is in contact with the first sub-insert 901 .

[0331] like Fig.23 and Fig.24 As shown, after step S130: sintering the part to be sintered 30, a sintered part 40 is formed. In this way, the sintered part 40 includes a fourth part 406 and a third transition layer 404. The first part 401 surrounds the fourth part 406, and the fourth part 406 is connected to the first part 401 through the third transition layer 404. It can be understood that the structure and formation principle of the third transition layer 404 are the same as the structure and formation principle of the first transition layer 404. The details are not repeated here. In this embodiment, the part to be sintered 30 is formed into an integrally formed sintered part 40 by an insert powder metallurgy process, and the fourth part 406 of the sintered part 40 can be formed by the first sub-insert 901. The third transition layer 404 can be formed at the contact interface between the first sub-insert 901 and the first powder 302.

[0332] like Fig.21 and Fig.24 As shown, after step S140: processing the sintered part 40, the support part 20 is formed. In this way, the support part 20 includes a first embedded part 25 and a first sub-connecting part 26. The first fixing part 21 surrounds the first embedded part 25, and the first sub-connecting part 26 connects the first embedded part 25 and the first fixing part 21, that is, the first embedded part 25 and the first sub-connecting part 26 are embedded on the first fixing part 21.

[0333] Specifically, the remaining portion of the fourth portion 406 after mechanical processing forms the first embedded portion 25. The remaining portion of the third transition layer 404 after mechanical processing forms the first sub-connection portion 26. At this time, the material of the first embedded portion 25 is the fourth metal material.

[0334] like Fig.18 and Fig.21As shown, the support member 20 may further include a second embedded portion 27. The second embedded portion 27 is embedded in the second fixing portion 23. The hardness of the second embedded portion 27 is higher than the hardness of the second fixing portion 23, and / or the thermal conductivity of the second embedded portion 27 is higher than the thermal conductivity of the second fixing portion 23. It is understood that the arrangement of the second embedded portion 27 is similar to or the same as the arrangement of the first embedded portion 25. The details are not repeated here.

[0335] The above text, in conjunction with the relevant drawings, specifically introduces the solution that the support member 20 further includes the first embedded portion 25 and / or the second embedded portion 27. The following text will take the support member 20 including the first embedded portion 25 as an example to list some material settings of the relevant parts of the support member 20.

[0336] In the first embodiment, the first metal material, the third metal material and the fourth metal material all use a particle-reinforced aluminum-based composite material of 50% by mass SiC (silicon carbide) particle reinforcement phase + 50% by mass 6013 aluminum alloy matrix. The second metal material uses TA4 titanium alloy. Since the fourth metal material is the same as the third metal material, the support member 20 is not provided with a first embedded portion 25 formed by the fourth metal material. The hardness, elastic modulus, density and thermal conductivity of each metal material have been introduced above. The details will not be repeated here.

[0337] It is understood that the overall density of the support member 20 may be approximately 3.1 g / cm 3 , not in the bamboo book area (that is, in Fig. 9 and Fig.10 In the embodiment, the elastic modulus of the support member 20 (excluding the first main bending zone 223) can be about 180GPa, the hardness can be about 280HV, and the thermal conductivity can be about 200W / (m·℃). Compared with the solution that the material of the support member 20 is all stainless steel, the mass of the support member 20 of this embodiment can be reduced by about 61%, the hardness of the non-bamboo book area of ​​the support member 20 can be increased by about 12%, and the heat dissipation capacity can be increased by about 12 times, while not affecting the bamboo book area of ​​the support member 20 (that is, in the Fig. 9 and Fig.10 In addition, compared with the solution that the material of the support member 20 is entirely made of titanium alloy, the mass of the support member 20 of this embodiment can be reduced by approximately 31%, the elastic modulus of the non-bamboo book area of ​​the support member 20 can be increased by approximately 64%, and the heat dissipation capacity can be increased by approximately 28 times, without affecting the screen reliability of the bamboo book area. Compared with the solution that the material of the support member 20 is entirely made of carbon fiber resin, the elastic modulus of the non-bamboo book area of ​​the support member 20 of this embodiment can be increased by approximately 1.6 times, and the heat dissipation capacity can be increased by approximately 100 times. In addition, the screen reliability of the bamboo book area of ​​the support member 20 is better, and the light and shadow effects are better.

[0338] The second embodiment, the same technical content as the above embodiments will not be repeated: the first metal material and the fourth metal material use a particle-reinforced aluminum-based composite material of 20% SiC (silicon carbide) particle reinforcement phase + 80% 6013 aluminum alloy matrix by mass. The second metal material uses TA4 titanium alloy. The third metal material uses a particle-reinforced aluminum-based composite material of 70% SiC (silicon carbide) particle reinforcement phase + 30% 6013 aluminum alloy matrix by mass.

[0339] It is understood that the overall density of the support member 20 may be approximately 3.08 g / cm 3 , the elastic modulus of the non-bamboo book area can be about 240GPa, the hardness can be about 350HV, and the thermal conductivity can be about 210W / (m·℃). Compared with the solution that the material of the support 20 is all stainless steel, the mass of the support 20 of this embodiment can be reduced by about 61%, the hardness of the non-bamboo book area of ​​the support 20 can be increased by about 24%, the heat dissipation capacity can be increased by about 12 times, and the hardness can be increased by about 40%, while the screen reliability of the bamboo book area of ​​the support 20 is not affected. In addition, compared with the solution that the material of the support 20 is all titanium alloy, the mass of the support 20 of this embodiment can be reduced by about 32%, the elastic modulus of the non-bamboo book area of ​​the support 20 can be increased by about 1.2 times, the hardness can be increased by about 25%, and the heat dissipation capacity can be increased by about 50 times, while the screen reliability of the bamboo book area is not affected. Compared with the solution that the material of the support 20 is all carbon fiber resin, the elastic modulus of the non-bamboo book area of ​​the support 20 of this embodiment can be increased by about 2.4 times, and the heat dissipation capacity can be increased by about 174 times. In addition, the screen reliability of the bamboo book area of ​​the support member 20 is better and the light and shadow effects are better.

[0340] The third embodiment, the same technical content as the above embodiments will not be repeated: the first metal material and the third metal material are both made of SiC (silicon carbide) particle reinforcement phase with a mass fraction of 50% + 6013 aluminum alloy matrix particle reinforcement aluminum matrix composite material with a mass fraction of 50%. The second metal material is TA4 titanium alloy. The fourth metal material is made of SiC (silicon carbide) particle reinforcement phase with a mass fraction of 70% + 6013 aluminum alloy matrix particle reinforcement aluminum matrix composite material with a mass fraction of 30%.

[0341] It can be understood that this embodiment can achieve the three advantages over the traditional solutions introduced in the first embodiment, and because the elastic modulus, hardness and thermal conductivity of the fourth metal material are higher than the elastic modulus, hardness and thermal conductivity of the first metal material, the screen reliability and heat dissipation capacity of the first embedded part 25 made of the fourth metal material are better than those of the first embodiment.

[0342] The fourth embodiment, the same technical contents as the above embodiments are not repeated: the first metal material and the third metal material are both made of a particle-reinforced aluminum matrix composite material of 50% by mass SiC (silicon carbide) particle reinforcement phase + 50% by mass 6013 aluminum alloy matrix. The second metal material and the fourth metal material are both made of TA4 titanium alloy.

[0343] It can be understood that this embodiment can achieve the three solutions described in the first embodiment that are superior to the traditional ones, and at the same time, due to the higher hardness of the fourth metal material, the screen reliability of the first embedded part 25 made of the fourth metal material is better.

[0344] The fifth embodiment, the same technical contents as the above embodiments are not repeated: the first metal material and the third metal material are both made of a particle-reinforced aluminum-based composite material of 50% by mass SiC (silicon carbide) particle reinforcement phase + 50% by mass 6013 aluminum alloy matrix. The second metal material is TA4 titanium alloy. The fourth metal material is SUS316 stainless steel. The hardness, elastic modulus, density and thermal conductivity of each metal material have been introduced above. The details are not repeated here.

[0345] It can be understood that, while the present embodiment can achieve the three advantages over the traditional solutions introduced in the first embodiment, the elastic modulus of the fourth metal material is higher than the elastic modulus of the first metal material, so that the first embedded portion 25 made of the fourth metal material has better ability to resist deformation than the support member 20 of the first embodiment.

[0346] The sixth embodiment, the same technical contents as the above embodiments are not repeated: the first metal material adopts a particle-reinforced aluminum-based composite material of 20% SiC (silicon carbide) particle reinforcement phase + 80% 6013 aluminum alloy matrix by mass fraction. The second metal material adopts TA4 titanium alloy. The third metal material adopts a particle-reinforced aluminum-based composite material of 70% SiC (silicon carbide) particle reinforcement phase + 30% 6013 aluminum alloy matrix by mass fraction. Since the fourth metal material is the same as the third metal material, the support member 20 is not provided with a first embedded portion 25 formed by the fourth metal material.

[0347] It can be understood that this embodiment can realize the three solutions introduced in the second embodiment that are superior to the traditional ones.

[0348] The seventh embodiment, the same technical content as the above embodiments is not repeated: the first metal material and the fourth metal material are a particle-reinforced magnesium-based composite material of 20% SiC (silicon carbide) particle reinforcement phase + 80% AZ91 magnesium alloy matrix by mass fraction. The second metal material is TA4 titanium alloy. The third metal material is a particle-reinforced aluminum-based composite material of 20% SiC (silicon carbide) particle reinforcement phase + 80% 6013 aluminum alloy matrix by mass fraction.

[0349] It can be understood that this embodiment can achieve the three solutions introduced in the first embodiment that are superior to the traditional ones, and at the same time, due to the lighter weight of the first metal material and the fourth metal material, the first fixing part 21 made of the first metal material and the first embedded part 25 made of the fourth metal material can be lighter in weight.

[0350] The eighth embodiment, the same technical content as the above embodiments is not repeated: the first metal material adopts a particle-reinforced magnesium-based composite material of 20% SiC (silicon carbide) particle reinforcement phase + 80% AZ91 magnesium alloy matrix by mass fraction. The second metal material and the fourth metal material adopt TA4 titanium alloy. The third metal material adopts a particle-reinforced aluminum-based composite material of 20% SiC (silicon carbide) particle reinforcement phase + 80% 6013 aluminum alloy matrix by mass fraction.

[0351] It can be understood that this embodiment can achieve the three solutions introduced in the seventh embodiment that are superior to the traditional ones, and at the same time, due to the higher hardness of the fourth metal material, the screen reliability of the first embedded part 25 made of the fourth metal material is better.

[0352] In the ninth embodiment, the same technical contents as those in the above embodiments are not repeated: the first metal material, the third metal material and the fourth metal material are all made of a particle-reinforced aluminum-based composite material of 50% by mass SiC (silicon carbide) particle reinforcement phase + 50% by mass 6013 aluminum alloy matrix. The second metal material is SUS316 stainless steel. Since the fourth metal material is the same as the third metal material, the support member 20 is not provided with a first embedded portion 25 formed by the fourth metal material.

[0353] It can be understood that in this embodiment, since the elastic modulus of the second metal material is relatively high, the first bent portion 22 made of the second metal material has a better ability to resist deformation.

[0354] The tenth embodiment, the same technical contents as the above embodiments are not repeated: the first metal material and the fourth metal material adopt a particle-reinforced aluminum-based composite material of 20% SiC (silicon carbide) particle reinforcement phase + 80% 6013 aluminum alloy matrix by mass fraction. The second metal material adopts SUS316 stainless steel. The third metal material adopts a particle-reinforced aluminum-based composite material of 70% SiC (silicon carbide) particle reinforcement phase + 30% 6013 aluminum alloy matrix by mass fraction.

[0355] It can be understood that in this embodiment, since the elastic modulus of the second metal material is relatively high, the first bent portion 22 made of the second metal material has a better ability to resist deformation.

[0356] In the eleventh embodiment, the same technical contents as those in the above embodiments are not repeated: the first metal material and the third metal material both use a particle-reinforced aluminum-based composite material of 50% by mass SiC (silicon carbide) particle reinforcement phase + 50% by mass 6013 aluminum alloy matrix. The second metal material uses SUS316 stainless steel. The fourth metal material uses a particle-reinforced aluminum-based composite material of 70% by mass SiC (silicon carbide) particle reinforcement phase + 30% by mass 6013 aluminum alloy matrix.

[0357] It can be understood that in this embodiment, since the elastic modulus of the second metal material is relatively high, the first bent portion 22 made of the second metal material has a better ability to resist deformation.

[0358] The twelfth embodiment, the same technical contents as the above embodiments are not repeated: the first metal material and the third metal material are both made of a particle-reinforced aluminum matrix composite material of 50% by mass SiC (silicon carbide) particle reinforcement phase + 50% by mass 6013 aluminum alloy matrix. The second metal material is SUS316 stainless steel. The fourth metal material is TA4 titanium alloy.

[0359] It can be understood that in this embodiment, since the elastic modulus of the second metal material is relatively high, the first bent portion 22 made of the second metal material has a better ability to resist deformation.

[0360] The thirteenth embodiment, the same technical contents as the above embodiments are not repeated: the first metal material and the third metal material are both made of a particle-reinforced aluminum-based composite material of 50% by mass SiC (silicon carbide) particle reinforcement phase + 50% by mass 6013 aluminum alloy matrix. The second metal material and the fourth metal material are made of SUS316 stainless steel.

[0361] It can be understood that in this embodiment, since the elastic modulus of the second metal material is relatively high, the first bent portion 22 made of the second metal material has a better ability to resist deformation.

[0362] The fourteenth embodiment, the same technical contents as the above embodiments are not repeated: the first metal material adopts a particle-reinforced aluminum-based composite material of 20% by mass SiC (silicon carbide) particle reinforcement phase + 80% by mass 6013 aluminum alloy matrix. The second metal material adopts SUS316 stainless steel. The third metal material and the fourth metal material adopt a particle-reinforced aluminum-based composite material of 70% by mass SiC (silicon carbide) particle reinforcement phase + 30% by mass 6013 aluminum alloy matrix. Since the fourth metal material is the same as the third metal material, the support member 20 is not provided with a first embedded portion 25 formed by the fourth metal material.

[0363] It can be understood that in this embodiment, since the elastic modulus of the second metal material is relatively high, the first bent portion 22 made of the second metal material has a better ability to resist deformation.

[0364] In the fifteenth embodiment, the same technical contents as those in the above embodiments are not repeated: the first metal material and the fourth metal material both use a particle-reinforced magnesium-based composite material of 20% by mass SiC (silicon carbide) particle reinforcement phase + 80% by mass AZ91 magnesium alloy matrix. The second metal material uses SUS316 stainless steel. The third metal material uses a particle-reinforced aluminum-based composite material of 20% by mass SiC (silicon carbide) particle reinforcement phase + 80% by mass 6013 aluminum alloy matrix.

[0365] It can be understood that in this embodiment, since the elastic modulus of the second metal material is relatively high, the first bent portion 22 made of the second metal material has a better ability to resist deformation.

[0366] The sixteenth embodiment, the same technical contents as the above embodiments are not repeated: the first metal material is a particle-reinforced magnesium-based composite material of 20% SiC (silicon carbide) particle reinforcement phase + 80% AZ91 magnesium alloy matrix by mass fraction. The second metal material is SUS316 stainless steel. The third metal material is a particle-reinforced aluminum-based composite material of 20% SiC (silicon carbide) particle reinforcement phase + 80% 6013 aluminum alloy matrix by mass fraction. The fourth metal material is TA4 titanium alloy.

[0367] It can be understood that in this embodiment, since the elastic modulus of the second metal material is relatively high, the first bent portion 22 made of the second metal material has a better ability to resist deformation.

[0368] It is understandable that the electronic device 1000 described above is described by taking the folding once as an example. In other embodiments, the electronic device 1000 may also be folded twice or more. The technical contents that are mostly the same as those described above are not repeated in this embodiment.

[0369] Fig.25 It is a structural schematic diagram of the electronic device 1000 provided in an embodiment of the present application in an unfolded state. Fig.26 yes Fig.25 The structure diagram of an implementation example of an electronic device 1000 in a first folded state is shown. Fig. 27 yes Fig.25 The structure diagram of an implementation example of the electronic device 1000 shown is in a second folding state.

[0370] like Figure 25 to Figure 27 As shown, the present application provides an electronic device 1000 that can be folded more than once. Figure 25 to Figure 27 The electronic device 1000 of the illustrated embodiment is still described by taking a mobile phone as an example. For ease of description, illustratively, the thickness direction of the electronic device 1000 is defined as the Z-axis direction, and the extension direction of the rotation axis of the electronic device 1000 is the Y-axis direction, that is, the width direction of the electronic device 1000 is the Y-axis direction. The direction perpendicular to the Y-axis direction and the Z-axis direction is the X-axis direction, that is, the length direction of the electronic device 1000 is the X-axis. Exemplarily, the X-axis direction is defined as the first direction, and the Y-axis direction is defined as the second direction. In other embodiments, the first direction and the second direction can also be flexibly set according to demand, as long as the first direction and the second direction are different.

[0371] It is understandable that the coordinate system of the electronic device 1000 can also be flexibly set according to specific needs. In this embodiment, when the direction of the rotation axis of the electronic device 1000 is the Y-axis direction, the electronic device 1000 can be relatively unfolded or folded along the Y-axis direction. In this way, when the electronic device 1000 is in the second folded state, the size of the electronic device 1000 in the X-axis direction becomes smaller.

[0372] Fig.28 yes Fig.25 A partially exploded view of one embodiment of an electronic device 1000 is shown. Fig.29 yes Fig. 27 A partial cross-sectional view of an embodiment of an electronic device is shown at line BB.

[0373] See also Fig.28 and Fig.29 , and combined with Figure 25 to Figure 27As shown, the electronic device 1000 includes a display module 100, a first housing 210, a second housing 220, a third housing 230, a first folding mechanism 310, and a second folding mechanism 320. The first housing 210, the second housing 220, the third housing 230, the first folding mechanism 310, and the second folding mechanism 320 may constitute a housing device 300 of the electronic device 1000.

[0374] In addition, the first folding mechanism 310 connects the first housing 210 and the second housing 220. The first folding mechanism 310 is used to relatively unfold or fold the first housing 210 and the second housing 220. The second folding mechanism 320 connects the second housing 220 and the third housing 230. The second folding mechanism 320 is used to relatively unfold or fold the second housing 220 and the third housing 230. It can be understood that in the present application, by providing the first folding mechanism 310 and the second folding mechanism 320 in the electronic device 1000, the electronic device 1000 can be folded multiple times. Among them, the first folding mechanism 310 can be an inner folding mechanism. The second folding mechanism 320 can be an outer folding mechanism. The inner folding mechanism refers to a folding mechanism that can fold at least part of the display module 100 between the two housings. The outer folding mechanism refers to a folding mechanism that can fold at least part of the display module 100 to the outside of the housing. In other embodiments, the first folding mechanism 310 can also be an outer folding mechanism. The second folding mechanism 320 can also be an inner folding mechanism. Specifically, this application does not limit it.

[0375] In this embodiment, the first folding mechanism 310 is an inner folding mechanism, and the second folding mechanism 320 is an outer folding mechanism.

[0376] See also Fig.28 , and combined with Fig.25 As shown, when the first housing 210, the second housing 220, the third housing 230, the first folding mechanism 310 and the second folding mechanism 320 are relatively unfolded to the unfolded state, the electronic device 1000 is in the unfolded state. Exemplarily, when the electronic device 1000 is in the unfolded state, the first housing 210, the second housing 220, the third housing 230, the first folding mechanism 310 and the second folding mechanism 320 can be arranged along the X-axis direction and can be approximately 180° (slight deviation is allowed, such as 165°, 177° or 185°, etc.).

[0377] See also Fig.26 , and combined with Fig.28As shown, when the first housing 210, the second housing 220, the third housing 230, the first folding mechanism 310 and the second folding mechanism 320 are relatively folded to the first folding state, the electronic device 1000 is in the first folding state. Exemplarily, when the electronic device 1000 is in the first folding state, the first housing 210, the second housing 220 and the first folding mechanism 310 can be arranged along the X-axis direction, and can be approximately 180° (slight deviation is allowed, such as 165°, 177° or 185°, etc.), the second housing 220 and the third housing 230 can be close to each other, and the second housing 220 and the third housing 230 are stacked in the thickness direction of the electronic device 1000.

[0378] See also Fig.29 , and combined with Fig. 27 As shown, when the first shell 210, the second shell 220, the third shell 230, the first folding mechanism 310 and the second folding mechanism 320 are relatively folded to the second folding state, the electronic device 1000 is in the second folding state. Exemplarily, when the electronic device 1000 is in the second folding state, the first shell 210 and the second shell 220 can be close to each other, and the first shell 210 and the second shell 220 are stacked in the thickness direction of the electronic device 1000; the second shell 220 and the third shell 230 can be close to each other, and the second shell 220 and the third shell 230 are stacked in the thickness direction of the electronic device 1000, and the second shell 220 is stacked between the first shell 210 and the third shell 230. At this time, the first shell 210, the second shell 220 and the third shell 230 can be arranged along the Z-axis direction. When the first shell 210 and the second shell 220 are converted from the first folding state to the second folding state, the first folding mechanism 310 can enclose the accommodating space 3104. It is understandable that first folding mechanisms 310 of different structures have accommodating spaces 3104 of different shapes. The present application does not limit the specific structures of the first folding mechanism 310 and the second folding mechanism 320 .

[0379] See also Fig.28 and Fig.29 , and combined with Figure 25 to Figure 27 As shown, the display module 100 includes a first portion 100A, a second portion 100B, a third portion 100C, a fourth portion 100D, and a fifth portion 100E connected in sequence. The second portion 100B is connected between the first portion 100A and the third portion 100C. The third portion 100C is connected between the second portion 100B and the fourth portion 100D. The fourth portion 100D is connected between the third portion 100C and the fifth portion 100E. For example, Fig.25 and Fig.28The arrangement of the first part 100A, the second part 100B, the third part 100C, the fourth part 100D and the fifth part 100E along the X-axis direction is taken as an example for illustration.

[0380] Among them, the first part 100A of the display module 100 can be fixed on the first shell 210. The third part 100C can be fixed on the second shell 220. The fifth part 100E can be fixed on the third shell 230. It can be understood that when the first folding mechanism 310 makes the first shell 210 and the second shell 220 relatively unfold or fold, the first shell 210 can drive the first part 100A of the display module 100 to unfold or fold relative to the third part 100C, and the second shell 220 can drive the third part 100C of the display module 100 to unfold or fold relative to the first part 100A. At this time, the second part 100B of the display module 100 can be bent. When the second folding mechanism 320 causes the second housing 220 and the third housing 230 to be relatively unfolded or folded, the second housing 220 can drive the third portion 100C of the display module 100 to be unfolded or folded relative to the fifth portion 100E, and the third housing 230 can drive the fifth portion 100E of the display module 100 to be unfolded or folded relative to the third portion 100C. At this time, the fourth portion 100D of the display module 100 can be bent.

[0381] like Fig.25 and Fig.28 As shown, when the electronic device 1000 is in the unfolded state, the display module 100 can be in the unfolded state. Exemplarily, the first part 100A, the second part 100B, the third part 100C, the fourth part 100D and the fifth part 100E of the display module 100 can be approximately 180° (slight deviation is allowed, such as 165°, 177° or 185°). At this time, the display module 100 has a continuous large-area display area, that is, the display module 100 can achieve large-screen display, and the user experience is better.

[0382] For example, when the electronic device 1000 is in the unfolded state, at least part of the first folding mechanism 310 can be used to support the second part 100B, and at least part of the second folding mechanism 320 can be used to support the fourth part 100D. In this way, when the second part 100B and the fourth part 100D of the display module 100 are subjected to pressing force, extrusion force or impact force, the first folding mechanism 310 and the second folding mechanism 320 can be used to improve the pressure resistance and impact resistance of the second part 100B and the fourth part 100D, that is, to ensure that the second part 100B and the fourth part 100D are not prone to dents and other problems.

[0383] See also Fig.26 , and combined with Fig.25, when the electronic device 1000 is in the first folding state, the display module 100 can be in the first folding state. Among them, the first part 100A, the second part 100B, the third part 100C, the fourth part 100D and the fifth part 100E of the display module 100 are all located outside the electronic device 1000. At this time, the first part 100A, the second part 100B, the third part 100C, the fourth part 100D and the fifth part 100E of the display module 100 are folded into the outer screen of the electronic device 1000. Exemplarily, the first part 100A, the second part 100B and the third part 100C of the display module 100 can be approximately 180° (slight deviation is allowed, such as 165°, 177° or 185°). The third part 100C and the fifth part 100E of the display module 100 are arranged close to each other. At this time, the third part 100C and the fifth part 100E of the display module 100 can be arranged along the Z-axis direction. In addition, the fourth portion 100D of the display module 100 is bent.

[0384] like Fig. 27 and Fig.29 As shown, when the electronic device 1000 is in the second folded state, the display module 100 can be in the second folded state. Exemplarily, the first part 100A and the third part 100C of the display module 100 are arranged close to each other, and the third part 100C and the fifth part 100E of the display module 100 are arranged close to each other. At this time, the first part 100A, the third part 100C and the fifth part 100E of the display module 100 can be arranged along the Z-axis direction. In addition, the second part 100B and the fourth part 100D of the display module 100 are bent.

[0385] Exemplarily, when the electronic device 1000 is in the second folding state, the first part 100A, the second part 100B and the third part 100C of the display module 100 are all located between the first shell 210 and the second shell 220, and the second part 100B is located in the accommodating space 3104 of the first folding mechanism 310, the fourth part 100D and the fifth part 100E of the display module 100 are both located outside the second folding mechanism 320 and the third shell 230 (that is, the outside of the electronic device 1000), and the fifth part 100E of the display module 100 is located on the side of the third shell 230 away from the second shell 220. Among them, when the electronic device 1000 is in the second folding state, since the first part 100A, the second part 100B and the third part 100C of the display module 100 are all located between the first shell 210 and the second shell 220, the display surface of the first part 100A faces the display surface of the third part 100C, the second part 100B is bent and arranged between the first part 100A and the third part 100C, and the second part 100B is located in the accommodating space 3104 of the first folding mechanism 310, the first part 100A, the second part 100B and the third part 100C of the display module 100 can be called the inner screen of the display module 100. When the first housing 210 and the second housing 220 are folded, the first part 100A, the second part 100B and the third part 100C are folded to the space formed by the first housing 210, the second housing 220 and the first folding mechanism 310, and the first part 100A, the second part 100B and the third part 100C can therefore be called the inner screen of the display module 100. When the second part 100B and the third part 100C are folded, at least part of the display surface of the fourth part 100D of the display module 100 and the display surface of the fifth part 100E are located outside the second folding mechanism 320 and the third housing 230, that is, outside the electronic device 1000, and the fourth part 100D and the fifth part 100E of the display module 100 can therefore be called the outer screen of the display module 100. At this time, the second folding mechanism 320 is used to fold the fourth part 100D and the fifth part 100E of the display module 100 into the outer screen of the electronic device 1000.

[0386] Fig.30 yes Fig.28 An exploded view of an embodiment of a display module 100 is shown. Fig.31 yes Fig.30 The structure diagram of the display module 100 shown is in a first folding state. Fig.32 yes Fig.30 The structure diagram of the display module 100 shown is in the second folding state.

[0387] like Figure 30 to Figure 32As shown, the display panel 10 of the display module 100 includes a first display area 11, a second display area 12, a third display area 13, a fourth display area 14 and a fifth display area 15 which are sequentially connected along the X-axis direction. In other words, the second display area 12 is connected between the first display area 11 and the third display area 13. The fourth display area 14 is connected between the third display area 13 and the fifth display area 15. It can be understood that Fig.30 and Fig.31 The first display area 11 , the second display area 12 , the third display area 13 , the fourth display area 14 , and the fifth display area 15 are schematically distinguished by dotted lines.

[0388] like Figure 30 to Figure 32 As shown, the support member 20 includes a first fixing portion 21, a first connecting portion 24, a first bending portion 22, a second connecting portion 25, a second fixing portion 23, a third connecting portion 51, a second bending portion 52, a fourth connecting portion 53 and a third fixing portion 54 which are sequentially connected along the X-axis direction. In other words, the first connecting portion 24 is connected between the first fixing portion 21 and the first bending portion 22. The second connecting portion 25 is connected between the first bending portion 22 and the second fixing portion 23. The third connecting portion 51 is connected between the second fixing portion 23 and the second bending portion 52. The fourth connecting portion 53 is connected between the second bending portion 52 and the third fixing portion 54. It can be understood that although the arrangement direction of the various parts of the support member 20 is the same as the arrangement direction of the various parts of the display panel 10, within the range of process errors or tolerances, the arrangement direction of the various parts of the support member 20 and the arrangement direction of the various parts of the display panel 10 may be different, that is, the two are not strictly parallel. In addition, Figure 30 to Figure 32 The positions of the third connection portion 51 and the fourth connection portion 53 are schematically shown by dashed lines. Of course, the positions of the third connection portion 51 and the fourth connection portion 53 are not limited to Figure 30 to Figure 32 The location indicated.

[0389] It is understandable that the structures and formation methods of the first fixing portion 21, the first connecting portion 24, the first bending portion 22, the second connecting portion 25 and the second fixing portion 23 of the support member 20 can all refer to the structures and formation methods of the first fixing portion 21, the first connecting portion 24, the first bending portion 22, the second connecting portion 25 and the second fixing portion 23 of the support member 20 of the folded electronic device 1000 described above. The details will not be repeated here.

[0390] In this embodiment, the second fixing portion 23 is made of a third metal material. The second bending portion 52 is made of a fifth metal material. The third connecting portion 51 includes a third metal material and a fifth metal material. The third metal material and the fifth metal material are different materials. The third metal material and the fifth metal material can be formed by an insert powder metallurgy process. Exemplarily, the second bending portion 52 is formed by an insert using a fifth metal material, and the second fixing portion 23 is formed by sintering a powder using a third metal material. It can be understood that when the third metal material and the fifth metal material are formed by an insert powder metallurgy process, a third connecting portion 51 is formed between the second fixing portion 23 and the second bending portion 52. The structure and formation method of the second fixing portion 23, the third connecting portion 51 and the second bending portion 52 can also refer to the structure and formation method of the first fixing portion 21, the first connecting portion 24, and the first bending portion 22 of the support member 20 of the folded electronic device 1000 above. The specific details are not repeated here.

[0391] It can be understood that in this embodiment, since the second fixing portion 23, the third connecting portion 51 and the second bending portion 52 of the support member 20 are integrally formed structural parts formed by the insert powder metallurgy process, based on the metal interdiffusion effect during the sintering process, an interdiffusion layer with a composition gradient can be formed between the second bending portion 52 formed by the insert and the second fixing portion 23 formed by the powder, that is, a third connecting portion 51 in which the fifth metal material and the third metal material diffuse with each other is formed. At this time, the formation of the third connecting portion 51 significantly improves the interface bonding strength between the second fixing portion 23 and the second bending portion 52, so that the connection strength between the second fixing portion 23 and the second bending portion 52 is high, and the overall structure of the second fixing portion 23, the third connecting portion 51 and the second bending portion 52 is stable and reliable.

[0392] In this embodiment, the second bending portion 52 is made of a fifth metal material. The third fixing portion 54 is made of a sixth metal material. The fourth connecting portion 53 includes a fifth metal material and a sixth metal material. The fifth metal material and the sixth metal material are different materials. The fifth metal material and the sixth metal material can be formed by an insert powder metallurgy process. Exemplarily, the second bending portion 52 is formed by an insert using the fifth metal material, and the third fixing portion 54 is formed by sintering a powder using the sixth metal material. It can be understood that when the fifth metal material and the sixth metal material are formed by an insert powder metallurgy process, a fourth connecting portion 53 is formed between the third fixing portion 54 and the second bending portion 52. The structure and formation method of the third fixing portion 54, the fourth connecting portion 53 and the second bending portion 52 can also refer to the structure and formation method of the first fixing portion 21, the first connecting portion 24, and the first bending portion 22 of the support member 20 of the folded electronic device 1000 above. It will not be described in detail here.

[0393] It can be understood that in this embodiment, since the third fixing portion 54, the fourth connecting portion 53 and the second bending portion 52 of the support member 20 are integrally formed structural parts formed by the insert powder metallurgy process, based on the metal interdiffusion effect during the sintering process, an interdiffusion layer with a composition gradient can be formed between the second bending portion 52 formed by the insert and the third fixing portion 54 formed by the powder, that is, a fourth connecting portion 53 in which the fifth metal material and the sixth metal material diffuse with each other is formed. At this time, the formation of the fourth connecting portion 53 significantly improves the interface bonding strength between the third fixing portion 54 and the second bending portion 52, so that the connection strength between the third fixing portion 54 and the second bending portion 52 is high, and the overall structure of the third fixing portion 54, the third connecting portion 51 and the second bending portion 52 is stable and reliable.

[0394] like Figure 30 to Figure 32 As shown, the support member 20 is fixed to the non-display surface of the display panel 10. Exemplarily, the first surface 21a of the first fixing portion 21 of the support member 20 is fixedly connected to the first display area 11 of the display panel 10. The first surface 22a of the first bent portion 22 of the support member 20 is fixedly connected to the second display area 12 of the display panel 10. The first surface 23a of the second fixing portion 23 of the support member 20 is fixedly connected to the third display area 13 of the display panel 10. The first surface 51a of the second bent portion 52 of the support member 20 is fixedly connected to the fourth display area 14 of the display panel 10. The first surface 25a of the third fixing portion 54 of the support member 20 is fixedly connected to the fifth display area 15 of the display panel 10. In this way, the first fixing portion 21 is arranged opposite to the first display area 11. The first bent portion 22 is arranged opposite to the second display area 12. The second fixing portion 23 is arranged opposite to the third display area 13. The second bent portion 52 is arranged opposite to the fourth display area 14. The third fixing portion 54 is arranged opposite to the fifth display area 15. It can be understood that, as Fig.30 As shown, when the electronic device 1000 is in the unfolded state, the first surface 21a of the first fixing portion 21, the first surface 22a of the first bending portion 22, the first surface 23a of the second fixing portion 23, the first surface 51a of the second bending portion 52, and the first surface 54a of the third fixing portion 54 can be located on the same surface.

[0395] For example, the first surface 24a of the first connection portion 24 may be fixedly connected to the first display area 11 of the display panel 10, or may be fixedly connected to the second display area 12 of the display panel 10, or may be partially fixedly connected to the first display area 11 of the display panel 10, and partially fixedly connected to the second display area 12 of the display panel 10. This application does not limit this in detail.

[0396] Exemplarily, the first surface 25a of the second connection portion 25 may be fixedly connected to the third display area 13 of the display panel 10, or may be fixedly connected to the second display area 12 of the display panel 10, or may be partially fixedly connected to the third display area 13 of the display panel 10, and partially fixedly connected to the second display area 12 of the display panel 10. This application does not make any specific limitation.

[0397] Exemplarily, the first surface 51a of the third connection portion 51 may be fixedly connected to the third display area 13 of the display panel 10, may be fixedly connected to the fourth display area 14 of the display panel 10, or may be partially fixedly connected to the third display area 13 of the display panel 10 and partially fixedly connected to the fourth display area 14 of the display panel 10. This application does not limit this in detail.

[0398] Exemplarily, the first surface 53a of the fourth connection portion 53 may be fixedly connected to the fourth display area 14 of the display panel 10, may be fixedly connected to the fifth display area 15 of the display panel 10, or may be partially fixedly connected to the fourth display area 14 of the display panel 10 and partially fixedly connected to the fifth display area 15 of the display panel 10. This application does not make any specific limitation.

[0399] It is understandable that the first display area 11 of the display panel 10 and the first fixing portion 21 of the support member 20 may constitute the first portion 100A of the display module 100 (see Fig.28 and Fig.29 The second display area 12 of the display panel 10 and the first bent portion 22 of the support member 20 may constitute a second portion 100B of the display module 100 (see Fig.28 and Fig.29 The third display area 13 of the display panel 10 and the second fixing portion 23 of the support member 20 may constitute a third portion 100C of the display module 100 (see Fig.28 and Fig.29 The fourth display area 14 of the display panel 10 and the second bent portion 52 of the support member 20 may constitute a fourth portion 100D of the display module 100 (see Fig.28 and Fig.29 The fifth display area 15 of the display panel 10 and the third fixing portion 54 of the support member 20 may constitute a fifth portion 100E of the display module 100 (see Fig.28 and Fig.29 ) part.

[0400] It is understandable that the support member 20 can be used to provide a rigid support for the display panel 10 to improve the support strength of the display panel 10. In addition, while ensuring a certain hardness, the support member 20 can also be bent under the action of an external force, that is, the support member 20 also has a certain bendability. The structure of the support member 20 will be described in detail below in conjunction with the relevant drawings.

[0401] See also Figure 30 to Figure 32 The second surface 21b of the first fixing portion 21 is fixedly connected to the first housing 210 (see Fig.28 and Fig.29 The second surface 23b of the second fixing portion 23 is fixedly connected to the second housing 220 (see Fig.28 and Fig.29 The second surface 54b of the third fixing portion 54 is fixedly connected to the third housing 230 (see Fig.28 and Fig.29 ). The first surface 21a of the first fixing portion 21 and the second surface 21b of the first fixing portion 21 are opposite to each other. The first surface 23a of the second fixing portion 23 and the second surface 23b of the second fixing portion 23 are opposite to each other. The first surface 54a of the third fixing portion 54 and the second surface 54b of the third fixing portion 54 are opposite to each other.

[0402] like Fig.30 As shown, when the electronic device 1000 is in the unfolded state, the display panel 10 and the support member 20 can both be in the unfolded state. Exemplarily, the first display area 11, the second display area 12, the third display area 13, the fourth display area 14 and the fifth display area 15 of the display panel 10 can be approximately 180° (slight deviation is allowed, such as 165°, 177° or 185°). In addition, the first fixing portion 21, the first connecting portion 24, the first bending portion 22, the second connecting portion 25, the second fixing portion 23, the third connecting portion 51, the second bending portion 52, the fourth connecting portion 53 and the third fixing portion 54 of the support member 20 can form a plate-like structure. In other words, the first fixing portion 21, the first connecting portion 24, the first bending portion 22, the second connecting portion 25, the second fixing portion 23, the third connecting portion 51, the second bending portion 52, the fourth connecting portion 53 and the third fixing portion 54 can be approximately 180° (slight deviations are allowed, such as 165°, 177° or 185°).

[0403] like Fig.31As shown, when the electronic device 1000 is in the first folding state, the display panel 10 can be in the first folding state. Among them, the first display area 11, the second display area 12, the third display area 13, the fourth display area 14 and the fifth display area 15 of the display panel 10 are all located outside the electronic device 1000. Exemplarily, when the electronic device 1000 is in the first folding state, the first display area 11, the second display area 12 and the third display area 13 of the display panel 10 can be approximately 180° (slight deviation is allowed, such as 165°, 177° or 185°), the fourth display area 14 is bent, and the fifth display area 15 and the third display area 13 are arranged close to each other.

[0404] like Fig.31 As shown, when the electronic device 1000 is in the first folding state, the support member 20 can be in the first folding state. Exemplarily, when the electronic device 1000 is in the first folding state, the first fixing portion 21, the first connecting portion 24, the first bending portion 22, the second connecting portion 25, and the second fixing portion 23 form a plate-like structure, that is, the first fixing portion 21, the first connecting portion 24, the first bending portion 22, the second connecting portion 25, and the second fixing portion 23 can be approximately 180° (slight deviations are allowed, such as 165°, 177°, or 185°). In addition, the second bending portion 52 is bent, and the third fixing portion 54 and the second fixing portion 23 are arranged close to each other. At this time, the third fixing portion 54 and the second fixing portion 23 can be stacked along the Z-axis direction.

[0405] like Fig.32 As shown, when the electronic device 1000 is in the second folding state, the display panel 10 can be in the second folding state. Among them, the first display area 11, the second display area 12, and the third display area 13 of the display panel 10 are located on the inner side of the electronic device 1000, and the fifth display area 15 and at least part of the fourth display area 14 of the display panel 10 are located on the outer side of the electronic device 1000. Exemplarily, the first display area 11 and the third display area 13 of the display panel 10 are arranged close to each other, and the third display area 13 and the fifth display area 15 of the display panel 10 are arranged close to each other. At this time, the first display area 11, the third display area 13 and the fifth display area 15 of the display panel 10 can be arranged along the Z-axis direction. In addition, the second display area 12 and the fourth display area 14 of the display panel 10 are bent.

[0406] In addition, when the electronic device 1000 is in the second folding state, the support member 20 can be in the second folding state. Exemplarily, the first fixing portion 21 and the second fixing portion 23 of the support member 20 are arranged close to each other, and the second fixing portion 23 and the third fixing portion 54 of the support member 20 are arranged close to each other. At this time, the first fixing portion 21, the second fixing portion 23 and the third fixing portion 54 of the support member 20 can be stacked along the Z-axis direction. In addition, the first bending portion 22 and the second bending portion 52 of the support member 20 are bent. Among them, the first fixing portion 21, the first bending portion 22 and the second fixing portion 23 of the support member 20 form a receiving space 206. The first display area 11, the second display area 12, and the third display area 13 of the display panel 10 are located in the receiving space 206. In addition, the fifth display area 15 and at least part of the fourth display area 14 are located outside the second bending portion 52 and the third fixing portion 54.

[0407] It can be understood that when the first connection portion 24 is fixedly connected to the first display area 11, the state of the first connection portion 24 when the electronic device 1000 is in the folded state can refer to the state of the first fixing portion 21. When the first connection portion 24 is fixedly connected to the second display area 12, the state of the first connection portion 24 when the electronic device 1000 is in the folded state can refer to the state of the first bending portion 22. The states of the second connection portion 25, the third connection portion 51 and the fourth connection portion 53 can all refer to the description of the state of the first connection portion 24. The specific description is not repeated here.

[0408] Exemplarily, the first bending portion 22 has a bending property. Thus, when the electronic device 1000 is in the second folded state, the second portion 100B (see Fig.28 and Fig.29 ) can be bent and easily disposed in the accommodation space 3104 (see Fig.28 and Fig.29 ). In addition, the second bending portion 52 has a bending property. In this way, when the electronic device 1000 is in the second folding state, the fourth part 100D of the display module 100 can be bent. It can be understood that there are multiple implementations for the setting of the second bending portion 52 having a bending property. For example, the setting method of the first bending portion 22 can refer to the setting method of the first bending portion 22 of the folding electronic device 1000. The details are not repeated here. In addition, the setting of the second bending portion 52 having a bending property also has multiple settings. Exemplarily, a through hole or a groove can be provided in the second bending portion 52 to reduce the hardness of the second bending portion 52, so that the second bending portion 52 can be bent. Specifically, reference can be made to the structural setting of the main bending portion 223 of the first bending portion 22 of the folding electronic device 1000.

[0409] It is understandable that this embodiment specifically introduces a multi-fold electronic device 1000 in conjunction with the relevant drawings. The support member 20 of the multi-fold electronic device 1000 can also take into account high hardness, good bendability, light weight and high thermal conductivity.

[0410] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other, and any combination of features in different embodiments is also within the protection scope of the present application. In other words, the multiple embodiments described above can also be arbitrarily combined according to actual needs.

[0411] It should be noted that all the above drawings are illustrative illustrations of the present application and do not represent the actual size of the product. Moreover, the size ratio relationship between the components in the drawings is not intended to limit the actual product of the present application.

[0412] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A support member (20), applied to a flexible display module (100), and used for being fixedly connected to a non-display surface of a display panel (10) of the display module (100), characterized in that: The support member (20) comprises a first fixing portion (21), a first connecting portion (24), a first bending portion (22) and a second fixing portion (23) which are arranged in sequence, the first bending portion (22) being provided with at least one groove and / or through hole, and the support member (20) can be bent at the first bending portion (22); The first fixing portion (21) is made of a first metal material, the first bending portion (22) is made of a second metal material, the first connecting portion (24) comprises the first metal material and the second metal material, the hardness of the second metal material is greater than the hardness of the first metal material, and the density of the first metal material is less than the density of the second metal material; The second fixing portion (23) is made of a third metal material, the hardness of the second metal material is greater than or equal to the hardness of the third metal material, and the density of the third metal material is less than or equal to the density of the second metal material.

2. The support member (20) according to claim 1, characterized in that: The support member (20) comprises a second connecting portion (25), wherein the second connecting portion (25) connects the first bending portion (22) and the second fixing portion (23); The second connecting portion (25) comprises the second metal material and the third metal material, the hardness of the second metal material is greater than the hardness of the second metal material, and the density of the third metal material is less than the density of the second metal material.

3. The support member (20) according to claim 2, characterized in that: The thermal conductivity of the first metal material is greater than the thermal conductivity of the second metal material; and / or, the thermal conductivity of the third metal material is greater than the thermal conductivity of the second metal material; and / or, the elastic modulus of the second metal material is greater than the elastic modulus of the first metal material; and / or, the elastic modulus of the second metal material is greater than the elastic modulus of the third metal material.

4. The support member (20) according to claim 2 or 3, characterized in that: The first metal material is a particle-reinforced aluminum-based composite material or a particle-reinforced magnesium-based composite material; and / or, the second metal material is stainless steel or a titanium alloy; and / or; and / or, the third metal material is a particle-reinforced aluminum-based composite material or a particle-reinforced magnesium-based composite material.

5. The support member (20) according to any one of claims 1 to 4, characterized in that: The support member (20) comprises a first embedded portion (25), wherein the first embedded portion (25) is embedded in the first fixing portion (21); The first embedded portion (25) is made of a fourth metal material, the hardness of the fourth metal material is greater than the hardness of the first metal material; and / or the thermal conductivity of the fourth metal material is greater than the thermal conductivity of the first metal material.

6. The support member (20) according to claim 5, characterized in that The support member (20) comprises a first sub-connecting portion (26), wherein the first sub-connecting portion (26) connects the first embedded portion (25) and the first fixing portion (21); The first sub-connecting portion (26) includes the first metal material and the fourth metal material.

7. The support member (20) according to claim 6, characterized in that The first metal material is a particle-reinforced aluminum-based composite material or a particle-reinforced magnesium-based composite material; and / or the fourth metal material is stainless steel or a titanium alloy.

8. The support member (20) according to claim 5, characterized in that The fourth metal material and the first metal material include the same chemical components, and the mass fraction of each chemical component of the fourth metal material is different from the mass fraction of each chemical component of the first metal material.

9. The support member (20) according to any one of claims 1 to 8, characterized in that: In a first direction, a thickness H1 of the first connecting portion (24) satisfies: 0.1 μm≤H1≤30 μm, and the first direction is a direction from the first fixing portion to the second fixing portion.

10. The support member (20) according to any one of claims 1 to 9, characterized in that: The content of the main group elements of the first metal material in the first connecting portion (24) decreases in the first direction, and the content of the main group elements of the second metal material increases in the first direction, and the first direction is the direction from the first fixing portion to the second fixing portion.

11. The support member (20) according to any one of claims 1 to 10, characterized in that: A first interface (241) is formed between the first fixing portion (21) and the first connecting portion (24), and a second interface (242) is formed between the first bending portion (22) and the first connecting portion (24), and the first interface (241) and the second interface (242) are visible in the metallographic structure of the support member (20).

12. The support member (20) according to any one of claims 1 to 11, characterized in that The first fixing portion (21), the first connecting portion (24) and the first bending portion (22) are formed by an insert powder metallurgy process; The first fixing portion (21) is formed by sintering powder of the first metal material, the first bending portion (22) is formed by an insert of the second metal material, and the first connecting portion (24) is formed by mutual diffusion of the first metal material and the second metal material.

13. The support member (20) according to any one of claims 1 to 12, characterized in that The thickness of the support member (20) is in the range of 0.05 mm to 0.4 mm.

14. The support member (20) according to any one of claims 1 to 13, characterized in that The first bending portion (22) comprises a first sub-bending portion (221), a main bending portion (223) and a second sub-bending portion (225), wherein the main bending portion (223) connects the first sub-bending portion (221) and the second sub-bending portion (225); The rigidity of the first sub-bending portion (221) and the second sub-bending portion (225) are both greater than the rigidity of the main bending portion (223), and the main bending portion (223) is provided with at least one groove and / or through hole.

15. The support (20) according to any one of claims 1 to 14, characterized in that The support member (20) further comprises a second bending portion (52) and a third fixing portion (54), wherein the second bending portion (52) connects the second fixing portion (23) and the third fixing portion (54), and the second bending portion (52) is provided with at least one groove and / or through hole, and the support member (20) can be bent at the second bending portion (52); The second bending portion (52) is made of a fifth metal material, and the third fixing portion (54) is made of a sixth metal material. The hardness of the fifth metal material is greater than the hardness of the third metal material and the hardness of the sixth metal material. The density of the third metal material and the density of the sixth metal material are both less than the density of the fifth metal material.

16. The support member (20) according to claim 15, characterized in that The support member (20) further comprises a third connecting portion (51), wherein the third connecting portion (51) connects the second fixing portion (23) and the second bending portion (52), and the third connecting portion (51) comprises the third metal material and the fifth metal material; And / or, the support member (20) further includes a fourth connecting portion (53), the fourth connecting portion (53) is connected between the third fixing portion (54) and the second bending portion (52), and the fourth connecting portion (53) includes the fifth metal material and the sixth metal material.

17. A display module (100), characterized in that: The display module (100) is a flexible screen, comprising a display panel (10) and a support member (20) according to any one of claims 1 to 16, wherein the support member (20) is fixed to a non-display surface of the display panel (10).

18. An electronic device (1000), characterized in that: It comprises a shell device (300) and a display module (100) as shown in claim 17, wherein the display module (100) is installed on the shell device (300), and the shell device (300) is used to drive the display module (100) to be relatively unfolded or folded.

19. An electronic device (1000), characterized in that: The device comprises a first shell (210), a second shell (220), a first folding mechanism (310) and a display module (100), wherein the first folding mechanism (310) connects the first shell (210) and the second shell (220), and the first folding mechanism (310) is used to enable the first shell (210) and the second shell (220) to be relatively unfolded or folded; The display module (100) comprises a display panel (10) and a support member (20), wherein the support member (20) is fixed on a non-display surface of the display panel (10); The support member (20) comprises a first fixing portion (21), a first connecting portion (24), a first bending portion (22) and a second fixing portion (23) which are sequentially arranged along a first direction, the first bending portion (22) being provided with at least one groove and / or through hole, and the support member (20) being able to bend at the first bending portion (22), wherein the first direction is the direction in which the first housing (210) points to the second housing (220) when the electronic device (1000) is in an unfolded state; The first fixing portion (21) is made of a first metal material, the first bending portion (22) is made of a second metal material, the first connecting portion (24) comprises the first metal material and the second metal material, the hardness of the second metal material is greater than the hardness of the first metal material, and the density of the first metal material is less than the density of the second metal material; The second fixing portion (23) is made of a third metal material, the hardness of the second metal material is greater than or equal to the hardness of the second metal material, and the density of the third metal material is less than or equal to the density of the second metal material; The display panel (10) comprises a first display area (11), a second display area (12) and a third display area (13) arranged along the first direction; a first surface (21a) of the first fixing portion (21) is fixedly connected to the first display area (11); a first surface (22a) of the first bending portion (22) is fixedly connected to the second display area (12); and a first surface (23a) of the second fixing portion (23) is fixedly connected to the third display area (13); The second surface (21b) of the first fixing portion (21) is fixedly connected to the first shell (210), and the second surface (23b) of the second fixing portion (23) is fixedly connected to the second shell (220), wherein the first surface (21a) of the first fixing portion (21) and the second surface (21b) of the first fixing portion (21) are opposite to each other, and the first surface (23a) of the second fixing portion (23) and the second surface (23b) of the second fixing portion (23) are opposite to each other.

20. The electronic device (1000) according to claim 19, characterized in that: The support member (20) comprises a second connecting portion (25), wherein the second connecting portion (25) connects the first bending portion (22) and the second fixing portion (23); The second connecting portion (25) comprises the second metal material and the third metal material, the hardness of the second metal material is greater than the hardness of the second metal material, and the density of the third metal material is less than the density of the second metal material.

21. The electronic device (1000) according to claim 20, characterized in that: The thermal conductivity of the first metal material is greater than the thermal conductivity of the second metal material; and / or, the thermal conductivity of the third metal material is greater than the thermal conductivity of the second metal material; and / or, the elastic modulus of the second metal material is greater than the elastic modulus of the first metal material; and / or, the elastic modulus of the second metal material is greater than the elastic modulus of the third metal material.

22. The electronic device (1000) according to claim 20 or 21, characterized in that: The first metal material is a particle-reinforced aluminum-based composite material or a particle-reinforced magnesium-based composite material; and / or, the second metal material is stainless steel or a titanium alloy; and / or; and / or, the third metal material is a particle-reinforced aluminum-based composite material or a particle-reinforced magnesium-based composite material.

23. The electronic device (1000) according to any one of claims 19 to 22, characterized in that: The support member (20) comprises a first embedded portion (25), wherein the first embedded portion (25) is embedded in the first fixing portion (21); The first embedded portion (25) is made of a fourth metal material, the hardness of the fourth metal material is greater than the hardness of the first metal material; and / or the thermal conductivity of the fourth metal material is greater than the thermal conductivity of the first metal material.

24. The electronic device (1000) according to claim 23, characterized in that: The support member (20) comprises a first sub-connecting portion (26), wherein the first sub-connecting portion (26) connects the first embedded portion (25) and the first fixing portion (21); The first sub-connecting portion (26) includes the first metal material and the fourth metal material.

25. The electronic device (1000) according to any one of claims 19 to 23, characterized in that: A thickness H1 of the first connection portion (24) in the first direction satisfies: 0.1 μm≤H1≤30 μm.

26. The electronic device (1000) according to any one of claims 19 to 25, characterized in that: The first fixing portion (21), the first connecting portion (24) and the first bending portion (22) are formed by an insert powder metallurgy process; The first fixing portion (21) is formed by sintering powder of a first metal material, the first bending portion (22) is formed by an insert of a second metal material, and the first connecting portion (24) is formed by mutual diffusion of the first metal material and the second metal material.

27. The electronic device (1000) according to any one of claims 19 to 26, characterized in that: The electronic device (1000) comprises a third housing (230) and a second folding mechanism (320), wherein the second folding mechanism (320) connects the second housing (220) and the third housing (230), and the second folding mechanism (320) is used to enable the second housing (220) and the third housing (230) to be relatively unfolded or folded; The support member (20) further comprises a second bending portion (52) and a third fixing portion (54), wherein the second bending portion (52) connects the second fixing portion (23) and the third fixing portion (54), and the second bending portion (52) is provided with at least one groove and / or through hole, and the support member (20) can be bent at the second bending portion (52); The second bending portion (52) is made of a fifth metal material, the third fixing portion (54) is made of a sixth metal material, the hardness of the fifth metal material is greater than the hardness of the third metal material and the hardness of the sixth metal material, the density of the third metal material is less than the density of the fifth metal material, and the density of the sixth metal material is less than the density of the fifth metal material; The display panel (10) further comprises a fourth display area (14) and a fifth display area (15), the fourth display area (14) being connected to the third display area (13) and the fifth display area (15), the first surface (52a) of the second bent portion (52) being fixedly connected to the fourth display area (14), and the first surface (54a) of the third fixing portion (54) being fixedly connected to the fifth display area (15); The second surface (54b) of the third fixing portion (54) is fixedly connected to the third shell (230), and the first surface (25a) of the third fixing portion (54) and the second surface (25b) of the third fixing portion (54) are opposite to each other.

28. The electronic device (1000) according to claim 27, characterized in that: The support member (20) further comprises a third connecting portion (51), wherein the third connecting portion (51) connects the second fixing portion (23) and the second bending portion (52), and the third connecting portion (51) comprises the third metal material and the fifth metal material; And / or, the support member (20) further includes a fourth connecting portion (53), the fourth connecting portion (53) is connected between the third fixing portion (54) and the second bending portion (52), and the fourth connecting portion (53) includes the fifth metal material and the sixth metal material.

29. A method for preparing a support member (20) according to any one of claims 2 to 16, characterized in that: include: preparing an insert (301), wherein the insert (301) is made of a second metal material; The insert (301) is placed in a jig (304), and a first powder (302) and a second powder (303) are filled into the jig (304), wherein the first powder (302) and the second powder (303) are respectively located on both sides of the insert (301) and are in contact with the insert (301), so as to form a sintered part (30), wherein the first powder (302) is made of a first metal material, and the second powder (303) is made of a third metal material; Sintering the part to be sintered (30) to form a sintered part (40); A sintered part (40) is processed to form a support part (20), wherein a portion of the insert (301) is used to form a first bending portion (22) of the support part (20), another portion of the insert (301) and a portion of the first powder (302) are used to jointly form a first connecting portion (24) of the support part (20), a portion of the first powder (302) is used to form a first fixing portion (21) of the support part (20), a portion of the insert (301) and a portion of the second powder (303) are used to jointly form a second connecting portion (25) of the support part (20), and another portion of the second powder (303) is used to form a second fixing portion (23) of the support part (20).

30. The method according to claim 29, characterized in that During the sintering process of the to-be-sintered part (30), the sintering pressure P1 satisfies: P1≥100Mpa, the sintering temperature T1 satisfies: 500°C≤T1≤660°C, and the sintering time t1 satisfies: 2h≤t1≤5h.

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