Warping detection device, support plate manufacturing method and warping monitoring method thereof

Abstract

The invention discloses a warpage detection device, a support plate manufacturing method and a warpage monitoring method. The warpage detection device comprises a support, a stress detection layer and a developing layer. The support serves as a basic supporting structure, the stress detection layer is connected to the support, and the developing layer is connected to the support and spaced from the stress detection layer. The stress detection layer is designed to be capable of being pressed by the carrier plate to deform towards the developing layer until the stress detection layer is in contact with the developing layer and enables the developing layer to generate traces. Therefore, the warping condition of the carrier plate can be visually displayed through the trace on the developing layer, the warping position of the carrier plate can be conveniently and rapidly judged, then production personnel can conveniently and timely adjust a production process or production equipment, and the loss caused by excessive warping of the carrier plate is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of flip chip ball grid array boards, and in particular to a warping detection device, carrier board manufacturing and a warping monitoring method thereof. Background Art

[0002] FCBGA substrate, full name Flip Chip Ball Grid Array substrate, is a high-density substrate used to package IC (integrated circuit) bare chips. FCBGA substrate plays an important role in chip packaging, providing support, heat dissipation and protection for the chip, and serving as an electronic connection bridge between the chip and the PCB (printed circuit board). With the rapid development of the electronics industry, the market demand for FCBGA substrates continues to grow. FCBGA substrates are widely used in smartphones, tablets, high-end servers, network routers / converters, high-performance game consoles and other industries. FCBGA substrates will inevitably warp due to external factors during the production process. Excessive warping will cause the quality of the FCBAG substrate to fail to meet the use requirements and even lead to rework and scrapping. Since the FCBAG substrate needs to undergo multiple processes during the production process, it is difficult to effectively control the warping of the FCBAG substrate. Therefore, it is necessary to design a device that can control the warping of the FCBAG substrate in real time. Summary of the invention

[0003] The main purpose of the present invention is to propose a warping detection device, carrier board manufacturing and warping monitoring method, aiming to solve the technical problem of how to monitor the warping of FCBAG carrier boards.

[0004] To achieve the above object, the present invention provides a warping detection device, which is suitable for detecting the warping amount of a carrier board, comprising:

[0005] Bracket;

[0006] A stress detection layer connected to the bracket;

[0007] a developing layer, connected to the support and spaced apart from the stress detecting layer;

[0008] The stress detection layer is configured to be pressed by the carrier plate and deformed toward the developing layer until it presses against the developing layer, so as to generate and show a mark on the developing layer.

[0009] In some embodiments, the stress detection layer is configured to have multiple detection lines arranged horizontally and vertically staggered with each other, the bracket includes multiple collimators wrapped around the circumference of the developing layer, each of the detection lines is installed on the collimator, and the detection line is configured to be able to extend or retract relative to the collimator, and the collimator is configured to be able to rotate as the detection line is extended or retracted.

[0010] In some embodiments, the warping stress F of the carrier and the circumference x of the rotation of the collimator satisfy: F=kx, where k is the elastic coefficient of the detection line.

[0011] In some embodiments, the stress detection layer is configured to have a plurality of detection lines that are arranged horizontally and vertically in an alternating manner, and the stress detection layer is provided with a pressure sensor, and the pressure sensor is configured to detect the pressure of each detection line pressed by the carrier board.

[0012] In some embodiments, the bracket is configured to be able to move in a direction close to the carrier, and the stress detection layer is configured to be able to move relative to the developing layer in a direction parallel to the movement path of the bracket, so as to adjust the detection range of the warping detection device according to the maximum preset warping value of the carrier.

[0013] In some embodiments, along a direction parallel to the movement path of the bracket, the stress detection layer has a first position and a second position relative to the developing layer. When the stress detection layer is located at the first position, the distance from the stress detection layer to the developing layer is M, and the maximum preset warpage value of the carrier is L. 1 When the stress detection layer is located at the second position, the distance from the stress detection layer to the developing layer is N, and the maximum preset warpage value of the carrier is L 2 , where M>N, L 1 <L 2 .

[0014] In some embodiments, the warpage detection device has a positioning position along the direction in which the bracket moves, and the warpage detection device further comprises a carrier plate, the carrier plate being configured to carry the carrier plate and being configured to be able to move relative to the bracket so that the carrier plate is located at the positioning position;

[0015] The warping detection device also includes a driving member, the bracket has an initial position, a preparatory position and a working position, the driving member is connected to the bracket, and the driving member is configured to drive the bracket to move between the initial position, the preparatory position and the working position, when the bracket is in the initial position, the carrier plate is waiting to enter the positioning position, when the bracket is in the preparatory position, the carrier plate is located at the positioning position, and when the bracket is in the working position, the carrier plate is pressed against the stress detection layer and the stress detection layer is pressed against the developing layer.

[0016] In some embodiments, the maximum preset warping value of the carrier is defined as L, and the thickness of the carrier is D, then the path H of the bracket moving from the preparation position to the working position satisfies: H=L+D.

[0017] In some embodiments, the carrier plate includes a main body and a support portion connected to the main body, the support portion protrudes from the main body, and the carrier plate includes multiple shipping units and auxiliary edges arranged around the sides of the shipping units, the support portion is configured to support the auxiliary edges so that a gap exists between the shipping units and the main body.

[0018] A second aspect of the present invention further provides a carrier board manufacturing and a warpage monitoring method thereof, the warpage monitoring method being applicable to a warpage detection device described in any one of the above embodiments, the warpage detection device comprising a carrier plate, the carrier plate being configured to carry the carrier board and being configured to be able to move relative to the bracket, the carrier board manufacturing and the warpage monitoring method thereof comprising:

[0019] preparing a substrate, and placing the substrate on the carrier plate;

[0020] driving the carrier plate to move to the warping detection device;

[0021] Using the warpage detection device to perform warpage detection on the substrate to obtain first detection information;

[0022] driving the carrier plate to move away from the warpage detection device, and welding the chip to the substrate to obtain a first workpiece;

[0023] driving the carrier plate carrying the first workpiece to move to a warping detection device;

[0024] Using the warpage detection device to perform warpage detection on the first workpiece to obtain second detection information;

[0025] driving the carrier plate to move away from the warpage detection device, and packaging the first workpiece to obtain the carrier plate;

[0026] driving the carrier plate carrying the carrier plate to move to the warping detection device;

[0027] Using the warpage detection device to perform warpage detection on the carrier to obtain third detection information;

[0028] The carrier plate is cut to obtain a shipping unit.

[0029] Compared with the prior art, the present invention has the following beneficial effects:

[0030] In the technical solution of the present invention, the warping detection device includes a bracket, a stress detection layer and a developing layer. The stress detection layer and the developing layer are both connected to the bracket, and the developing layer and the stress detection layer are arranged at intervals. The stress detection layer is configured to be able to be pressed by the carrier plate and deformed in a direction close to the developing layer to press the developing layer, so as to produce and show a mark on the developing layer, so that the production personnel can quickly determine the warping position of the carrier plate according to the mark on the developing layer, and then the production personnel can adjust the production process or production equipment in time to reduce the loss caused by excessive warping of the carrier plate.

[0031] In the related art, optical instruments are usually used to detect the warpage of the carrier board after the carrier board is produced and formed. The warpage detection device of the present application can be set at each manufacturing site in the carrier board production process, so as to obtain the warpage of the carrier board in production at each manufacturing site, so that the production personnel can discover, predict and avoid the warpage risk of the carrier board at each manufacturing site in advance, thereby improving the yield of the carrier board, reducing the loss caused by excessive warpage of the carrier board and reducing the manufacturing cost of the carrier board. In addition, the optical instrument used in the related art has a complex positioning process, and the process of scanning and generating the warpage of the carrier board is time-consuming and lengthy. The detection of the next batch of carrier boards requires repeated positioning, and the detection efficiency is low. The warpage detection device provided by the present application adopts a mechanical structure to detect the warpage of the carrier board, which is simple to operate and low in cost. In addition, the warpage detection device can adapt to the production rhythm of the carrier board, and will not interfere with the production process of the carrier board while ensuring that the warpage detection of the carrier board avoids excessive warpage, and the produced carrier board has high consistency. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

[0033] Figure 1 It is a structural schematic diagram of a warpage detection device in one embodiment of the present invention;

[0034] Figure 2 A warpage detection device according to an embodiment of the present invention is provided along Figure 1 Sectional view cut along the AA direction;

[0035] Figure 3 A warpage detection device according to an embodiment of the present invention is provided along Figure 1 A cross-sectional view cut along the AA direction; wherein the stent is in a prepared position;

[0036] Figure 4The warping detection device according to another embodiment of the present invention is Figure 1 A cross-sectional view cut along the AA direction; wherein the bracket is between the preparation position and the working position, and the detection line is pressed against the warped portion of the carrier;

[0037] Figure 5 A warpage detection device according to another embodiment of the present invention is provided along Figure 1 A cross-sectional view cut along the AA direction; wherein the bracket is in a working position, the stress detection layer is pressed against the warped portion of the carrier, and the stress detection layer is pressed against the developing layer;

[0038] Figure 6 It is a structural schematic diagram of a carrier plate placed on a carrier plate in one embodiment of the present invention;

[0039] Figure 7 In one embodiment of the present invention, the carrier plate is placed on the rear edge of the carrier plate. Figure 6 Sectional view cut along the BB direction;

[0040] Figure 8 FIG. 1 is a schematic diagram of the structure of a carrier plate in one embodiment of the present invention.

[0041] Description of Figure Numbers:

[0042] Warpage detection device 100;

[0043] Support 110; Collimator 111;

[0044] Stress detection layer 120; detection line 121;

[0045] A developing layer 130;

[0046] Carrying plate 140; main body 141; supporting portion 142;

[0047] Carrier board 200;

[0048] Shipping unit 210; auxiliary edge 220.

[0049] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0050] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0051] See also Figures 1 to 8The present invention provides a warping detection device, which is suitable for detecting the warping amount of a carrier, and the carrier includes but is not limited to a flip chip ball grid array carrier. The warping detection device includes a bracket, a stress detection layer and a developing layer. Among them, the bracket serves as a basic supporting structure, the stress detection layer is connected to the bracket, and the developing layer is also connected to the bracket and is spaced apart from the stress detection layer. The stress detection layer is designed to be able to be pressed by the carrier and deformed toward the developing layer until it contacts the developing layer and causes a mark on the developing layer. Therefore, the warping condition of the carrier can be intuitively displayed through the marks on the developing layer, which is convenient for quickly judging the warping position of the carrier.

[0052] In some embodiments, the stress detection layer can be made of a flexible material that can deform as the carrier plate warps. In some embodiments, the stress detection layer and the developing layer are configured to be able to move toward the carrier plate until they are pressed against the surface of the carrier plate to obtain the warping of the carrier plate. In other embodiments, the carrier plate can be placed on the stress detection layer. If the carrier plate is warped, the stress detection layer will deform toward the developing layer under the action of the warping of the carrier plate. When the stress detection layer contacts the developing layer, the developing layer may change color or other visible signs, thereby showing the position and degree of the warping of the carrier plate. The developing layer can be made of a material that is easily deformed by pressure, such as photosensitive paper or a special coating. When the stress detection layer contacts the developing layer, a visible mark or trace will be left on it.

[0053] It is understandable that in some embodiments, the developing layer uses special materials, such as pressure-sensitive ink or color-developing coating, and traces can be immediately revealed when the stress detection layer contacts it. By observing the traces on the developing layer, the production personnel can quickly determine the warping position of the carrier, and then adjust the production process or production equipment in time to avoid losses caused by the warping of the carrier. Compared with traditional optical detection methods, the clever combination of the stress detection layer and the developing layer makes the detection process simple and efficient, and the warping of the carrier can be fed back immediately, greatly improving production efficiency and quality control capabilities. In other embodiments, the developing layer can also use pressure test paper (also known as pressure-sensitive paper). In some other embodiments, the developing layer can also use replaceable developing test paper.

[0054] See also Figures 1 to 8The present invention provides a warpage detection device 100, which is suitable for detecting the warpage amount of a carrier 200, and the carrier 200 includes but is not limited to a flip chip ball grid array carrier 200. The warpage detection device 100 includes a bracket 110, a stress detection layer 120 and a developing layer 130. Among them, the bracket 110 serves as a basic supporting structure, the stress detection layer 120 is connected to the bracket 110, and the developing layer 130 is also connected to the bracket 110 and is spaced apart from the stress detection layer 120. The stress detection layer 120 is designed to be able to be pressed by the carrier 200 and deformed toward the developing layer 130 until it contacts the developing layer 130 and causes a mark on the developing layer 130. Therefore, the warpage of the carrier 200 can be intuitively displayed through the marks on the developing layer 130, which is convenient for quickly judging the warpage position of the carrier 200.

[0055] In some embodiments, the stress sensing layer 120 may be made of a flexible material and may be deformed as the carrier 200 is warped. In some embodiments, the stress sensing layer 120 and the developing layer 130 are configured to be able to move toward the carrier 200 until they are pressed against the surface of the carrier 200 to obtain the warping of the carrier 200. In other embodiments, the carrier 200 may be placed on the stress sensing layer 120. If the carrier 200 is warped, the stress sensing layer 120 may be deformed toward the developing layer 130 under the warping of the carrier 200. When the stress sensing layer 120 contacts the developing layer 130, the developing layer 130 may change color or show other visible signs, thereby showing the warping position and degree of the carrier 200. The developing layer 130 may be made of a material that is easily deformed by pressure, such as photosensitive paper or a special coating. When the stress sensing layer 120 contacts the developing layer 130, a visible mark or trace may be left on it.

[0056] It is understandable that, in some embodiments, the developing layer 130 uses special materials, such as pressure-sensitive ink or color-developing coating, and when the stress detection layer 120 contacts it, the trace can be immediately revealed. By observing the traces on the developing layer 130, the production personnel can quickly determine the warping position of the carrier 200, and then adjust the production process or production equipment in time to avoid losses caused by the warping of the carrier 200. Compared with traditional optical detection methods, the clever combination of the stress detection layer 120 and the developing layer 130 makes the detection process simple and efficient, and the warping of the carrier 200 can be fed back immediately, greatly improving the production efficiency and quality control capabilities. In other embodiments, the developing layer 130 can also use pressure test paper (also known as pressure-sensitive paper). In some other embodiments, the developing layer 130 can also use replaceable developing test paper.

[0057] See also Figures 1 to 3In some embodiments, the warpage detection device 100 includes a bracket 110, a stress detection layer 120 and a developing layer 130. The stress detection layer 120 is configured to have a plurality of detection lines 121 arranged horizontally and vertically in an interlaced manner, and the bracket 110 includes a plurality of collimators 111 wound around the developing layer 130. Each detection line 121 is installed on the collimator 111, and the detection lines 121 are configured to be able to extend or retract relative to the collimator 111. The collimator 111 is configured to be able to rotate with the extension or retraction of the detection line 121. In some embodiments, the material used for the detection line 121 includes but is not limited to nylon line. The detection line 121 is configured to have a certain elasticity to ensure that the pressure applied to the carrier 200 by the stress detection layer 120 during the warpage detection of the carrier 200 will not cause marks on the surface of the carrier 200, thereby improving the production quality of the carrier 200.

[0058] Specifically, the stress detection layer 120 is composed of a plurality of detection lines 121, which are arranged in a staggered manner horizontally and vertically to form a grid structure. Each detection line 121 is installed on a collimator 111, and the collimator 111 is wound around the side of the developing layer 130. When the carrier 200 contacts the stress detection layer 120, if the carrier 200 is warped, the stress detection layer 120 will be deformed by the local pressure generated by the warped part of the carrier 200, causing the detection line 121 to extend or retract relative to the collimator 111 at certain positions. The collimator 111 can rotate as the detection line 121 extends or retracts, preventing the detection line 121 from being damaged by the warping stress of the carrier 200, while realizing the detection of the warping of the carrier 200. The service life of the warping detection device 100 is ensured, and the maintenance cost and frequency are reduced.

[0059] It should be noted that the setting of the detection line 121 enables the warping detection device 100 to accurately sense the slight changes in the concave and convex surfaces of the carrier 200, especially the pressure changes generated by the warped part. This high sensitivity ensures that even in the case of slight warping, it can be effectively captured by the detection line 121. When the warped part of the carrier 200 contacts the detection line 121 and applies pressure, the detection line 121 can be deformed. This deformation process converts the physical signal generated by the warping into a mechanical displacement signal, which is beneficial to subsequent signal conversion and recognition. In addition, since the warping part of the carrier 200 may have an irregular shape and it is difficult to obtain the warping situation, the detection line 121 can form a bulge based on the highest point of the warping it contacts, and the bulge presses against the developing layer 130 so that the developing layer 130 can show traces. At the same time, the presence of the detection line 121 is also beneficial to reduce the wear between the developing layer 130 and the carrier 200.

[0060] It is understandable that, in some embodiments, the extension or retraction of the detection line 121 will drive the rotation of the collimator 111. When a certain area of ​​the carrier 200 is warped, the detection line 121 at the corresponding position will be subjected to greater pressure, thereby extending or retracting, thereby driving the collimator 111 to rotate. In some embodiments, the rotation angle of the collimator 111 is proportional to the magnitude of the warping stress of the carrier 200. Therefore, by detecting the rotation angle of the collimator 111, the warping of the carrier 200 can be quantified. Combined with the traces of the developing layer 130, the warping detection makes it more intuitive and accurate, which is convenient for production personnel to adjust the production process or production equipment in time according to the test results, and avoid the loss of the carrier 200 due to excessive warping.

[0061] In some embodiments, the warping stress F of the carrier 200 and the rotation circumference x of the collimator 111 satisfy the relationship F=kx, where k is the elastic coefficient of the detection line 121. That is, the warping stress of the carrier 200 can be indirectly measured by calculating and analyzing the rotation circumference of the collimator 111. When the warping stress of the carrier 200 is greater, the rotation circumference of the collimator 111 is also greater, and vice versa.

[0062] Specifically, the elastic coefficient k of the detection line 121 is a fixed physical parameter, which represents the stress change of the detection line 121 under the unit length change. By measuring the circumference x of the rotation of the collimator 111, the warping stress F of the carrier 200 can be calculated. This design makes the warping detection more quantitative and accurate, providing reliable detection data for production personnel, facilitating timely adjustment of process parameters, and ensuring the consistency and high-quality production of the carrier 200.

[0063] It is understandable that, in some embodiments, the warping stress F of the carrier 200 is indirectly measured by the circumference x of the rotation of the collimator 111, so that the warping condition of the carrier 200 can be accurately detected. Since the elastic coefficient k of the detection line 121 is known, as long as the circumference x of the rotation of the collimator 111 is measured, the warping stress F of the carrier 200 can be calculated according to the relationship F=kx. Not only does it simplify the detection process, but it also improves the detection efficiency, so that the warping detection device 100 can adapt to the production rhythm of the carrier 200, will not interfere with the production process, and ensure the consistency and high-quality production of the carrier 200.

[0064] It should be noted that, in some embodiments, the warping detection device 100 may be provided with a pull-wire displacement sensor to obtain the rotational circumference of the collimator 111, wherein the pull-wire displacement sensor includes a winding disk coaxially arranged with the collimator 111 and a pull-wire rope connected to the periphery of the collimator 111. When the collimator 111 rotates, the pull-wire rope will be wound around the winding disk, thereby driving the rotatable sliding resistor inside the pull-wire displacement sensor to rotate and send out a resistance signal. The warping detection device 100 may be provided with a controller and a display. The controller can calculate the rotation distance of the collimator 111 by measuring the change of the resistance signal, and then obtain the circumference of the collimator 111. After the controller obtains the warping stress at the warping point of the carrier 200 according to the rotational circumference of the collimator 111 and the elastic coefficient of the detection line 121, the relevant information can be displayed through the display so that the production personnel can obtain it conveniently and quickly. In other embodiments, the warping detection device 100 may also be provided with a combined structure of a Hall sensor and a magnetic sheet to obtain the rotational circumference of the collimator 111. Specifically, a magnetic sheet may be provided on one side of the collimator 111, and a Hall sensor may be installed below the collimator 111. When the collimator 111 rotates, the magnetic sheet may pass through the Hall sensor, thereby generating an induction pulse signal. The controller may calculate the rotational circumference of the collimator 111 by measuring the period and linear velocity of the pulse signal (which may be obtained by other velocity sensors). In yet other embodiments, the rotational circumference of the collimator 111 may also be obtained by providing a roller-type distance measuring wheel.

[0065] In other embodiments, the warpage detection device 100 includes a bracket 110, a stress detection layer 120, and a developing layer 130. The stress detection layer 120 is configured to have a plurality of detection lines 121 arranged horizontally and vertically staggered with each other, and a pressure sensor is provided in the stress detection layer 120. The pressure sensor is configured to be able to detect the pressure of each detection line 121 pressed by the carrier 200, thereby ensuring accurate detection of the warpage of the carrier 200.

[0066] Specifically, the stress detection layer 120 is composed of a plurality of detection lines 121, which are arranged in a staggered manner horizontally and vertically to form a grid structure. Each detection line 121 is mounted on the bracket 110, and a pressure sensor is provided between the detection lines 121. When the carrier 200 is pressed against the stress detection layer 120, if the carrier 200 is warped, the detection line 121 will be subjected to pressure from different parts of the carrier 200. The pressure sensor can detect the pressure changes on each detection line 121, and convert this information into an electrical signal, which is then transmitted to the controller for analysis and processing, and finally the warping of the carrier 200 is obtained. It is understandable that in some embodiments, by providing a pressure sensor in the stress detection layer 120, real-time monitoring of the warping of the carrier 200 can be achieved. The pressure sensor can accurately capture the changes in the force on the detection line 121, and combined with the traces shown by the developing layer 130, the warping information of the carrier 200 can be quickly obtained.

[0067] In some embodiments, the support 110 is configured to be able to move in a direction close to the carrier 200, and the stress detection layer 120 is configured to be able to move relative to the developing layer 130 in a direction parallel to the movement path of the support 110, so as to adjust the detection range of the warpage detection device 100 according to the maximum preset warpage value of the carrier 200, so that the warpage detection device 100 can adapt to the detection requirements of different carriers 200, and improve the flexibility and accuracy of the detection. Specifically, there is a certain spacing distance between the stress detection layer 120 and the developing layer 130, and the position of the stress detection layer 120 relative to the developing layer 130 can be adjusted according to the maximum preset warpage value of the carrier 200 required by the customer. When the preset warpage value of the carrier 200 is large, the distance between the stress detection layer 120 and the developing layer 130 can be appropriately reduced, and vice versa. In this way, it can be ensured that the warpage amount of the carrier 200 is within the detection range, avoiding false alarms or missed detections caused by too wide or too narrow a detection range.

[0068] It is understandable that in some embodiments, by adjusting the position of the stress detection layer 120 relative to the developing layer 130, accurate detection of different carriers 200 can also be achieved. This adjustable design enables the warpage detection device 100 to adapt to the detection requirements of carriers 200 of various specifications and warpage degrees. Production personnel can flexibly adjust the detection range according to actual conditions to ensure that each detection can cover all warpage conditions of the carrier 200, thereby improving the effectiveness and reliability of the detection, while reducing production and maintenance costs, and increasing the service life and economic benefits of the warpage detection device 100.

[0069] Exemplarily, along the direction parallel to the movement path of the bracket 110, the stress detection layer 120 has a first position and a second position relative to the developing layer 130. When the stress detection layer 120 is located at the first position, the distance between it and the developing layer 130 is M, and the maximum preset warpage value of the carrier 200 is L. 1 When the stress detection layer 120 is located at the second position, the distance from the developing layer 130 is N, and the maximum preset warpage value of the carrier 200 is L 2 When M>N, L 1 <L 2 Therefore, the production personnel can adjust the distance between the stress detection layer 120 and the developing layer 130 according to the maximum preset warpage value of the carrier 200, so that the warpage detection device 100 can adapt to the detection requirements of carriers 200 of different specifications, thereby improving the flexibility and accuracy of the detection.

[0070] See also Figures 3 to 5 In some embodiments, the warpage detection device 100 has a positioning position along the direction in which the support 110 moves. The warpage detection device 100 further includes a carrier plate 140, which is configured to carry the carrier plate 200 and move relative to the support 110 so that the carrier plate 200 is located at the positioning position. The warpage detection device 100 further includes a driving member, the support 110 has an initial position, a preparatory position, and a working position, the driving member is connected to the support 110, and the driving member is configured to drive the support 110 to move between the initial position, the preparatory position, and the working position.

[0071] Specifically, when the bracket 110 is in the initial position, the carrier 200 is waiting to enter the positioning position; when the bracket 110 is in the preparation position, the carrier 200 is in the positioning position, and the stress detection layer 120 is not in contact with the carrier 200; when the bracket 110 is in the working position, the carrier 200 has been pressed against the stress detection layer 120 and the stress detection layer 120 has been pressed against the developing layer 130. It should be noted that when the bracket 110 is in the initial position, there is enough space between the stress detection layer 120 and the positioning position so that the carrier plate 140 can transport the carrier 200 to the positioning position.

[0072] It is understood that in some embodiments, by setting different positions of the support 110, an automatic detection process of the carrier 200 can be realized, so that the detection process is synchronized with the production rhythm of the carrier 200, and the monitoring of the warping of the carrier 200 is improved without affecting the production efficiency of the carrier 200. The carrier plate 140 carries the carrier 200 and can move between different positions to ensure that the carrier 200 can be detected at the correct position, and can also ensure that the carrier 200 can be transported between various manufacturing sites. When the support 110 is in the initial position, the carrier 200 has not yet entered the detection position; when the carrier 200 is in the positioning position, the support 110 moves to the preparation position and is ready for detection; when the support 110 moves to the working position, the carrier 200 presses against the stress detection layer 120 to perform actual warping detection. During the entire detection process, the support 110 only needs to move in the same direction, which simplifies the detection process, improves the detection efficiency, ensures the accuracy of the detection results, and avoids errors caused by improper manual operation.

[0073] In some embodiments, for ease of description, the maximum preset warpage value of the carrier 200 is defined as L, and the thickness of the carrier 200 is defined as D. The path H of the bracket 110 moving from the preparation position to the working position satisfies: H=L+D. The distance that the bracket 110 moves from the preparation position to the working position is determined by the maximum warpage value of the carrier 200 and the thickness of the carrier 200, thereby preventing the carrier 200, the stress detection layer 120 and the developing layer 130 from being damaged due to excessive movement of the bracket 110, and at the same time ensuring that the stress detection layer 120 and the developing layer 130 can effectively detect the carrier 200 with different warpage requirements, so that when the carrier 200 presses against the stress detection layer 120, it can fully contact the developing layer 130 to ensure the accuracy of the detection.

[0074] See also Figures 6 to 8 In some embodiments, the carrier plate 140 includes a main body 141 and a support portion 142 connected to the main body 141, the support portion 142 protrudes from the main body 141, and the carrier plate 200 includes a plurality of delivery units 210 and an auxiliary edge 220 arranged around the side of the delivery unit 210. The support portion 142 is configured to support the auxiliary edge 220 so that there is a gap between the delivery unit 210 and the main body 141. The carrier plate 200 can be better supported on the carrier plate 140 to ensure stability during the inspection process. At the same time, the gap between the delivery unit 210 and the main body 141 can prevent the delivery unit 210 and the main body 141 from being damaged by friction, thereby improving the production quality of the carrier plate 200.

[0075] The second aspect of the present invention further provides a method for manufacturing a carrier 200 and monitoring its warpage, which is applicable to the warpage detection device 100 described in any of the above embodiments and implementations. The method includes but is not limited to the following steps:

[0076] S101: Prepare a substrate. First, prepare a substrate and place it on the carrier plate 140. The substrate is the basis for subsequent processing, and its flatness and size must meet the requirements. Drive the carrier plate 140 to the warpage detection device 100 so that the substrate can enter the detection position of the warpage detection device 100.

[0077] S102: Perform warpage detection on the substrate using the warpage detection device 100 to obtain first detection information. When the substrate is pressed against the stress detection layer 120, if the substrate is warped, the stress detection layer 120 will be pressed by the substrate and deformed toward the developing layer 130, thereby generating and showing a mark on the developing layer 130. By observing the mark on the developing layer 130, the warpage position of the substrate can be determined.

[0078] S103: driving the carrier plate 140 away from the warpage detection device 100 so that the substrate moves out of the detection position.

[0079] S104: The carrier plate 140 carries the substrate and moves to the chip bonding location, and the chip is bonded to the substrate to form a first workpiece.

[0080] S105: Move the carrier plate 140 carrying the first workpiece to the warpage detection device 100 again (the warpage detection device 100 may be the warpage detection device 100 in step S102 or another additional warpage detection device 100).

[0081] S106: Perform warpage detection on the first workpiece using the warpage detection device 100 to obtain second detection information. This detection step can detect whether new warpage is introduced during the chip bonding process, so that production personnel can monitor each manufacturing site of the carrier 200 in real time.

[0082] S107: driving the carrier plate 140 away from the warpage detection device 100 again to move the first workpiece out of the detection position.

[0083] S108 : The carrier plate 140 carries the first workpiece and moves to the packaging station to package the first workpiece to form the carrier plate 200 .

[0084] S109: Move the carrier plate 140 carrying the carrier plate 200 to the warpage detection device 100 again (similarly, the warpage detection device 100 at this time may be the warpage detection device 100 in step S102, or may be another additional warpage detection device 100), and use the warpage detection device 100 to perform a warpage detection on the carrier plate 200 to obtain third detection information. This detection step can monitor whether new warpage is introduced during the packaging process of the carrier plate 200.

[0085] S110: The carrier tray 140 transports the packaged carrier 200 to a cutting station, where the carrier 200 is cut into a plurality of shipping units 210, completing the entire manufacturing and warpage monitoring process.

[0086] It is understandable that, in some embodiments, through the above steps, it can be ensured that the carrier 200 can be timely warped at each stage of the production process. Each detection helps to timely discover and deal with the warping problem, thereby improving the yield of the carrier 200 and reducing the loss and manufacturing cost caused by warping. That is, by performing multiple warping detections at different stages, the warping problem can be timely discovered and dealt with to ensure the quality of the carrier 200. Each detection can quickly determine the warping position of the carrier 200 based on the traces on the developing layer 130, thereby facilitating the adjustment of the production process or production equipment.

[0087] Compared with the traditional optical instrument detection method, the warpage detection device 100 provided by the present invention is simple to operate, low in cost, and can adapt to the production rhythm of the carrier 200 without interfering with the production process. The detection process is simple and fast, which improves the production efficiency. In addition, by adopting the carrier 200 manufacturing and the warpage monitoring method provided by the present invention, multiple detections are performed throughout the production process to facilitate timely detection and handling of warpage problems, thereby ensuring that the produced carrier 200 has high consistency and avoiding product quality problems caused by warpage problems.

[0088] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0089] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or", "and / or" or "and / or" appears in the full text, its meaning includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in the field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0090] The above are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural changes made using the contents of the present invention's specification and drawings, or directly / indirectly applied in other related technical fields, are included in the patent protection scope of the present invention.

Claims

1. A warpage detection device, suitable for detecting the warpage of a carrier board, characterized in that: include: Bracket; A stress detection layer connected to the bracket; a developing layer, connected to the support and spaced apart from the stress detecting layer; The stress detection layer is configured to be pressed by the carrier plate and deformed toward the developing layer until it presses against the developing layer, so as to generate and show a mark on the developing layer.

2. The warpage detection device according to claim 1, characterized in that: The stress detection layer is configured to have multiple detection lines arranged horizontally and vertically in an alternating manner. The bracket includes multiple collimators wound around the circumference of the developing layer. Each of the detection lines is installed on the collimator, and the detection line is configured to be able to extend or retract relative to the collimator. The collimator is configured to be able to rotate as the detection line is extended or retracted.

3. The warpage detection device according to claim 2, characterized in that: The warping stress F of the carrier plate and the circumference x of the collimator rotation satisfy the following: F=kx, where k is the elastic coefficient of the detection line.

4. The warpage detection device according to claim 1, characterized in that: The stress detection layer is configured to have a plurality of detection lines that are arranged horizontally and vertically in an interlaced manner, and the stress detection layer is provided with a pressure sensor, and the pressure sensor is configured to be able to detect the pressure of each detection line pressed by the carrier board.

5. The warpage detection device according to claim 1, characterized in that: The bracket is configured to be able to move in a direction close to the carrier, and the stress detection layer is configured to be able to move relative to the developing layer in a direction parallel to the movement path of the bracket, so as to adjust the detection range of the warping detection device according to the maximum preset warping value of the carrier.

6. The warpage detection device according to claim 5, characterized in that: Along a direction parallel to the movement path of the bracket, the stress detection layer has a first position and a second position relative to the developing layer. When the stress detection layer is located at the first position, the distance from the stress detection layer to the developing layer is M, and the maximum preset warping value of the carrier is L1. When the stress detection layer is located at the second position, the distance from the stress detection layer to the developing layer is N, and the maximum preset warping value of the carrier is L2, wherein when M>N, L1<L2.

7. The warpage detection device according to claim 1, characterized in that: The warping detection device has a positioning position along the direction in which the bracket moves, and the warping detection device further comprises a carrying plate, the carrying plate being configured to carry the carrying plate and being configured to be able to move relative to the bracket so that the carrying plate is located at the positioning position; The warping detection device also includes a driving member, the bracket has an initial position, a preparatory position and a working position, the driving member is connected to the bracket, and the driving member is configured to drive the bracket to move between the initial position, the preparatory position and the working position, when the bracket is in the initial position, the carrier plate is waiting to enter the positioning position, when the bracket is in the preparatory position, the carrier plate is located at the positioning position, and when the bracket is in the working position, the carrier plate is pressed against the stress detection layer and the stress detection layer is pressed against the developing layer.

8. The warpage detection device according to claim 7, characterized in that: The maximum preset warping value of the carrier is defined as L, and the thickness of the carrier is defined as D. Then, the path H of the bracket moving from the preparation position to the working position satisfies: H=L+D.

9. The warpage detection device according to claim 7, characterized in that: The carrier plate includes a main body and a support portion connected to the main body, the support portion protrudes from the main body, and the carrier plate includes multiple shipping units and auxiliary edges arranged around the sides of the shipping units, the support portion is configured to support the auxiliary edges so that a gap exists between the shipping units and the main body.

10. A carrier board manufacturing and warpage monitoring method thereof, the warpage monitoring method being applicable to the warpage detection device according to any one of claims 1 to 9, the warpage detection device comprising a carrier plate, the carrier plate being configured to carry the carrier board and being configured to be movable relative to the bracket, characterized in that: The carrier board manufacturing and warpage monitoring method thereof include: preparing a substrate, and placing the substrate on the carrier plate; driving the carrier plate to move to the warping detection device; Using the warpage detection device to perform warpage detection on the substrate to obtain first detection information; driving the carrier plate to move away from the warpage detection device, and welding the chip to the substrate to obtain a first workpiece; driving the carrier plate carrying the first workpiece to move to a warping detection device; Using the warpage detection device to perform warpage detection on the first workpiece to obtain second detection information; driving the carrier plate to move away from the warpage detection device, and packaging the first workpiece to obtain the carrier plate; driving the carrier plate carrying the carrier plate to move to the warping detection device; Using the warpage detection device to perform warpage detection on the carrier to obtain third detection information; The carrier plate is cut to obtain a shipping unit.

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