Control method and system of wafer UV film sticking machine

Abstract

The invention provides a control method and system of a wafer UV film sticking machine. The control method comprises the steps that a preset material rolling mechanism is driven to discharge a film material; a preset film cutting mechanism is driven to cut the film material around a preset profiling jig; transferring the cut film to a preset attaching head; a preset film tearing mechanism is driven to tear off waste films in the cut films; the attaching film is attached to a wafer on a preset attaching platform; driving a preset easy-to-tear tape mechanism to attach the easy-to-tear tape to the wafer to obtain a wafer finished product; and discharging the wafer finished product to a preset placing rack. According to the automatic film pasting machine, after the film material is discharged through the film rolling mechanism and cut, the waste film is torn off through the film tearing mechanism, the attached film is attached to the wafer, and the easy-to-tear tape is attached, so that film rolling, film cutting, film tearing, film pasting and easy-to-tear tape attaching can be integrated, a traditional manual film pasting mode is replaced, automatic film pasting is achieved, and the production efficiency is improved. The intelligent degree and the working efficiency are greatly improved, and the phenomenon of pollution or damage to the UV film is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of equipment automation, and in particular to a control method and system of a wafer UV laminating machine. Background Art

[0002] In semiconductor equipment, wafers are a basic material for manufacturing semiconductor chips, and their surfaces need to be treated with UV film, which can provide good protection for the wafer surface. The UV film is in the form of rolls, and the UV roll film has three layers, the upper and lower layers are base films, and the middle layer is an effective layer. Usually, the lower base film needs to be torn off before filming to obtain the UV film to be attached. When filming the wafer, the UV film needs to be kept neat and clean before attachment.

[0003] At present, the processing method of applying UV film to wafers is to cut them manually or use tools to cut them and then transport them to the application site again, tear off the base film at the application site and then apply the film. This processing method will reduce work efficiency, easily cause contamination to the UV film, require workers' proficiency, and cause a large amount of material loss and bubbles and scratches on the wafer surface. The present invention can directly integrate the module to automatically apply the film on the wafer surface, ensuring that the UV film and the wafer are more accurately and tightly attached to protect the wafer surface from contamination, oxidation or other damage. It is efficient and fast, and effectively prevents the contamination and material loss of the UV film. Summary of the invention

[0004] The present invention aims to solve the problem that in the above-mentioned prior art, UV film is applied to wafers by manual cutting, which has low intelligence, low working efficiency, and is easy to cause contamination or damage to the UV film. A control method and system for a wafer UV film applying machine are provided.

[0005] The present invention provides a control method for a wafer UV laminating machine, comprising the following steps: Drive the preset coiling mechanism to discharge the film material; Driving a preset film cutting mechanism to cut the film material around a preset profiling jig to obtain a cut film; Transferring the cut film to a preset attachment head; Driving a preset film tearing mechanism to tear off the waste film in the cut film to obtain an attached film; Attaching the attachment film to the wafer on a preset attachment platform; Driving a preset easy-tear sticker mechanism to attach the easy-tear sticker to the wafer to obtain a finished wafer; The finished wafers are unloaded onto a preset placement rack.

[0006] Furthermore, after the step of driving the preset coiling mechanism to discharge the film material, the following steps are included: The film material is stretched tight by a preset film stretching mechanism; Determining whether the tension of the film material reaches a preset threshold; If so, stop the tensioning action; If not, continue to perform the tightening action.

[0007] Furthermore, before the step of driving the preset film cutting mechanism to cut the film material around the preset profiling fixture to obtain the film cutting step, the step includes: Performing defect detection on the film material; Determining whether the film material has defects; If yes, the film material is cut off according to the set length; If not, the film cutting mechanism is controlled to cut around the profiling jig; wherein the motion trajectory of the film cutting mechanism is set as a circle.

[0008] Furthermore, before the step of attaching the attachment film to the wafer on the preset attachment platform, the process includes: Controlling the preset material taking mechanism to take the wafer from the preset jamming mechanism; The wafer is placed on an attaching platform.

[0009] Furthermore, after the step of controlling the preset material taking mechanism to take the wafer from the preset jamming mechanism, the method further comprises: Acquire the coordinate data of the film material and the coordinate data of the wafer, and use the coordinate data of the film material as the attachment reference center; Calculating an offset according to the coordinate data of the film material and the coordinate data of the wafer; The attachment platform is driven to move to correspond to the attachment reference center.

[0010] Furthermore, after the step of driving the attachment platform to move to a position corresponding to the attachment reference center, the method further comprises: Heating the attachment platform by a preset heating mechanism; detecting the temperature of the attachment platform; Determining whether the temperature of the attachment platform reaches a preset temperature value; If so, stop heating; If not, continue heating.

[0011] Furthermore, the step of attaching the attachment film to the wafer on the preset attachment platform includes: The attachment platform is moved into a preset cavity, and a vacuum pumping mechanism is driven to vacuum the cavity; Determining whether the pressure of the cavity reaches a preset pressure threshold; If yes, stop driving the vacuum mechanism and drive the attaching head to attach; If not, continue to drive the vacuum mechanism.

[0012] Furthermore, after the step of stopping driving the vacuum pumping mechanism and driving the attaching head to attach, the method further comprises: Setting the pressure value of the attachment head; The attaching head is driven to move according to a set attaching track, and the attaching film is attached to the wafer.

[0013] Furthermore, after the step of driving the preset easy-tear sticker mechanism to attach the easy-tear sticker to the wafer to obtain a finished wafer, the method further comprises: Detecting whether there is an easy-tear sticker on the surface of the wafer; If yes, unloading the finished wafer to a preset placement rack; If not, the easy-tear sticker mechanism is driven to attach the easy-tear sticker.

[0014] The present invention also provides a control system for a wafer UV film laminating machine, comprising a main controller, a material rolling mechanism, a film cutting mechanism, a profiling jig, a film pulling mechanism, an attaching head, a film tearing mechanism, an easy-tear attaching mechanism, an attaching platform, a cavity, a material taking mechanism, a heating mechanism, a vacuum mechanism and a plurality of attaching heads, wherein the main controller is electrically connected to the material rolling mechanism, the film cutting mechanism, the film pulling mechanism, the film tearing mechanism, the easy-tear attaching mechanism, the material taking mechanism, the attaching platform, the attaching head, the heating mechanism and the vacuum mechanism respectively; the material taking mechanism is located on one side of the attaching platform; the film pulling mechanism is located on one side of the material rolling mechanism; the film tearing mechanism is located on one side of the film pulling mechanism; the profiling jig and the attaching platform are respectively located below the film cutting mechanism; the attaching platform is located below the cavity; the attaching head is located above the attaching platform; the heating mechanism is located on the attaching platform and contacts with the attaching platform.

[0015] The present invention provides a control method and system for a wafer UV laminating machine, which has the following beneficial effects: The present invention discharges the film material through a film rolling mechanism, and after cutting the film material, the waste film is torn off through a film tearing mechanism, and the attached film is attached to the wafer, and an easy-to-tear sticker is attached. It can integrate film rolling, film cutting, film tearing, film sticking and easy-to-tear sticker attachment, replacing the traditional manual film sticking method, realizing automatic film sticking, greatly improving the degree of intelligence and work efficiency, and avoiding pollution or damage to the UV film. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic diagram of the method steps of a control method of a wafer UV laminating machine in the present invention; Figure 2 It is a structural block diagram of a control system of a wafer UV film laminating machine in the present invention; Figure 3 It is a three-dimensional schematic diagram of a film rolling mechanism, a film cutting mechanism, a film pulling mechanism, and a film tearing mechanism in one embodiment of the present invention; Figure 4 A three-dimensional schematic diagram of an easy-tear sticker mechanism in one embodiment of the present invention; Figure 5 It is a three-dimensional schematic diagram of a material taking mechanism in one embodiment of the present invention; Figure 6 A three-dimensional schematic diagram of an attachment platform in one embodiment of the present invention; Figure 7 It is a three-dimensional schematic diagram of a vacuum pumping mechanism in one embodiment of the present invention.

[0017] Description of markings: main controller 101, material winding mechanism 1, film cutting mechanism 2, film pulling mechanism 3, film tearing mechanism 4, easy-tear and sticking mechanism 5, material taking mechanism 6, heating mechanism 7, sticking platform 8, vacuuming mechanism 9, sticking head 11, acquisition module 12, first judgment module 301, detection module 501, second judgment module 701, third judgment module 901, cavity 902. DETAILED DESCRIPTION

[0018] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0019] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0020] Reference Figure 1 , is a control method for a wafer UV laminating machine in one embodiment of the present invention, comprising: S1, driving the preset coiling mechanism 1 to discharge the film material; S2, driving the preset film cutting mechanism 2 to cut the film material around the preset profiling jig to obtain a cut film; S3, transferring the cut film to a preset attaching head 11; S4, driving the preset film tearing mechanism 4 to tear off the waste film in the cut film to obtain the attached film; S5, attaching the attachment film to the wafer on the preset attachment platform 8; S6, driving the preset easy-tear adhesive mechanism 5 to attach the easy-tear adhesive tape to the wafer to obtain a finished wafer; S7, unloading the finished wafers to a preset placement rack.

[0021] In the above steps, first, the coiling mechanism 1 is driven by the controller to rotate the film material out and feed the film; the coiling mechanism 1 can be a coiling drum; the coiling drum is provided with a reducer, which can reduce the speed of the coiling drum to avoid the film material being pulled and damaged or the film material being folded due to the film discharge speed being too fast. In a specific embodiment, a program is pre-entered into the coiling mechanism 1 so that the coiling mechanism 1 can automatically discharge the film material. Then the film cutting mechanism 2 is driven to cut the film material around the profiling jig, wherein the diameter of the profiling jig is larger than the wafer, and the profiling jig can provide support so that the film cutting mechanism 2 can accurately cut the film material along the edge of the profiling jig to obtain a cut film. In a specific embodiment, the cutting trajectory of the film cutting mechanism 2 is pre-set so that the film cutting mechanism 2 can automatically complete the film cutting. The cut film is transferred to the attachment head 11. In a specific embodiment, the cut film can be clamped by a robot and placed on the attachment head 11. In another specific embodiment, the attaching head 11 directly clamps the cut film. Then, the film tearing mechanism 4 is driven to tear off the waste film in the cut film to obtain the attached film. Then, the attached film is attached to the wafer on the attaching platform 8, and then the easy-tear attaching mechanism 5 is driven to attach the easy-tear attaching film to obtain a finished wafer; finally, the wafer is unloaded into the placement rack. It can realize full-automatic film attaching of wafers, improve work efficiency, and is not affected by manual proficiency. At the same time, it can avoid contamination or damage to the UV film.

[0022] In one embodiment, after the step of discharging the film material through the preset winding mechanism 1, the following steps are included: The film material is stretched tight by the preset film stretching mechanism 3; Determine whether the tension of the film material reaches a preset threshold; If so, stop the tensioning action; If not, continue to perform the tightening action.

[0023] like Figure 3 As shown, in a specific implementation, after the film material is discharged, the film material is tightened by the film pulling mechanism 3 to facilitate cutting; and the first judgment module 301 is used to judge whether the tension of the film material reaches a preset threshold, that is, the value of the tension. If so, the tightening action is stopped. If not, the film material is continued to be tightened until the tension reaches the preset tension value. In a specific embodiment, a surface tension meter is provided on one side of the film material and is electrically connected to the first judgment module 301. It can ensure that the film material is cut under the set tension to avoid deformation of the film material.

[0024] In one embodiment, before the step of cutting the film material around the preset profiling jig by the preset film cutting mechanism 2 to obtain the film cutting step, the following steps are included: Conduct defect detection on membrane materials; Determine whether the membrane material has defects; If so, the membrane material is cut off according to the set length; If not, the film cutting mechanism 2 is controlled to cut around the profiling jig, wherein the motion trajectory of the film cutting mechanism 2 is set as a circle.

[0025] like Figure 3 As shown, in a specific implementation, before cutting the film, the film material is inspected for defects. The inspection method can be scanning inspection or point contact inspection. In a specific embodiment, a three-axis detection coordinate device is provided to determine whether there is a defect by making point contact with the film material. Specifically, when point contact is made, if no test point is detected in the plane of the film material, the film material has a damage defect. In another specific embodiment, a defect scanning device is provided to scan the film material to detect whether the film material is damaged. After the film material is scanned and processed by the processor, the inspection result will be presented on the display screen. By observing the color depth of the scanned image, it can be known whether the film material has cracks.

[0026] In one embodiment, before the step of attaching the attachment film to the wafer on the preset attachment platform 8, the following steps are included: Control the preset material taking mechanism 6 to take the wafer from the preset jamming mechanism; The wafer is placed on the attaching platform 8 .

[0027] like Figure 5 and Figure 6 As shown, in a specific implementation, before attaching the film material, the material taking mechanism 6 is controlled to take the wafer in the jamming mechanism. In a specific embodiment, the material taking mechanism 6 can be a robotic arm that can take the wafer and place the wafer on the attaching platform 8.

[0028] In one embodiment, after the step of controlling the preset material taking mechanism 6 to take the wafer in the preset jamming mechanism, the following steps are included: Obtaining the coordinate data of the film material and the coordinate data of the wafer, and using the coordinate data of the film material as the attachment reference center; Calculate the offset according to the coordinate data of the film material and the coordinate data of the wafer; The attachment platform 8 is driven to move to correspond to the attachment reference center.

[0029] In the specific implementation, after the wafer is taken, the coordinate data of the film material and the coordinate data of the wafer are obtained through the acquisition module 12, and the coordinate data of the film material is used as the attachment reference center. Then, the offset of the wafer is calculated with the attachment reference center as the reference point. Specifically, the film material is provided with an attachment reference center, and the coordinate data of the wafer can be the coordinates of the center of the wafer or the coordinates of a point set at the edge of the wafer. Then, the offset between the coordinates of the wafer and the attachment reference center is calculated. In a specific embodiment, the coordinate point of the attachment reference center is (5,5), and the coordinate data of the wafer is the coordinates of a point on the edge of the wafer (2,2). The calculated offset is 3 units in the X-axis direction and 3 units in the Y-axis direction. Then, the attachment platform 8 is driven to move three units in the X-axis and three units in the Y-axis, so that the coordinates of the wafer correspond to the attachment reference center, and the subsequent film attachment is carried out.

[0030] In one embodiment, after the step of driving the attachment platform 8 to move to a position corresponding to the attachment reference center, the following steps are included: The attachment platform 8 is heated by a preset heating mechanism 7; Detecting the temperature of the attachment platform 8; Determine whether the temperature of the attaching platform 8 reaches a preset temperature value; If so, stop heating; If not, continue heating.

[0031] like Figure 6 As shown, in a specific implementation, the attachment platform 8 is provided with a heating mechanism 7, and the heating mechanism 7 can be a heating rod, and the heating rod contacts the wafer for heat conduction. The wafer is attached after being heated, which can avoid the generation of bubbles. Specifically, after starting the heating mechanism 7, the temperature of the attachment platform 8 is detected, and a thermometer can be set on one side of the attachment platform 8 to detect the temperature of the attachment platform 8. The thermometer is electrically connected to the second judgment module 701, and then the second judgment module 701 is used to judge whether the attachment platform 8 reaches the preset temperature value. If so, the heating is stopped; if not, the heating is not continued.

[0032] In one embodiment, the step of attaching the attachment film to the wafer on the preset attachment platform 8 includes: The attaching platform 8 is moved into the preset cavity 902, and the vacuum pumping mechanism 9 is driven to vacuum the cavity 902; Determine whether the pressure of the cavity 902 reaches a preset pressure threshold; If yes, the vacuum mechanism 9 is stopped from being driven, and the attaching head 11 is driven to attach; If not, the vacuum pumping mechanism 9 continues to be driven.

[0033] like Figure 7As shown, in the specific implementation, a cavity 902 is provided on one side of the attachment platform 8, and the attachment platform 8 can be displaced into the cavity 902, and then the vacuum pumping mechanism 9 provided in the cavity 902 is driven to vacuum the cavity 902, wherein the vacuum pumping mechanism 9 can be a vacuum pump. Then, the third judgment module 901 is used to judge whether the pressure in the cavity 902 reaches a preset pressure threshold, such as 200Pa, and the third judgment module 901 is electrically connected to the vacuum pumping mechanism 9. When the pressure in the cavity 902 reaches the set pressure threshold, the vacuum pumping mechanism 9 is stopped from being driven, and the attachment head 11 is driven to attach the film. If it is not reached, the vacuum pump is continued to be driven to vacuum.

[0034] In one embodiment, if yes, then after the step of stopping driving the vacuum mechanism 9 and driving the attaching head 11 to attach, the following steps are included: Setting the pressure value of the attaching head 11; The attaching head 11 is driven to move along a set attaching track and attach the attaching film to the wafer.

[0035] In a specific implementation, before attaching the wafer through the attaching head 11, the pressure value of the attaching head 11 is set. When attaching the wafer, a larger downward pressure is required to avoid the generation of bubbles. In a specific embodiment, the attaching head 11 can be a rubber roller, and the wafer is attached by rolling. Before attaching, the attaching track of the attaching head 11 is pre-set, such as a horizontal motion track from right to left, and then the attaching head 11 is driven to move along the set attaching track, and the attaching film is attached to the wafer.

[0036] In one embodiment, after the step of attaching the easy-tear sticker to the wafer by the preset easy-tear sticker mechanism 5 to obtain the wafer product, the following steps are included: Check whether there is easy-to-tear sticker on the surface of the wafer; If yes, unload the finished wafer to a preset placement rack; If not, the easy-tear sticker mechanism 5 is driven to attach the easy-tear sticker.

[0037] like Figure 4 As shown, in a specific implementation, the detection module 501 is electrically connected to the easy-tear sticker mechanism 5. The detection module 501 detects whether there is an easy-tear sticker on the surface of the wafer. If it is detected that the wafer is attached with an easy-tear sticker, the finished wafer is transported to the placement rack, which can be a multi-layer wafer box. If it is detected that the wafer is not attached with an easy-tear sticker, the easy-tear sticker mechanism 5 is driven to attach the easy-tear sticker to the wafer.

[0038] Reference Figure 2A control system for a wafer UV film laminating machine includes a main controller 101, a material winding mechanism 1, a film cutting mechanism 2, a profiling fixture, a film pulling mechanism 3, an attaching head 11, a film tearing mechanism 4, an easy-tear pasting mechanism 5, an attaching platform 8, a cavity 902, a material taking mechanism 6, a heating mechanism 7, a vacuum mechanism 9 and a plurality of attaching heads 11. The main controller 101 is electrically connected to the material winding mechanism 1, the film cutting mechanism 2, the film pulling mechanism 3, the film tearing mechanism 4, the easy-tear pasting mechanism 5, the material taking mechanism 6, the attaching platform 8, the attaching head 11, the heating mechanism 7 and the vacuum mechanism 9 respectively; the material taking mechanism 6 is located at one side of the attaching platform 8; the film pulling mechanism 3 is located at one side of the material winding mechanism 1; the film tearing mechanism 4 is located at one side of the film pulling mechanism 3; the profiling fixture and the attaching platform 8 are respectively located below the film cutting mechanism 2; the attaching platform 8 is located below the cavity 902; the attaching head 11 is located above the attaching platform 8; the heating mechanism 7 is located on the attaching platform 8 and contacts with the attaching platform 8.

[0039] In a specific implementation, the main controller 101 is electrically connected to the material coiling mechanism 1, the film cutting mechanism 2, the film pulling mechanism 3, the film tearing mechanism 4, the easy-tear-sticking mechanism 5, the material taking mechanism 6, the heating mechanism 7, the attaching platform 8, the attaching head 11, the vacuuming mechanism 9, the first judgment module 301, the acquisition module 12, the second judgment module 701, the third judgment module 901 and the detection module 501. The main controller 101 can drive the material coiling mechanism 1, the film cutting mechanism 2, the film pulling mechanism 3, the film tearing mechanism 4, the easy-tear-sticking mechanism 5, the material taking mechanism 6, the heating mechanism 7, the vacuuming mechanism 9, the attaching platform 8 and the attaching head 11.

[0040] In one embodiment, the main controller 101 is electrically connected to the display screen.

[0041] In specific implementation, the display screen can display the working stage of the film material. In a specific embodiment, the main controller 101 controls the winding mechanism 1 to discharge the film, and at the same time displays the running state of the winding mechanism 1 on the display screen.

[0042] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, device, article or method including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, device, article or method. In the absence of further restrictions, an element defined by the sentence "includes a ..." does not exclude the presence of other identical elements in the process, device, article or method including the element.

[0043] The above description is only a preferred embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A control method for a wafer UV laminating machine, characterized in that: The following steps are involved: Drive the preset coiling mechanism to discharge the film material; Driving a preset film cutting mechanism to cut the film material around a preset profiling jig to obtain a cut film; Transferring the cut film to a preset attachment head; Driving a preset film tearing mechanism to tear off the waste film in the cut film to obtain an attached film; Attaching the attachment film to the wafer on a preset attachment platform; Driving a preset easy-tear sticker mechanism to attach the easy-tear sticker to the wafer to obtain a finished wafer; The finished wafers are unloaded onto a preset placement rack.

2. The control method of the wafer UV laminating machine according to claim 1, characterized in that: After the step of driving the preset coiling mechanism to discharge the film material, the method further comprises: The film material is stretched tight by a preset film stretching mechanism; Determining whether the tension of the film material reaches a preset threshold; If so, stop the tensioning action; If not, continue to perform the tightening action.

3. The control method of the wafer UV laminating machine according to claim 1, characterized in that: The step of driving the preset film cutting mechanism to cut the film material around the preset profiling fixture to obtain the film cutting step includes: Performing defect detection on the film material; Determining whether the film material has defects; If yes, the film material is cut off according to the set length; If not, the film cutting mechanism is controlled to cut around the profiling jig; wherein the motion trajectory of the film cutting mechanism is set as a circle.

4. The control method of the wafer UV laminating machine according to claim 1, characterized in that: Before the step of attaching the attachment film to the wafer on the preset attachment platform, the method includes: Controlling the preset material taking mechanism to take the wafer from the preset jamming mechanism; The wafer is placed on an attaching platform.

5. The control method of the wafer UV laminating machine according to claim 4, characterized in that: After the step of controlling the preset material taking mechanism to take the wafer from the preset jamming mechanism, the method further comprises: Acquire the coordinate data of the film material and the coordinate data of the wafer, and use the coordinate data of the film material as the attachment reference center; Calculating an offset according to the coordinate data of the film material and the coordinate data of the wafer; The attachment platform is driven to move to correspond to the attachment reference center.

6. The control method of the wafer UV laminating machine according to claim 5, characterized in that: After the step of driving the attachment platform to move to a position corresponding to the attachment reference center, the method further comprises: Heating the attachment platform by a preset heating mechanism; detecting the temperature of the attachment platform; Determining whether the temperature of the attachment platform reaches a preset temperature value; If so, stop heating; If not, continue heating.

7. The control method of the wafer UV laminating machine according to claim 1, characterized in that: The step of attaching the attachment film to the wafer on the preset attachment platform includes: The attachment platform is moved into a preset cavity, and a vacuum pumping mechanism is driven to vacuum the cavity; Determining whether the pressure of the cavity reaches a preset pressure threshold; If yes, stop driving the vacuum mechanism and drive the attaching head to attach; If not, continue to drive the vacuum mechanism.

8. The control method of the wafer UV laminating machine according to claim 7, characterized in that: If yes, then the step of stopping driving the vacuum mechanism and driving the attaching head to attach includes: Setting the pressure value of the attachment head; The attaching head is driven to move according to a set attaching track, and the attaching film is attached to the wafer.

9. The control method of the wafer UV laminating machine according to claim 1, characterized in that: After the step of driving the preset easy-tear sticker mechanism to attach the easy-tear sticker to the wafer to obtain a wafer product, the method includes: Detecting whether there is an easy-tear sticker on the surface of the wafer; If yes, unloading the finished wafer to a preset placement rack; If not, the easy-tear sticker mechanism is driven to attach the easy-tear sticker.

10. A control system for a wafer UV laminating machine, characterized in that: It includes a main controller, a material rolling mechanism, a film cutting mechanism, a profiling jig, a film pulling mechanism, an attachment head, a film tearing mechanism, an easy-tear attachment mechanism, an attachment platform, a cavity, a material taking mechanism, a heating mechanism, a vacuum mechanism and a plurality of attachment heads, wherein the main controller is electrically connected to the material rolling mechanism, the film cutting mechanism, the film pulling mechanism, the film tearing mechanism, the easy-tear attachment mechanism, the material taking mechanism, the attachment platform, the attachment head, the heating mechanism and the vacuum mechanism respectively; the material taking mechanism is located at one side of the attachment platform; the film pulling mechanism is located at one side of the material rolling mechanism; the film tearing mechanism is located at one side of the film pulling mechanism; the profiling jig and the attachment platform are respectively located below the film cutting mechanism; the attachment platform is located below the cavity; the attachment head is located above the attachment platform; the heating mechanism is located on the attachment platform and contacts with the attachment platform.

Images