Wafer defect detection device and detection method

Abstract

The invention provides a wafer defect detection device and a wafer defect detection method, and belongs to the technical field of wafers. The mounting seat can be used for supporting the whole equipment; two clamping mechanisms are arranged in the mounting base, one clamping mechanism comprises a first motor, a gear, a sliding base, a rack, a sliding rod, a sliding frame, a second motor, a butt joint and a clamping block, the first motor is fixedly connected to the lower inner wall of the mounting base and can be used for driving the gear to rotate, and the gear is fixedly connected to the output end of the first motor and can be used for driving the butt joint to rotate; the light receiving pot can be used for driving the two racks to move relative to each other, the penetrating lamp is moved to the upper surface of the wafer, the penetrating lamp is operated to irradiate the wafer, and the light receiving pot receives a reflected light signal. And a photoelectric converter in the light receiving pot converts the reflected light signal into an electric signal and amplifies and filters the electric signal so as to improve the signal-to-noise ratio, and whether the wafer has a crack or not and the position of the crack can be judged by analyzing the intensity and distribution of the received reflected light signal.

Description

Technical Field

[0001] The present invention belongs to the field of wafer technology, and in particular relates to a wafer defect detection device and a detection method. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polysilicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod is formed into a silicon wafer, also known as a wafer.

[0003] After searching, it was found that a wafer pretreatment device and a wafer defect detection method were disclosed in a Chinese patent with authorization announcement number CN113725131A. The wafer pretreatment device includes: a cover body; a support table arranged in the cover body; a clamping assembly for clamping and fixing the wafer, which can be movably connected to the support table; an electrical test assembly for testing the electrical performance of the wafer, which is arranged on the support table; a blowing assembly for blowing air to the surface of the wafer, which is arranged on the support table; and a controller, which is connected to the clamping assembly, the electrical test assembly and the blowing assembly, and is used to control the working state of the clamping assembly, the electrical test assembly and the blowing assembly. The wafer pretreatment device and wafer defect detection method provided by the present disclosure can realize fully automatic drying of the wafer surface and testing resistance, no longer requiring the cooperation of multiple people, with a high degree of automation, effectively improving the efficiency of the entire pre-processing, easy to use, and reducing labor costs.

[0004] However, the above technical solution can realize fully automatic drying of the wafer surface and testing of resistance, and no longer requires the cooperation of multiple people. It has a high degree of automation, effectively improves the efficiency of the entire pre-processing, is easy to use, and reduces labor costs. However, in the prior art, when inspecting wafers, operators are required to use optical microscopes to observe the wafer surface microscopically to detect scratches, cracks, and bubbles, but this is time-consuming and laborious in batch inspection, and mistakes and recording errors may occur during the operation. Summary of the invention

[0005] The purpose of the present invention is to provide a wafer defect detection device and detection method, aiming to solve the problem in the prior art that when inspecting wafers, an operator needs to use an optical microscope to perform microscopic observation of the wafer surface to detect scratches, cracks, and bubbles, but it is time-consuming and laborious in batch inspection, and mistakes and recording errors may occur during the operation.

[0006] To achieve the above object, the present invention provides the following technical solutions: A wafer defect detection device comprises: a mounting seat; Two groups of clamping mechanisms are arranged in the mounting seat, and one group of clamping mechanisms includes a first motor, a gear, a slide, a rack, a slide rod, a slide, a second motor, a docking head and a clamping block, the first motor is fixedly connected to the lower inner wall of the mounting seat, the gear is fixedly connected to the output end of the first motor, the slide is slidably connected in the mounting seat, the rack is fixedly connected to the side end of the slide, the rack and the gear are meshed with each other, the slide rod is fixedly connected to the side end of the slide, the slide is fixedly connected to the upper end of the slide, the second motor is fixedly connected to the upper end of the slide, the docking head is fixedly connected to the output end of the second motor, and the clamping block is fixedly connected to one end of the docking head; A detection mechanism is provided at the upper end of the mounting seat, and the detection mechanism includes a support rod, a first electric push rod, a connecting rod, a third motor, a rotating head, three swing rods, a light receiving pot, a penetrating lamp, an air pipe, a nozzle, an ultrasonic receiving pot and an ultrasonic probe. The support rod is fixedly connected to the upper end of the mounting seat, the first electric push rod is fixedly connected to the support rod, the connecting rod is fixedly connected to the telescopic end of the first electric push rod, the third motor is fixedly connected to the connecting rod, the rotating head is fixedly connected to the output end of the third motor, the three swing rods are fixedly connected to the output end of the rotating head, the light receiving pot is fixedly connected to one end of one of the swing rods, the penetrating lamp is fixedly connected to the light receiving pot, the air pipe is fixedly connected to one end of one of the swing rods, the nozzle is fixedly connected to the lower end of the air pipe, the ultrasonic receiving pot is fixedly connected to one end of one of the swing rods, and the ultrasonic probe is fixedly connected to the ultrasonic receiving pot.

[0007] As a preferred solution of the present invention, an upper end of one of the slides is fixedly connected to an inclined block, and an upper end of the inclined block is fixedly connected to a sensor.

[0008] As a preferred solution of the present invention, the lower ends of the two racks are fixedly connected with a slide bar, the lower inner wall of the mounting seat is provided with two slide grooves, and the two slide bars are slidably connected in the two slide grooves respectively.

[0009] As a preferred solution of the present invention, the upper end of the mounting seat is fixedly connected to a butt joint pipe, a second electric push rod is fixedly connected inside the butt joint pipe, and a reflective plate is fixedly connected to the telescopic end of the second electric push rod.

[0010] As a preferred solution of the present invention, two fixing seats are fixedly connected to the upper end of the mounting seat, and the side ends of the two fixing seats are fixedly connected to the sensing devices.

[0011] As a preferred solution of the present invention, a storage tray is fixedly connected to the upper end of the mounting seat, a fixed bottom plate is fixedly connected to the lower end of the mounting seat, and two mounting blocks are fixedly connected to both side ends of the mounting seat.

[0012] As a preferred solution of the present invention, installation grooves are provided in the two clamping blocks, and pressure sensors are fixedly connected in the two installation grooves.

[0013] As a preferred solution of the present invention, protection pads are fixedly connected to the two clamping blocks, and the two protection pads are made of rubber material.

[0014] As a preferred solution of the present invention, the two sliding rods are slidably connected in the mounting seat, and the two sliding seats are slidably connected via the sliding rods.

[0015] As a preferred embodiment of the present invention, A method for detecting wafer defects, comprising: S1. First, place the wafer on the reflective plate, and then run the first motor to drive the gear to rotate. The two racks drive the two slides to approach each other under the power of the gear, so that the two clamping blocks clamp the wafer. After testing one side of the wafer, the two second motors can be run at the same time to drive the wafer to rotate respectively, so that the testing mechanism can comprehensively test the wafer. S2. After the clamping mechanism fixes the wafer, the third motor can be operated to drive the rotating head to rotate, so that the nozzle moves to the upper end of the wafer. The nozzle avoids cleaning the wafer, which can reduce dust on the wafer surface. Then the ultrasonic probe is moved to the upper end of the wafer, and the first electric push rod is controlled to drive the ultrasonic probe to move toward the wafer. The ultrasonic probe radiates ultrasonic waves to the wafer, and measures the measured distance through the reflection of the measured object and the time difference after the echo is received. When the ultrasonic signal at a part of the wafer deviates, the ultrasonic receiving pot can receive the rebounded ultrasonic signal to detect bubbles and scratches on the wafer surface. By moving the penetration lamp to the upper surface of the wafer and running the penetration lamp to irradiate the wafer, when the wafer breaks, the irradiation light of the penetration lamp will pass through the wafer and shine on the surface of the reflective disk. At the same time, the light receiving pot can receive the reflected light signal to determine the position of the wafer crack. S3. When the two clamping blocks are clamping the wafer, the wafer will contact the protective pad. When the pressure sensor is subjected to the pressure of the wafer, the operation of the first motor will be stopped, so that the two clamping blocks can fix the wafer while avoiding the clamping blocks squeezing the wafer. The sensor installed on the slide can be used to detect the position of the wafer to avoid deviation during the clamping process.

[0016] Compared with the prior art, the present invention has the following beneficial effects: 1. After the wafer is fixed by the clamping mechanism, the wafer is inspected by the penetration lamp and ultrasonic probe respectively. The second motor controls the rotation of the wafer so that the detection mechanism can detect both sides of the wafer. The ultrasonic probe radiates ultrasonic waves to the wafer. When bubbles and concave-convex structures appear on the surface of the wafer, its energy will be emitted, refracted and scattered on the scratches and bubble surfaces of the wafer, thereby changing the propagation path of the ultrasonic wave, causing part of the ultrasonic wave energy to be reflected back. By analyzing the ultrasonic wave signal reflected back from the object being tested, the defects of the wafer can be detected. The wafer is illuminated by running the penetration lamp. When the light receiving pot receives the reflected light signal. The photoelectric converter in the light receiving pot converts the reflected light signal into an electrical signal, and amplifies and filters it to improve the signal-to-noise ratio. By analyzing the intensity and distribution of the received reflected light signal, it can be determined whether the wafer has cracks and the location of the cracks. If the intensity of the reflected light signal received by the receiving pot increases significantly, it indicates that the light has penetrated the wafer and the wafer may be broken. Therefore, no manual operation is required, and the wafer detection effect can be automatically achieved, which is more convenient in batch detection.

[0017] 2. When the two clamping blocks are fixing the wafer, the wafer will push the pressure sensor through the protective pad contacting the protective pad. When the pressure sensor senses the pressure, it will stop the operation of the first motor to prevent the clamping block from squeezing the wafer. The sensor installed on the slide allows the clamping block to find the position of the wafer and avoid deviation during the clamping process. The protective pad installed in the clamping block can protect the wafer and prevent the clamping block from damaging the wafer.

[0018] 3. The storage tray installed on the mounting base can be used to protect the wafer. When the wafer falls, the storage tray can reduce the damage to the wafer caused by the mounting base. The sensing device installed on the mounting base can sense the surroundings. During the operation of the equipment, when the operator is within the sensing range of the sensing device, the operation of the equipment can be stopped to prevent the equipment from causing injuries to the operator during operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings: Figure 1 This is a first-view stereogram of the present invention; Figure 2 It is an exploded view of the present invention; Figure 3 An exploded view of the clamping mechanism of the present invention; Figure 4 It is a partial enlarged view of point A in the present invention; Figure 5 is a cross-sectional view of the clamping block in the present invention; Figure 6 is a cross-sectional view of the slide in the present invention; Figure 7 It is an exploded diagram of the detection mechanism in the present invention; Figure 8 It is a stereoscopic diagram from a second viewing angle of the present invention; Fig. 9 It is a cross-sectional view of the mounting seat in the present invention.

[0020] In the figure: 1, mounting base; 201, slide; 202, slide; 203, slide rod; 204, first motor; 205, gear; 206, rack; 207, docking head; 208, second motor; 209, clamping block; 301, support rod; 302, first electric push rod; 303, connecting rod; 304, third motor; 305, rotating head; 306, swing rod; 307, penetrating lamp; 308, lamp Light receiving pot; 309, air pipe; 310, nozzle; 311, ultrasonic receiving pot; 312, ultrasonic probe; 4, fixing seat; 5, sensing device; 6, fixed bottom plate; 7, mounting block; 8, storage tray; 9, docking tube; 10, second electric push rod; 11, reflection disk; 12, pressure sensor; 13, protection pad; 14, mounting groove; 15, slide groove; 16, inclined block; 17, sensor; 18, slide bar. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Example

[0022] See also Figure 1-Figure 9 , the present invention provides the following technical solutions: A wafer defect detection device includes: a mounting base 1, which can be used to support the overall device; Two groups of clamping mechanisms are arranged in the mounting seat 1, wherein one group of clamping mechanisms comprises a first motor 204, a gear 205, a slide 202, a rack 206, a slide bar 203, a carriage 201, a second motor 208, a docking joint 207 and a clamping block 209. The first motor 204 is fixedly connected to the lower inner wall of the mounting seat 1 and can be used to drive the gear 205 to rotate. The gear 205 is fixedly connected to the output end of the first motor 204 and can be used to drive the two racks 206 to move relative to each other. The slide 202 is slidably connected in the mounting seat 1 and can be used to support the clamping mechanism. The rack 206 is fixedly connected to the side end of the slide 202 and can drive the carriage 201 to move by cooperating with the gear 205. The rack 206 meshes with the gear 205, and the slide bar 203 is fixedly connected to the side end of the slide 202 and can be used to support the slide 202 to slide in the mounting seat 1. The slide 201 is fixedly connected to the upper end of the slide 202 and can be used to install the second motor 208. The second motor 208 is fixedly connected to the upper end of the slide 201 and can drive the wafer to rotate through the clamping block 209. The docking head 207 is fixedly connected to the output end of the second motor 208, and the clamping block 209 can be installed at the output end of the second motor 208. The clamping block 209 is fixedly connected to one end of the docking head 207 and can be used to fix the wafer; The upper end of the mounting base 1 is provided with a detection mechanism, which includes a support rod 301, a first electric push rod 302, a connecting rod 303, a third motor 304, a rotating head 305, three swing rods 306, a light receiving pot 308, a penetrating lamp 307, an air pipe 309, a nozzle 310, an ultrasonic receiving pot 311 and an ultrasonic probe 312. The support rod 301 is fixedly connected to the upper end of the mounting base 1 and can be used to install the first electric push rod 302. The first electric push rod 302 is fixedly connected in the support rod 301 and can drive the three swing rods 306 to move up and down. The connecting rod 303 is fixedly connected to the telescopic end of the first electric push rod 302 and can be used to install the third motor 304. The third motor 304 is fixedly connected in the connecting rod 303 and can drive the three swing rods 306 to rotate. The rotating head 305 is fixedly connected to the output end of the third motor 304 and can be used to install the three swing rods 306. Three swinging rods 306 are fixedly connected to the output end of the rotating head 305, and can be used to install the detection equipment respectively. The light receiving pot 308 is fixedly connected to one end of one of the swinging rods 306, and can be used to receive the light signal rebounded by the reflective disk 11. The penetrating lamp 307 is fixedly connected to the light receiving pot 308. The light of the penetrating lamp 307 here uses light of a specific wavelength to irradiate the wafer, such as infrared light. Silicon is opaque in the visible light range, but in the infrared wavelength range, the transparency of silicon is improved. For the light receiving pot 308, the structure is to receive the reflected light signal reflected by the reflective disk 11, and the light receiving pot 308 receives the reflected light signal. The photoelectric converter in the receiving pot 308 converts the reflected light signal into an electrical signal, and amplifies and filters it to improve the signal-to-noise ratio. By analyzing the intensity and distribution of the received reflected light signal, it can be determined whether the wafer has cracks and the location of the cracks. If the intensity of the reflected light signal received by the receiving pot 308 increases significantly, it indicates that the light has penetrated the wafer and the wafer may be broken. Therefore, the strength of the light detector output signal can determine the change of the concave-convex structure on the surface of the wafer, and the light receiving pot 308 is pot-shaped, which can effectively receive the signal received by the light source. The air pipe 309 is fixedly connected to one end of one of the swing rods 306, and can supply air to the nozzle 310 by connecting to the air pump. The nozzle 310 is fixedly connected to the lower end of the air pipe 309 and can be used to clean the dust on the surface of the wafer. The ultrasonic receiving pot 311 is fixedly connected to one end of one of the swing rods 306 and can be used to receive the rebounded ultrasonic signal. The ultrasonic probe 312 is fixedly connected to the ultrasonic receiving pot 311, and transmits ultrasonic waves to the wafer. When bubbles and concave-convex structures appear on the surface of the wafer, the energy will be emitted, refracted and scattered on the scratches and bubble surfaces on the surface of the wafer, thereby changing the propagation path of the ultrasonic wave, causing part of the ultrasonic wave energy to be reflected back. By analyzing the ultrasonic wave signal reflected back from the object being measured, the defects of the wafer can be detected.

[0023] like Figure 3As shown, an upper end of one of the slides 201 is fixedly connected with an inclined block 16, which can be used to install a sensor 17. An upper end of the inclined block 16 is fixedly connected with a sensor 17, which can be used to assist the slide 201 in sensing the wafer.

[0024] like Figure 3 and Fig. 9 As shown, the lower ends of the two racks 206 are fixedly connected with a slide bar 18, which can be used to assist the slide 202 to slide in the mounting seat 1. The lower inner wall of the mounting seat 1 is provided with two slide grooves 15, and the two slides 202 can slide stably in the slide grooves 15 through the slide bars 18. The two slide bars 18 are slidably connected in the two slide grooves 15 respectively.

[0025] like Figure 2 As shown, the upper end of the mounting base 1 is fixedly connected with a butt joint pipe 9, and the second electric push rod 10 can be fixedly mounted on the mounting base 1. The second electric push rod 10 is fixedly connected inside the butt joint pipe 9, which can drive the wafer to move up and down. The telescopic end of the second electric push rod 10 is fixedly connected with a reflective plate 11, which can be used to place the wafer and reflect the detection light.

[0026] like Figure 1 As shown, the upper end of the mounting base 1 is fixedly connected to two fixing bases 4, and the sensing device 5 can be fixedly mounted on the mounting base 1. The side ends of the two fixing bases 4 are fixedly connected to the sensing devices 5, which can sense the surroundings. During the operation of the equipment, when the operator is within the sensing range of the sensing device 5, the operation of the equipment can be stopped.

[0027] like Figure 1 As shown, a storage tray 8 is fixedly connected to the upper end of the mounting seat 1, which can be used to protect the wafer. A fixed bottom plate 6 is fixedly connected to the lower end of the mounting seat 1, which can be used to reduce the wear of the workbench on the mounting seat 1. Two mounting blocks 7 are fixedly connected to both side ends of the mounting seat 1, and the mounting seat 1 can be fixedly mounted on the workbench.

[0028] like Figure 4 and Figure 5 As shown, both clamping blocks 209 are provided with mounting grooves 14 for mounting pressure sensors 12. Pressure sensors 12 are fixedly connected to both mounting grooves 14. When the clamping blocks 209 clamp the wafer, the wafer presses against the pressure sensors 12, thereby controlling the first motor 204 to stop running.

[0029] like Figure 4 As shown, the two clamping blocks 209 are both fixedly connected with protection pads 13, which can reduce the wear of the wafer caused by the clamping blocks 209. The two protection pads 13 are made of rubber material and can effectively protect the surface of the wafer.

[0030] like Figure 2 and Figure 3As shown, two slide bars 203 are slidably connected in the mounting seat 1, so that the slide 202 can slide stably in the mounting seat 1. The two slides 202 are slidably connected by the slide bars 203, respectively, which can increase the accuracy of the movement of the two slides 201.

[0031] The working principle and use process of the present invention are as follows: first, the wafer is placed on the reflective plate 11, and then the gear 205 is driven to rotate by running the first motor 204. The two racks 206 respectively drive the two slides 201 to approach each other under the power of the gear 205, so that the two clamping blocks 209 clamp the wafer. After detecting one side of the wafer, the two second motors 208 can be operated at the same time to drive the wafer to rotate respectively, so that the detection mechanism can comprehensively detect the wafer. After the clamping mechanism fixes the wafer, the third motor 304 can be operated to drive the rotating head 305 to rotate, so that the nozzle 310 moves to the upper end of the wafer, and the nozzle 310 can be used to avoid cleaning the wafer. Reduce the dust on the surface of the wafer, then move the ultrasonic probe 312 to the upper end of the wafer, control the first electric push rod 302 to drive the ultrasonic probe 312 to move toward the wafer, the ultrasonic probe 312 radiates ultrasonic waves to the wafer, and the ultrasonic receiving pot 311 can receive the rebounded ultrasonic signal to detect bubbles and scratches on the surface of the wafer. Move the penetration lamp 307 to the upper surface of the wafer, and irradiate the wafer by running the penetration lamp 307. The light of the penetration lamp 307 uses a light of a specific wavelength to irradiate the wafer. The light receiving pot 308 is to receive the reflected light signal reflected by the reflection disk 11, and the light receiving pot 308 receives the reflected light signal. The photoelectric converter in the receiving pot 308 converts the reflected light signal into an electrical signal, and amplifies and filters it to improve the signal-to-noise ratio. By analyzing the intensity and distribution of the received reflected light signal, it can be determined whether the wafer has cracks and the location of the cracks. If the intensity of the reflected light signal received by the receiving pot 308 increases significantly, it indicates that the light has penetrated the wafer and the wafer may be broken.

[0032] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A wafer defect detection device, characterized in that: include: Mounting seat (1); Two groups of clamping mechanisms are arranged in the mounting seat (1), wherein one group of the clamping mechanisms comprises a first motor (204), a gear (205), a slide seat (202), a rack (206), a slide rod (203), a slide frame (201), a second motor (208), a docking head (207) and a clamping block (209), wherein the first motor (204) is fixedly connected to the lower inner wall of the mounting seat (1), the gear (205) is fixedly connected to the output end of the first motor (204), and the slide seat (202) is slidably connected to the mounting seat (1). The rack (206) is fixedly connected to the side end of the slide (202), the rack (206) and the gear (205) are meshed with each other, the slide bar (203) is fixedly connected to the side end of the slide (202), the slide (201) is fixedly connected to the upper end of the slide (202), the second motor (208) is fixedly connected to the upper end of the slide (201), the docking head (207) is fixedly connected to the output end of the second motor (208), and the clamping block (209) is fixedly connected to one end of the docking head (207); The upper end of the mounting seat (1) is provided with a detection mechanism, and the detection mechanism comprises a support rod (301), a first electric push rod (302), a connecting rod (303), a third motor (304), a rotating head (305), three swing rods (306), a light receiving pot (308), a penetrating lamp (307), an air pipe (309), a nozzle (310), an ultrasonic receiving pot (311) and an ultrasonic probe (312), wherein the support rod (301) is fixedly connected to the upper end of the mounting seat (1), the first electric push rod (302) is fixedly connected inside the support rod (301), the connecting rod (303) is fixedly connected to the telescopic end of the first electric push rod (302), and the third motor (304) is fixedly connected to the In the connecting rod (303), the rotating head (305) is fixedly connected to the output end of the third motor (304), the three swinging rods (306) are fixedly connected to the output end of the rotating head (305), the light receiving pot (308) is fixedly connected to one end of one of the swinging rods (306), the penetrating lamp (307) is fixedly connected in the light receiving pot (308), the air pipe (309) is fixedly connected to one end of one of the swinging rods (306), the nozzle (310) is fixedly connected to the lower end of the air pipe (309), the ultrasonic receiving pot (311) is fixedly connected to one end of one of the swinging rods (306), and the ultrasonic probe (312) is fixedly connected in the ultrasonic receiving pot (311).

2. A wafer defect detection device according to claim 1, characterized in that: An upper end of one of the slides (201) is fixedly connected to an inclined block (16), and an upper end of the inclined block (16) is fixedly connected to a sensor (17).

3. A wafer defect detection device according to claim 2, characterized in that: The lower ends of the two racks (206) are fixedly connected to a slide bar (18), the lower inner wall of the mounting seat (1) is provided with two slide grooves (15), and the two slide bars (18) are slidably connected in the two slide grooves (15) respectively.

4. The wafer defect detection device according to claim 3, characterized in that: The upper end of the mounting seat (1) is fixedly connected to a butt joint pipe (9), a second electric push rod (10) is fixedly connected inside the butt joint pipe (9), and a reflective plate (11) is fixedly connected to the telescopic end of the second electric push rod (10).

5. The wafer defect detection device according to claim 4, characterized in that: The upper end of the mounting seat (1) is fixedly connected to two fixing seats (4), and the side ends of the two fixing seats (4) are fixedly connected to sensing devices (5).

6. The wafer defect detection device according to claim 5, characterized in that: The upper end of the mounting seat (1) is fixedly connected to a storage tray (8), the lower end of the mounting seat (1) is fixedly connected to a fixed bottom plate (6), and both side ends of the mounting seat (1) are fixedly connected to two mounting blocks (7).

7. The wafer defect detection device according to claim 6, characterized in that: Both clamping blocks (209) are provided with mounting grooves (14), and both mounting grooves (14) are fixedly connected with pressure sensors (12).

8. The wafer defect detection device according to claim 7, characterized in that: The two clamping blocks (209) are both fixedly connected with a protection pad (13), and the two protection pads (13) are made of rubber material.

9. The wafer defect detection device according to claim 8, characterized in that: The two sliding rods (203) are slidably connected in the mounting seat (1), and the two sliding seats (202) are slidably connected via the sliding rods (203) respectively.

10. The wafer defect detection device according to claim 9, applied to a wafer defect detection method according to any one of claims 1 to 9, characterized in that: The steps include: S1. First, a wafer is placed on a reflective plate (11), and then the first motor (204) is operated to drive the gear (205) to rotate. The two racks (206) respectively drive the two slides (201) to approach each other under the power of the gear (205), so that the two clamping blocks (209) clamp the wafer. After one side of the wafer is inspected, the two second motors (208) can be operated simultaneously to respectively drive the wafer to rotate, so that the inspection mechanism can comprehensively inspect the wafer. S2. After the clamping mechanism fixes the wafer, the third motor (304) can be operated to drive the rotating head (305) to rotate, so that the nozzle (310) moves to the upper end of the wafer. The nozzle (310) avoids cleaning the wafer, which can reduce dust on the surface of the wafer. Then, the ultrasonic probe (312) is moved to the upper end of the wafer, and the first electric push rod (302) is controlled to drive the ultrasonic probe (312) to move toward the wafer. The ultrasonic probe (312) radiates ultrasonic waves to the wafer. When bubbles and concave-convex structures appear on the surface of the wafer, the energy will be emitted, refracted and scattered on the scratches and bubble surfaces on the surface of the wafer, thereby changing the propagation path of the ultrasonic wave, causing a part of the ultrasonic wave energy to be reflected back. The ultrasonic signal reflected back from the object to be tested is received by the ultrasonic receiving pot (311), thereby achieving the detection of wafer defects. The penetrating lamp (307) is moved to the upper surface of the wafer, and the wafer is illuminated by the penetrating lamp (307). When the light receiving pot (308) receives the reflected light signal. The photoelectric converter in the light receiving pot (308) converts the reflected light signal into an electrical signal, and amplifies and filters it to improve the signal-to-noise ratio. By analyzing the intensity and distribution of the received reflected light signal, it can be determined whether the wafer has cracks and the location of the cracks. S3. When the two clamping blocks (209) are clamping the wafer, the wafer will contact the protection pad (13). When the pressure sensor (12) is subjected to the pressure of the wafer, the operation of the first motor (204) will be stopped, so that the two clamping blocks (209) can fix the wafer while preventing the clamping blocks (209) from squeezing the wafer. The sensor (17) installed on the slide (201) can be used to detect the position of the wafer to avoid deviation during the clamping process.

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