Wafer chuck, leveling method thereof and wafer bonding equipment

Abstract

The invention provides a wafer chuck, wafer bonding equipment, a leveling method of the wafer chuck and a computer readable storage medium. The wafer chuck comprises: a mounting substrate; the chuck body is connected with the mounting substrate through at least one tensioning mechanism and at least three piezoelectric screws; the at least one tensioning mechanism is used for providing a tensioning force for tensioning the chuck body to the mounting base plate for the chuck body; and the at least three piezoelectric screws are distributed at a plurality of first positions between the mounting substrate and the back surface of the chuck body in a non-linear manner, are used for providing supporting force for offsetting the tensioning force for the chuck body, and stretch out and draw back according to the distance from the corresponding position to a preset bonding plane.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a wafer chuck, a wafer bonding device, a wafer chuck leveling method, and a computer-readable storage medium. Background Art

[0002] With the increasing precision requirements of chip bonding technology, the bonding object and the bonded object will need to have sub-micron to nanometer parallelism in the future. The traditional automatic leveling structure is mainly composed of a motor, a transmission component (linear module) and an assembly integration of a wedge block. Therefore, there is a gap between the parts. This assembly error and transmission gap will reduce its leveling accuracy.

[0003] In order to overcome the above-mentioned defects of the prior art, the art is in urgent need of a wafer chuck technology for changing the traditional leveling structure, thereby improving the overall rigidity of the leveling mechanism and reducing the leveling step distance to improve the leveling accuracy in multiple dimensions. Summary of the invention

[0004] A brief summary of one or more aspects is given below to provide a basic understanding of these aspects. This summary is not an exhaustive overview of all conceived aspects, and is neither intended to identify the key or decisive elements of all aspects nor to define the scope of any or all aspects. Its only purpose is to give some concepts of one or more aspects in a simplified form as a prelude to a more detailed description that will be given later.

[0005] In order to overcome the above-mentioned defects of the prior art, the present invention provides a wafer chuck, a wafer bonding device, a wafer chuck leveling method, and a computer-readable storage medium, which are used to change the traditional leveling structure, thereby improving the overall rigidity of the leveling mechanism and reducing the leveling step distance to improve the leveling accuracy in multiple dimensions.

[0006] Specifically, the wafer chuck provided according to the first aspect of the present invention includes: a mounting substrate; a chuck body, connected to the mounting substrate via at least one tightening mechanism and at least three piezoelectric screws; the at least one tightening mechanism is used to provide a tightening force to the chuck body to tighten it to the mounting substrate; and the at least three piezoelectric screws are non-linearly distributed at multiple first positions between the mounting substrate and the back side of the chuck body, for providing a supporting force to the chuck body to offset the tightening force, and to extend and retract according to the distance from the corresponding position to the preset bonding plane.

[0007] Further, in some embodiments of the present invention, the at least one tensioning mechanism includes: a negative pressure mechanism, one end of which is fixedly connected to the second position of the mounting substrate, and the other end of which is vacuum-adsorbed to the central area of ​​the back side of the chuck body to provide a first tensioning force to the central area of ​​the back side of the chuck body to tighten it to the mounting substrate; and / or multiple tension springs, wherein one end of each of the tension springs is fixedly connected to a third position of the mounting substrate, and the other end of the tension spring is connected to the edge area of ​​the back side of the chuck body or the first fourth position of the outer edge of the chuck body after being stretched and deformed, so as to provide a second tensioning force to the edge area of ​​the back side of the chuck body or the outer edge of the chuck body to tighten it to the mounting substrate.

[0008] Furthermore, in some embodiments of the present invention, one end of the piezoelectric screw is fixedly connected to the mounting substrate, and the other end thereof is provided with a spherical structure so as to abut against a first position corresponding to the back side of the chuck body via the spherical structure.

[0009] Further, in some embodiments of the present invention, the wafer chuck includes three piezoelectric screws, wherein each piezoelectric screw is equidistant from the center of the chuck body and is distributed at a central angle of 120°, or the wafer chuck includes four piezoelectric screws, wherein each piezoelectric screw is equidistant from the center of the chuck body and is distributed at a central angle of 90°.

[0010] Furthermore, in some embodiments of the present invention, the wafer chuck also includes a controller, which is configured to: respectively determine the first distance from the first position of each piezoelectric screw on the back side of the chuck body to the bonding plane; and adjust the driving voltage of each piezoelectric screw according to the difference between the first distances to level the chuck body.

[0011] Furthermore, in some embodiments of the present invention, the wafer chuck also includes a distance sensor, and the step of respectively determining the first distance from the first position of each piezoelectric screw on the back side of the chuck body to the bonding plane includes: collecting, via the distance sensor, the second distances from multiple fifth positions on the front side of the chuck body to the bonding plane; and respectively determining the first distance from the first position of each piezoelectric screw to the bonding plane based on each of the second distances and the coordinates of each of the fifth positions in the chuck body coordinate system.

[0012] Further, in some embodiments of the present invention, the step of determining the first distance from the first position of each piezoelectric screw to the bonding plane based on each second distance and the coordinates of each fifth position in the chuck body coordinate system includes: fitting the relative position relationship between the front side of the chuck body and the bonding plane based on each second distance and the plane coordinates of each fifth position in the chuck body coordinate system; and determining the first distance from each first position to the bonding plane based on the coordinates of each first position in the chuck body coordinate system and the relative position relationship between the front side of the chuck body and the bonding plane.

[0013] Further, in some embodiments of the present invention, the distance sensor is an eddy current sensor, which is installed on the bonding head of the bonding equipment, and the step of collecting the second distance from multiple fifth positions on the front side of the chuck body to the bonding plane via the distance sensor includes: before performing the bonding process, first moving the eddy current sensor to the detection area on the front side of the chuck body via the bonding head, and releasing a high-frequency magnetic field to each of the fifth positions on the front side of the chuck body to generate an induced current on the chuck body, wherein the amplitude of the oscillator inside the eddy current sensor decreases as the distance from the eddy current sensor to the front side of the chuck body decreases; detecting the amplitude of the oscillator, and determining the third distance from the eddy current sensor to each of the fifth positions on the front side of the chuck body based on the corresponding relationship between the amplitude of the oscillator and the distance; and determining the second distance from multiple fifth positions on the front side of the chuck body to the bonding plane based on each of the third distances and the fourth distance from the eddy current sensor to the bonding plane.

[0014] In addition, the wafer bonding equipment provided according to the second aspect of the present invention includes: a wafer chuck as described in any one of the first aspect of the present invention, used to adsorb and level the wafer to be bonded; and a bonding head, used to adsorb the part to be bonded and bond it to the wafer adsorbed on the wafer chuck, wherein the part to be bonded is a chip or another wafer.

[0015] In addition, the wafer chuck leveling method provided according to the third aspect of the present invention includes the following steps: respectively determining the first distance from the first position of at least three piezoelectric screws of the wafer chuck as described in any one of the first aspects of the present invention on the back side of its chuck body to a preset bonding plane; and adjusting the driving voltage of each of the piezoelectric screws according to the difference between the first distances to level the chuck body.

[0016] In addition, the computer-readable storage medium provided according to the fourth aspect of the present invention stores computer instructions, which, when executed by a processor, implement the wafer chuck leveling method according to the third aspect of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, the components are not necessarily drawn to scale, and components with similar related properties or features may have the same or similar reference numerals.

[0018] Figure 1 A schematic structural diagram of a wafer bonding device provided according to some embodiments of the present invention is shown.

[0019] Figure 2 A schematic structural diagram of a wafer chuck provided according to some embodiments of the present invention is shown.

[0020] Figure 3A A schematic structural diagram of a piezoelectric screw provided according to some embodiments of the present invention is shown.

[0021] Figure 3B A schematic diagram showing the distribution of piezoelectric screws provided according to some embodiments of the present invention is shown.

[0022] Figure 4A A schematic diagram showing a plurality of fifth positions provided according to some embodiments of the present invention.

[0023] Figure 4B A schematic diagram showing the principle of an eddy current sensor detecting a chuck body according to some embodiments of the present invention is shown.

[0024] Reference numerals:

[0025] 10 Mounting the Base Plate

[0026] 20 Chuck body

[0027] 31 Negative pressure mechanism

[0028] 32 Extension spring

[0029] 40 Piezoelectric Screw

[0030] 50 Distance Sensor

[0031] 60 Bonding head

[0032] 70 Wafer DETAILED DESCRIPTION

[0033] The following specific embodiments illustrate the implementation of the present invention, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Although the description of the present invention will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this invention are limited to this implementation. On the contrary, the purpose of introducing the invention in conjunction with the implementation is to cover other options or modifications that may be extended based on the claims of the present invention. In order to provide a deep understanding of the present invention, the following description will include many specific details. The present invention can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the present invention, some specific details will be omitted in the description.

[0034] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0036] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, regions, layers and / or parts, these components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers and / or parts. Therefore, the first component, region, layer and / or part discussed below may be referred to as a second component, region, layer and / or part without departing from some embodiments of the present invention.

[0037] As mentioned above, with the increasing precision requirements of chip bonding technology, the bonding object and the bonded object will need to have sub-micron to nanometer parallelism in the future. The traditional automatic leveling structure is mainly composed of a motor, a transmission component (linear module) and an assembly integration of a wedge block. Therefore, there is a gap between the parts. This assembly error and transmission gap will reduce its leveling accuracy.

[0038] In order to overcome the above-mentioned defects of the prior art, the present invention provides a wafer chuck, a wafer bonding device, a wafer chuck leveling method, and a computer-readable storage medium, which are used to change the traditional leveling structure, thereby improving the overall rigidity of the leveling mechanism and reducing the leveling step distance to improve the leveling accuracy in multiple dimensions.

[0039] In some non-limiting embodiments, the wafer chuck provided in the first aspect of the present invention can be configured in the wafer bonding device provided in the second aspect of the present invention, and the leveling method of the wafer chuck provided in the third aspect of the present invention can be implemented based on the wafer chuck and the wafer bonding device. Specifically, the wafer chuck and the wafer bonding device include a processor and a memory. The memory includes but is not limited to the computer-readable storage medium provided in the fourth aspect of the present invention, on which computer instructions are stored. When the computer instructions are executed by the processor, the leveling method of the wafer chuck is implemented.

[0040] Please refer to Figure 1 , Figure 1 A schematic structural diagram of a wafer bonding device provided according to some embodiments of the present invention is shown.

[0041] like Figure 1 As shown, the wafer bonding equipment includes a wafer chuck and a bonding head 60. The wafer chuck is used to absorb and level a wafer 70 to be bonded. The bonding head 60 is used to absorb a part to be bonded and bond it to the wafer 70 absorbed on the wafer chuck, wherein the part to be bonded is a chip or another wafer.

[0042] Please refer to Figure 2 , Figure 2 A schematic structural diagram of a wafer chuck provided according to some embodiments of the present invention is shown.

[0043] like Figure 2 As shown, the wafer chuck includes a mounting substrate 10 , a chuck body 20 , at least one tightening mechanism and at least three piezoelectric screws 40 .

[0044] The chuck body 20 is connected to the mounting substrate 10 via at least one tensioning mechanism and at least three piezoelectric screws 40. The at least one tensioning mechanism is used to provide a tensioning force to the chuck body 20 to tighten it to the mounting substrate 10. The at least three piezoelectric screws 40 are non-linearly distributed at a plurality of first positions between the mounting substrate 10 and the back of the chuck body 20, and are used to provide a supporting force to the chuck body 20 to offset the tensioning force, and are extended and retracted according to the distance from the corresponding position to the preset bonding plane.

[0045] In some embodiments, at least one tensioning mechanism includes a negative pressure mechanism 31 and a plurality of tension springs 32. One end of the negative pressure mechanism 31 is fixedly connected to the second position of the mounting substrate 10, and the other end thereof vacuum-adsorbs the central area of ​​the back side of the chuck body 20 to provide a first tensioning force to tighten the central area of ​​the back side of the chuck body 20 to the mounting substrate 10. One end of each of the plurality of tension springs 32 is fixedly connected to a third position of the mounting substrate 10, and the other end thereof is connected to the first fourth position of the edge area of ​​the back side of the chuck body 20 or the outer edge of the chuck body 20 after being stretched and deformed, so as to provide a second tensioning force to tighten the edge area of ​​the back side of the chuck body 20 or the outer edge of the chuck body 20 to the mounting substrate 10.

[0046] Please refer to Figure 3A to Figure 3B , Figure 3A A schematic structural diagram of a piezoelectric screw provided according to some embodiments of the present invention is shown. Figure 3B A schematic diagram showing the distribution of piezoelectric screws provided according to some embodiments of the present invention is shown.

[0047] like Figure 3A As shown, one end of the piezoelectric screw 40 is fixedly connected to the mounting substrate 10, and the other end thereof is provided with a spherical structure, so as to abut against the first position corresponding to the back side of the chuck body 20 via the spherical structure. Here, the distance from each position of the spherical surface to the center of the sphere is the same, so as to avoid the distance deviation of the corresponding position caused by different tilt angles of the chuck body 20 under the same expansion and contraction amount.

[0048] like Figure 3B As shown, the wafer chuck includes three piezoelectric screws 40, wherein the distance between each piezoelectric screw 40 and the center of the chuck body 20 is equal and the piezoelectric screws 40 are distributed at intervals of 120°. Alternatively, the wafer chuck includes four piezoelectric screws 40, wherein the distance between each piezoelectric screw 40 and the center of the chuck body 20 is equal and the piezoelectric screws 40 are distributed at intervals of 90°.

[0049] In addition, the wafer chuck also includes a controller. The wafer chuck also includes a distance sensor 50. The distance sensor 50 can be an eddy current sensor, which is installed on the bonding head 60 of the bonding device.

[0050] The working principle of the above-mentioned wafer chuck and wafer bonding equipment will be described below in conjunction with some embodiments of the wafer chuck leveling method. Those skilled in the art will understand that these embodiments of the wafer chuck leveling method are only some non-limiting implementation methods provided by the present invention, which are intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are convenient for the public to implement, rather than to limit all functions or all working modes of the wafer chuck and wafer bonding equipment. Similarly, the wafer chuck and wafer bonding equipment are also only some non-limiting implementation methods provided by the present invention, and do not constitute a limitation on the execution subject or execution order of each step in the leveling method of these wafer chucks.

[0051] The wafer chuck may first perform step S1: respectively determining a first distance from a first position of at least three piezoelectric screws 40 of the wafer chuck on the back side of the chuck body 20 to a preset bonding plane.

[0052] Specifically, the processor may first execute step S11: collecting, via the distance sensor 50, second distances from a plurality of fifth positions on the front side of the chuck body 20 to the bonding plane.

[0053] Please refer to Figure 4A to Figure 4B , Figure 4A A schematic diagram showing a plurality of fifth positions provided according to some embodiments of the present invention. Figure 4B A schematic diagram showing the principle of an eddy current sensor detecting a chuck body according to some embodiments of the present invention is shown.

[0054] like Figure 4A As shown, for example, the fifth position can be the projection position of each first position projected onto the front side of the chuck body 20 in a direction perpendicular to the chuck body 20. For another example, the fifth position can be the center O of the front side of the chuck body 20, and at least two arbitrary positions that are not in the same straight line with the center O.

[0055] like Figure 4B As shown, before the bonding process is performed, the eddy current sensor is first moved to the detection area on the front of the chuck body 20 via the bonding head 60, and a high-frequency magnetic field is released to each fifth position on the front of the chuck body 20 to generate an induced current on the chuck body 20. The amplitude of the oscillator inside the eddy current sensor decreases as the distance from the front of the chuck body 20 decreases. Here, an eddy current sensor can be used and released in sequence in a time-sharing manner. Afterwards, the amplitude of the oscillator is detected, and the third distance (for example: X1, X2 and X3) from the eddy current sensor to each fifth position on the front of the chuck body 20 is determined based on the corresponding relationship between the eddy current sensor and the distance. Afterwards, according to each third distance and the fourth distance from the eddy current sensor to the bonding plane, the second distance from multiple fifth positions on the front of the chuck body 20 to the bonding plane is determined.

[0056] Then, the processor may continue to execute step S12: determining the first distance from the first position of each piezoelectric screw 40 to the bonding plane according to each second distance and the coordinates of each fifth position in the coordinate system of the chuck body 20 .

[0057] In some embodiments, the wafer chuck can fit the relative position relationship between the front surface of the chuck body 20 and the bonding plane according to each second distance and the plane coordinates of each fifth position in the coordinate system of the chuck body 20. Here, the plane coordinates of each fifth position in the coordinate system of the chuck body 20 can be the rectangular coordinates (x i ,y i ) or polar coordinates (ρ i ,θ i Then, according to the coordinates of each first position in the coordinate system of the chuck body 20 and the relative position relationship between the front surface of the chuck body 20 and the bonding plane, the first distance from each first position to the bonding plane is determined respectively.

[0058] In some embodiments, for the fifth position determined by projecting each first position along a direction perpendicular to the chuck body 20 onto its front side, the controller may not need to use the relative position relationship of the front side of the fitting chuck body 20 compared to the bonding plane, but may directly calculate the first distance from each first position to the bonding plane based on the relative position relationship between each fifth position and the corresponding first position.

[0059] In some embodiments, the controller can calculate the tilt angle Y of the chuck relative to the horizontal plane through X1, X2, and X3, and then calculate the first distance from each first position to the bonding plane through the tilt angle Y.

[0060] Afterwards, the wafer chuck may execute step S2 : adjusting the driving voltage of each piezoelectric screw 40 according to the difference between each first distance, so as to level the chuck body 20 .

[0061] In summary, the wafer chuck, wafer bonding equipment, wafer chuck leveling method, and computer-readable storage medium provided by the present invention can be used to change the traditional leveling structure, thereby improving the overall rigidity of the leveling mechanism and reducing the leveling step distance to improve the leveling accuracy in multiple dimensions.

[0062] Although the above methods are illustrated and described as a series of actions for simplicity of explanation, it should be understood and appreciated that these methods are not limited by the order of the actions, because according to one or more embodiments, some actions may occur in a different order and / or concurrently with other actions from those illustrated and described herein or not illustrated and described herein but understandable to those skilled in the art.

[0063] The steps of the method or algorithm described in conjunction with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. The software module may reside in a RAM memory, a flash memory, a ROM memory, an EPROM memory, an EEPROM memory, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor so that the processor can read and write information from / to the storage medium. In an alternative, a storage medium may be integrated into a processor. The processor and the storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In an alternative, the processor and the storage medium may reside in a user terminal as discrete components.

[0064] In one or more exemplary embodiments, the functions described may be implemented in hardware, software, firmware, or any combination thereof. If implemented as a computer program product in software, each function may be stored on or transmitted by a computer-readable medium as one or more instructions or codes. Computer-readable media include both computer storage media and communication media, including any medium that facilitates the transfer of a computer program from one place to another. Storage media may be any available medium that can be accessed by a computer. As an example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disk storage, disk storage or other magnetic storage device, or any other medium that can be used to carry or store the desired program code in the form of an instruction or data structure and can be accessed by a computer. Any connection is also properly referred to as a computer-readable medium. For example, if the software is transmitted from a website, a server, or other remote source using a coaxial cable, a fiber optic cable, a twisted pair, a digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwaves, the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwaves are included in the definition of the medium. Disk and disc as used herein include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk and Blu-ray disc, wherein disk often reproduces data magnetically, while disc reproduces data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.

[0065] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the disclosure. Thus, the disclosure is not intended to be limited to the examples and designs described herein, but should be granted the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A wafer chuck, characterized in that: include: Install the base plate; a chuck body connected to the mounting substrate via at least one tensioning mechanism and at least three piezoelectric screws; The at least one tensioning mechanism is configured to provide a tensioning force to the chuck body to tighten it to the mounting substrate; and The at least three piezoelectric screws are non-linearly distributed at multiple first positions between the mounting substrate and the back of the chuck body, and are used to provide a supporting force to the chuck body to offset the tensioning force, and to expand and contract according to the distance from the corresponding position to the preset bonding plane.

2. The wafer chuck according to claim 1, wherein: The at least one tensioning mechanism comprises: A negative pressure mechanism, one end of which is fixedly connected to the second position of the mounting substrate, and the other end of which vacuum-adsorbs the central area of ​​the back side of the chuck body to provide a first tensioning force to the central area of ​​the back side of the chuck body to tighten it to the mounting substrate; and / or A plurality of tension springs, wherein one end of each of the tension springs is fixedly connected to a third position of the mounting substrate, and the other end of the tension spring is connected to an edge area on the back side of the chuck body or a first fourth position on the outer edge of the chuck body after being stretched and deformed, so as to provide a second tensioning force to the edge area on the back side of the chuck body or the outer edge of the chuck body to tighten it to the mounting substrate.

3. The wafer chuck according to claim 1, wherein: One end of the piezoelectric screw is fixedly connected to the mounting substrate, and the other end of the piezoelectric screw is provided with a spherical structure so as to abut against a first position corresponding to the back side of the chuck body via the spherical structure.

4. The wafer chuck according to claim 1, wherein: The wafer chuck includes three piezoelectric screws, wherein the distances between the piezoelectric screws and the center of the chuck body are equal and the piezoelectric screws are distributed at intervals of 120° at the central angle of the circle, or The wafer chuck includes four piezoelectric screws, wherein the distances between each piezoelectric screw and the center of the chuck body are equal and the piezoelectric screws are distributed at intervals of 90° at the central angle of the circle.

5. The wafer chuck according to claim 1, wherein: The wafer chuck also includes a controller configured to: Determine respectively a first distance between a first position of each of the piezoelectric screws on the back side of the chuck body and the bonding plane; and According to the difference between the first distances, the driving voltage of each piezoelectric screw is adjusted to level the chuck body.

6. The wafer chuck according to claim 5, characterized in that: The wafer chuck also includes a distance sensor, and the step of respectively determining a first distance from a first position of each piezoelectric screw on the back side of the chuck body to the bonding plane includes: collecting, via the distance sensor, second distances from a plurality of fifth positions on the front side of the chuck body to the bonding plane; and According to each of the second distances and the coordinates of each of the fifth positions in the chuck body coordinate system, the first distance from the first position where each of the piezoelectric screws is located to the bonding plane is determined respectively.

7. The wafer chuck according to claim 6, characterized in that: The step of determining the first distance from the first position where each piezoelectric screw is located to the bonding plane according to each of the second distances and the coordinates of each of the fifth positions in the chuck body coordinate system comprises: Fitting the relative position relationship between the front surface of the chuck body and the bonding plane according to each of the second distances and the plane coordinates of each of the fifth positions in the chuck body coordinate system; and The first distances from each first position to the bonding plane are determined respectively according to the coordinates of each first position in the chuck body coordinate system and the relative position relationship between the front surface of the chuck body and the bonding plane.

8. The wafer chuck according to claim 6, wherein: The distance sensor is an eddy current sensor installed on a bonding head of a bonding device. The step of collecting the second distances from a plurality of fifth positions on the front side of the chuck body to the bonding plane via the distance sensor comprises: Before the bonding process is performed, the eddy current sensor is first moved to the detection area on the front side of the chuck body via the bonding head, and a high-frequency magnetic field is released to each of the fifth positions on the front side of the chuck body to generate an induced current on the chuck body, wherein the amplitude of the oscillator inside the eddy current sensor decreases as the distance from the eddy current sensor to the front side of the chuck body decreases; Detecting the amplitude of the oscillator, and determining a third distance from the eddy current sensor to each of the fifth positions on the front side of the chuck body according to a corresponding relationship between the amplitude of the oscillator and the distance; and The second distances from a plurality of fifth positions on the front side of the chuck body to the bonding plane are determined based on the third distances and a fourth distance from the eddy current sensor to the bonding plane.

9. A wafer bonding device, characterized in that: include: The wafer chuck according to any one of claims 1 to 8, used for adsorbing and leveling the wafer to be bonded; as well as The bonding head is used to absorb the part to be bonded and bond it to the wafer absorbed on the wafer chuck, wherein the part to be bonded is a chip or another wafer.

10. A method for leveling a wafer chuck, characterized in that: The following steps are involved: Respectively determining a first distance from a first position of at least three piezoelectric screws of the wafer chuck according to any one of claims 1 to 8 on the back side of the chuck body to a preset bonding plane; and According to the difference between the first distances, the driving voltage of each piezoelectric screw is adjusted to level the chuck body.

11. A computer-readable storage medium having computer instructions stored thereon, characterized in that: When the computer instructions are executed by a processor, the wafer chuck leveling method as claimed in claim 10 is implemented.

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