PCB substrate for LED packaging and surface anti-oxidation treatment method thereof

Abstract

The invention discloses a PCB (Printed Circuit Board) substrate for LED (Light Emitting Diode) packaging and a surface anti-oxidation treatment method thereof. The PCB substrate is composed of the base layer, the heat conduction layer, the conductive layer and the insulating layer, the base layer is made of a high-strength and high-temperature-resistant material so as to provide stable support for the whole PCB substrate, meanwhile, the heat conduction layer is made of a material with a high heat conductivity coefficient, heat generated by an LED chip can be rapidly conducted out, and the heat dissipation efficiency is improved; the surface of the PCB substrate provided by the invention is subjected to special treatment, so that the PCB substrate has good weldability and corrosion resistance, and packaging and long-term use of an LED chip are facilitated; in order to improve the dimensional stability of the PCB substrate, the buffer layer is arranged between the base layer and the heat conduction layer, and the buffer layer is made of an elastic material and can absorb dimensional changes caused by factors such as temperature changes.

Description

Technical Field

[0001] The invention belongs to the field of electronic technology, and specifically refers to a PCB substrate for LED packaging and a surface anti-oxidation treatment method thereof. Background Art

[0002] With the continuous development of electronic technology, LED has been widely used as an efficient and energy-saving light-emitting element. As an important component of LED packaging, the performance of PCB substrate directly affects the service life and reliability of LED. However, the existing PCB substrate for LED packaging is easily affected by oxidation during use, resulting in a decrease in its conductivity and reliability, thus affecting the performance of LED. At present, the circuits of the substrates used for CHIP-type LED packaging are all copper foils. The surface of the copper foil is easy to oxidize. At the same time, in order to facilitate wire welding, the copper foil surface of the substrate needs to be electroplated, such as gold plating, silver plating, nickel plating, etc., so as to protect the copper foil from being easily oxidized by air. At the same time, it is easy to weld wires. When customers use it, the soldering feet of the LED are easy to get tinned.

[0003] In the field of LED packaging, PCB substrate plays a vital role. Traditional PCB substrates for LED packaging have certain deficiencies in heat dissipation, electrical insulation, dimensional stability, etc. With the continuous development of LED technology, the performance requirements for PCB substrates are getting higher and higher. For example, higher heat dissipation efficiency to ensure the stable operating temperature of LED chips, better electrical insulation performance to prevent circuit short circuits, and higher dimensional stability to ensure packaging accuracy. Summary of the invention

[0004] The purpose of the present invention is to provide a PCB substrate for LED packaging and a surface anti-oxidation treatment method thereof. The present invention is composed of a base layer, a heat-conducting layer, a conductive layer and an insulating layer, wherein the base layer is made of high-strength, high-temperature resistant material, thereby providing a stable support for the entire PCB substrate, and the heat-conducting layer is made of a material with a high thermal conductivity coefficient, which can quickly conduct the heat generated by the LED chip and improve the heat dissipation efficiency; the surface of the PCB substrate provided by the present invention is specially treated, has good solderability and corrosion resistance, and is convenient for the packaging and long-term use of the LED chip; in order to improve the dimensional stability of the PCB substrate, a buffer layer is arranged between the base layer and the heat-conducting layer, and the buffer layer is made of an elastic material, which can absorb dimensional changes caused by factors such as temperature changes.

[0005] A PCB substrate for LED packaging and a surface anti-oxidation treatment method thereof. The PCB substrate comprises a base layer, a heat-conducting layer, a conductive layer and an insulating layer.

[0006] Furthermore, the base layer is made of high-strength, high-temperature resistant material.

[0007] Preferably, the high-strength, high-temperature-resistant material comprises one or more of ceramics and metal-ceramic composite materials.

[0008] Furthermore, the heat-conducting layer is located on the base layer and is composed of graphene and carbon nanotubes.

[0009] Furthermore, the conductive layer is made of copper foil.

[0010] Furthermore, the insulating layer covers the conductive layer and is made of one or more of polyimide and epoxy resin.

[0011] Furthermore, a heat dissipation channel is provided in the heat-conducting layer, and the heat dissipation effect is further improved through the circulation of the coolant.

[0012] The present invention also provides a surface anti-oxidation treatment method for a PCB substrate for LED packaging, the surface anti-oxidation treatment method comprising the following steps:

[0013] (1) Cleaning: Clean the oil, dust and other impurities on the surface of the PCB substrate;

[0014] (2) Activation: Use an activator to activate the surface of the PCB substrate to improve the activity of the surface;

[0015] (3) Coating: Use physical vapor deposition (PVD) or chemical vapor deposition (CVD) to coat an anti-oxidation film on the surface of the PCB substrate;

[0016] (4) Curing: The coated PCB substrate is cured to improve the adhesion and stability of the antioxidant film.

[0017] Preferably, the activator in step (2) is a PdC1_2 / HCl activator.

[0018] Preferably, the anti-oxidation film in step (3) is one or more of aluminum oxide and silicon oxide.

[0019] The beneficial effects achieved by the present invention using the above structure are as follows: (1) The present invention is composed of a base layer, a heat-conducting layer, an electrically conductive layer and an insulating layer, wherein the base layer is made of high-strength, high-temperature-resistant material, thereby providing stable support for the entire PCB substrate, while the heat-conducting layer is made of a material with a high thermal conductivity coefficient, which can quickly conduct the heat generated by the LED chip and improve the heat dissipation efficiency; (2) The surface of the PCB substrate provided by the present invention has been specially treated and has good solderability and corrosion resistance, which is convenient for the packaging and long-term use of the LED chip; (3) The present invention provides a buffer layer between the base layer and the heat-conducting layer, and the buffer layer is made of an elastic material, which can absorb dimensional changes caused by factors such as temperature changes, thereby improving the dimensional stability of the PCB substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 The invention discloses an anti-oxidation property of a PCB substrate for LED packaging.

[0021] The accompanying drawings are used to provide further understanding of the present invention and constitute a part of the specification. They are used to explain the present invention together with the embodiments of the present invention and do not constitute a limitation of the present invention. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments; based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0023] Unless otherwise defined, all professional and scientific terms used herein have the same meanings as those familiar to those skilled in the art. In addition, any methods and materials similar or equivalent to those described herein may be applied to the present invention. The preferred implementation methods and materials described herein are for demonstration purposes only and are not intended to limit the content of this application.

[0024] The experimental methods in the following examples are conventional methods unless otherwise specified; the experimental materials and test strains used in the following examples are purchased from commercial channels unless otherwise specified.

[0025] Example 1

[0026] A PCB substrate for LED packaging and surface anti-oxidation treatment method thereof

[0027] The PCB substrate comprises a base layer, a heat conducting layer, a conductive layer and an insulating layer.

[0028] Wherein, the base layer is made of high-strength and high-temperature resistant material.

[0029] Wherein, the high-strength, high-temperature resistant material is ceramic.

[0030] Wherein, the heat-conducting layer is located on the base layer and is composed of graphene and carbon nanotubes.

[0031] Wherein, the conductive layer is made of copper foil.

[0032] Wherein, the insulating layer covers the conductive layer and is made of polyimide.

[0033] Wherein, a heat dissipation channel is provided in the heat-conducting layer, and the heat dissipation effect is further improved through the circulation of the coolant.

[0034] The present invention also provides a surface anti-oxidation treatment method for a PCB substrate for LED packaging, the surface anti-oxidation treatment method comprising the following steps:

[0035] (1) Cleaning: Clean the oil, dust and other impurities on the surface of the PCB substrate;

[0036] (2) Activation: Use PdC1_2 / HCl activator to activate the surface of the PCB substrate to improve the activity of the surface;

[0037] (3) Coating: A layer of aluminum oxide film is coated on the surface of the PCB substrate using physical vapor deposition (PVD) method;

[0038] (4) Curing: The coated PCB substrate is cured to improve the adhesion and stability of the antioxidant film.

[0039] Example 2

[0040] A PCB substrate for LED packaging and surface anti-oxidation treatment method thereof

[0041] The PCB substrate comprises a base layer, a heat conducting layer, a conductive layer and an insulating layer.

[0042] Wherein, the base layer is made of high-strength and high-temperature resistant material.

[0043] Wherein, the high-strength, high-temperature-resistant material is a metal-ceramic composite material.

[0044] Wherein, the heat-conducting layer is located on the base layer and is composed of graphene and carbon nanotubes.

[0045] Wherein, the conductive layer is made of copper foil.

[0046] Wherein, the insulating layer covers the conductive layer and is made of epoxy resin.

[0047] Wherein, a heat dissipation channel is provided in the heat-conducting layer, and the heat dissipation effect is further improved through the circulation of the coolant.

[0048] The present invention also provides a surface anti-oxidation treatment method for a PCB substrate for LED packaging, the surface anti-oxidation treatment method comprising the following steps:

[0049] (1) Cleaning: Clean the oil, dust and other impurities on the surface of the PCB substrate;

[0050] (2) Activation: Use PdC1_2 / HCl activator to activate the surface of the PCB substrate to improve the surface activity;

[0051] (3) Coating: A layer of silicon oxide film is coated on the surface of the PCB substrate using methods such as chemical vapor deposition (CVD);

[0052] (4) Curing: The coated PCB substrate is cured to improve the adhesion and stability of the antioxidant film.

[0053] Example 3

[0054] A PCB substrate for LED packaging and surface anti-oxidation treatment method thereof

[0055] The PCB substrate comprises a base layer, a heat conducting layer, a conductive layer and an insulating layer.

[0056] Wherein, the base layer is made of high-strength and high-temperature resistant material.

[0057] Wherein, the high-strength, high-temperature-resistant material is a metal-ceramic composite material.

[0058] Wherein, the heat-conducting layer is located on the base layer and is composed of graphene and carbon nanotubes.

[0059] Wherein, the conductive layer is made of copper foil.

[0060] Wherein, the insulating layer covers the conductive layer and is made of polyimide and epoxy resin.

[0061] Wherein, a heat dissipation channel is provided in the heat-conducting layer, and the heat dissipation effect is further improved through the circulation of the coolant.

[0062] The present invention also provides a surface anti-oxidation treatment method for a PCB substrate for LED packaging, the surface anti-oxidation treatment method comprising the following steps:

[0063] (1) Cleaning: Clean the oil, dust and other impurities on the surface of the PCB substrate;

[0064] (2) Activation: Use PdC1_2 / HCl activator to activate the surface of the PCB substrate to improve the surface activity;

[0065] (3) Coating: A layer of aluminum oxide film is coated on the surface of the PCB substrate using methods such as chemical vapor deposition (CVD);

[0066] (4) Curing: The coated PCB substrate is cured to improve the adhesion and stability of the antioxidant film.

[0067] Experimental Example 1

[0068] Antioxidation performance of a PCB substrate for LED packaging

[0069] The PCB substrates prepared in Example 1, Example 2 and Example 3 were used as test products and divided into Example 1 group, Example 2 group and Example 3 group, with three replicates in each group, and the antioxidant performance test was performed according to the following method: a part of the samples were placed in a constant temperature and humidity test box, and different temperature and humidity conditions were set to simulate the temperature and humidity changes in the actual use environment; the other part of the samples were immersed in the antioxidant test solution to ensure that the samples were completely immersed; after 14 days, the samples were taken out for observation and measurement; the mass of each sample was measured with a precision electronic balance, the mass change was recorded, the mass change rate was calculated, and the antioxidant performance was judged by the mass change rate, mass change rate = (mass after test - initial mass) / initial mass × 100%.

[0070] Result analysis:

[0071] like Figure 1 , the PCB substrate samples prepared in Example 1, Example 2 and Example 3 all have high antioxidant properties, among which the antioxidant property of Example 2 group is the highest, followed by Example 1 and Example 3 groups.

[0072] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

[0073] The present invention and its embodiments are described above, and such description is not restrictive. The drawings show only one embodiment of the present invention, and the actual structure is not limited thereto. In short, if ordinary technicians in the field are inspired by it, without departing from the purpose of the invention, they can design a structure and embodiment similar to the technical solution without creativity, which should belong to the protection scope of the present invention.

Claims

1. A PCB substrate for LED packaging and a surface anti-oxidation treatment method thereof, characterized in that: The PCB substrate comprises a base layer, a heat conducting layer, a conductive layer and an insulating layer.

2. The PCB substrate for LED packaging and the surface anti-oxidation treatment method thereof according to claim 1, characterized in that: The base layer is made of high-strength and high-temperature resistant material.

3. The PCB substrate for LED packaging and the surface anti-oxidation treatment method thereof according to claim 2, characterized in that: The high-strength, high-temperature-resistant material includes one or more of ceramics and metal-ceramic composite materials.

4. The PCB substrate for LED packaging and the surface anti-oxidation treatment method thereof according to claim 3, characterized in that: The heat-conducting layer is located on the base layer and is composed of graphene and carbon nanotubes.

5. The PCB substrate for LED packaging and the surface anti-oxidation treatment method thereof according to claim 4, characterized in that: The conductive layer is made of copper foil.

6. The PCB substrate for LED packaging and the surface anti-oxidation treatment method thereof according to claim 5, characterized in that: The insulating layer covers the conductive layer and is made of one or more of polyimide and epoxy resin.

7. The PCB substrate for LED packaging and the surface anti-oxidation treatment method thereof according to claim 6, characterized in that: The heat-conducting layer is provided with a heat-dissipating channel, and the heat-dissipating effect is further improved through the circulation of the coolant.

8. A surface anti-oxidation treatment method for a PCB substrate for LED packaging according to claim 7, characterized in that: The surface anti-oxidation treatment method comprises the following steps: (1) Cleaning: Clean the oil, dust and other impurities on the surface of the PCB substrate; (2) Activation: Use an activator to activate the surface of the PCB substrate to improve the activity of the surface; (3) Coating: Use physical vapor deposition (PVD) or chemical vapor deposition (CVD) to coat an anti-oxidation film on the surface of the PCB substrate; (4) Curing: The coated PCB substrate is cured to improve the adhesion and stability of the antioxidant film.

9. The method for anti-oxidation treatment of a PCB substrate for LED packaging according to claim 8, characterized in that: The activator in step (2) is PdC1_2 / HCl activator.

10. The surface anti-oxidation treatment method of a PCB substrate for LED packaging according to claim 9, characterized in that: The anti-oxidation film in step (3) is one or more of aluminum oxide and silicon oxide.

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