Tungsten filament double-layer electrolytic plating device and method
By setting up a double-layer plating tank and winding roller in the tungsten wire plating equipment, the circulating flow of the plating solution is solved, and the existing equipment covers a large area and uses a large amount of plating solution is improved, and the plating efficiency is reduced.
Patent Information
- Application Number
- CN202411986323.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2025-02-18
AI Technical Summary
Existing tungsten wire electroplating equipment requires multiple plating tanks, which leads to long equipment, large area, troublesome maintenance, and large amount of plating solution and low efficiency.
Design a double-layer electrolytic plating device for tungsten wire. By setting up a double-layer plating tank and winding roller, the tungsten wire passes through two plating tanks for electroplating multiple times, realizing the plating solution circulation flow, reducing the amount of plating solution and equipment volume.
It effectively reduces the floor area and plating solution usage of electroplating equipment, improves plating efficiency, and reduces equipment costs and electricity costs by about 80%.
Smart Images
Figure CN119465354A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of electrolytic equipment, and in particular relates to a tungsten wire double-layer electrolytic plating device and method. Background Art
[0002] At present, in the process of using tungsten wire to produce diamond wire or steel cord, the tungsten wire needs to be electroplated, and a layer of brass alloy is plated on its surface to make electroplated brass wire, and then it is processed into the required product through subsequent production and processing. The brass electroplating process includes pretreatment of the tungsten wire, followed by copper plating, galvanizing and thermal diffusion. The copper plating and galvanizing processes require electroplating equipment. Current electroplating equipment usually needs to set up multiple plating tanks to ensure the completion of the copper or zinc layer plating. Because multiple plating tanks are set in sequence, the overall equipment is relatively long, occupies a large area, is difficult to maintain, and the required plating solution volume is large, and the efficiency is low. Summary of the invention
[0003] The present invention aims to solve the problem that in the existing process of electroplating brass on the surface of tungsten wire, the electroplating equipment usually needs to be provided with multiple plating tanks to ensure the completion of the plating of the copper or zinc layer. Because the multiple plating tanks are arranged in sequence, the overall equipment is relatively long, occupies a large area, is troublesome to maintain, and the volume of the required plating solution is large and the efficiency is low. A tungsten wire double-layer electrolytic plating device and method are provided. By setting a double-layer plating tank and arranging winding rollers at both ends of the aqueduct, the tungsten wire passes through the two plating tanks for multiple times after passing through the winding rollers to achieve electroplating, thereby effectively reducing the volume of the electroplating equipment, reducing the volume of the plating solution, and improving the plating efficiency.
[0004] In order to achieve the above object, the technical solution of the present invention is: A tungsten wire double-layer electrolytic plating device comprises two electrolytic cells arranged up and down, a storage tank is arranged on one side of the electrolytic cell, a circulation pipeline is arranged between the storage tank and the electrolytic cell for circulating the plating solution between the storage tank and the electrolytic cell, and the plating solution circulates between the storage tank and the electrolytic cell through the circulation pipeline.
[0005] A first partition is provided at both ends of each electrolytic cell, two second partitions are provided between the two first partitions, the first partition and the second partition are provided with corresponding strip holes, a plurality of groups of support blocks are provided between the two second partitions, each group of the support blocks is provided with a tray, the tray is a tray structure surrounded by a mesh plate, a plating block lower than the strip holes is provided on the tray, the plating block and the plating solution are used as an anode, and the tungsten wire is used as a cathode to energize so that the anode material is plated on the surface of the tungsten wire.
[0006] Winding rollers are provided at both ends of the electrolytic cell, and tungsten wire is wound between the two winding rollers. The tungsten wire extending tangentially along the upper side of the winding roller passes through the strip holes of the upper electrolytic cell, and the tungsten wire extending tangentially along the lower side of the winding roller passes through the strip holes of the lower electrolytic cell. The winding roller cooperates with the upper and lower electrolytic cells, so that the tungsten wire is wound on the winding roller and passes through the electrolytic cell multiple times to perform the electroplating process.
[0007] Preferably, the circulation pipeline includes a liquid supply pipe and a liquid outlet pipe, one end of the liquid supply pipe is connected to the lower end of the storage tank, and the other end is connected to the inside of the corresponding electrolytic cell, and a liquid discharge port is provided at the bottom of the electrolytic cell between the adjacent first partition and the second partition, and the liquid discharge port is connected to the liquid outlet pipe, and the end of the liquid outlet pipe away from the liquid discharge port is connected to the upper end of the storage tank, and the plating liquid in the storage tank enters the electrolytic cell from the liquid supply pipe and flows back to the storage tank through the liquid outlet pipe to realize the circulation of the plating liquid.
[0008] Preferably, each electrolytic cell is provided with at least one liquid inlet pipe, and the liquid supply pipe is connected with the interior of the corresponding electrolytic cell through the liquid inlet pipe. The liquid inlet pipe is lower than the tray in the electrolytic cell and is provided with multiple liquid outlets. The plating liquid in the liquid supply pipe is transported to the liquid inlet pipe and enters the electrolytic cell through the multiple liquid outlets, thereby ensuring the uniform distribution and stirring effect of the plating liquid in the electrolytic cell.
[0009] The liquid supply pipe is provided with a delivery pump and a filter. The filter is located at one side of the delivery pump outlet end. The delivery pump drives the plating solution to be delivered to realize circulation flow, and the filter filters out impurities in the plating solution.
[0010] Preferably, there are gaps between the tray and the inner wall of the electrolytic cell and between multiple trays to ensure sufficient contact between the tray and the plating solution.
[0011] Preferably, the plating blocks are multiple copper blocks or multiple zinc blocks, and the plating blocks are dissolved during electroplating and then plated on the surface of the tungsten wire.
[0012] The tray is a tray surrounded by a titanium mesh plate, a partition is provided on the tray, a plating block is provided on the partition, the partition is made of conductive material, the tray with a mesh plate structure can fully contact with the plating solution, and the partition is provided to prevent the plating block from falling into the electrolytic cell, thereby ensuring full contact between the plating block and the plating solution.
[0013] The partition layer is a layered structure made of polypropylene fibers.
[0014] Preferably, the winding roller is provided with a plurality of winding grooves, and the tungsten wires are sequentially wound on the plurality of winding grooves. The provision of the plurality of winding grooves can avoid mutual interference between the tungsten wires.
[0015] A tungsten wire double-layer electrolytic plating method is implemented by the above-mentioned tungsten wire double-layer electrolytic plating device, comprising the following steps: Step 1: Wind at least one tungsten wire on two winding rollers for multiple turns. The minimum spacing between two adjacent turns of the same tungsten wire is 4 mm, and the minimum spacing between two adjacent tungsten wires is 8 mm. After winding, the line speed is controlled at 3-20 m / min. Step 2, starting the delivery pump, and the plating solution circulates between the storage tank and the electrolytic cell through the circulation pipeline; The plating solution level in the electrolytic cell is at least 0.5 cm higher than the tungsten wire; Step 3: Make the tray and the tungsten wire conductive and control the line speed at 25±0.5m / min.
[0016] Preferably, it is used for copper or zinc plating on the surface of tungsten wire; When copper is plated on the surface of the tungsten wire, the plating block is a plurality of copper blocks, the plating solution is a mixed solution of copper pyrophosphate, potassium pyrophosphate, pyrophosphoric acid and pure water, the copper ion concentration is 27±7g / L, the pH value is 8.3±0.4, the temperature is set at 50±5°C, the concentration ratio of copper ions to pyrophosphate ions in the plating solution is 1:7.5±1, and the thickness of the copper plating layer is 0.001±0.00005mm; When zinc is plated on the surface of the tungsten wire, the plating block is a plurality of zinc blocks, the plating solution is a zinc sulfate solution prepared by mixing zinc sulfate and pure water, the concentration of the zinc sulfate solution is 225±75g / L, the pH value is 1.4-2.2, the temperature is set at 35±5°C, and the thickness of the zinc plating layer is 0.00025±0.00005mm.
[0017] Preferably, after the tungsten wire is wound in step 1, the wire speed of the tungsten wire is controlled to be 3 m / min, or 11 m / min, or 20 m / min; In the step 3, after the tray and the tungsten wire are made conductive, the line speed is controlled at 25 m / min.
[0018] Preferably, when the tungsten wire is wound on the winding rod, the distance between two adjacent turns of the same tungsten wire is 5 mm, and the distance between two adjacent tungsten wires is 10 mm.
[0019] Through the above technical solution, the beneficial effects of the present invention are: 1. The present invention sets a winding roller and two electrolytic cells corresponding to the upper and lower parts, so that the tungsten wire passes through the electrolytic cells for many times during the process of being wound on the two winding rollers, and the electroplating process is completed in the electrolytic cells. Compared with the existing electroplating method of connecting multiple electrolytic cells end to end, the floor space of the equipment is effectively reduced, the amount of plating solution used in the electroplating process is reduced, and the processing efficiency of electroplated brass is improved. By using the plating device of the present invention, the total length of the electrolytic cell is reduced from 40m to about 4m, the number of pumps is greatly reduced, and the equipment cost and electricity cost are reduced by about 80%.
[0020] 2. The present invention effectively avoids interference caused by mutual contact when the tungsten wires are wound on the winding roller by opening a plurality of winding grooves on the winding roller.
[0021] 3. The present invention adopts a tray with a mesh structure, so that the tray is in full contact with the plating solution, effectively increasing the contact area between the tray and the plating solution. At the same time, the tray structure and the partition arranged on the tray are used to lift the plating block to prevent it from falling from the mesh holes of the tray. The block-shaped plating block is used to increase the contact area between the plating block and the plating solution, effectively increasing the electrolysis efficiency and ensuring the plating effect on the tungsten wire surface.
[0022] 4. The present invention arranges a liquid inlet pipe in the electrolytic cell and opens a plurality of liquid outlets on the liquid inlet pipe, so that the plating solution is evenly diffused after entering the electrolytic cell, so that the plating solution is in full, uniform and effective contact with materials such as tungsten wire, tray, plating block, etc., and at the same time, the plating solution is transported into the electrolytic cell through the plurality of liquid outlets, thereby disturbing and stirring the plating solution in the electrolytic cell.
[0023] 5. The present invention sets two second partitions, and as the plating solution is continuously transported into the electrolytic cell between the two second partitions, the liquid level continues to rise. When the liquid level reaches the position of the strip hole of the second partition, it overflows into the electrolytic cell between the adjacent first partition and the second partition, and is discharged from the electrolytic cell through the drain port. In this process, the height of the plating solution level in the electrolytic cell is guaranteed to ensure that the plating solution submerges the tungsten filament.
[0024] 6. The coating of the present invention is uniform, and the bonding strength and ductility are improved. According to tests, in the subsequent process of drawing the tungsten wire from a diameter of 0.06 mm to 0.031 mm for diamond wire production, 200 km of diamond wire busbars were continuously produced without any out-of-tolerance problems. The diameter of the 200 km diamond wire busbars produced using the method of the present application was maintained at 0.031 ± 0.0005 mm. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 The structure of the present invention is schematically shown Figure 1 .
[0026] Figure 2 The structure of the present invention is schematically shown Figure 2 .
[0027] Figure 3 It is a schematic diagram of the distribution structure of the support block and the liquid inlet pipe of the present invention.
[0028] Figure 4 It is a schematic diagram of the structure after winding the tungsten wire of the present invention.
[0029] Figure 5 The figure is a schematic diagram of the structure of winding tungsten wire on a winding rod according to the present invention.
[0030] Figure 6 For the present invention Figure 5 Enlarged view of point A in the middle.
[0031] The numbers in the accompanying drawings are: 1 is an electrolytic cell, 2 is a storage tank, 3 is a first partition, 4 is a second partition, 5 is a strip hole, 6 is a support block, 7 is a tray, 8 is a winding roller, 9 is a liquid supply pipe, 10 is a liquid outlet pipe, 11 is a liquid inlet pipe, 12 is a delivery pump, 13 is a discharge port, 14 is a plating block, 15 is a tungsten wire, and 16 is a winding groove. DETAILED DESCRIPTION
[0032] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments: like Figure 1 to Figure 6 As shown, this embodiment provides a tungsten wire double-layer electrolytic plating device, including two electrolytic cells 1 arranged vertically, and a storage tank 2 is provided on one side of the electrolytic cell 1.
[0033] The storage tank 2 is provided with a plating solution for plating. When copper is plated on tungsten wire, the plating solution is a mixed solution of copper pyrophosphate, potassium pyrophosphate, pyrophosphoric acid and pure water, wherein the copper ion concentration is 27±7 g / L, the pH value is 8.3±0.4, the temperature is set at 50±5°C, and the concentration ratio of copper ions to pyrophosphate ions in the plating solution is 1:7.5±1; When galvanizing the tungsten wire, the plating solution is a zinc sulfate solution prepared by mixing zinc sulfate and pure water. The concentration of the zinc sulfate solution is 225±75 g / L, the pH value is 1.4-2.2, and the temperature is set at 35±5°C.
[0034] A circulation pipeline is provided between the storage tank 2 and the electrolytic cell 1 for circulating the plating solution between the storage tank 2 and the electrolytic cell 1. A delivery pump 12 and a filter are provided on the circulation pipeline. In actual use, the delivery pump 12 allows the plating solution to circulate between the storage tank 2 and the electrolytic cell 1 through the circulation pipeline. On the one hand, sufficient and effective contact between the plating solution and the tungsten wire 15 is ensured to ensure the quality of plating. On the other hand, during the circulation of the plating solution, impurities in the plating solution are removed by the filter.
[0035] Each electrolytic cell 1 is provided with a first partition plate 3 at both ends, and two second partition plates 4 are provided between the two first partition plates 3. The first partition plates 3 and the second partition plates 4 are provided with corresponding strip holes 5. When in use, the tungsten wire 15 passes through the strip holes 5 to enter and exit the electrolytic cell 1. Multiple groups of support blocks 6 are provided between the two second partition plates 4. Each group of the support blocks 6 is provided with a tray 7. There are gaps between the tray 7 and the inner wall of the electrolytic cell 1 and between the multiple trays 7. The tray 7 is a tray structure surrounded by a mesh plate, thereby effectively To ensure the contact area between the plating solution and the tray 7, a plating block 14 lower than the strip hole 5 is arranged on the tray 7, and the tray 7 is a tray surrounded by a mesh plate made of titanium. A partition is arranged on the tray 7, and a plating block 14 is arranged on the partition. The plating block 14 is a plurality of copper blocks or a plurality of zinc blocks. The partition is made of conductive material and is a layered structure made of polypropylene fiber. On the one hand, the partition will not affect the transmission of current. On the other hand, the partition can effectively prevent the plating block 14 from falling through the mesh of the tray 7.
[0036] When copper is plated on the tungsten wire, the plating solution and the copper block used in the copper plating are used as anodes, and the tungsten wire 15 is used as a cathode. Under the action of electrolysis, copper ions are precipitated and plated on the surface of the tungsten wire. The pyrophosphoric acid in the plating solution reacts with the copper block, so that the copper block is dissolved into copper ions, ensuring that the copper ion concentration in the plating solution is in dynamic equilibrium. When galvanizing the tungsten wire, the plating solution and the zinc block used in the galvanizing process serve as the anode, and the tungsten wire 15 serves as the cathode. Under the action of electrolysis, zinc particles are precipitated and plated on the surface of the tungsten wire, and the sulfuric acid in the plating solution reacts with the zinc block, so that the zinc block dissolves into zinc ions, thereby ensuring that the zinc ion concentration in the plating solution is in dynamic equilibrium.
[0037] Winding rollers 8 are provided at both ends of the electrolytic cell 1. Tungsten wire 15 is wound between the two winding rollers 8. The diameter of the tungsten wire is 0.05-0.15 mm. The winding direction can be clockwise or counterclockwise. The tungsten wire 15 extending tangentially along the upper side of the winding roller 8 passes through the strip hole 5 of the upper electrolytic cell 1, and the tungsten wire 15 extending tangentially along the lower side of the winding roller 8 passes through the strip hole 5 of the lower electrolytic cell 1. Through the arrangement of the two winding rollers 8, the tungsten wire passes through the electrolytic cell 1 between the two winding rollers 8 during the process of being wound on the winding rollers 8. The tungsten wire passes through the corresponding electrolytic cell 1 through the strip hole 5, and the tungsten wire is immersed in the electrolytic cell 1. The tungsten wire 15 is immersed in the plating solution, and the tungsten wire is wound multiple times and then passes through the electrolytic cell 1 multiple times, so that the residence time of the tungsten wire 15 in the plating solution is 60-80s. At the same time, the concentration of copper ions or zinc ions in the electrolytic cell 1 is in dynamic equilibrium, and only two electrolytic cells 1 are used in conjunction with the winding roller 8, so that the space occupied by the equipment can be effectively reduced while ensuring the plating quality (that is, two electrolytic cells 1 replace the original dozen or even more), effectively reducing the cost, and reducing the amount of plating solution used (the volume of the plating solution used for copper plating is about 6% of the original, and the volume of the plating solution used for zinc plating is about 15% of the original), further reducing the cost.
[0038] The winding roller 8 is provided with a plurality of winding grooves 16, which are arranged in sequence along the axial direction of the winding roller 8. The tungsten wires 15 are wound on the plurality of winding grooves 16 in sequence, and the tungsten wires wound on the winding roller 8 are separated by the winding grooves 16 to avoid mutual contact and interference, thereby ensuring smooth electroplating.
[0039] The circulation pipeline includes a liquid supply pipe 9 and a liquid outlet pipe 10. One end of the liquid supply pipe 9 is connected to the lower end of the storage tank 2, and the other end is connected to the inside of the corresponding electrolytic cell 1. A delivery pump 12 and a filter are provided on the liquid supply pipe 9. The filter is located on one side of the outlet end of the delivery pump 12. The plating liquid in the storage tank 2 is delivered to the electrolytic cell 1 (between the two second partitions 4 in the electrolytic cell 1) through the liquid supply pipe 9 by the delivery pump 12. With continuous delivery, the plating liquid level in the electrolytic cell 1 rises to the position of the strip hole 5 on the second partition 4, and the strip hole 5 is discharged from the strip hole 5. The strip-shaped hole 5 flows into the space between the adjacent first partition plate 3 and the second partition plate 4. A drain port 13 is provided at the bottom of the electrolytic cell 1 between the adjacent first partition plate 3 and the second partition plate 4. The drain port 13 is connected to a liquid outlet pipe 10. The end of the liquid outlet pipe 10 away from the drain port 13 is connected to the upper end of the storage tank 2. The plating liquid overflowing through the strip-shaped hole 5 to the area between the adjacent first partition plate 3 and the second partition plate 4 flows back into the storage tank 2 through the drain port 13 and the liquid outlet pipe 10. In this process, the plating liquid submerges the tungsten wire passing through the strip-shaped hole 5.
[0040] At least one liquid inlet pipe 11 is provided in each electrolytic cell 1, and the liquid supply pipe 9 is connected with the interior of the corresponding electrolytic cell 1 through the liquid inlet pipe 11. The liquid inlet pipe 11 is lower than the tray 7 in the electrolytic cell 1 and is provided with multiple liquid outlets. The liquid supply pipe 9 transports the plating solution to the liquid inlet pipe 11 and enters the electrolytic cell through the multiple liquid outlets. The multiple liquid outlets are provided to allow the plating solution to diffuse rapidly in the electrolytic cell 1 and to disturb the plating solution in the electrolytic cell 1 to a certain extent, thereby cooperating with the circulation effect of the plating solution between the electrolytic cell 1 and the storage tank 2 to ensure that the plating solution near the tungsten wire is constantly replaced, to ensure the concentration of copper ions or zinc ions near the tungsten wire, and to ensure the plating effect of electroplating.
[0041] As an implementation method, the inner bottom surface of the electrolytic cell 1 between the first partition plate 3 and the second partition plate 4 is set as an inclined surface, and the lower end of the inclined surface extends to the drain port 13, so that the plating solution can quickly flow back to the storage tank 2.
[0042] As an implementable embodiment, a spray pipe (not shown in the figure) is arranged above each winding roller 8, which is used to spray and rinse the tungsten wire 15 extending out of the electrolytic cell 1 and wound on the winding roller 8, so as to rinse away the copper or zinc that is not plated on the surface of the tungsten wire 15 but attached to the surface of the tungsten wire 15 during the electroplating process, so as to avoid affecting the subsequent electroplating process.
[0043] A tungsten wire double-layer electrolytic plating method is implemented by the above-mentioned tungsten wire double-layer electrolytic plating device, comprising the following steps: Step 1: Wind at least one tungsten wire 15 on two winding rollers 8 for 7-10 turns respectively, the minimum spacing between two adjacent turns of the same tungsten wire 15 is 4 mm, and the minimum spacing between two adjacent tungsten wires 15 is 8 mm. After winding, the line speed is controlled at 3-20 m / min; After the winding of the tungsten wire 15 is completed in step 1, the linear speed of the tungsten wire 15 is controlled to be 3 m / min, 11 m / min, or 20 m / min to prevent the tungsten wire 15 from being damaged due to sudden movement when power is subsequently turned on.
[0044] When the tungsten wire 15 is wound on the winding roller 8, the spacing between two adjacent turns of the same tungsten wire 15 is 5 mm, and they are respectively located in two adjacent winding grooves 16, and the spacing between two adjacent tungsten wires is 10 mm, that is, there is a winding groove 16 between the two turns that are closest to each other (such as Figure 6 as shown).
[0045] Step 2, start the delivery pump 12, and the plating solution circulates between the storage tank 2 and the electrolytic cell 1 through the circulation pipeline; The plating solution level in the electrolytic cell 1 is at least 0.5 cm higher than the tungsten wire.
[0046] Step 3, making the tray and the tungsten wire conductive, and controlling the line speed at 25±0.5m / min; In the step three, the tray and the tungsten wire are made conductive, and the line speed is controlled at 24.5 m / min, 25 m / min, or 25.5 m / min to ensure that the residence time of the tungsten wire 15 in the plating solution is 60 s, 70 s, or 80 s.
[0047] When copper is plated on the surface of the tungsten wire, the plating block is a plurality of copper blocks, the plating solution is a mixed solution of copper pyrophosphate, potassium pyrophosphate, pyrophosphoric acid and pure water, the copper ion concentration is 27±7g / L, the pH value is 8.3±0.4, the temperature is set at 50±5°C, the concentration ratio of copper ions to pyrophosphate ions in the plating solution is 1:7.5±1, and the thickness of the copper plating layer is 0.001±0.00005mm; In actual use, copper pyrophosphate is mixed with pure water to ensure that the copper ion concentration in the solution is 27±7 g / L, pyrophosphoric acid is used to adjust the pH value of the plating solution to 8.3±0.4, and potassium pyrophosphate is added to adjust the concentration ratio of copper ions to pyrophosphate ions in the plating solution to 1:7.5±1.
[0048] When zinc is plated on the surface of the tungsten wire, the plating block is a plurality of zinc blocks, the plating solution is a zinc sulfate solution prepared by mixing zinc sulfate and pure water, the concentration of the zinc sulfate solution is 225±75g / L, the pH value is 1.4-2.2, the temperature is set at 35±5°C, and the thickness of the zinc plating layer is 0.00025±0.00005mm; In actual use, the pH value of the plating solution is adjusted to 1.4-2.2 by adding sulfuric acid into the plating solution.
[0049] like Figure 4 As shown in the figure, the arrow in the figure is the winding direction of the corresponding tungsten wire 15. The tungsten wire 15 is wound on two winding rollers 8 and passes through two electrolytic cells 1, that is, the tungsten wire 15 passes through one of the electrolytic cells 1 tangentially along the winding roller 8 (through the strip holes 5 on the first partition 3 and the second partition 4 in each electrolytic cell 1), and then is wound on the other winding roller 8 (the tungsten wire 15 is wound in the corresponding winding groove 16 on the winding roller 8, and each time is wound in a different winding groove 16), and then passes through another electrolytic cell 1 tangentially along the other winding roller 8, and then the tungsten wire 15 is wound through the winding roller 8 and passes through the electrolytic cell 1 for multiple times (the tungsten wire 15 is wound on the winding roller 8 7-10 times), ensuring that the tungsten wire 15 stays in the plating solution for 60s, 70s or 80s, thereby ensuring the thickness of the copper or zinc layer plated on the surface of the tungsten wire 15.
[0050] Plating solution circulation process: the delivery pump 12 delivers the plating solution in the storage tank 2 to the liquid inlet pipe 11 through the filter and then through the liquid supply pipe 9, and enters between the two second partitions 4 in the electrolytic cell 1 through multiple liquid outlets opened on the liquid inlet pipe 11. As the plating solution continues to enter, its liquid level gradually increases. When the plating solution immerses the tungsten wire 15, its liquid level height matches the height of the strip hole 5, and then the plating solution overflows to the side away from the two second partitions 4 in the electrolytic cell 1 (that is, between the adjacent first partition 3 and second partition 4), and then the plating solution flows back to the storage tank 2 from the drain port 13 through the liquid outlet pipe 10, and then the plating solution in the electrolytic cell 1 is in dynamic balance.
[0051] Electroplating process: The tungsten wire 15 and the tray 7 in the electrolytic cell 1 are energized through a rectifier, and then under the action of electrolysis, the copper ions or zinc ions near the tungsten wire 15 are precipitated and electrolytically plated on the surface of the tungsten wire 15, and then the copper block or zinc block in the electrolytic cell 1 is dissolved into copper ions or zinc ions, ensuring that the concentration of copper ions or zinc ions in the plating solution is in dynamic equilibrium. As the reaction continues, a layer of copper or zinc is plated on the surface of the tungsten wire 15.
[0052] In the actual production process, copper is first plated on the surface of the tungsten wire 15 by a set of plating devices of the present invention, and then zinc is plated on the surface of the tungsten wire 15 by another set of plating devices, and then heat diffusion is performed to complete the brass electroplating process.
[0053] The embodiments described above are only preferred embodiments of the present invention and are not intended to limit the scope of implementation of the present invention. Therefore, any equivalent changes or modifications made according to the structures, features and principles described in the patent scope of the present invention should be included in the scope of the patent application of the present invention.
Claims
1. A tungsten wire double-layer electrolytic plating device, characterized in that: It comprises two electrolytic cells (1) arranged vertically, a storage tank (2) being provided on one side of the electrolytic cell (1), and a circulation pipeline being provided between the storage tank (2) and the electrolytic cell (1) for circulating the plating solution between the storage tank (2) and the electrolytic cell (1); Each electrolytic cell (1) is provided with a first partition plate (3) at both ends, two second partition plates (4) are provided between the two first partition plates (3), the first partition plates (3) and the second partition plates (4) are provided with mutually corresponding strip holes (5), a plurality of groups of support blocks (6) are provided between the two second partition plates (4), each group of the support blocks (6) is provided with a tray (7), the tray (7) is a tray structure surrounded by a mesh plate, and a plating block (14) is provided on the tray (7) which is lower than the strip holes (5); Winding rollers (8) are provided at both ends of the electrolytic cell (1), and a tungsten wire (15) is wound between the two winding rollers (8). The tungsten wire (15) extending tangentially along the upper side of the winding roller (8) passes through the strip hole (5) of the upper electrolytic cell (1), and the tungsten wire (15) extending tangentially along the lower side of the winding roller (8) passes through the strip hole (5) of the lower electrolytic cell (1).
2. A tungsten wire double-layer electrolytic plating device according to claim 1, characterized in that: The circulation pipeline comprises a liquid supply pipe (9) and a liquid outlet pipe (10), one end of the liquid supply pipe (9) is connected to the lower end of the storage tank (2), and the other end is connected to the inside of the corresponding electrolytic cell (1), and a liquid discharge port (13) is provided at the bottom of the electrolytic cell (1) between the adjacent first partition plate (3) and the second partition plate (4), and the liquid discharge port (13) is connected to the liquid outlet pipe (10), and the end of the liquid outlet pipe (10) away from the liquid discharge port (13) is connected to the upper end of the storage tank (2).
3. A tungsten wire double-layer electrolytic plating device according to claim 2, characterized in that: At least one liquid inlet pipe (11) is provided in each electrolytic cell (1), the liquid supply pipe (9) is connected to the interior of the corresponding electrolytic cell (1) through the liquid inlet pipe (11), the liquid inlet pipe (11) is lower than the tray (7) in the electrolytic cell (1) and is provided with a plurality of liquid outlets; The liquid supply pipe (9) is provided with a delivery pump (12) and a filter, and the filter is located on one side of the outlet end of the delivery pump (12).
4. A tungsten wire double-layer electrolytic plating device according to claim 1, characterized in that: There are gaps between the tray (7) and the inner wall of the electrolytic cell (1), and between multiple trays (7).
5. A tungsten wire double-layer electrolytic plating device according to claim 1, characterized in that: The plating blocks (14) are a plurality of copper blocks or a plurality of zinc blocks; The tray (7) is a tray surrounded by a mesh plate made of titanium, a partition is provided on the tray (7), a plating block (14) is provided on the partition, and the partition is made of a conductive material; The partition layer is a layered structure made of polypropylene fibers.
6. A tungsten wire double-layer electrolytic plating device according to claim 1, characterized in that: The winding roller (8) is provided with a plurality of winding grooves (16), and the tungsten wire (15) is wound in sequence on the plurality of winding grooves (16).
7. A method for double-layer electrolytic plating of tungsten wire, characterized in that: The method is realized by a tungsten wire double-layer electrolytic plating device according to any one of claims 1 to 6, comprising the following steps: Step 1: Wind at least one tungsten wire on two winding rollers for multiple turns. The minimum spacing between two adjacent turns of the same tungsten wire is 4 mm, and the minimum spacing between two adjacent tungsten wires is 8 mm. After winding, the line speed is controlled at 3-20 m / min. Step 2, starting the delivery pump, and the plating solution circulates between the storage tank and the electrolytic cell through the circulation pipeline; The plating solution level in the electrolytic cell is at least 0.5 cm higher than the tungsten wire; Step 3: Make the tray and the tungsten wire conductive and control the line speed at 25±0.5m / min.
8. A tungsten wire double-layer electrolytic plating method according to claim 7, characterized in that: Used to copper or zinc plate the surface of tungsten wire; When copper is plated on the surface of the tungsten wire, the plating block is a plurality of copper blocks, the plating solution is a mixed solution of copper pyrophosphate, potassium pyrophosphate, pyrophosphoric acid and pure water, the copper ion concentration is 27±7g / L, the pH value is 8.3±0.4, the temperature is set at 50±5°C, the concentration ratio of copper ions to pyrophosphate ions in the plating solution is 1:7.5±1, and the thickness of the copper plating layer is 0.001±0.00005mm; When zinc is plated on the surface of the tungsten wire, the plating block is a plurality of zinc blocks, the plating solution is a zinc sulfate solution prepared by mixing zinc sulfate and pure water, the concentration of the zinc sulfate solution is 225±75g / L, the pH value is 1.4-2.2, the temperature is set at 35±5°C, and the thickness of the zinc plating layer is 0.00025±0.00005mm.
9. A tungsten wire double-layer electrolytic plating method according to claim 7, characterized in that: After the tungsten wire is wound in step 1, the wire speed of the tungsten wire is controlled to be 3 m / min, 11 m / min, or 20 m / min; In the step 3, after the tray and the tungsten wire are made conductive, the line speed is controlled at 25 m / min.
10. A tungsten wire double-layer electrolytic plating method according to claim 7, characterized in that: When the tungsten wire is wound on the winding rod, the distance between two adjacent turns of the same tungsten wire is 5 mm, and the distance between two adjacent tungsten wires is 10 mm.