Young's modulus measuring method, device and equipment of particles and storage medium

Abstract

The invention provides a Young's elastic modulus measuring method, device and equipment of particles and a storage medium. The method comprises the following steps: determining an equivalent curvature radius of a to-be-measured particle according to a long-axis length and a short-axis length which are obtained by measuring the length of the to-be-measured particle by using a digital microscope, a front-view profile diagram and a side-view profile diagram which are obtained by shooting the to-be-measured particle by using the digital microscope, and presetting a pixel length; according to the equivalent curvature radius, the total displacement obtained by using a data collector to measure the displacement of the contact flat plate through a displacement sensor, the load applied to the to-be-measured particles measured by a load sensor and obtained by using the data collector, and preset parameters, determining the reduced modulus of the to-be-measured particles in contact with the contact flat plate; and determining the Young's modulus of the to-be-measured particles according to the reduced modulus, the Poisson's ratio of the to-be-measured particles, and the Young's modulus and Poisson's ratio of the contact flat plate, thereby reducing the measurement cost and measurement difficulty of the Young's modulus of the particles.

Description

Technical Field

[0001] The present invention relates to the technical field of material mechanics testing, and in particular to a particle Young's elastic modulus measurement method, device, equipment and storage medium. Background Art

[0002] In the microscopic mechanical analysis and discrete element simulation of particle aggregates, as well as the mechanical analysis of granular materials as proppants in petroleum engineering, it is necessary to measure the Young's modulus of elasticity of the particles and use the Young's modulus of elasticity as a mechanical parameter for the above research.

[0003] There are existing methods for measuring Young's modulus, such as static stretching, compression, dynamic resonance, and nanoindentation. Among them, since static stretching, compression, and dynamic resonance have many requirements on the shape and size of particles, they cannot be directly applied to the measurement of Young's modulus of all particles, and their versatility is poor; although the nanoindentation method can measure the Young's modulus of particles, the nanoindenter used in the nanoindentation method is expensive, resulting in a high cost for measuring the Young's modulus of particles by nanoindentation, and the nanoindentation method requires surface polishing of the surface of the particles to be measured, which has high requirements for smoothness and complex experimental operations, resulting in the problem that the measurement of the Young's modulus of particles by nanoindentation is not convenient enough. Summary of the invention

[0004] The present invention provides a method, device, equipment and storage medium for measuring the Young's modulus of particles, which can accurately control the contact conditions with particles and achieve the purpose of efficiently and accurately measuring the Young's modulus of particles; and, in the method for measuring the Young's modulus of particles provided by the present invention, the prices of measuring instruments such as digital microscopes, displacement sensors, load sensors, data collectors and contact plates used are much lower than those of nano indenters, which greatly reduces the measurement cost of the Young's modulus of particles; in addition, the method for measuring the Young's modulus of particles provided by the present invention does not require measurement personnel to have professional knowledge reserves, and the use of various instruments is simple and convenient. The method has low difficulty in use and simple measurement operation, which greatly reduces the difficulty of measuring the Young's modulus of particles and improves the convenience of measuring the Young's modulus of particles. Finally, since the shape, size and surface smoothness of the particles to be measured will not affect the digital microscope's measurement of the length of the particles to be measured and the taking of images of the particles to be measured, the Young's modulus of particles measured by the present invention has no requirements on the shape, size and surface smoothness of the particles to be measured, and is not only suitable for the measurement of the Young's modulus of sand particles, but also more suitable for the measurement of the Young's modulus of other granular materials, making the Young's modulus of particles The method for measuring the Young's modulus of particles is more versatile.

[0005] According to a first aspect of the present invention, a method for measuring Young's elastic modulus of particles is provided, the method comprising:

[0006] Using a digital microscope to measure the length of the particles to be measured to obtain the major axis length and the minor axis length of the particles to be measured;

[0007] Using a digital microscope to photograph the particle to be tested to obtain a front view contour image and a side view contour image of the particle to be tested, and determining the equivalent radius of curvature of the particle to be tested according to the major axis length, the minor axis length, the front view contour image, the side view contour image and a preset pixel length;

[0008] When the particles to be tested are vertically compressed by the contact plate, a data collector is used to obtain a total displacement obtained by measuring the displacement of the contact plate by a displacement sensor, and a load applied to the particles to be tested measured by a load sensor is obtained by the data collector, wherein the material of the contact plate is a high-hardness material;

[0009] Determining the reduced modulus of contact between the particle to be tested and the contact plate according to the equivalent radius of curvature, the total displacement, the load and preset parameters;

[0010] The Young's elastic modulus of the particle to be measured is determined according to the reduced modulus, the Poisson's ratio of the particle to be measured, the Young's elastic modulus of the contact plate and the Poisson's ratio.

[0011] According to a second aspect of the present invention, there is provided a device for measuring Young's elastic modulus of particles, the device comprising:

[0012] A length measurement module, used to measure the length of the particle to be measured using a digital microscope to obtain the major axis length and minor axis length of the particle to be measured;

[0013] A first determination module is used to photograph the particle to be tested using a digital microscope to obtain a front view contour image and a side view contour image of the particle to be tested, and determine the equivalent radius of curvature of the particle to be tested according to the major axis length, the minor axis length, the front view contour image, the side view contour image and a preset pixel length;

[0014] A displacement and load acquisition module, used to acquire the total displacement obtained by the displacement sensor on the contact plate when the particle to be tested is vertically compressed by the contact plate using a data acquisition device, and to acquire the load applied to the particle to be tested measured by the load sensor using the data acquisition device, wherein the material of the contact plate is a high-hardness material;

[0015] A second determination module is used to determine the reduced modulus of contact between the particle to be tested and the contact plate according to the equivalent radius of curvature, the total displacement, the load and preset parameters;

[0016] The third determination module is used to determine the Young's elastic modulus of the particle to be measured according to the reduced modulus, the Poisson's ratio of the particle to be measured, the Young's elastic modulus of the contact plate and the Poisson's ratio.

[0017] According to a third aspect of the present invention, there is provided an electronic device, comprising a processor and a memory.

[0018] The memory is used to store codes and related data;

[0019] The processor is used to execute the code in the memory to implement the method for measuring the Young's elastic modulus of particles as described in any one of the embodiments of the present invention.

[0020] According to a fourth aspect of the present invention, there is provided a storage medium having a computer program stored thereon, which, when executed by a processor, implements the method for measuring the Young's elastic modulus of particles as described in any one of the embodiments of the present invention.

[0021] In the embodiment of the present invention, the length of the particle to be measured can be measured by a digital microscope to obtain the major axis length and the minor axis length of the particle to be measured, and then the particle to be measured can be photographed by the digital microscope to obtain a front view contour image and a side view contour image of the particle to be measured, and the equivalent radius of curvature can be determined according to the major axis length, the minor axis length, the front view contour image, the side view contour image and the preset pixel length, which is equivalent to achieving the purpose of determining the equivalent radius of curvature of the particle to be measured in three-dimensional space, and the digital microscope has high measurement accuracy and high image clarity obtained by photographing, and the equivalent radius of curvature determined according to the major axis length, the minor axis length, the front view contour image, the side view contour image and the preset pixel length has higher accuracy and reliability, thereby improving the quality of the particle to be measured. The accuracy and reliability of the equivalent radius of curvature of the measured particles are improved; then, when the measured particles are vertically compressed by the contact plate, the data collector is used to obtain the total displacement obtained by measuring the displacement of the contact plate by the displacement sensor, and the data collector is used to obtain the load applied to the measured particles measured by the load sensor. Since the material of the contact plate is a high-hardness material, the contact conditions with the measured particles can be accurately controlled, thereby improving the accuracy of the total displacement. According to the equivalent radius of curvature, the total displacement, the load and the preset parameters, the reduced modulus of contact between the measured particles and the contact plate is determined, and then according to the reduced modulus, the Poisson's ratio of the measured particles, the Young's elastic modulus of the contact plate and the Poisson's ratio, the Young's elastic modulus of the measured particles can be more accurately determined. The Young's modulus of the particles to be measured is equivalent to ensuring the accuracy and reliability of the numerical values ​​of the various parameters required to determine the Young's modulus of the particles to be measured, thereby ensuring the accuracy and reliability of the Young's modulus of the particles to be measured determined according to the various parameters, thereby achieving the purpose of efficiently and accurately measuring the Young's modulus of the particles; and, in the Young's modulus of particles measurement method provided by the present invention, the prices of the digital microscope, displacement sensor, load sensor, data acquisition device, contact plate and other measuring instruments used are much lower than those of the nanoindenter, thereby greatly reducing the measurement cost of the Young's modulus of the particles, and solving the problem that the nanoindenter used in the nanoindentation method is expensive, resulting in the high cost of the nanoindenter used in the nanoindentation method. The problem of high measurement cost of measuring the Young's modulus of particles by nanoindentation method is solved; in addition, the Young's modulus of particles measured by the present invention does not require the measurement personnel to have professional knowledge reserves, and the Young's modulus of the particles to be measured can be measured by following the operation steps to obtain the Young's modulus of the particles to be measured. The use of each instrument is easy and the measurement operation is simple, which also greatly reduces the difficulty of measuring the Young's modulus of particles, improves the convenience of measuring the Young's modulus of particles, and solves the problem that the measurement of the Young's modulus of particles by nanoindentation method is not convenient enough due to the high requirement of the surface smoothness of the particles to be measured by the nanoindentation method and the complex measurement operation;Finally, since the shape, size and surface smoothness of the particles to be measured will not affect the digital microscope to measure the length of the particles to be measured and to take the image of the particles to be measured, the particle Young's elastic modulus measurement method provided by the present invention has no requirements for the shape, size and surface smoothness of the particles to be measured, and is not only suitable for measuring the Young's elastic modulus of sand particles, but also suitable for measuring the Young's elastic modulus of other granular materials, making the particle Young's elastic modulus measurement method more versatile. ; BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 1 is a schematic flow chart of a method for measuring Young's elastic modulus of particles provided in an embodiment of the present invention;

[0024] Figure 2 is a schematic diagram of a measuring instrument used in the method for measuring Young's elastic modulus of particles provided in an embodiment of the present invention;

[0025] Figure 3a is a schematic diagram of a scenario for measuring the Young's elastic modulus of sand particles provided by an embodiment of the present invention;

[0026] Figure 3b is a front view profile diagram of sand particles provided by an embodiment of the present invention;

[0027] Figure 3c is a side profile diagram of a sand particle provided by an embodiment of the present invention;

[0028] Figure 4 is a schematic diagram of a fitting circle in a front view contour diagram of a sand particle provided by an embodiment of the present invention;

[0029] Figure 5 is a schematic diagram of a fitted circle in a side view profile diagram of a sand particle provided by an embodiment of the present invention;

[0030] Figure 6 is a schematic diagram of the top surface displacement of sand particles provided by an embodiment of the present invention;

[0031] Figure 7 It is a schematic diagram of using a linear equation to fit the linear relationship of load and displacement to the power of 1.5 provided in an embodiment of the present invention;

[0032] Figure 8It is a schematic diagram of using a linear equation to fit the data of 1.5 power of load and displacement provided by an embodiment of the present invention;

[0033] Fig. 9 is another schematic flow chart of a method for measuring Young's elastic modulus of particles provided in an embodiment of the present invention;

[0034] Fig.10 is a structural schematic diagram of a device for measuring Young's elastic modulus of particles provided in an embodiment of the present invention;

[0035] Fig.11 It is a schematic diagram of the structure of an electronic device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0037] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0038] The technical solution of the present invention is described in detail with specific embodiments below. The following specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments.

[0039] Figure 1 The present invention provides a flow chart of a method for measuring the Young's modulus of particles provided in an embodiment of the present invention. The method can be performed by a device for measuring the Young's modulus of particles, and the device can be implemented in software and / or hardware. In a specific embodiment, the device can be integrated into an electronic device, such as a computer, a server, etc. The following embodiments will be described by taking the device integrated into an electronic device as an example, and refer to Figure 1, the method may specifically include the following steps:

[0040] Step 101 , using a digital microscope to measure the length of the particle to be measured to obtain the major axis length and the minor axis length of the particle to be measured.

[0041] The major axis length can be understood as the longest diameter of the particle to be measured, and the minor axis length can be understood as the shortest diameter of the particle to be measured; the particle to be measured can be a sand particle.

[0042] For example, the measuring instrument used to measure the Young's elastic modulus of the particles to be measured in the embodiment of the present invention includes: Figure 2 The stepper motor, pressure head, base, contact plate, load sensor, displacement sensor, and measuring instrument also include a data logger ( Figure 2 (not shown), wherein the stepper motor is used to drive the load sensor, the displacement sensor is used to measure the displacement of the contact plate, the base is used to carry the contact plate and the particles to be tested, the load sensor is used to apply a load to the particles to be tested, and the data collector is used to obtain data from the displacement sensor and the load sensor. Figure 2 As shown, the contact plate is respectively pasted on the base and the pressure head as a plane in contact with the particles to be measured. Assuming that the particles to be measured are sand particles, the sand particles are placed on the contact plate on the base. Figure 3a The long axis of the sand particles in Figure 3a The short axis of the sand particle is Figure 3a The line segment y2 in can be used Figure 2 Digital microscope in Figure 3a The length of the sand particles in the sample is measured and the length of the line segment y1 is 1.060 mm, that is, the major axis length of the sand particles a = 1.060 mm. Figure 2 Digital microscope in Figure 3a The length of the sand particles in the Figure 3a The length of the line segment y2 in is 0.926 mm, that is, the minor axis length b of the sand particle is 0.926 mm.

[0043] Step 102, using a digital microscope to photograph the particle to be tested to obtain a front view contour image and a side view contour image of the particle to be tested, and determining the equivalent radius of curvature of the particle to be tested according to the major axis length, minor axis length, the front view contour image, the side view contour image and the preset pixel length.

[0044] Among them, the front view contour image can be understood as the image obtained by taking the front of the particle to be tested using a digital microscope; the side view contour image can be understood as the image obtained by taking the side of the particle to be tested using a digital microscope; the preset pixel length can be understood as the actual length corresponding to the preset unit pixel; the equivalent curvature radius can be understood as the inverse of the curvature of the contour curve of the particle to be tested.

[0045] In an optional embodiment, the front view contour image is sent to the client, so that the user of the client draws the long axis of the image in the front view contour image, fits the upper edge of the front view contour image in the front view contour image to obtain a first fitting circle, and fits the lower edge of the front view contour image in the front view contour image to obtain a second fitting circle; obtains the long axis of the image, the first fitting circle and the second fitting circle, and determines the first upper curvature radius and the first lower curvature radius of the particle to be measured according to the long axis of the image, the first fitting circle, the second fitting circle and the preset pixel length; sends the side view contour image to the client, so that the client The user of the terminal draws the minor axis of the figure in the side view contour image, fits the upper edge of the side view contour image in the side view contour image to obtain a third fitting circle, and fits the lower edge of the side view contour image in the side view contour image to obtain a fourth fitting circle; obtains the minor axis of the figure, the third fitting circle and the fourth fitting circle, and determines the second upper curvature radius and the second lower curvature radius of the particle to be measured according to the minor axis of the figure, the third fitting circle, the fourth fitting circle and the preset pixel length; determines the equivalent curvature radius of the particle to be measured according to the first upper curvature radius, the first lower curvature radius, the second upper curvature radius and the second lower curvature radius.

[0046] Among them, the major axis of the graph can be understood as the longest diameter of the particle to be measured drawn by the user in the front view contour graph; the minor axis of the graph can be understood as the shortest diameter of the particle to be measured drawn by the user in the side view contour graph; the first fitting circle can be understood as the circle obtained by the user fitting a circle in the front view contour graph to the upper edge of the front view contour graph; the second fitting circle can be understood as the circle obtained by the user fitting a circle in the front view contour graph to the lower edge of the front view contour graph; the third fitting circle can be understood as the circle obtained by the user fitting a circle in the side view contour graph to the upper edge of the side view contour graph; the fourth fitting circle can be understood as the circle obtained by the user fitting a circle in the side view contour graph to the lower edge of the side view contour graph.

[0047] Specifically, determining a first upper radius of curvature and a first lower radius of curvature of the particle to be measured according to the major axis of the graph, the first fitting circle, the second fitting circle and the preset pixel length includes:

[0048] Determine the first pixel number of the long axis of the image, and determine the first pixel ratio according to the long axis length, the first pixel number and the preset pixel length:

[0049]

[0050] Wherein, k1 represents the first pixel ratio, a represents the major axis length, n1 represents the first pixel number, and l represents the preset pixel length;

[0051] Determine the second pixel number of the radius of the first fitting circle, and determine the first upper curvature radius of the particle to be measured according to the first pixel ratio, the second pixel number and the preset pixel length:

[0052]

[0053] Among them, R u1 represents the first upper curvature radius, n2 represents the second number of pixels;

[0054] Determine the third pixel number of the radius of the second fitting circle, and determine the first lower curvature radius of the particle to be measured according to the first pixel ratio, the third pixel number and the preset pixel length:

[0055]

[0056] Among them, R l1 represents the first lower curvature radius, and n3 represents the third number of pixels.

[0057] Determining a second upper radius of curvature and a second lower radius of curvature of the particle to be measured according to the minor axis of the graph, the third fitting circle, the fourth fitting circle and the preset pixel length, including:

[0058] Determine the fourth number of pixels of the minor axis of the graph, and determine the second pixel ratio according to the minor axis length, the fourth number of pixels and the preset pixel length;

[0059]

[0060] Wherein, k2 represents the second pixel ratio, b represents the major axis length, and n4 represents the fourth pixel number;

[0061] Determine the fifth pixel number of the radius of the third fitting circle, and determine the second upper curvature radius of the particle to be measured according to the second pixel ratio, the fifth pixel number and the preset pixel length:

[0062]

[0063] Among them, R u2 represents the second upper curvature radius, n5 represents the fifth number of pixels;

[0064] Determine the sixth pixel number of the radius of the fourth fitting circle, and determine the second lower curvature radius of the particle to be measured according to the second pixel ratio, the sixth pixel number and the preset pixel length:

[0065]

[0066] Among them, R l2 represents the second lower curvature radius, and n6 represents the sixth pixel number. The equivalent curvature radius includes an upper equivalent curvature radius and a lower equivalent curvature radius. Specifically, according to the first upper curvature radius, the first lower curvature radius, the second upper curvature radius and the second lower curvature radius, the equivalent curvature radius of the particle to be measured is determined, including:

[0067] According to the first upper radius of curvature and the second upper radius of curvature, determine the upper equivalent radius of curvature:

[0068]

[0069] Among them, R u Represents the upper equivalent radius of curvature, R u1 represents the first upper curvature radius, R u2 represents the second upper curvature radius;

[0070] According to the first lower curvature radius and the second lower curvature radius, determine the lower equivalent curvature radius:

[0071]

[0072] Among them, R l represents the lower equivalent curvature radius, R l1 Represents the first lower curvature radius, R l2 Denotes the second lower curvature radius.

[0073] For example, the particle to be measured is a sand particle, the preset pixel length is l, and Figure 3b The front view contour image in the image is sent to the client, so that the user of the client can draw the following in the front view contour image: Figure 3b The long axis z1 shown in the figure is fitted with the upper edge of the front view contour diagram to obtain the following circle fitting: Figure 4 The first fitting circle C1 shown in the figure is fitted to the lower edge of the front view contour image in the front view contour image to obtain a circle as shown in the figure. Figure 4 The second fitting circle C2 shown in the figure; obtain the major axis z1 of the figure, the first fitting circle C1 and the second fitting circle C2, and determine the first pixel number n1 of the major axis z1 of the figure, and determine the first pixel ratio k1 according to the major axis length a, the first pixel number n1 and the preset pixel length l; determine the second pixel number n2 of the radius of the first fitting circle, and substitute the first pixel ratio k1, the second pixel number n2 and the preset pixel length l into the calculation formula of the first upper curvature radius:

[0074]

[0075] get Figure 4 The first upper curvature radius R of the sand particles in u1 =0.691 mm; determine the third pixel number n3 of the radius of the second fitting circle, and substitute the first pixel ratio k1, the third pixel number n3 and the preset pixel length l into the calculation formula of the first lower curvature radius:

[0076]

[0077] Get the first lower curvature radius R of the sand particles l1=0.567mm.

[0078] Will Figure 3c The side view profile image is sent to the client so that the user of the client can draw the following in the side view profile image: Figure 3c The short axis z2 shown in the figure is fitted with the upper edge of the side view contour diagram to obtain the following circle fitting: Figure 5 The third fitting circle C3 shown in the figure is fitted to the lower edge of the side view profile image in the side view profile image to obtain a circle as shown in the figure. Figure 5 The fourth fitting circle C4 shown in FIG. 1 is obtained; the minor axis z2 of the figure, the third fitting circle C3 and the fourth fitting circle C4 are obtained, and the fourth pixel number n4 of the major axis z2 of the figure is determined, and the second pixel ratio k2 is determined according to the minor axis length b, the fourth pixel number n4 and the preset pixel length l; the fifth pixel number n5 of the radius of the third fitting circle is determined, and the second pixel ratio k2, the fifth pixel number n5 and the preset pixel length l are substituted into the calculation formula of the second upper curvature radius:

[0079]

[0080] Get the second upper curvature radius R of the sand particles u2 =0.481 mm; determine the sixth pixel number n6 of the radius of the fourth fitting circle, and substitute the second pixel ratio k2, the sixth pixel number n6 and the preset pixel length l into the calculation formula of the second lower curvature radius:

[0081]

[0082] Get the second lower curvature radius R of the sand particles l2 =0.510mm.

[0083] Step 103, when the particle to be tested is vertically compressed by the contact plate, the total displacement obtained by the displacement sensor on the contact plate is obtained by a data collector, and the load applied to the particle to be tested measured by the load sensor is obtained by a data collector, wherein the material of the contact plate is a high hardness material.

[0084] Among them, the total displacement can be understood as the displacement caused by the contact plate.

[0085] In an optional embodiment, the contact plate can be a sapphire substrate substrate, which can accurately control the contact conditions with the particles to be measured, thereby improving the accuracy of the total displacement, and accurately determining the reduced modulus of contact between the particles to be measured and the contact plate based on the equivalent radius of curvature, the first displacement, the second displacement, the load and preset parameters, and then more accurately determining the Young's modulus of the particles to be measured based on the reduced modulus, the Poisson's ratio of the particles to be measured, the Young's modulus of the contact plate and the Poisson's ratio, which is equivalent to ensuring the accuracy and reliability of the Young's modulus of the particles to be measured determined according to the various parameters by ensuring the numerical accuracy and reliability of the various parameters required to determine the Young's modulus of the particles to be measured.

[0086] For example, if the particles to be measured are sand particles, the range of the load sensor can be set to 200N, the accuracy can be 0.02%, the range of the displacement sensor can be set to 1mm, the accuracy can be 0.1μm, and the load sensor can be set to 200N, the accuracy can be 0.02%, and the displacement sensor can be set to 1mm, the accuracy can be 0.1μm. Figure 2 The load sensor in the load sensor applies pressure F to the sand particles. During the process of applying pressure by the load sensor, the loading rate of the displacement sensor is set to 0.01mm / min, and the load is loaded until the displacement reaches about 1.5% of the long axis length of the sand particles. Figure 2 The displacement sensor in the contact plate measures the displacement of the contact plate. Figure 6 The total displacement Δ in .

[0087] Step 104, determining the reduced modulus of contact between the particle to be tested and the contact plate according to the equivalent radius of curvature, the total displacement, the load and the preset parameters.

[0088] In the embodiment of the present invention, Figure 7 As shown, a linear equation is used to fit the load F and Δ 1.5 The straight line segment data of the data points are obtained to obtain the fitting equation F = C × Δ 1.5 , and then we can get:

[0089]

[0090] Therefore, the calculation formula for the reduced modulus coefficient can be determined based on the load and total displacement:

[0091]

[0092] Where C represents the reduced modulus coefficient, F represents the load, and Δ represents the total displacement. For example, a linear equation is used to fit the load F and Δ 1.5 The straight line segment data of the data points is obtained as follows Figure 8 The fitting diagram shown in the figure obtains the fitting equation F = 30702 × Δ 1.5 , that is, C=30702.

[0093] According to Hertz's sphere-surface contact theory, the calculation formula for the particle to be tested with a radius of R, the load F when the contact plate contacts, the displacement at the contact point, and the reduced modulus of contact between the particle to be tested and the contact plate is:

[0094]

[0095] Among them, E * represents the reduced modulus of contact between the sphere and the contact plate, R represents the radius of the particle to be tested, and δ is the displacement at the contact point; Hertz sphere-surface contact theory is a mechanical theory that describes the interaction between two elastic bodies at the contact point.

[0096] The calculation formula of the reduced modulus of contact between the measured particle and the contact plate is:

[0097]

[0098] Where E represents the Young's modulus of the particle to be measured, E' represents the Young's modulus of the contact plate, v represents the Poisson's ratio of the particle to be measured, and v' represents the Poisson's ratio of the contact plate.

[0099] According to the calculation formula of the reduced modulus of contact between the particle to be measured and the contact plate and the calculation formula of the reduced modulus of contact between the particle to be measured and the contact plate, the calculation formula of the first displacement of the contact plate in contact with the upper surface of the particle to be measured can be obtained as follows:

[0100]

[0101] The calculation formula for the second displacement of the contact plate in contact with the lower top surface of the particle to be measured is:

[0102]

[0103] The total displacement is calculated as:

[0104] Δ=δ u +δ l

[0105] Combining the calculation formula of the reduced modulus of contact between the particle to be tested and the contact plate, the calculation formula of the reduced modulus of contact between the particle to be tested and the contact plate, the calculation formula of the first displacement, the calculation formula of the second displacement, the calculation formula of the upper equivalent radius of curvature, the calculation formula of the lower equivalent radius of curvature, and the calculation formula of the total displacement, the calculation formula of the reduced modulus of contact between the particle to be tested and the contact plate can be derived as follows:

[0106]

[0107] In an optional implementation, the upper equivalent radius of curvature may be determined according to the first upper radius of curvature and the second upper radius of curvature:

[0108]

[0109] According to the first lower curvature radius and the second lower curvature radius, determine the lower equivalent curvature radius:

[0110]

[0111] According to the relationship between load and total displacement, the reduced modulus coefficient is determined:

[0112]

[0113] According to the upper equivalent radius of curvature, the lower equivalent radius of curvature, the reduced modulus coefficient and the preset parameters, the reduced modulus of contact between the particle to be tested and the contact plate is determined:

[0114]

[0115] For example, the particles to be tested are sand particles. A high-precision load sensor and a displacement sensor are installed on the compression test loading system. The pressure head is lowered to contact the top surface of the sand particles, and then loading is performed. The loading rate is 0.01 mm / min. The total displacement Δ obtained by the displacement sensor for measuring the displacement of the contact plate is obtained by a data acquisition device. The load F applied to the sand particles measured by the load sensor is obtained by a data acquisition device. The load is loaded until the displacement reaches about 1.5% of the long axis length of the sand particles. According to the first upper curvature radius R u1 =0.691mm and the second upper curvature radius R u2 =0.481mm, determine the upper equivalent radius of curvature R u =0.576mm, according to the first lower curvature radius R l1 =0.567mm and the second lower curvature radius R l2 =0.510mm, determine the equivalent radius of curvature R l =0.538mm; then R u , R l , C, Substitute the reduced modulus E of the contact plate * The calculation formula is:

[0116]

[0117] Get E * =89.472GPa.

[0118] Step 105, determining the Young's elastic modulus of the particle to be measured according to the reduced modulus, the Poisson's ratio of the particle to be measured, the Young's elastic modulus of the contact plate and the Poisson's ratio.

[0119] In an optional embodiment, the first modulus is determined according to the reduced modulus, the Poisson's ratio of the particle to be measured, the Young's elastic modulus of the contact plate, and the Poisson's ratio:

[0120] E1=E * E′×(1-v 2 )

[0121] Among them, E1 represents the first modulus, E * represents the reduced modulus of contact of the contact plate, E′ represents the Young's elastic modulus of the contact plate, v represents the Poisson's ratio of the particle to be tested, and v′ represents the Poisson's ratio of the contact plate;

[0122] The second modulus is determined based on the reduced modulus, the Poisson's ratio of the particle to be measured, the Young's elastic modulus of the contact plate and the Poisson's ratio:

[0123] E2=E′-E * (1-v′ 2 )

[0124] Wherein, E2 represents the second modulus;

[0125] According to the first modulus and the second modulus, the Young's modulus of elasticity of the particle to be tested is determined:

[0126]

[0127] That is, the calculation formula of Young's elastic modulus of the particles to be tested is as follows:

[0128]

[0129] The reduced modulus, the Poisson's ratio of the particle to be measured, the Young's elastic modulus of the contact plate and the Poisson's ratio are substituted into the calculation formula of the Young's elastic modulus of the particle to be measured to calculate the Young's elastic modulus of the particle to be measured.

[0130] In this example, the particles to be tested are quartz sand particles, the contact plate is a sapphire substrate, and the equivalent modulus E * =89.472GPa, Poisson's ratio of quartz sand particles v = 0.23, Young's elastic modulus of sapphire substrate E' = 345GPa, Poisson's ratio of sapphire substrate v' = 0.285, E * Substitute , E′, v and v′ into the Young's elastic modulus calculation formula of the particles to be tested:

[0131]

[0132] The Young's modulus of the quartz sand particles is E=107.7 GPa. After experimental verification, the Young's modulus of quartz sand particles is measured by the Young's modulus of particles provided by the embodiment of the present invention, and the obtained measurement results are compared with the measurement results obtained by measuring the Young's modulus of quartz sand particles by the nanoindentation method. The measurement results are consistent, proving that the Young's modulus of quartz sand particles obtained by the Young's modulus of particles provided by the embodiment of the present invention has a certain reliability.

[0133] That is, in the embodiment of the present invention, when the particles to be measured are sand particles, the length of the sand particles can be measured using a digital microscope to obtain the major axis length and the minor axis length of the sand particles, and then the sand particles are photographed using the digital microscope to obtain the front view profile and the side view profile of the sand particles, and the equivalent radius of curvature of the sand particles is determined according to the major axis length, the minor axis length, the front view profile, the side view profile and the preset pixel length; then, when the sand particles are vertically compressed by the contact plate, the total displacement obtained by the displacement sensor measuring the displacement of the contact plate is obtained using a data collector, and the load is obtained using the data collector. The load applied to the sand particles measured by the sensor, because the material of the contact plate is a high-hardness material, the contact conditions with the sand particles can be accurately controlled, thereby improving the accuracy of the total displacement, and determining the reduced modulus of contact between the sand particles and the contact plate according to the equivalent radius of curvature, the total displacement, the load and the preset parameters, and then determining the Young's modulus of the sand particles more accurately according to the reduced modulus, the Poisson's ratio of the sand particles, the Young's modulus of the contact plate and the Poisson's ratio, thereby achieving the purpose of efficiently and accurately measuring the Young's modulus of the particles; and the Young's modulus of the particles provided by the present invention can be measured. The method is characterized in that the prices of the digital microscope, displacement sensor, load sensor, data acquisition device, contact plate and other measuring instruments used are much lower than those of the nanoindenter, which greatly reduces the measurement cost of the Young's modulus of sand particles, and can solve the problem that the measurement cost of the Young's modulus of sand particles measured by the nanoindenter is high due to the high price of the nanoindenter used in the nanoindenter method; in addition, the Young's modulus of sand particles measured by the nanoindenter method provided by the present invention greatly reduces the difficulty of measuring the Young's modulus of sand particles, improves the convenience of measuring the Young's modulus of sand particles, and solves the problem that the Young's modulus of sand particles measured by the nanoindenter method is not convenient enough due to the high requirements of the nanoindenter method on the surface smoothness of sand particles and the complex measurement operation; finally, since the shape, size and surface smoothness of sand particles will not affect the digital microscope to measure the length of sand particles and take images of sand particles, the Young's modulus of sand particles measured by the nanoindenter method provided by the present invention has no requirements on the shape, size and surface smoothness of sand particles, so that the Young's modulus of sand particles The method for measuring the Young's modulus of particles is more versatile.

[0134] In the embodiment of the present invention, the length of the particle to be measured can be measured by a digital microscope to obtain the major axis length and the minor axis length of the particle to be measured, and then the particle to be measured can be photographed by the digital microscope to obtain a front view contour image and a side view contour image of the particle to be measured, and the equivalent radius of curvature can be determined according to the major axis length, the minor axis length, the front view contour image, the side view contour image and the preset pixel length, which is equivalent to achieving the purpose of determining the equivalent radius of curvature of the particle to be measured in three-dimensional space, and the digital microscope has high measurement accuracy and high image clarity obtained by photographing, and the equivalent radius of curvature determined according to the major axis length, the minor axis length, the front view contour image, the side view contour image and the preset pixel length has higher accuracy and reliability, thereby improving the quality of the particle to be measured. The accuracy and reliability of the equivalent radius of curvature of the measured particles are improved; then, when the measured particles are vertically compressed by the contact plate, the data collector is used to obtain the total displacement obtained by measuring the displacement of the contact plate by the displacement sensor, and the data collector is used to obtain the load applied to the measured particles measured by the load sensor. Since the material of the contact plate is a high-hardness material, the contact conditions with the measured particles can be accurately controlled, thereby improving the accuracy of the total displacement. According to the equivalent radius of curvature, the total displacement, the load and the preset parameters, the reduced modulus of contact between the measured particles and the contact plate is determined, and then according to the reduced modulus, the Poisson's ratio of the measured particles, the Young's elastic modulus of the contact plate and the Poisson's ratio, the Young's elastic modulus of the measured particles can be more accurately determined. The Young's modulus of the particles to be measured is equivalent to ensuring the accuracy and reliability of the numerical values ​​of the various parameters required to determine the Young's modulus of the particles to be measured, thereby ensuring the accuracy and reliability of the Young's modulus of the particles to be measured determined according to the various parameters, thereby achieving the purpose of efficiently and accurately measuring the Young's modulus of the particles; and, in the Young's modulus of particles measurement method provided by the present invention, the prices of the digital microscope, displacement sensor, load sensor, data acquisition device, contact plate and other measuring instruments used are much lower than those of the nanoindenter, thereby greatly reducing the measurement cost of the Young's modulus of the particles, and solving the problem that the nanoindenter used in the nanoindentation method is expensive, resulting in the high cost of the nanoindenter used in the nanoindentation method. The problem of high measurement cost of measuring the Young's modulus of particles by nanoindentation method is solved; in addition, the Young's modulus of particles measured by the present invention does not require the measurement personnel to have professional knowledge reserves, and the Young's modulus of the particles to be measured can be measured by following the operation steps to obtain the Young's modulus of the particles to be measured. The use of each instrument is easy and the measurement operation is simple, which also greatly reduces the difficulty of measuring the Young's modulus of particles, improves the convenience of measuring the Young's modulus of particles, and solves the problem that the measurement of the Young's modulus of particles by nanoindentation method is not convenient enough due to the high requirement of the surface smoothness of the particles to be measured by the nanoindentation method and the complex measurement operation;Finally, since the shape, size and surface smoothness of the particles to be measured will not affect the digital microscope to measure the length of the particles to be measured and to take the image of the particles to be measured, the particle Young's elastic modulus measurement method provided by the present invention has no requirements for the shape, size and surface smoothness of the particles to be measured, and is not only suitable for measuring the Young's elastic modulus of sand particles, but also suitable for measuring the Young's elastic modulus of other granular materials, making the particle Young's elastic modulus measurement method more versatile. ;

[0135] The following further describes the method for measuring the Young's elastic modulus of particles provided in the embodiments of the present invention. Fig. 9 As shown, Fig. 9 : is another flow chart of the method for measuring the Young's elastic modulus of particles provided in an embodiment of the present invention, which may specifically include the following steps:

[0136] Step 201 : Using a digital microscope to measure the length of the particle to be measured, the length of the major axis and the length of the minor axis of the particle to be measured are obtained.

[0137] Step 202: photograph the particle to be tested using a digital microscope to obtain a front view contour image and a side view contour image of the particle to be tested.

[0138] Step 203, sending the front view contour image to the client, so that the user of the client draws the long axis of the image in the front view contour image, fits the upper edge of the front view contour image in the front view contour image to obtain a first fitting circle, and fits the lower edge of the front view contour image in the front view contour image to obtain a second fitting circle.

[0139] Step 204, obtaining the major axis of the graph, the first fitting circle and the second fitting circle, and determining the first upper curvature radius and the first lower curvature radius of the particle to be measured according to the major axis of the graph, the first fitting circle, the second fitting circle and the preset pixel length.

[0140] Step 205, sending the side view profile image to the client, so that the user of the client draws the short axis of the image in the side view profile image, fits the upper edge of the side view profile image in the side view profile image to perform circle fitting to obtain a third fitting circle, and fits the lower edge of the side view profile image in the side view profile image to perform circle fitting to obtain a fourth fitting circle.

[0141] Step 206, obtaining the minor axis of the graph, the third fitting circle and the fourth fitting circle, and determining the second upper radius of curvature and the second lower radius of curvature of the particle to be measured according to the minor axis of the graph, the third fitting circle, the fourth fitting circle and the preset pixel length.

[0142] Step 207 , determining an equivalent radius of curvature of the particle to be measured according to the first upper radius of curvature, the first lower radius of curvature, the second upper radius of curvature, and the second lower radius of curvature.

[0143] Step 208, when the particle to be tested is vertically compressed by the contact plate, the total displacement obtained by the displacement sensor on the contact plate is obtained by the data acquisition device, and the load applied to the particle to be tested measured by the load sensor is obtained by the data acquisition device.

[0144] Step 209, determining the reduced modulus coefficient according to the load and the total displacement.

[0145] Step 210, determining the reduced modulus of contact between the particle to be tested and the contact plate according to the upper equivalent radius of curvature, the lower equivalent radius of curvature, the reduced modulus coefficient and preset parameters.

[0146] Step 211, determining a first modulus according to the reduced modulus, the Poisson's ratio of the particle to be measured, the Young's elastic modulus of the contact plate, and the Poisson's ratio.

[0147] Step 212, determining a second modulus according to the reduced modulus, the Poisson's ratio of the particle to be measured, the Young's elastic modulus of the contact plate, and the Poisson's ratio.

[0148] Step 213, determining the Young's modulus of elasticity of the particle to be measured according to the first modulus and the second modulus.

[0149] In the embodiments of the present invention, the purpose of efficiently and accurately measuring the Young's modulus of particles is achieved; and, in the Young's modulus of particles measuring method provided by the present invention, the prices of measuring instruments such as digital microscopes, displacement sensors, load sensors, data acquisition devices and contact plates used are much lower than those of nanoindenters, which greatly reduces the measurement cost of the Young's modulus of particles and solves the problem that the cost of measuring the Young's modulus of particles by nanoindentation is high due to the expensive price of nanoindenters used in the nanoindentation method; in addition, the Young's modulus of particles measuring method provided by the present invention does not require the measurement personnel to have professional knowledge reserves, and only needs to follow the operating steps to measure the Young's modulus of the particles to be measured to obtain the Young's modulus of the particles to be measured, and the difficulty of using each instrument is low. The nanoindentation method has the advantages of small size, simple measurement operation, and greatly reduces the difficulty of measuring the Young's modulus of particles, improves the convenience of measuring the Young's modulus of particles, and solves the problem that the nanoindentation method has high requirements on the surface smoothness of the particles to be measured and the measurement operation is complicated, resulting in the inconvenience of measuring the Young's modulus of particles by the nanoindentation method; finally, since the shape, size and surface smoothness of the particles to be measured will not affect the digital microscope to measure the length of the particles to be measured and take the image of the particles to be measured, the Young's modulus measurement method of the particles provided by the present invention has no requirements on the shape, size and surface smoothness of the particles to be measured, and is not only suitable for the measurement of the Young's modulus of sand particles, but also suitable for the measurement of the Young's modulus of other granular materials, making the Young's modulus measurement method of particles more versatile.

[0150] Fig.10 1 is a schematic diagram of a structure of a device for measuring the Young's elastic modulus of particles provided in an embodiment of the present invention. The device is suitable for performing a method for measuring the Young's elastic modulus of particles provided in an embodiment of the present invention. Fig.10 As shown, the device may specifically include:

[0151] The length measurement module 301 is used to measure the length of the particle to be measured by using a digital microscope to obtain the major axis length and the minor axis length of the particle to be measured;

[0152] The first determination module 302 is used to photograph the particle to be tested using a digital microscope to obtain a front view contour image and a side view contour image of the particle to be tested, and determine the equivalent radius of curvature of the particle to be tested according to the major axis length, the minor axis length, the front view contour image, the side view contour image and a preset pixel length;

[0153] The displacement and load acquisition module 303 is used to acquire the total displacement obtained by the displacement sensor on the contact plate when the particle to be tested is vertically compressed by the contact plate using a data acquisition device, and acquire the load applied to the particle to be tested measured by the load sensor using the data acquisition device, wherein the material of the contact plate is a high-hardness material;

[0154] A second determination module 304 is used to determine the reduced modulus of contact between the particle to be tested and the contact plate according to the equivalent radius of curvature, the total displacement, the load and preset parameters;

[0155] The third determination module 305 is used to determine the Young's elastic modulus of the particle to be measured according to the reduced modulus, the Poisson's ratio of the particle to be measured, the Young's elastic modulus of the contact plate and the Poisson's ratio.

[0156] Optionally, the first determination module 302 determines the equivalent radius of curvature of the particle to be measured according to the major axis length, the minor axis length, the front view contour image, the side view contour image and a preset pixel length, including:

[0157] Sending the front view contour image to a client, so that a user of the client draws a long axis in the front view contour image, performs circle fitting on the upper edge of the front view contour image in the front view contour image to obtain a first fitting circle, and performs circle fitting on the lower edge of the front view contour image in the front view contour image to obtain a second fitting circle;

[0158] Acquire the major axis of the graph, the first fitting circle, and the second fitting circle, and determine a first upper radius of curvature and a first lower radius of curvature of the particle to be measured according to the major axis of the graph, the first fitting circle, the second fitting circle, and the preset pixel length;

[0159] Sending the side view profile image to a client, so that a user of the client draws a minor axis in the side view profile image, performs circle fitting on the upper edge of the side view profile image to obtain a third fitting circle, and performs circle fitting on the lower edge of the side view profile image to obtain a fourth fitting circle;

[0160] Acquire the minor axis of the graph, the third fitting circle, and the fourth fitting circle, and determine a second upper radius of curvature and a second lower radius of curvature of the particle to be measured according to the minor axis of the graph, the third fitting circle, the fourth fitting circle, and the preset pixel length;

[0161] The equivalent radius of curvature of the particle to be detected is determined according to the first upper radius of curvature, the first lower radius of curvature, the second upper radius of curvature and the second lower radius of curvature.

[0162] Optionally, the first determination module 302 determines a first upper radius of curvature and a first lower radius of curvature of the particle to be detected according to the major axis of the graph, the first fitting circle, the second fitting circle and the preset pixel length, including:

[0163] Determine a first number of pixels of the major axis of the image, and determine a first pixel ratio according to the major axis length, the first number of pixels, and the preset pixel length:

[0164]

[0165] Wherein, k1 represents the first pixel ratio, a represents the major axis length, n1 represents the first pixel number, and l represents the preset pixel length;

[0166] Determine a second pixel number of the radius of the first fitting circle, and determine a first upper curvature radius of the particle to be detected according to the first pixel ratio, the second pixel number and the preset pixel length:

[0167]

[0168] Among them, R u1 represents the first upper curvature radius, n2 represents the second number of pixels;

[0169] Determine a third pixel number of the radius of the second fitting circle, and determine a first lower curvature radius of the particle to be detected according to the first pixel ratio, the third pixel number and the preset pixel length:

[0170]

[0171] Among them, R l1represents the first lower curvature radius, and n3 represents the third number of pixels.

[0172] Optionally, the first determination module 302 determines a second upper radius of curvature and a second lower radius of curvature of the particle to be detected according to the minor axis of the graph, the third fitting circle, the fourth fitting circle and the preset pixel length, including:

[0173] Determine a fourth number of pixels of the minor axis of the image, and determine a second pixel ratio according to the minor axis length, the fourth number of pixels and the preset pixel length;

[0174]

[0175] Wherein, k2 represents the second pixel ratio, b represents the minor axis length, and n4 represents the fourth pixel number;

[0176] Determine the fifth pixel number of the radius of the third fitting circle, and determine the second upper curvature radius of the particle to be measured according to the second pixel ratio, the fifth pixel number and the preset pixel length:

[0177]

[0178] Among them, R u2 represents the second upper curvature radius, n5 represents the fifth number of pixels;

[0179] Determine the sixth pixel number of the radius of the fourth fitting circle, and determine the second lower curvature radius of the particle to be measured according to the second pixel ratio, the sixth pixel number and the preset pixel length:

[0180]

[0181] Among them, R l2 represents the second lower curvature radius, and n6 represents the sixth number of pixels.

[0182] Optionally, the equivalent radius of curvature includes an upper equivalent radius of curvature and a lower equivalent radius of curvature, and the first determining module 302 determines the equivalent radius of curvature of the particle to be tested according to the first upper radius of curvature, the first lower radius of curvature, the second upper radius of curvature, and the second lower radius of curvature, including:

[0183] Determine the upper equivalent radius of curvature according to the first upper radius of curvature and the second upper radius of curvature:

[0184]

[0185] Among them, R u Represents the upper equivalent radius of curvature, R u1 represents the first upper curvature radius, Ru2 represents the second upper curvature radius;

[0186] The lower equivalent radius of curvature is determined according to the first lower radius of curvature and the second lower radius of curvature:

[0187]

[0188] Among them, R l represents the lower equivalent curvature radius, R l1 Represents the first lower curvature radius, R l2 Represents the second lower curvature radius.

[0189] Optionally, the second determination module 304 determines the reduced modulus of contact between the particle to be tested and the contact plate according to the equivalent radius of curvature, the first displacement, the second displacement, the load and preset parameters, including:

[0190] According to the load and the total displacement, the reduced modulus coefficient is determined:

[0191]

[0192] Among them, C represents the reduced modulus coefficient, F represents the load, and Δ represents the total displacement;

[0193] The reduced modulus of contact between the particle to be tested and the contact plate is determined according to the upper equivalent radius of curvature, the lower equivalent radius of curvature, the reduced modulus coefficient and the preset parameters:

[0194]

[0195] Among them, E * Represents the reduced modulus of contact between the contacting plates.

[0196] Optionally, the third determining module 305 is specifically configured to:

[0197] According to the reduced modulus, the Poisson's ratio of the particle to be measured, the Young's elastic modulus and the Poisson's ratio of the contact plate, the first modulus is determined:

[0198] E1=E * E′×(1-v 2 )

[0199] Among them, E1 represents the first modulus, E * represents the reduced modulus of contact of the contact plate, E′ represents the Young's elastic modulus of the contact plate, v represents the Poisson's ratio of the particle to be tested, and v′ represents the Poisson's ratio of the contact plate;

[0200] The second modulus is determined according to the reduced modulus, the Poisson's ratio of the particle to be measured, the Young's elastic modulus and the Poisson's ratio of the contact plate:

[0201] E2=E′-E * (1-v′ 2 )

[0202] Wherein, E2 represents the second modulus;

[0203] According to the first modulus and the second modulus, the Young's modulus of elasticity of the particle to be measured is determined:

[0204]

[0205] Wherein, E represents the Young's elastic modulus of the particles to be tested.

[0206] Optionally, the contact plate is a sapphire substrate.

[0207] Those skilled in the art can clearly understand that for the convenience and simplicity of description, only the division of the above-mentioned functional modules is used as an example for illustration. In actual applications, the above-mentioned functions can be assigned to different functional modules as needed, that is, the internal structure of the device is divided into different functional modules to complete all or part of the functions described above. The specific working process of the functional modules described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here.

[0208] The Young's modulus measuring device for particles provided in an embodiment of the present invention can achieve the purpose of efficiently and accurately measuring the Young's modulus of particles; and, in the Young's modulus measuring method for particles provided in the present invention, the prices of measuring instruments such as digital microscopes, displacement sensors, load sensors, data acquisition devices and contact plates used are much lower than those of nanoindenters, which greatly reduces the measurement cost of the Young's modulus of particles and solves the problem that the measurement cost of the Young's modulus of particles by nanoindentation method is high due to the expensive price of the nanoindenter used in the nanoindentation method; in addition, the Young's modulus measuring method for particles provided in the present invention does not require the measurement personnel to have professional knowledge reserves, and only needs to follow the operating steps to measure the Young's modulus of the particles to be measured, and obtain the Young's modulus of the particles to be measured. The use of each instrument is easy and the measurement operation is simple, which greatly reduces the difficulty of measuring the Young's modulus of particles, improves the convenience of measuring the Young's modulus of particles, and solves the problem that the measurement of the Young's modulus of particles by nanoindentation method is not convenient enough due to the high requirements of the surface smoothness of the particles to be measured and the complex measurement operation; finally, since the shape, size and surface smoothness of the particles to be measured will not affect the digital microscope to measure the length of the particles to be measured and take the image of the particles to be measured, therefore, the Young's modulus measurement method of particles provided by the present invention has no requirements for the shape, size and surface smoothness of the particles to be measured, and is not only suitable for the measurement of the Young's modulus of sand particles, but also suitable for the measurement of the Young's modulus of other granular materials, making the Young's modulus measurement method of particles more versatile.

[0209] Fig.11 It is a schematic diagram of the structure of an electronic device provided by an embodiment of the present invention.

[0210] Please refer to Fig.11 , an electronic device 50 is provided, comprising:

[0211] a processor 51; and

[0212] A memory 52, used to store executable instructions of the processor;

[0213] The processor 51 is configured to execute the above-mentioned method by executing the executable instructions.

[0214] The processor 51 can communicate with the memory 52 via a bus 53 .

[0215] An embodiment of the present invention further provides a computer-readable storage medium on which a computer program is stored. When the program is executed by a processor, the above-mentioned method is implemented.

[0216] Those skilled in the art can understand that all or part of the steps of implementing the above-mentioned method embodiments can be completed by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When the program is executed, the steps of the above-mentioned method embodiments are executed; and the aforementioned storage medium includes: ROM, RAM, disk or optical disk and other media that can store program codes.

[0217] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for measuring Young's elastic modulus of particles, characterized in that: The method comprises: Using a digital microscope to measure the length of the particles to be measured to obtain the major axis length and the minor axis length of the particles to be measured; Using a digital microscope to photograph the particle to be tested to obtain a front view contour image and a side view contour image of the particle to be tested, and determining the equivalent radius of curvature of the particle to be tested according to the major axis length, the minor axis length, the front view contour image, the side view contour image and a preset pixel length; When the particles to be tested are vertically compressed by the contact plate, a data collector is used to obtain a total displacement obtained by measuring the displacement of the contact plate by a displacement sensor, and a load applied to the particles to be tested measured by a load sensor is obtained by the data collector, wherein the material of the contact plate is a high-hardness material; Determining the reduced modulus of contact between the particle to be tested and the contact plate according to the equivalent radius of curvature, the total displacement, the load and preset parameters; The Young's elastic modulus of the particle to be measured is determined according to the reduced modulus, the Poisson's ratio of the particle to be measured, the Young's elastic modulus of the contact plate and the Poisson's ratio.

2. The method according to claim 1, wherein determining the equivalent radius of curvature of the particle to be measured according to the major axis length, the minor axis length, the front view contour image, the side view contour image and the preset pixel length comprises: Sending the front view contour image to a client, so that a user of the client draws a long axis in the front view contour image, performs circle fitting on the upper edge of the front view contour image in the front view contour image to obtain a first fitting circle, and performs circle fitting on the lower edge of the front view contour image in the front view contour image to obtain a second fitting circle; Acquire the major axis of the graph, the first fitting circle, and the second fitting circle, and determine a first upper radius of curvature and a first lower radius of curvature of the particle to be measured according to the major axis of the graph, the first fitting circle, the second fitting circle, and the preset pixel length; Sending the side view profile image to a client, so that a user of the client draws a minor axis in the side view profile image, performs circle fitting on the upper edge of the side view profile image to obtain a third fitting circle, and performs circle fitting on the lower edge of the side view profile image to obtain a fourth fitting circle; Acquire the minor axis of the graph, the third fitting circle, and the fourth fitting circle, and determine a second upper radius of curvature and a second lower radius of curvature of the particle to be measured according to the minor axis of the graph, the third fitting circle, the fourth fitting circle, and the preset pixel length; The equivalent radius of curvature of the particle to be detected is determined according to the first upper radius of curvature, the first lower radius of curvature, the second upper radius of curvature and the second lower radius of curvature.

3. The method according to claim 2, wherein determining a first upper radius of curvature and a first lower radius of curvature of the particle to be detected according to the major axis of the graph, the first fitting circle, the second fitting circle and the preset pixel length comprises: Determine a first number of pixels of the major axis of the image, and determine a first pixel ratio according to the major axis length, the first number of pixels, and the preset pixel length: Wherein, k1 represents the first pixel ratio, a represents the major axis length, n1 represents the first pixel number, and l represents the preset pixel length; Determine a second pixel number of the radius of the first fitting circle, and determine a first upper curvature radius of the particle to be detected according to the first pixel ratio, the second pixel number and the preset pixel length: Among them, R u1 represents the first upper curvature radius, n2 represents the second number of pixels; Determine a third pixel number of the radius of the second fitting circle, and determine a first lower curvature radius of the particle to be detected according to the first pixel ratio, the third pixel number and the preset pixel length: Among them, R l1 represents the first lower curvature radius, and n3 represents the third number of pixels.

4. The method according to claim 2, wherein determining the second upper radius of curvature and the second lower radius of curvature of the particle to be detected according to the minor axis of the graph, the third fitting circle, the fourth fitting circle and the preset pixel length comprises: Determine a fourth number of pixels of the minor axis of the image, and determine a second pixel ratio according to the minor axis length, the fourth number of pixels and the preset pixel length; Wherein, k2 represents the second pixel ratio, b represents the minor axis length, and n4 represents the fourth pixel number; Determine the fifth pixel number of the radius of the third fitting circle, and determine the second upper curvature radius of the particle to be measured according to the second pixel ratio, the fifth pixel number and the preset pixel length: Among them, R u2 represents the second upper curvature radius, n5 represents the fifth number of pixels; Determine the sixth pixel number of the radius of the fourth fitting circle, and determine the second lower curvature radius of the particle to be measured according to the second pixel ratio, the sixth pixel number and the preset pixel length: Among them, R l2 represents the second lower curvature radius, and n6 represents the sixth number of pixels.

5. The method according to claim 2, wherein the equivalent radius of curvature comprises an upper equivalent radius of curvature and a lower equivalent radius of curvature, and the determining the equivalent radius of curvature of the particle to be tested according to the first upper radius of curvature, the first lower radius of curvature, the second upper radius of curvature and the second lower radius of curvature comprises: Determine the upper equivalent radius of curvature according to the first upper radius of curvature and the second upper radius of curvature: Among them, R u Represents the upper equivalent radius of curvature, R u1 represents the first upper curvature radius, R u2 represents the second upper curvature radius; The lower equivalent radius of curvature is determined according to the first lower radius of curvature and the second lower radius of curvature: Among them, R l represents the lower equivalent curvature radius, R l1 Represents the first lower curvature radius, R l2 Denotes the second lower curvature radius.

6. The method according to claim 5, wherein determining the reduced modulus of contact between the particle to be tested and the contact plate according to the equivalent radius of curvature, the total displacement, the load and preset parameters comprises: According to the load and the total displacement, the reduced modulus coefficient is determined: Among them, C represents the reduced modulus coefficient, F represents the load, and Δ represents the total displacement; The reduced modulus of contact between the particle to be tested and the contact plate is determined according to the upper equivalent radius of curvature, the lower equivalent radius of curvature, the reduced modulus coefficient and the preset parameters: Among them, E * Represents the reduced modulus of contact between the contacting plates.

7. The method according to claim 1, characterized in that Determining the Young's elastic modulus of the particle to be measured according to the reduced modulus, the Poisson's ratio of the particle to be measured, the Young's elastic modulus of the contact plate and the Poisson's ratio comprises: According to the reduced modulus, the Poisson's ratio of the particle to be measured, the Young's elastic modulus and the Poisson's ratio of the contact plate, the first modulus is determined: E1=E * E′×(1-v 2 ) Among them, E1 represents the first modulus, E * represents the reduced modulus of contact of the contact plate, E′ represents the Young's elastic modulus of the contact plate, v represents the Poisson's ratio of the particle to be tested, and v′ represents the Poisson's ratio of the contact plate; The second modulus is determined according to the reduced modulus, the Poisson's ratio of the particle to be measured, the Young's elastic modulus and the Poisson's ratio of the contact plate: E2=E′-E * (1-v′ 2 ) Wherein, E2 represents the second modulus; According to the first modulus and the second modulus, the Young's modulus of elasticity of the particle to be measured is determined: Wherein, E represents the Young's elastic modulus of the particles to be tested.

8. The method according to claim 1, characterized in that The contact plate is a sapphire substrate.

9. A device for measuring Young's elastic modulus of particles, characterized in that: The device comprises: A length measurement module, used to measure the length of the particle to be measured using a digital microscope to obtain the major axis length and minor axis length of the particle to be measured; A first determination module is used to photograph the particle to be tested using a digital microscope to obtain a front view contour image and a side view contour image of the particle to be tested, and determine the equivalent radius of curvature of the particle to be tested according to the major axis length, the minor axis length, the front view contour image, the side view contour image and a preset pixel length; A displacement and load acquisition module, used to acquire the total displacement obtained by the displacement sensor on the contact plate when the particle to be tested is vertically compressed by the contact plate using a data acquisition device, and to acquire the load applied to the particle to be tested measured by the load sensor using the data acquisition device, wherein the material of the contact plate is a high-hardness material; A second determination module is used to determine the reduced modulus of contact between the particle to be tested and the contact plate according to the equivalent radius of curvature, the total displacement, the load and preset parameters; The third determination module is used to determine the Young's elastic modulus of the particle to be measured according to the reduced modulus, the Poisson's ratio of the particle to be measured, the Young's elastic modulus of the contact plate and the Poisson's ratio.

10. An electronic device, characterized in that: Including processor and memory, The memory is used to store codes and related data; The processor is used to execute the code in the memory to implement the method for measuring the Young's elastic modulus of particles according to any one of claims 1 to 8.

11. A storage medium having a computer program stored thereon, wherein when the program is executed by a processor, the method for measuring the Young's elastic modulus of particles according to any one of claims 1 to 8 is implemented.

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