Heat dissipation device and portable electronic equipment

Abstract

The invention provides a heat dissipation device which is used for dissipating heat of portable electronic equipment, the heat dissipation device is arranged in an inner cavity of a shell of the portable electronic equipment, the heat dissipation device is close to the end of the shell, and the heat dissipation device comprises a fan and a radiator. The shell is provided with an air inlet hole directly facing the fan and an air outlet hole directly facing the radiator, the air inlet hole is close to the air outlet hole, and the air inlet hole and the air outlet hole are located on the same side of the shell; when the fan runs, outside air can be sucked to pass through the radiator from the air inlet hole, and the outside air is exhausted from the air outlet hole after exchanging heat with the radiator. The invention further provides the portable electronic equipment provided with the heat dissipation device.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation of electronic equipment, and in particular to a heat dissipation device and a portable electronic equipment provided with the heat dissipation device. Background Art

[0002] Existing portable electronic devices generally use passive heat dissipation such as graphite sheets or heat spreaders. As the power consumption of electronic devices such as chips in portable electronic devices increases, the power consumption of portable electronic devices continues to increase, and the existing passive heat dissipation effect is gradually insufficient, and the user experience deteriorates. In order to improve the passive heat dissipation effect, some portable electronic devices use micro fans for active air cooling. The active air cooling can drive the external cold air medium to take away the heat inside the portable electronic device, and has a good heat dissipation effect; however, the existing active heat dissipation device is generally arranged in the middle of the shell of the portable electronic device. The active heat dissipation device will occupy a large space in the middle of the shell, which not only affects the layout of other components, but also is not user-friendly to hold, affecting the user experience. Summary of the invention

[0003] The present application provides a heat dissipation device that occupies a relatively small space inside a housing, and a portable electronic device provided with the heat dissipation device.

[0004] The present application provides a heat dissipation device for dissipating heat for a portable electronic device. The heat dissipation device is arranged in the inner cavity of a shell of the portable electronic device, the heat dissipation device is close to the end of the shell, the heat dissipation device includes a fan and a radiator, the shell is provided with an air inlet hole facing the fan and an air outlet hole facing the radiator, the air inlet hole is close to the air outlet hole, and the air inlet hole and the air outlet hole are located on the same side of the shell; when the fan is in operation, it can draw outside air from the air inlet hole through the radiator, and the outside air is discharged from the air outlet hole after heat exchange with the radiator.

[0005] The present application also provides a portable electronic device, which includes a heat dissipation device and a shell, wherein the heat dissipation device is arranged in the inner cavity of the shell, the heat dissipation device is close to the end of the shell, the heat dissipation device includes a fan and a radiator, the shell is provided with an air inlet hole facing the fan and an air outlet hole facing the radiator, the air inlet hole is close to the air outlet hole, and the air inlet hole and the air outlet hole are located on the same side of the shell; the shell includes a middle frame and a back cover covering the middle frame, the middle frame includes a support plate and a frame surrounding the support plate, the heat dissipation device is arranged at the end of the support plate close to the frame, the air inlet hole is located at the back cover close to the frame, and the air outlet hole is located on the frame; when the fan is running, it can suck external air from the air inlet hole through the radiator, and the external air is discharged from the air outlet hole after heat exchange with the radiator.

[0006] The shell of the present invention is provided with an air inlet facing the fan and an air outlet facing the radiator. The air inlet is close to the air outlet and is located on the same side of the shell. The heat generated by the chip on the circuit board during operation is conducted to the radiator. The fan is operated to draw outside air into the radiator from the air inlet, and the outside air is discharged from the air outlet after heat exchange with the radiator. Since the air inlet and the air outlet are located on the same side of the same end of the portable electronic device, the outside air can be quickly discharged out of the shell after heat exchange with the radiator, thereby improving the heat dissipation efficiency of the heat dissipation device. Secondly, the heat dissipation device is arranged at the end of the inner cavity of the shell, and will not occupy the middle space of the shell, which is conducive to the layout of other components. The air inlet and the air outlet are located on the same side of the end of the shell, which can reduce the probability of closing the air inlet and the air outlet when the user holds the hand, which can not only enable the heat dissipation device to maintain a stable heat dissipation effect, but also be user-friendly and improve the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the implementation. Obviously, the drawings described below are some implementations of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0008] Figure 1 It is a schematic diagram of the three-dimensional structure of the portable electronic device in the first embodiment of the present application.

[0009] Figure 2 yes Figure 1 Schematic diagram of the internal structure of a portable electronic device.

[0010] Figure 3 yes Figure 2 Schematic diagram of the heat transfer link of the heat dissipation device of the portable electronic device.

[0011] Figure 4 yes Figure 2 A schematic diagram of a three-dimensional structure of a heat dissipation device in FIG.

[0012] Figure 5 yes Figure 4 A schematic diagram of the three-dimensional structure of the heat dissipation device from another perspective.

[0013] Figure 6 yes Figure 4 Schematic diagram of the three-dimensional structure decomposition of the heat dissipation device.

[0014] Figure 7 yes Figure 5 Schematic diagram of the three-dimensional structure decomposition of the heat dissipation device.

[0015] Figure 8 yes Figure 6 A further schematic diagram of the three-dimensional structural decomposition of the heat dissipation device.

[0016] Fig. 9 yes Figure 7 A further schematic diagram of the three-dimensional structural decomposition of the heat dissipation device.

[0017] Fig.10 yes Figure 4 One of the three-dimensional cross-sectional views of the heat dissipation device in FIG.

[0018] Fig.11 yes Fig.10 Cross-sectional view of the heat sink in FIG.

[0019] Fig.12 yes Figure 4 Another three-dimensional cross-sectional view of the heat dissipation device in FIG.

[0020] Fig.13 yes Fig.12 Cross-sectional view of the heat sink in FIG.

[0021] Fig.14 yes Figure 2 An enlarged view of the local structure of a portable electronic device.

[0022] Main markings:

[0023] 100. portable electronic device; 20. heat dissipation device; 22. fan; 24. heat sink; 242. heat dissipation frame; 2421. side piece; 2423. end piece; 244. heat dissipation fin; 245. heat dissipation channel; 25. heat conduction seat; 252. first heat conduction plate; 253. first heat conduction surface; 254. second heat conduction plate; 255. second heat conduction surface; 26. support frame; 262. positioning plate; 263. air guide groove; 264. first connecting portion; 2641. first supporting plate; 2643. first connecting plate; 2645. first connecting hole; 28. air guide cover; 282. top cover Plate; 2822, air inlet; 284, side plate; 285, end plate; 286, second connecting portion; 2862, second connecting hole; 287, accommodating space; 40, shell; 401, air inlet; 403, air outlet; 42, middle frame; 421, support plate; 423, frame; 4231, side wall; 4233, end wall; 424, second avoidance groove; 44, back cover; 443, decorative ring; 60, circuit board; 62, chip; 64, first avoidance groove; 70, thermal conductive component; 72, heat spreader; 74, thermal conductive sheet; 75, thermal conductive block; 76, thermal conductive layer; 80, display screen. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0025] In addition, the following descriptions of the various embodiments are made with reference to the attached drawings to illustrate specific embodiments that the present application may be implemented in. Directional terms mentioned in the present application, such as "upper", "lower", "front", "back", "left", "right", "inner", "outer", "side", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the present application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0026] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "set on..." should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0027] Please also read Figures 1 to 5 The portable electronic device 100 in the first embodiment of the present invention includes a heat dissipation device 20, a housing 40, a circuit board 60, a heat conducting component 70 and a display screen 80. The housing 40 is provided with an air inlet 401 and an air outlet 403. The air inlet 401 is close to the air outlet 403. The air inlet 401 and the air outlet 403 are located on the same side of the housing 40. The housing 40 includes a middle frame 42 and a back cover 44 covering the back of the middle frame 42. The middle frame 42 includes a support plate 421 and a frame 423 surrounding the support plate 421. The heat dissipation device 20 is used to dissipate heat for the portable electronic device 100. The heat dissipation device 20 is arranged inside the housing 40. cavity, and the heat dissipation device 20 is close to the end side of the shell 40; specifically, the heat dissipation device 20 is arranged at the end of the support plate 421 close to the frame 423; the heat dissipation device 20 includes a fan 22, a radiator 24, a heat conductive seat 25, a support frame 26 and an air guide cover 28, the air inlet of the fan 22 is directly opposite to the air inlet hole 401, and the radiator 24 is directly opposite to the air outlet hole 403. The heat generated by the chip on the circuit board 60 during operation is transferred to the radiator 24 through the heat conductive component 70. When the fan 22 is running, it can draw outside air from the air inlet hole 401 through the radiator 24, and the outside air is discharged from the air outlet hole 403 after heat exchange with the radiator 24.

[0028] It should be noted that the heat dissipation device 20 is installed on a portable electronic device, and the heat dissipation device 20 is used to dissipate heat for the portable electronic device. The portable electronic device may be, but is not limited to, a mobile phone, a tablet computer, a laptop computer, a smart watch, a VR head-mounted display, a smart wearable device, and the like. The "connection" in the description of the embodiment of the present invention includes both direct connection and indirect connection. For example, the connection between A and B includes direct connection between A and B or connection through a third element C or more other elements. The connection also includes two situations: an integrated connection and a non-integrated connection. An integrated connection means that A and B are formed and connected as one, and a non-integrated connection means that A and B are formed and connected as a non-integrated.

[0029] The shell 40 of the present invention is provided with an air inlet 401 facing the fan 22 and an air outlet 403 facing the radiator 24. The air inlet 401 is close to the air outlet 403. The heat generated by the chip on the circuit board 60 during operation is transferred to the radiator 24 through the heat conduction component 70. The fan 22 is operated to draw outside air into the radiator 24 from the air inlet 401. The outside air is discharged from the air outlet 403 after heat exchange with the radiator 24. Since the air inlet 401 and the air outlet 403 are located on the same side of the same end of the portable electronic device 100, the outside air can be quickly discharged from the shell 40 after heat exchange with the radiator 24, thereby improving the heat dissipation efficiency of the heat dissipation device 20; secondly, the heat dissipation device 20 is arranged at the end of the inner cavity of the shell 40, and will not occupy the middle space of the shell 40, which is beneficial to the layout of other components, and the air inlet 401 and the air outlet 403 are located on the same side of the end of the shell 40, which can reduce the probability of the user's hand closing the air inlet 401 and the air outlet 403, which can not only enable the heat dissipation device 20 to maintain a stable heat dissipation effect, but also be user-friendly to hold, thereby improving the user experience.

[0030] Optionally, the air outlet 403 is located at the frame 423, and the air inlet 401 is located at the back cover 44 near the frame 423. Specifically, the support plate 421 is a rectangular heat-conducting plate, and the frame 423 includes two opposite side walls 4231 and two opposite end walls 4233. The two side walls 4231 are arranged at opposite sides of the support plate 421, and the two end walls 4233 are arranged at opposite ends of the support plate 421. One side surface of the support plate 421 and the two side walls 4231 and the two end walls 4233 enclose a first receiving space, and the first receiving space is used to receive the circuit board 60, the heat dissipation device 20, the battery, etc.; the other opposite side surface of the support plate 421 and the two side walls 4231 and the two end walls 4233 enclose a second receiving space, and the second receiving space is used to receive the heat-conducting component 70, the display screen 80, etc. The air outlet 403 is disposed on the side wall 4231 and / or the end wall 4233 . In this embodiment, the air outlet 403 is disposed on one end of the side wall 4231 close to the heat dissipation device 20 .

[0031] In other embodiments, the heat sink 20 is disposed at the intersection of one of the side walls 4231 and one of the end walls 4233 in the inner cavity of the middle frame 42, and an air inlet 401 facing the fan 22 is provided at a corner of the back cover 44 near the heat sink 20, and an end of one of the side walls 4231 near the heat sink 20 and an end of one of the end walls 4233 near the heat sink 20 respectively have air outlets 403. Since the heat sink 20 is located at the corner of the middle frame 42, the space occupied in the middle of the middle frame 42 is further reduced, which is more conducive to the layout of the electronic components in the housing 40; secondly, the side wall 4231 and the end wall 4233 are respectively provided with air outlets 403, which can further improve the heat dissipation effect of the heat sink 20, and can prevent the user from closing the air outlets 403 on the side wall 4231 and the air outlets 403 on the end wall 4233 at the same time when holding the housing 40, so that the heat sink 20 can maintain a stable heat dissipation effect.

[0032] In other embodiments, the heat dissipation device 20 is disposed at one end of the inner cavity of the middle frame 42, the end of the back cover 44 close to the heat dissipation device 20 is provided with an air inlet 401, and the end wall 4233 close to the radiator 24 of the heat dissipation device 20 is provided with an air outlet 403. Since the air outlet 403 is located on the end wall 4233, when the user holds the housing 40, the hand will not close the air outlet 403 of the end wall 4233, so that the heat dissipation device 20 can maintain a stable heat dissipation effect.

[0033] In other embodiments, the heat dissipation device 20 is disposed on one of the side walls 4231 of the inner cavity of the middle frame 42 near the end, and the one of the side walls 4231 and the back cover 44 are both provided with air outlet holes 403 .

[0034] Optionally, a decorative ring 443 is provided on the back cover 44, the heat sink 20 is accommodated in the first receiving space of the middle frame 42 and faces the decorative ring 443, the air inlet 401 is provided on the decorative ring 443, and the side wall 4231 and / or the end wall 4233 of the housing 40 are provided with an air outlet 403 facing the heat sink 24. Specifically, the air inlet 401 can be provided on the front of the decorative ring 443, or on the side of the decorative ring 443.

[0035] like Figure 3As shown, the circuit board 60 is arranged on one side of the support plate 421, the chip 62 on the circuit board 60 is attached to the support plate 421, the heat-conducting component 70 is arranged on the other side of the support plate 421, the heat-conducting component 70 is connected between the support plate 421 and the heat dissipation device 20, and the heat generated by the operation of the chip 62 is transferred to the heat dissipation device 20 through the support plate 421 and the heat-conducting component 70. Specifically, the heat-conducting component 70 includes a heat spreader 72 and a heat conductive sheet 74, a heat conductive block 75 and a heat conductive layer 76 stacked on each other. The heat spreader 72 is attached to the side of the support plate 421, that is, the heat spreader 72 is attached to the surface of the support plate 421 facing away from the circuit board 60, the heat conductive sheet 74 is attached to the surface of the heat spreader 72 facing away from the support plate 421, and the display screen 80 is attached to the surface of the heat conductive sheet 74 facing away from the heat spreader 72; the heat conductive block 75 is clamped between the heat sink 20 and the heat spreader 72, and the heat conductive layer 76 is clamped between the chip 62 and the support plate 421; the heat generated by the operation of the chip 62 is sequentially transferred to the heat sink 24 of the heat sink 20 via the heat conductive layer 76, the support plate 421, the heat spreader 72, the heat conductive sheet 74 and the heat conductive block 75.

[0036] It can be understood that the chip 62 can be but not limited to a processor, a graphics processor, etc. The heat spreader 72 is used to disperse and conduct heat. The heat spreader 72 can be but not limited to a copper sheet or an aluminum sheet, etc. The thermal conductive sheet 74 is used to conduct heat from the heating element to the heat dissipation component to reduce the temperature of the electronic device and improve the heat dissipation performance of the electronic device. The thermal conductive sheet 74 can be but not limited to a graphite film, graphene, a carbon fiber thermal conductive pad, etc. The thermal block 75 is used to enhance the heat dissipation performance of the electronic device. The thermal block 75 can be but not limited to a metal block or graphite, etc. The thermal conductive layer 76 is used to enhance heat transfer. The thermal conductive layer 76 can be but not limited to a thermal conductive gel or a thermal conductive pad, etc.

[0037] In other embodiments, the thermal conductive sheet 74 is attached to the surface of the support plate 421 facing away from the circuit board 60, the heat spreader 72 is attached to the surface of the thermal conductive sheet 74 facing away from the support plate 421, the thermal block 75 is clamped between the heat sink 20 and the heat spreader 72, and the chip 62 of the circuit board 60 is connected to the surface of the support plate 421 facing away from the thermal conductive sheet 74 through the thermal conductive layer 76; the heat generated by the operation of the chip 62 is transferred to the radiator 24 of the heat sink 20 in sequence through the thermal conductive layer 76, the support plate 421, the thermal conductive sheet 74, the heat spreader 72 and the thermal block 75.

[0038] like Figure 3As shown, the circuit board 60 is provided with a first avoidance groove 64, the support plate 421 is provided with a second avoidance groove 424 facing the first avoidance groove 64, the heat sink 20 is accommodated in the first avoidance groove 64, and the heat conduction block 75 is accommodated in the second avoidance groove 424. Specifically, the first avoidance groove 64 is located on the side of the circuit board 60 close to the air outlet, the second avoidance groove 424 is located on the support plate 421 close to the air outlet, the heat sink 20 is accommodated and positioned in the first avoidance groove 64, the heat conduction block 75 is accommodated and positioned in the second avoidance groove 424, the opposite sides of the heat conduction block 75 are respectively exposed to the opposite sides of the support plate 421, one side of the heat conduction block 75 is attached to the heat conduction seat 25, and the other opposite side of the heat conduction block 75 is attached to the heat spreader 72.

[0039] like Figure 4-Figure 9 As shown, the heat sink 24 includes a heat dissipation frame 242 and a plurality of heat dissipation fins 244, and the plurality of heat dissipation fins 244 are positioned in the inner cavity of the heat dissipation frame 242 at intervals; each two adjacent heat dissipation fins 244 enclose a heat dissipation channel 245, and the heat dissipation channel 245 is connected to the air outlet; when the fan 22 is running, it draws outside air through the heat dissipation channel 245 and exchanges heat with the heat dissipation fins 244 before being discharged from the air outlet to the housing 40. In this embodiment, the heat dissipation fins 244 are rectangular heat dissipation fins, and the plurality of heat dissipation fins 244 are spaced apart and parallel to each other, and each two adjacent heat dissipation fins 244 enclose a rectangular heat dissipation channel 245.

[0040] In other embodiments, the heat sink fins may be but are not limited to arc-shaped heat sinks, wavy heat sinks, etc., and a plurality of heat sink fins are arranged at intervals from each other; each two adjacent arc-shaped heat sinks form an arc-shaped heat dissipation channel or a wavy heat dissipation channel.

[0041] In other embodiments, the radiator 24 includes at least two rows of heat dissipation fins, the two rows of heat dissipation fins are arranged along the length direction of the heat dissipation channel, each row of heat dissipation fins includes a plurality of heat dissipation fins spaced apart from each other, and each two adjacent heat dissipation fins form a heat dissipation channel, wherein the plurality of heat dissipation channels of one row of heat dissipation fins are respectively interconnected with the plurality of heat dissipation channels of another row of heat dissipation fins. Preferably, the plurality of heat dissipation channels of one row of heat dissipation fins are respectively offset from the plurality of heat dissipation channels of another row of heat dissipation fins, that is, the plurality of heat dissipation channels of one row of heat dissipation fins are respectively opposite to the plurality of heat dissipation channels of another row of heat dissipation fins.

[0042] The heat dissipation frame 242 includes two side pieces 2421 that are spaced apart from each other and two end pieces 2423 that are spaced apart from each other. The two end pieces 2423 are respectively connected to the opposite ends of the two side pieces 2421. The two side pieces 2421 and the two end pieces 2423 form a wind guide space. A plurality of heat dissipation fins 244 are accommodated in the wind guide space, and the opposite sides of each heat dissipation fin 244 are respectively connected to the two side pieces 2421.

[0043] The heat conducting seat 25 includes a first heat conducting plate 252 and a second heat conducting plate 254 arranged on the first heat conducting plate 252. The first heat conducting plate 252 has a first heat conducting surface 253 facing away from the second heat conducting plate 254, and the first heat conducting surface 253 is used to contact the heat conducting block; the second heat conducting plate 254 has a second heat conducting surface 255 facing away from the first heat conducting plate 252, and the second heat conducting surface 255 is used to fit with the heat sink 24.

[0044] The support frame 26 includes a positioning plate 262 and a first connecting portion 264, and the first connecting portion 264 is arranged on the positioning plate 262; in this embodiment, the positioning plate 262 is a rectangular plate, and the two first connecting portions 264 are arranged at intervals on opposite sides of one end of the positioning plate 262; the first connecting portion 264 includes a first supporting plate 2641 and a first connecting plate 2643, one end of the first supporting plate 2641 is connected to the positioning plate 262, and the first connecting plate 2643 is connected to the end of the first supporting plate 2641 away from the positioning plate 262; a first connecting hole 2645 is provided in the middle of the first connecting plate 2643.

[0045] The air guide cover 28 covers the fan 22 and the radiator 24. The air guide cover 28 is provided with an air inlet 2822 facing the fan 22. The air guide cover 28 has an air guide groove 263 between the fan 22 and the radiator 24. The air guide groove 263 is connected to the heat dissipation channel 245. Specifically, the air guide cover 28 includes a top cover plate 282, two side plates 284, an end plate 285 and a second connecting portion 286. The two side plates 284 are provided at opposite sides of the top cover plate 282. The end plate 285 is provided at one end of the top cover plate 282. The top cover plate 282, the two side plates 284 and the end plate 285 enclose a receiving space 287. In this embodiment, the top cover plate 282 is a rectangular plate, the two side plates 284 are respectively connected vertically to the opposite sides of the rectangular plate, the end plate 285 is connected vertically to one end of the rectangular plate, and the two second connecting parts 286 are arranged on the opposite sides of one end of the top cover plate 282; the top cover plate 282, the two side plates 284 and the end plate 285 surround a rectangular receiving space 287. In other embodiments, the top cover plate 282 can be but not limited to a circular plate, a trapezoidal plate, a polygonal plate or an irregular plate. The air inlet 2822 is located at one end of the top cover plate 282, and the air inlet 2822 is connected to the receiving space 287. The second connecting part 286 is a second connecting plate that is sunken toward one side of the receiving space 287, and a second connecting hole 2862 is provided on the second connecting plate.

[0046] Please also read Figure 4-Figure 13When assembling the heat dissipation device 20, the fan 22 is installed on one end of the positioning plate 262 close to the two first connecting parts 264, the radiator 24 is connected to the second heat-conducting surface 255 of the heat-conducting seat 25, the heat-conducting seat 25 and the radiator 24 are placed on one end of the support frame 26 away from the first connecting part 264, and the air guide cover 28 is covered on the support frame 26, so that the fan 22 and the radiator 24 are accommodated in the receiving space 287 of the air guide cover 28, the air inlet of the fan 22 is directly opposite to the air inlet 2822 of the air guide cover 28, and the two second connecting parts 286 are respectively connected to the two first connecting parts 264; specifically, the two first connecting plates 2643 are respectively attached to the two second connecting parts 286, so that The two second connection holes 2862 are respectively opposite to the two first connection holes 2645, and the two locking pieces pass through the two second connection holes 2862 and are locked in the two first connection holes 2645; the two side plates 284 are respectively connected to the opposite sides of the positioning plate 262, the end pieces 2423 at the opposite ends of the radiator 24 are respectively connected to the two side plates 284, and the two side plates 284 are respectively connected to the opposite ends of the heat conducting seat 25, the side pieces 2421 away from the heat conducting seat 25 are connected to the top cover plate 282, and the end plate 285 is connected to the end of the positioning plate 262; the air guide cover 28 has an air guide groove 263 between the fan 22 and the radiator 24, and the air guide groove 263 is connected to the heat dissipation channel 245. In this embodiment, the radiator 24 and the air guide cover 28 are connected by welding. In other embodiments, the radiator 24 and the air guide cover 28 can be made in one piece.

[0047] like Fig.12 and Fig.13 As shown, when the fan 22 is running, it can draw in outside air, so that the outside air enters the air guide groove 263 from the air inlet 2822 through the fan 22, and the outside air in the air guide groove 263 is discharged from the radiator 24 through the heat dissipation channel 245. In the process of the outside air passing through the radiator 24, the outside air exchanges heat with the radiator 24, which can improve the heat exchange efficiency of the heat dissipation device 20 and achieve a more efficient heat exchange function.

[0048] like Figure 1-Figure 3 and Fig.14As shown, when assembling the heat sink 20 and the heat-conducting component 70 to the middle frame 42, the circuit board 60 is installed in the first receiving space of the middle frame 42, so that the chip 62 is connected to the support plate 421 through the heat-conducting layer 76, and the first avoidance groove 64 is opposite to the second avoidance groove 424; the heat spreader 72 is attached to the surface of the support plate 421 away from the chip 62, and the heat-conducting sheet 74 is attached to the surface of the heat spreader 72 away from the support plate 421; the heat-conducting block 75 is positioned in the second avoidance groove 424, so that one side of the heat-conducting block 75 is attached to the heat spreader 72; the heat sink 20 is positioned in the first avoidance groove 64, so that the first heat-conducting surface 253 of the heat-conducting seat 25 of the heat sink 20 is attached to the heat-conducting block 75. The back cover 44 is covered on the back of the middle frame 42 so that the air inlet 401 of the decorative ring 443 faces the fan 22 of the heat dissipation device 20 , and the back of the display screen 80 is attached to the surface of the heat conductive sheet 74 facing away from the support plate 421 .

[0049] When the portable electronic device 100 is working, the heat generated by the chip 62 is transferred to the radiator 24 in sequence through the heat-conducting layer 76, the support plate 421, the heat spreader 72, the heat-conducting sheet 74 and the heat-conducting block 75; at the same time, when the fan 22 is running, it draws outside air through the heat dissipation channel 245 of the radiator 24 and exchanges heat with the heat dissipation fins 244 before being discharged from the housing 40 through the air outlet 403 to dissipate most of the heat generated by the chip 62, and a small part of the heat generated by the chip 62 is dissipated through the display screen 80.

[0050] The heat dissipation device 20 of the portable electronic device 100 of the present application is arranged at one end of the inner cavity of the shell 40, the air inlet 401 is arranged on the decorative ring 443 of the back cover 44, and the air outlet 403 is located on the side wall 4231 close to the decorative ring 443; the fan 22 operates to draw external air from the air inlet 401 through the radiator 24 and then discharges it from the air outlet 403 after heat exchange with the radiator 24, thereby improving the heat dissipation efficiency of the portable electronic device 100; secondly, it avoids the heat dissipation device 20 occupying the middle space of the shell 40, which is beneficial to the layout of components such as circuit boards and batteries; in addition, the air inlet 401 and the air outlet 403 are located on the same side of the end of the shell 40, which can reduce the probability of the air inlet 401 and the air outlet 403 being closed when the user holds the shell, which can not only enable the heat dissipation device 20 to maintain a stable heat dissipation effect, but also be user-friendly to hold, thereby improving the user experience.

[0051] In other embodiments, the heat conducting block 75 of the heat conducting assembly 70 can be omitted, so that the heat conducting seat 25 of the heat dissipation device 20 is attached to the heat spreader 72 or the heat conducting sheet 74 on the side facing away from the heat sink 24, that is, the second heat conducting surface 255 of the heat conducting seat 25 is directly attached to the heat spreader 72 or the heat conducting sheet 74. Since the heat conducting block 75 is omitted, not only the manufacturing cost is saved, but also the path for the heat generated by the operation of the chip 62 to be conducted to the heat sink 24 is shortened, and the heat dissipation is further accelerated, thereby improving the thermal efficiency.

[0052] In other embodiments, the heat conducting base 25 of the heat dissipation device 20 can be omitted, so that the heat sink 24 is directly attached to the heat conducting block 75. Since the heat conducting base 25 is omitted, not only the manufacturing cost is saved, but also the path for the heat generated by the operation of the chip 62 to be conducted to the heat sink 24 is shortened, and the heat dissipation is further accelerated to improve the thermal efficiency.

[0053] In other embodiments, the heat conducting block 75 of the heat conducting assembly 70 and the heat conducting seat 25 of the heat dissipation device 20 can be omitted, so that the heat sink 24 is directly attached to the heat spreader 72 or the heat conducting sheet 74, that is, the heat dissipation frame 242 of the heat sink 24 is directly attached to the heat spreader 72 or the heat conducting sheet 74. Since the heat conducting seat 25 and the heat conducting block 75 are omitted, not only the manufacturing cost is further saved, but also the path for the heat generated by the operation of the chip 62 to be conducted to the heat sink 24 is further shortened, the heat dissipation is further accelerated, and the thermal efficiency is improved.

[0054] The above is an implementation of the embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the embodiment of the present invention. These improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A heat dissipation device for dissipating heat for a portable electronic device, characterized in that: The heat dissipation device is arranged in the inner cavity of the shell of the portable electronic device, the heat dissipation device is close to the end of the shell, the heat dissipation device includes a fan and a radiator, the shell is provided with an air inlet hole facing the fan and an air outlet hole facing the radiator, the air inlet hole is close to the air outlet hole, and the air inlet hole and the air outlet hole are located on the same side of the shell; when the fan is running, it can suck outside air from the air inlet hole through the radiator, and the outside air is discharged from the air outlet hole after heat exchange with the radiator.

2. The heat dissipation device according to claim 1, characterized in that: The air outlet is located on the frame of the shell, and the air inlet is located on the back cover of the shell close to the frame.

3. The heat dissipation device according to claim 2, characterized in that: The frame includes a side wall and an end wall, the air outlet is arranged on the side wall and / or the end wall, a decorative ring is arranged on the back cover, and the air inlet is arranged on the decorative ring.

4. The heat dissipation device according to claim 1, characterized in that: The radiator comprises a heat dissipation outer frame and a plurality of heat dissipation fins. The plurality of heat dissipation fins are positioned in an inner cavity of the heat dissipation outer frame at intervals. Every two adjacent heat dissipation fins form a heat dissipation channel, and the heat dissipation channel is connected to the air outlet.

5. The heat dissipation device according to claim 4, characterized in that: The heat dissipation device also includes an air guide cover, which covers the fan and the radiator. The air guide cover is provided with an air inlet facing the fan. The air guide cover has air guide grooves between the fan and the radiator, and the air guide grooves are connected to the heat dissipation channel.

6. A portable electronic device, characterized in that: The portable electronic device comprises a heat dissipation device and a shell as described in any one of claims 1 to 5, the shell comprises a middle frame and a back cover covering the middle frame, the middle frame comprises a support plate and a frame surrounding the support plate, the heat dissipation device is arranged at the end of the support plate close to the frame, the air inlet is located on the back cover close to the frame, and the air outlet is located on the frame.

7. The portable electronic device according to claim 6, characterized in that: The portable electronic device also includes a circuit board and a heat-conducting component. The circuit board is arranged on one side of the support plate, and the chip on the circuit board is attached to the support plate; the heat-conducting component is arranged on the other side of the support plate, and the heat-conducting component is connected between the support plate and the heat dissipation device. The heat generated by the operation of the chip is conducted to the heat dissipation device via the support plate and the heat-conducting component.

8. The portable electronic device according to claim 7, characterized in that: The heat conducting assembly includes a heat spreader and a heat conducting sheet stacked on each other, the heat spreader is attached to the side surface of the support plate; or the heat conducting sheet is attached to the side surface of the support plate.

9. The portable electronic device according to claim 8, characterized in that: The heat-conducting assembly further includes a heat-conducting block and a heat-conducting layer. The heat-conducting block is clamped between the heat sink and the heat spreader, and the heat-conducting layer is clamped between the chip and the support plate.

10. The portable electronic device according to claim 7, characterized in that: The circuit board is provided with a first avoidance groove, the support plate is provided with a second avoidance groove facing the first avoidance groove, the heat dissipation device is accommodated in the first avoidance groove, and the heat conduction block is accommodated in the second avoidance groove.

Images