Intelligent dynamic thermal management system and method based on heat dissipation structure of notebook equipment

Abstract

The invention discloses an intelligent dynamic thermal management system and method based on a heat dissipation structure of notebook equipment, relates to the technical field of heat dissipation of electronic equipment, and aims to solve the problems that the heat dissipation structure at present is difficult to meet the heat dissipation requirement of the notebook and cannot perform dynamic thermal management. The temperature sensor is used for monitoring the real-time temperature of a chip of a heating component in the notebook equipment; the intelligent thermal management chip with a built-in analysis algorithm is used for acquiring the current thermal load of the notebook equipment and the real-time temperature of a chip of a heating component in the notebook equipment, and performing intelligent analysis through the analysis algorithm, so as to automatically adjust the fan operation mode of the heat dissipation structure; a double-air-outlet turbofan heat dissipation structure arranged in the notebook computer equipment is used for rapidly taking away heat around a heating assembly in the notebook computer equipment. The heat dissipation problem of the notebook computer equipment can be solved, intelligent dynamic heat management is carried out on the notebook computer equipment, and the heat dissipation efficiency is remarkably improved.

Description

Technical Field

[0001] The present invention relates to the technical field of heat dissipation of electronic equipment, and in particular to an intelligent dynamic heat management system and method based on the heat dissipation structure of notebook equipment. Background Art

[0002] With the popularity of high-performance mobile computing devices such as gaming notebooks and workstations, the heat dissipation problem of high-power components (such as CPU, GPU and NPU) in a small space has become increasingly prominent. Currently, most notebooks use a single-fan cooling system with limited air volume, which makes it difficult to ensure sufficient cooling for multiple heat sources. A single fan is not enough to cope with the simultaneous high-load operation of the CPU and GPU, which causes the CPU and GPU to overheat and significantly reduce performance. In addition, in order to achieve the necessary heat dissipation effect, a single fan must run at high speed, which will generate a lot of noise. Therefore, a single fan is difficult to meet the needs of efficient and silent cooling, especially in intensive computing or long-term use scenarios. Overheating may cause system performance degradation, shortened life, and even hardware damage.

[0003] To ensure high performance and reliability of the device, heat dissipation design usually needs to consider redundancy. However, without intelligent thermal management analysis, the system may still let the fan run at high speed when high-intensity heat dissipation is not required, resulting in excessive noise and affecting the user experience. Therefore, notebook devices need to be equipped with a precise thermal management system to monitor and control internal temperature, ensure that key components remain within a safe operating temperature range, and dynamically adjust the heat dissipation strategy according to the current load conditions. Summary of the invention

[0004] In view of the problem that a single fan is currently unable to meet the heat dissipation requirements of high-performance notebooks and that dynamic thermal management cannot be performed, the present invention provides an intelligent dynamic thermal management system and method based on the heat dissipation structure of notebook devices. The present invention aims to solve the heat dissipation problem of high heat flux density notebooks through an efficient heat dissipation structure, and perform intelligent dynamic thermal management on the notebooks, thereby significantly improving the heat dissipation efficiency and reducing noise, thereby extending the service life of the equipment.

[0005] In the first aspect, the present invention provides an intelligent dynamic thermal management system based on the heat dissipation structure of a notebook device. The technical solution adopted to solve the above technical problems is as follows:

[0006] An intelligent dynamic thermal management system based on the heat dissipation structure of a notebook device, the structure of which includes:

[0007] The temperature sensor installed inside the notebook device is used to monitor the real-time temperature of the chip of the heat generating component in the notebook device;

[0008] An intelligent thermal management chip with built-in analysis algorithm is used to obtain the current thermal load of the notebook device and the real-time temperature of the chip of the heat-generating component in the notebook device, and perform intelligent analysis through the analysis algorithm to automatically adjust the fan operation mode of the dual-outlet turbo fan cooling structure;

[0009] The dual-air turbofan heat dissipation structure arranged inside the notebook device is used to quickly remove the heat around the heat-generating components in the notebook device.

[0010] Optionally, the intelligent thermal management chip involved includes the following two stages:

[0011] Pre-preparation stage: ① Given the power consumption of the chip of each heat-generating component in the notebook device, the intelligent thermal management chip completes the following tasks: first, the power consumption of the chips of all heat-generating components in the notebook device is summarized to obtain the total power consumption, and then the law of conservation of energy is used to calculate the air volume required to maintain the notebook device running at a safe temperature, and based on this, the dual-outlet turbo fan is selected, and then the thermal resistance analysis method is used to evaluate the heat transfer efficiency from each heat-generating component to the external environment, so as to determine how much surface area each heat-generating component needs for effective heat dissipation; ② Considering the air volume required to maintain the notebook device running at a safe temperature, the historical heat load of the notebook device, and the corresponding chip temperature of the heat-generating component in the notebook device, the intelligent thermal management chip is pre-configured with fan operation modes that meet different heat dissipation requirements; ③ Considering the space for installing the heat dissipation structure inside the notebook device and the size of the selected dual-outlet turbo fan, a dual-outlet turbo fan heat dissipation structure that meets the installation space and air outlet requirements is designed and installed inside the notebook device; ④ The dual-outlet turbo fan heat dissipation structure is powered by a USB interface or a dedicated connector, and is connected to the intelligent thermal management chip integrated on the notebook motherboard to achieve data exchange and control;

[0012] Automatic adjustment stage: The intelligent thermal management chip obtains the current thermal load of the notebook and the chip temperature of the heat-generating component itself, performs intelligent analysis through an analysis algorithm, and then dynamically adjusts the fan operation mode according to the analysis results to meet the heat dissipation needs of the notebook device.

[0013] Optionally, the fan operation modes involved include power saving mode, quiet mode, game mode and performance mode, where:

[0014] Monitor the current heat load of the notebook and the temperature of the chip of the heat generating component itself, and adopt the power saving mode when the current heat load of the notebook and the temperature of the chip of the heat generating component itself meet the heat dissipation requirement A; the heat dissipation requirement A is that the current heat load of the notebook is lower than the threshold a1, and the temperature of the chip of the heat generating component itself is lower than the threshold a2;

[0015] Monitor the current heat load of the notebook and the temperature of the chip of the heat generating component itself, and adopt the quiet mode when the current heat load of the notebook and the temperature of the chip of the heat generating component itself meet the heat dissipation requirement B; the heat dissipation requirement B is that the current heat load of the notebook is higher than the threshold a1 and lower than the threshold b1, and the temperature of the chip of the heat generating component itself is higher than the threshold a2 and lower than the threshold b2;

[0016] Monitor the current heat load of the notebook and the temperature of the chip of the heat generating component itself, and adopt the game mode when the current heat load of the notebook and the temperature of the chip of the heat generating component itself meet the heat dissipation requirement C; the heat dissipation requirement C is that the current heat load of the notebook is higher than the threshold b1 and lower than the threshold c1, and the temperature of the chip of the heat generating component itself is higher than the threshold b2 and lower than the threshold c2;

[0017] Monitor the current heat load of the notebook and the temperature of the chip of the heat-generating component itself, and adopt the game mode when the current heat load of the notebook and the temperature of the chip of the heat-generating component itself meet the heat dissipation requirement D; the heat dissipation requirement D is that the current heat load of the notebook is higher than the threshold value c1, and the temperature of the chip of the heat-generating component itself is higher than the threshold value c2.

[0018] Optionally, the dual-outlet turbofan heat dissipation structure involved includes a heat dissipation substrate, a heat pipe, heat dissipation fins and a dual-outlet turbofan, wherein the heat dissipation substrate is attached to the heat generating component of the notebook device, and the heat generated by the chip of the heat generating component itself is conducted to the heat pipe by direct contact; one end of the heat pipe is fixedly connected to the heat dissipation substrate, and the other end is fixedly connected to the heat dissipation fin, thereby forming a heat conduction path, and utilizing the phase change principle to quickly transfer heat; the heat dissipation fin is a structure with multiple thin metal sheets, which is used to dissipate the heat conducted by the heat pipe into the air; the dual-outlet turbofan has an air inlet and two air outlets, and the dual-outlet turbofan is arranged on one side of the heat dissipation fin, and the air inlet of the dual-outlet turbofan is opposite to the heat dissipation fin, which is used to quickly take away the heat around the heat dissipation fin.

[0019] Preferably, the notebook device involved has two sets of dual-outlet turbofan cooling structures, which are arranged on the left and right sides of the notebook device, and both include a cooling substrate, a heat pipe, cooling fins and a dual-outlet turbofan. The cooling substrate of one set of the dual-outlet turbofan cooling structures is a copper substrate, which is directly bonded to the CPU and GPU, the heat generating components of the notebook device; the cooling substrate of the other set of the dual-outlet turbofan cooling structures is an NPU copper substrate, which is directly bonded to the NPU, the heat generating component of the notebook device.

[0020] In the second aspect, the present invention provides an intelligent dynamic thermal management method based on the heat dissipation structure of a notebook device. The technical solution adopted to solve the above technical problems is as follows:

[0021] An intelligent dynamic thermal management method based on a notebook device heat dissipation structure comprises the following steps:

[0022] S1. Design an intelligent thermal management chip to complete the following tasks: ① When the power consumption of each heat-generating component chip in the notebook device is known, first summarize the power consumption of all heat-generating component chips in the notebook device to obtain the total power consumption, then use the law of conservation of energy to calculate the air volume required to maintain the notebook device running at a safe temperature, and use this as a basis to select a dual-air turbo fan, and then use the thermal resistance analysis method to evaluate the heat transfer efficiency from each heat-generating component to the external environment, so as to determine how much surface area each heat-generating component needs for effective heat dissipation; ② Considering the air volume required to maintain the notebook device running at a safe temperature, the historical heat load of the notebook device and the corresponding chip temperature of the heat-generating component in the notebook device, pre-configure the fan operation mode that meets different heat dissipation requirements in the intelligent thermal management chip;

[0023] S2. Considering the space for installing the heat dissipation structure inside the notebook device and the size of the selected dual-air turbo fan, a dual-air turbo fan heat dissipation structure is designed to meet the installation space and air outlet requirements;

[0024] S3. Install a temperature sensor, an intelligent thermal management chip, and a dual-air turbofan cooling structure at a designated location inside the notebook device. The dual-air turbofan cooling structure is powered by a USB interface or a dedicated connector and is connected to the intelligent thermal management chip integrated on the notebook motherboard to achieve data exchange and control, so that the intelligent thermal management chip can adjust the fan operation mode according to the analysis result of the analysis algorithm;

[0025] S4. The temperature sensor monitors the real-time temperature of the chip of the heat-generating component in the notebook device. The intelligent thermal management chip obtains the current heat load of the notebook device and the real-time temperature of the chip of the heat-generating component in the notebook device. The intelligent analysis is performed through the analysis algorithm, so as to automatically adjust the fan operation mode of the dual-outlet turbo fan cooling structure according to the analysis result. The air-outlet turbo fan cooling structure works based on the adjusted fan operation mode to quickly take away the heat around the heat-generating components in the notebook device.

[0026] Optionally, the fan operation modes involved include power saving mode, quiet mode, game mode and performance mode, where:

[0027] Monitor the current heat load of the notebook and the temperature of the chip of the heat generating component itself, and adopt the power saving mode when the current heat load of the notebook and the temperature of the chip of the heat generating component itself meet the heat dissipation requirement A; the heat dissipation requirement A is that the current heat load of the notebook is lower than the threshold a1, and the temperature of the chip of the heat generating component itself is lower than the threshold a2;

[0028] Monitor the current heat load of the notebook and the temperature of the chip of the heat generating component itself, and adopt the quiet mode when the current heat load of the notebook and the temperature of the chip of the heat generating component itself meet the heat dissipation requirement B; the heat dissipation requirement B is that the current heat load of the notebook is higher than the threshold a1 and lower than the threshold b1, and the temperature of the chip of the heat generating component itself is higher than the threshold a2 and lower than the threshold b2;

[0029] Monitor the current heat load of the notebook and the temperature of the chip of the heat generating component itself, and adopt the game mode when the current heat load of the notebook and the temperature of the chip of the heat generating component itself meet the heat dissipation requirement C; the heat dissipation requirement C is that the current heat load of the notebook is higher than the threshold b1 and lower than the threshold c1, and the temperature of the chip of the heat generating component itself is higher than the threshold b2 and lower than the threshold c2;

[0030] Monitor the current heat load of the notebook and the temperature of the chip of the heat-generating component itself, and adopt the game mode when the current heat load of the notebook and the temperature of the chip of the heat-generating component itself meet the heat dissipation requirement D; the heat dissipation requirement D is that the current heat load of the notebook is higher than the threshold value c1, and the temperature of the chip of the heat-generating component itself is higher than the threshold value c2.

[0031] Optionally, the dual-outlet turbofan heat dissipation structure involved includes a heat dissipation substrate, a heat pipe, heat dissipation fins and a dual-outlet turbofan, wherein the heat dissipation substrate is attached to the heat generating component of the notebook device, and the heat generated by the chip of the heat generating component itself is conducted to the heat pipe by direct contact; one end of the heat pipe is fixedly connected to the heat dissipation substrate, and the other end is fixedly connected to the heat dissipation fin, thereby forming a heat conduction path, and utilizing the phase change principle to quickly transfer heat; the heat dissipation fin is a structure with multiple thin metal sheets, which is used to dissipate the heat conducted by the heat pipe into the air; the dual-outlet turbofan has an air inlet and two air outlets, and the dual-outlet turbofan is arranged on one side of the heat dissipation fin, and the air inlet of the dual-outlet turbofan is opposite to the heat dissipation fin, which is used to quickly take away the heat around the heat dissipation fin.

[0032] Preferably, the notebook device involved has two sets of dual-outlet turbofan cooling structures, which are arranged on the left and right sides of the notebook device, and both include a cooling substrate, a heat pipe, cooling fins and a dual-outlet turbofan. The cooling substrate of one set of the dual-outlet turbofan cooling structures is a copper substrate, which is directly bonded to the CPU and GPU, the heat generating components of the notebook device; the cooling substrate of the other set of the dual-outlet turbofan cooling structures is an NPU copper substrate, which is directly bonded to the NPU, the heat generating component of the notebook device.

[0033] The intelligent dynamic thermal management system and method based on the heat dissipation structure of a notebook device of the present invention has the following beneficial effects compared with the prior art:

[0034] (1) The present invention aims to solve the heat dissipation problem of notebook computers with high heat flux density through an efficient heat dissipation structure and to perform intelligent dynamic thermal management on the notebook computer, which can significantly improve the heat dissipation efficiency and reduce noise, thereby extending the service life of the notebook device;

[0035] (2) The dual-air turbofan heat dissipation structure of the present invention provides a solution for heat dissipation of notebook computers with high heat flux density in a narrow space, greatly improving the heat dissipation efficiency and the working reliability of the notebook equipment;

[0036] (3) The intelligent thermal management chip of the present invention can dynamically adjust the fan speed according to the acquired data, thereby effectively controlling the noise level while ensuring the heat dissipation efficiency, extending the service life of the notebook device and improving the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Attached Figure 1 This is a flowchart of the implementation of the first embodiment of the present invention. DETAILED DESCRIPTION

[0038] In order to make the technical solution, the technical problem solved and the technical effect of the present invention more clearly understood, the technical solution of the present invention is clearly and completely described below in conjunction with specific embodiments.

[0039] Embodiment 1:

[0040] Combined with Figure 1 This embodiment proposes an intelligent dynamic thermal management system based on the heat dissipation structure of a notebook device, and its structure includes:

[0041] The temperature sensor installed inside the notebook device is used to monitor the real-time temperature of the chip of the heat generating component in the notebook device;

[0042] An intelligent thermal management chip with built-in analysis algorithm is used to obtain the current thermal load of the notebook device and the real-time temperature of the chip of the heat-generating component in the notebook device, and perform intelligent analysis through the analysis algorithm to automatically adjust the fan operation mode of the dual-outlet turbo fan cooling structure;

[0043] The dual-air turbofan heat dissipation structure arranged inside the notebook device is used to quickly remove the heat around the heat-generating components in the notebook device.

[0044] The intelligent thermal management chip involved in this embodiment includes the following two stages:

[0045] Pre-preparation stage: ① Given the power consumption of the chip of each heat-generating component in the notebook device, the intelligent thermal management chip completes the following tasks: first, the power consumption of the chips of all heat-generating components in the notebook device is summarized to obtain the total power consumption, and then the law of conservation of energy is used to calculate the air volume required to maintain the notebook device running at a safe temperature, and based on this, the dual-outlet turbo fan is selected, and then the thermal resistance analysis method is used to evaluate the heat transfer efficiency from each heat-generating component to the external environment, so as to determine how much surface area each heat-generating component needs for effective heat dissipation; ② Considering the air volume required to maintain the notebook device running at a safe temperature, the historical heat load of the notebook device, and the corresponding chip temperature of the heat-generating component in the notebook device, the intelligent thermal management chip is pre-configured with fan operation modes that meet different heat dissipation requirements; ③ Considering the space for installing the heat dissipation structure inside the notebook device and the size of the selected dual-outlet turbo fan, a dual-outlet turbo fan heat dissipation structure that meets the installation space and air outlet requirements is designed and installed inside the notebook device; ④ The dual-outlet turbo fan heat dissipation structure is powered by a USB interface or a dedicated connector, and is connected to the intelligent thermal management chip integrated on the notebook motherboard to achieve data exchange and control;

[0046] Automatic adjustment stage: The intelligent thermal management chip obtains the current thermal load of the notebook and the chip temperature of the heat-generating component itself, performs intelligent analysis through an analysis algorithm, and then dynamically adjusts the fan operation mode according to the analysis results to meet the heat dissipation needs of the notebook device.

[0047] In the pre-preparation stage, the pre-configured fan operating modes include power saving mode, quiet mode, gaming mode and performance mode, where:

[0048] Monitor the current heat load of the notebook and the temperature of the chip of the heat generating component itself, and adopt the power saving mode when the current heat load of the notebook and the temperature of the chip of the heat generating component itself meet the heat dissipation requirement A; the heat dissipation requirement A is that the current heat load of the notebook is lower than the threshold a1, and the temperature of the chip of the heat generating component itself is lower than the threshold a2;

[0049] Monitor the current heat load of the notebook and the temperature of the chip of the heat generating component itself, and adopt the quiet mode when the current heat load of the notebook and the temperature of the chip of the heat generating component itself meet the heat dissipation requirement B; the heat dissipation requirement B is that the current heat load of the notebook is higher than the threshold a1 and lower than the threshold b1, and the temperature of the chip of the heat generating component itself is higher than the threshold a2 and lower than the threshold b2;

[0050] Monitor the current heat load of the notebook and the temperature of the chip of the heat generating component itself, and adopt the game mode when the current heat load of the notebook and the temperature of the chip of the heat generating component itself meet the heat dissipation requirement C; the heat dissipation requirement C is that the current heat load of the notebook is higher than the threshold b1 and lower than the threshold c1, and the temperature of the chip of the heat generating component itself is higher than the threshold b2 and lower than the threshold c2;

[0051] Monitor the current heat load of the notebook and the temperature of the chip of the heat-generating component itself, and adopt the game mode when the current heat load of the notebook and the temperature of the chip of the heat-generating component itself meet the heat dissipation requirement D; the heat dissipation requirement D is that the current heat load of the notebook is higher than the threshold value c1, and the temperature of the chip of the heat-generating component itself is higher than the threshold value c2.

[0052] It should be added that, in actual use, the actual value of each threshold can be customized according to the heat dissipation requirements.

[0053] The dual-outlet turbofan heat dissipation structure involved in this embodiment adopts the existing structure, specifically including a heat dissipation substrate, a heat pipe, heat dissipation fins and a dual-outlet turbofan, wherein the heat dissipation substrate is attached to the heat generating component of the notebook device, and the heat generated by the chip of the heat generating component itself is conducted to the heat pipe through direct contact; one end of the heat pipe is fixedly connected to the heat dissipation substrate, and the other end is fixedly connected to the heat dissipation fin, thereby forming a heat conduction path, and the heat is quickly transferred by using the phase change principle; the heat dissipation fin is a structure with multiple thin metal sheets, which is used to dissipate the heat conducted by the heat pipe into the air; the dual-outlet turbofan has an air inlet and two air outlets, and the dual-outlet turbofan is arranged on one side of the heat dissipation fin, and the air inlet of the dual-outlet turbofan is directly opposite to the heat dissipation fin, which is used to quickly take away the heat around the heat dissipation fin.

[0054] In order to better meet the heat dissipation requirements, the notebook device involved has two sets of dual-outlet turbofan heat dissipation structures, which are arranged on the left and right sides of the notebook device, and both include a heat dissipation substrate, heat pipes, heat dissipation fins and dual-outlet turbofans. The heat dissipation substrate of one set of dual-outlet turbofan heat dissipation structures is a copper substrate, which is directly bonded to the heat-generating components CPU and GPU of the notebook device; the heat dissipation substrate of the other set of dual-outlet turbofan heat dissipation structures is an NPU copper substrate, which is directly bonded to the heat-generating component NPU of the notebook device.

[0055] Embodiment 2:

[0056] Combined with Figure 1 This embodiment proposes an intelligent dynamic thermal management method based on the heat dissipation structure of a notebook device, comprising the following steps:

[0057] S1. Design an intelligent thermal management chip to complete the following tasks: ① When the power consumption of each heat-generating component chip in the notebook device is known, first summarize the power consumption of all heat-generating component chips in the notebook device to obtain the total power consumption, and then use the law of conservation of energy to calculate the air volume required to maintain the notebook device running at a safe temperature, and use this as a basis for selecting a dual-outlet turbo fan, and then use the thermal resistance analysis method to evaluate the heat transfer efficiency from each heat-generating component to the external environment, so as to determine how much surface area each heat-generating component needs for effective heat dissipation; ② Considering the air volume required to maintain the notebook device running at a safe temperature, the historical heat load of the notebook device and the corresponding chip temperature of the heat-generating component in the notebook device, pre-configure fan operation modes that meet different heat dissipation requirements in the intelligent thermal management chip.

[0058] The fan operating modes include power saving mode, quiet mode, gaming mode and performance mode, where:

[0059] (i) monitoring the current heat load of the notebook and the temperature of the chip of the heat generating component itself, and adopting the power saving mode when the current heat load of the notebook and the temperature of the chip of the heat generating component itself meet the heat dissipation requirement A; the heat dissipation requirement A is that the current heat load of the notebook is lower than the threshold a1 and the temperature of the chip of the heat generating component itself is lower than the threshold a2;

[0060] (ii) monitoring the current heat load of the notebook and the temperature of the chip of the heat generating component itself, and adopting the quiet mode when the current heat load of the notebook and the temperature of the chip of the heat generating component itself meet the heat dissipation requirement B; the heat dissipation requirement B is that the current heat load of the notebook is higher than the threshold a1 and lower than the threshold b1, and the temperature of the chip of the heat generating component itself is higher than the threshold a2 and lower than the threshold b2;

[0061] (iii) monitoring the current heat load of the notebook and the temperature of the chip of the heat generating component itself, and adopting the gaming mode when the current heat load of the notebook and the temperature of the chip of the heat generating component itself meet the heat dissipation requirement C; the heat dissipation requirement C is that the current heat load of the notebook is higher than the threshold b1 and lower than the threshold c1, and the temperature of the chip of the heat generating component itself is higher than the threshold b2 and lower than the threshold c2;

[0062] (iv) Monitor the current heat load of the notebook and the temperature of the chip of the heat-generating component itself, and adopt the game mode when the current heat load of the notebook and the temperature of the chip of the heat-generating component itself meet the heat dissipation requirement D; the heat dissipation requirement D is that the current heat load of the notebook is higher than the threshold value c1, and the temperature of the chip of the heat-generating component itself is higher than the threshold value c2.

[0063] S2. Considering the space for installing the heat dissipation structure inside the notebook device and the size of the selected dual-air turbo fan, a dual-air turbo fan heat dissipation structure is designed that meets the installation space and air outlet requirements.

[0064] The dual-outlet turbofan heat dissipation structure involved includes a heat dissipation substrate, a heat pipe, heat dissipation fins and a dual-outlet turbofan, wherein the heat dissipation substrate is attached to the heat generating component of the notebook device, and the heat generated by the chip of the heat generating component itself is conducted to the heat pipe through direct contact; one end of the heat pipe is fixedly connected to the heat dissipation substrate, and the other end is fixedly connected to the heat dissipation fin, thereby forming a heat conduction path, and utilizing the phase change principle to quickly transfer heat; the heat dissipation fin is a structure with multiple thin metal sheets, which is used to dissipate the heat conducted by the heat pipe into the air; the dual-outlet turbofan has an air inlet and two air outlets, and the dual-outlet turbofan is arranged on one side of the heat dissipation fin, and the air inlet of the dual-outlet turbofan is directly opposite to the heat dissipation fin, which is used to quickly take away the heat around the heat dissipation fin.

[0065] The notebook device involved in this embodiment has two sets of dual-outlet turbofan cooling structures, which are arranged on the left and right sides of the notebook device, and both include a cooling substrate, a heat pipe, cooling fins and a dual-outlet turbofan. The cooling substrate of one set of the dual-outlet turbofan cooling structures is a copper substrate, which is directly bonded to the CPU and GPU, the heat generating components of the notebook device. The cooling substrate of the other set of the dual-outlet turbofan cooling structures is an NPU copper substrate, which is directly bonded to the NPU, the heat generating component of the notebook device.

[0066] S3. Install a temperature sensor, an intelligent thermal management chip and a dual-air turbo fan cooling structure at a designated location inside the notebook device. The dual-air turbo fan cooling structure is powered by a USB interface or a dedicated connector and is connected to the intelligent thermal management chip integrated on the notebook motherboard to achieve data exchange and control, so that the intelligent thermal management chip can adjust the fan operation mode (power saving mode / quiet mode / game mode and performance mode) according to the analysis results of the analysis algorithm, and different modes correspond to different fan speeds.

[0067] S4. The temperature sensor monitors the real-time temperature of the chip of the heat-generating component in the notebook device. The intelligent thermal management chip obtains the current heat load of the notebook device and the real-time temperature of the chip of the heat-generating component in the notebook device. The intelligent analysis is performed through the analysis algorithm, so as to automatically adjust the fan operation mode of the dual-outlet turbo fan cooling structure according to the analysis result. The air-outlet turbo fan cooling structure works based on the adjusted fan operation mode to quickly take away the heat around the heat-generating components in the notebook device.

[0068] In summary, the intelligent dynamic thermal management system and method based on the heat dissipation structure of a notebook device of the present invention can solve the heat dissipation problem of a notebook with high heat flux density through an efficient heat dissipation structure and perform intelligent dynamic thermal management on it, which can significantly improve the heat dissipation efficiency and reduce noise, thereby extending the service life of the notebook device.

[0069] The above specific examples are used to explain the principles and implementation methods of the present invention in detail. These examples are only used to help understand the core technical content of the present invention. Based on the above specific embodiments of the present invention, any improvements and modifications made by technicians in this technical field without departing from the principles of the present invention should fall within the scope of patent protection of the present invention.

Claims

1. An intelligent dynamic thermal management system based on the heat dissipation structure of a notebook device, characterized in that: Its structure includes: The temperature sensor installed inside the notebook device is used to monitor the real-time temperature of the chip of the heat generating component in the notebook device; An intelligent thermal management chip with built-in analysis algorithm is used to obtain the current thermal load of the notebook device and the real-time temperature of the chip of the heat-generating component in the notebook device, and perform intelligent analysis through the analysis algorithm to automatically adjust the fan operation mode of the dual-outlet turbo fan cooling structure; The dual-air turbofan heat dissipation structure arranged inside the notebook device is used to quickly remove the heat around the heat-generating components in the notebook device.

2. The intelligent dynamic thermal management system based on the heat dissipation structure of a notebook device according to claim 1 is characterized in that: The intelligent thermal management chip includes the following two stages: Pre-preparation stage: ① Given the power consumption of the chip of each heat-generating component in the notebook device, the intelligent thermal management chip completes the following tasks: first, the power consumption of the chips of all heat-generating components in the notebook device is summarized to obtain the total power consumption, and then the law of conservation of energy is used to calculate the air volume required to maintain the notebook device running at a safe temperature, and based on this, the dual-outlet turbo fan is selected, and then the thermal resistance analysis method is used to evaluate the heat transfer efficiency from each heat-generating component to the external environment, so as to determine how much surface area each heat-generating component needs for effective heat dissipation; ② Considering the air volume required to maintain the notebook device running at a safe temperature, the historical heat load of the notebook device, and the corresponding chip temperature of the heat-generating component in the notebook device, the intelligent thermal management chip is pre-configured with fan operation modes that meet different heat dissipation requirements; ③ Considering the space for installing the heat dissipation structure inside the notebook device and the size of the selected dual-outlet turbo fan, a dual-outlet turbo fan heat dissipation structure that meets the installation space and air outlet requirements is designed and installed inside the notebook device; ④ The dual-outlet turbo fan heat dissipation structure is powered by a USB interface or a dedicated connector, and is connected to the intelligent thermal management chip integrated on the notebook motherboard to achieve data exchange and control; Automatic adjustment stage: The intelligent thermal management chip obtains the current thermal load of the notebook and the chip temperature of the heat-generating component itself, performs intelligent analysis through an analysis algorithm, and then dynamically adjusts the fan operation mode according to the analysis results to meet the heat dissipation needs of the notebook device.

3. The intelligent dynamic thermal management system based on the heat dissipation structure of a notebook device according to claim 2 is characterized in that: The fan operation modes include power saving mode, quiet mode, gaming mode and performance mode, wherein: Monitor the current heat load of the notebook and the temperature of the chip of the heat generating component itself, and adopt the power saving mode when the current heat load of the notebook and the temperature of the chip of the heat generating component itself meet the heat dissipation requirement A; the heat dissipation requirement A is that the current heat load of the notebook is lower than the threshold a1, and the temperature of the chip of the heat generating component itself is lower than the threshold a2; Monitor the current heat load of the notebook and the temperature of the chip of the heat generating component itself, and adopt the quiet mode when the current heat load of the notebook and the temperature of the chip of the heat generating component itself meet the heat dissipation requirement B; the heat dissipation requirement B is that the current heat load of the notebook is higher than the threshold a1 and lower than the threshold b1, and the temperature of the chip of the heat generating component itself is higher than the threshold a2 and lower than the threshold b2; Monitor the current heat load of the notebook and the temperature of the chip of the heat generating component itself, and adopt the game mode when the current heat load of the notebook and the temperature of the chip of the heat generating component itself meet the heat dissipation requirement C; the heat dissipation requirement C is that the current heat load of the notebook is higher than the threshold b1 and lower than the threshold c1, and the temperature of the chip of the heat generating component itself is higher than the threshold b2 and lower than the threshold c2; Monitor the current heat load of the notebook and the temperature of the chip of the heat-generating component itself, and adopt the game mode when the current heat load of the notebook and the temperature of the chip of the heat-generating component itself meet the heat dissipation requirement D; the heat dissipation requirement D is that the current heat load of the notebook is higher than the threshold value c1, and the temperature of the chip of the heat-generating component itself is higher than the threshold value c2.

4. The intelligent dynamic thermal management system based on the heat dissipation structure of a notebook device according to claim 2, characterized in that: The dual-outlet turbofan heat dissipation structure includes a heat dissipation substrate, a heat pipe, heat dissipation fins and a dual-outlet turbofan, wherein the heat dissipation substrate is attached to the heat generating component of the notebook device, and conducts the heat generated by the chip of the heat generating component itself to the heat pipe through direct contact; one end of the heat pipe is fixedly connected to the heat dissipation substrate, and the other end is fixedly connected to the heat dissipation fin, thereby forming a heat conduction path, and utilizing the phase change principle to quickly transfer heat; the heat dissipation fin is a structure with multiple thin metal sheets, which is used to dissipate the heat conducted by the heat pipe into the air; the dual-outlet turbofan has an air inlet and two air outlets, and the dual-outlet turbofan is arranged on one side of the heat dissipation fin, and the air inlet of the dual-outlet turbofan is directly opposite to the heat dissipation fin, which is used to quickly take away the heat around the heat dissipation fin.

5. The intelligent dynamic thermal management system based on the heat dissipation structure of a notebook device according to claim 4 is characterized in that: The notebook device has two sets of dual-outlet turbofan cooling structures, which are arranged on the left and right sides of the notebook device, and both include a cooling substrate, a heat pipe, a cooling fin and a dual-outlet turbofan. The cooling substrate of one set of the dual-outlet turbofan cooling structures is a copper substrate, which is directly bonded to the CPU and GPU, the heating components of the notebook device. The cooling substrate of the other set of the dual-outlet turbofan cooling structures is an NPU copper substrate, which is directly bonded to the NPU, the heating component of the notebook device.

6. An intelligent dynamic thermal management method based on the heat dissipation structure of a notebook device, characterized in that: The method comprises the following steps: S1. Design an intelligent thermal management chip to complete the following tasks: ① When the power consumption of each heat-generating component chip in the notebook device is known, first summarize the power consumption of all heat-generating component chips in the notebook device to obtain the total power consumption, then use the law of conservation of energy to calculate the air volume required to maintain the notebook device running at a safe temperature, and use this as a basis to select a dual-air turbo fan, and then use the thermal resistance analysis method to evaluate the heat transfer efficiency from each heat-generating component to the external environment, so as to determine how much surface area each heat-generating component needs for effective heat dissipation; ② Considering the air volume required to maintain the notebook device running at a safe temperature, the historical heat load of the notebook device, and the corresponding temperature of the heat-generating component chip in the notebook device, pre-configure the fan operation mode that meets different heat dissipation requirements in the intelligent thermal management chip; S2. Considering the space for installing the heat dissipation structure inside the notebook device and the size of the selected dual-air turbo fan, a dual-air turbo fan heat dissipation structure is designed to meet the installation space and air outlet requirements; S3. Install a temperature sensor, an intelligent thermal management chip, and a dual-air turbofan cooling structure at a designated location inside the notebook device. The dual-air turbofan cooling structure is powered by a USB interface or a dedicated connector and is connected to the intelligent thermal management chip integrated on the notebook motherboard to achieve data exchange and control, so that the intelligent thermal management chip can adjust the fan operation mode according to the analysis result of the analysis algorithm; S4. The temperature sensor monitors the real-time temperature of the chip of the heat-generating component in the notebook device. The intelligent thermal management chip obtains the current heat load of the notebook device and the real-time temperature of the chip of the heat-generating component in the notebook device. The intelligent analysis is performed through the analysis algorithm, so as to automatically adjust the fan operation mode of the dual-outlet turbo fan cooling structure according to the analysis result. The air-outlet turbo fan cooling structure works based on the adjusted fan operation mode to quickly take away the heat around the heat-generating components in the notebook device.

7. The intelligent dynamic thermal management method based on the heat dissipation structure of a notebook device according to claim 6, characterized in that: The fan operation modes include power saving mode, quiet mode, gaming mode and performance mode, wherein: Monitor the current heat load of the notebook and the temperature of the chip of the heat generating component itself, and adopt the power saving mode when the current heat load of the notebook and the temperature of the chip of the heat generating component itself meet the heat dissipation requirement A; the heat dissipation requirement A is that the current heat load of the notebook is lower than the threshold a1, and the temperature of the chip of the heat generating component itself is lower than the threshold a2; Monitor the current heat load of the notebook and the temperature of the chip of the heat generating component itself, and adopt the quiet mode when the current heat load of the notebook and the temperature of the chip of the heat generating component itself meet the heat dissipation requirement B; the heat dissipation requirement B is that the current heat load of the notebook is higher than the threshold a1 and lower than the threshold b1, and the temperature of the chip of the heat generating component itself is higher than the threshold a2 and lower than the threshold b2; Monitor the current heat load of the notebook and the temperature of the chip of the heat generating component itself, and adopt the game mode when the current heat load of the notebook and the temperature of the chip of the heat generating component itself meet the heat dissipation requirement C; the heat dissipation requirement C is that the current heat load of the notebook is higher than the threshold b1 and lower than the threshold c1, and the temperature of the chip of the heat generating component itself is higher than the threshold b2 and lower than the threshold c2; Monitor the current heat load of the notebook and the temperature of the chip of the heat-generating component itself, and adopt the game mode when the current heat load of the notebook and the temperature of the chip of the heat-generating component itself meet the heat dissipation requirement D; the heat dissipation requirement D is that the current heat load of the notebook is higher than the threshold value c1, and the temperature of the chip of the heat-generating component itself is higher than the threshold value c2.

8. The intelligent dynamic thermal management method based on the heat dissipation structure of a notebook device according to claim 6, characterized in that: The dual-outlet turbofan heat dissipation structure includes a heat dissipation substrate, a heat pipe, heat dissipation fins and a dual-outlet turbofan, wherein the heat dissipation substrate is attached to the heat generating component of the notebook device, and conducts the heat generated by the chip of the heat generating component itself to the heat pipe through direct contact; one end of the heat pipe is fixedly connected to the heat dissipation substrate, and the other end is fixedly connected to the heat dissipation fin, thereby forming a heat conduction path, and utilizing the phase change principle to quickly transfer heat; the heat dissipation fin is a structure with multiple thin metal sheets, which is used to dissipate the heat conducted by the heat pipe into the air; the dual-outlet turbofan has an air inlet and two air outlets, and the dual-outlet turbofan is arranged on one side of the heat dissipation fin, and the air inlet of the dual-outlet turbofan is directly opposite to the heat dissipation fin, which is used to quickly take away the heat around the heat dissipation fin.

9. The intelligent dynamic thermal management method based on the heat dissipation structure of a notebook device according to claim 8, characterized in that: The notebook device has two sets of dual-outlet turbofan cooling structures, which are arranged on the left and right sides of the notebook device, and both include a cooling substrate, a heat pipe, a cooling fin and a dual-outlet turbofan. The cooling substrate of one set of the dual-outlet turbofan cooling structures is a copper substrate, which is directly bonded to the CPU and GPU, the heating components of the notebook device. The cooling substrate of the other set of the dual-outlet turbofan cooling structures is an NPU copper substrate, which is directly bonded to the NPU, the heating component of the notebook device.

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