Wafer film pasting method and device

Abstract

The embodiment of the invention provides a wafer film pasting method and device.The method comprises the steps that a wafer protection film is provided, and the size of the wafer protection film is larger than that of a wafer; placing the wafer protection film, and enabling the shape of the edge area of the wafer protection film to be matched with the surface, which does not need to be protected, of the wafer; the wafer is placed, so that the surface, which does not need to be protected, of the wafer is attached to the edge area of the wafer protection film; and carrying out film pasting treatment to enable the wafer protection film to be attached to the surface, needing to be protected, of the wafer and the surface, not needing to be protected, of the wafer. By the adoption of the scheme, the possibility that a wafer protection film falls off in the chemical plating process can be remarkably reduced, and the problem of chemical plating solution permeation is effectively solved.

Description

Technical Field

[0001] The embodiments of the present specification relate to the field of semiconductor device manufacturing technology, and more particularly to a wafer film attaching method and device. Background Art

[0002] In the field of semiconductor device manufacturing technology, before performing a front-side chemical plating process on a wafer, it is usually necessary to attach a protective film to the back side of the wafer to prevent the chemical plating solution from contaminating the back side of the wafer during the operation.

[0003] However, the existing wafer film attaching method is very prone to plating solution penetration and protective film shedding. Summary of the invention

[0004] The embodiments of this specification provide a wafer film attaching method and device, which can significantly reduce the possibility of wafer protective film falling off during the chemical plating process and effectively improve the problem of chemical plating solution penetration.

[0005] First, the embodiment of this specification provides a wafer film attaching method, including:

[0006] Providing a wafer protection film, wherein the size of the wafer protection film is larger than the size of the wafer;

[0007] Placing the wafer protection film so that the shape of the edge region of the wafer protection film matches the surface of the wafer that does not need to be protected;

[0008] Placing the wafer so that the surface of the wafer that does not need to be protected is in contact with the edge area of ​​the wafer protection film;

[0009] The film laminating process is performed to make the wafer protection film adhere to the surface to be protected and the surface not to be protected of the wafer.

[0010] Optionally, the wafer is concave in shape, the surface of the wafer that needs to be protected is the concave surface of the wafer, and the surface that does not need to be protected is the outer surface connected to the concave surface; wherein the outer surface includes the upper surface of the side wall connected to the concave surface and the outer side surface of the side wall.

[0011] Optionally, placing the wafer protection film so that the shape of the edge region of the wafer protection film matches the surface of the wafer that does not need to be protected includes:

[0012] The wafer protection film is placed in a concave state, and the concave direction of the wafer protection film is opposite to the concave direction of the surface of the wafer to be protected, so that the shape of the edge area of ​​the wafer protection film matches the surface of the wafer that does not need to be protected; wherein the edge area of ​​the wafer protection film includes: the side area of ​​the wafer protection film, and a partial main area connected to the side area.

[0013] Optionally, placing the wafer protection film in a concave state, and the concave direction of the wafer protection film is opposite to the concave direction of the surface of the wafer to be protected, so that the shape of the edge area of ​​the wafer protection film matches the surface of the wafer not to be protected, includes:

[0014] Providing an adsorption component, wherein the adsorption component has a groove, and the groove is suitable for accommodating the wafer protection film;

[0015] The wafer protection film is adsorbed by the adsorption component so that the wafer protection film is accommodated in the groove of the adsorption component in a concave state, and the concave direction of the wafer protection film is opposite to the concave direction of the surface to be protected of the wafer, so that the shape of the edge area of ​​the wafer protection film matches the surface of the wafer that does not need to be protected.

[0016] Optionally, placing the wafer so that the surface of the wafer that does not need to be protected is in contact with the edge area of ​​the wafer protection film includes:

[0017] The outer surface of the wafer is attached to the edge area of ​​the wafer protection film.

[0018] Optionally, the film laminating process is performed to make the wafer protection film adhere to the surface to be protected and the surface not to be protected of the wafer, including:

[0019] Providing a vacuum in the space between the wafer protection film and the surface to be protected of the wafer;

[0020] The vacuum is released to allow the wafer protection film to adhere to the surface of the wafer that needs to be protected and the surface that does not need to be protected.

[0021] Optionally, the wafer is formed into the concave shape by back grinding technology.

[0022] Optionally, the back grinding technique comprises a Taiko process.

[0023] Optionally, the adsorption component includes a Table component, and the Table component generates suction by releasing vacuum to adsorb the wafer protection film.

[0024] Optionally, a size difference between the wafer protection film and the wafer is within a preset difference range.

[0025] Optionally, the preset difference range is 1 mm to 2 mm.

[0026] The embodiment of this specification also provides a wafer film attaching device, including:

[0027] An adsorption assembly, adapted to accommodate a wafer protection film, so that the shape of an edge region of the wafer protection film matches a surface of the wafer that does not need to be protected;

[0028] The vacuum pumping component is suitable for providing vacuum in the space between the wafer protection film and the surface to be protected of the wafer to perform film laminating processing, so that the wafer protection film is laminated to the surface to be protected and the surface not to be protected of the wafer.

[0029] Optionally, the adsorption component has a groove, and the groove is suitable for accommodating the wafer protection film.

[0030] The wafer laminating method provided in the embodiment of this specification is adopted, by providing a wafer protective film whose size is larger than the size of the wafer, further placing the wafer protective film so that the shape of the edge area of ​​the wafer protective film matches the surface of the wafer that does not need protection, and further placing the wafer so that the surface of the wafer that does not need protection is in contact with the edge area of ​​the wafer protective film, so that when the laminating process is performed, the wafer protective film can be made to fit the surface of the wafer that needs to be protected and the surface that does not need protection, thereby significantly reducing the possibility of the wafer protective film falling off during the chemical plating process, and effectively improving the problem of chemical plating solution penetration.

[0031] Furthermore, the wafer is concave in shape, the surface to be protected of the wafer is the concave surface of the wafer, and the surface that does not need protection is the outer surface connected to the concave surface; since the outer surface includes the upper surface of the side wall connected to the concave surface and the outer surface of the side wall, when the film is pasted, by making the wafer protection film fit the surface to be protected of the wafer and the surface that does not need protection, the buffer distance of the wafer protection film to the surface to be protected of the wafer can be increased, thereby further reducing the possibility of the wafer protection film falling off during the chemical plating process and further improving the problem of chemical plating solution penetration.

[0032] Furthermore, by placing the wafer protection film in a concave state, and the concave direction of the wafer protection film is opposite to the concave direction of the surface to be protected of the wafer, the shape of the edge area of ​​the wafer protection film matches the surface of the wafer that does not need protection, thereby ensuring that during the film lamination process, the wafer protection film can not only fit the surface to be protected of the wafer, but also fit the surface of the wafer that does not need protection, thereby significantly reducing the possibility of the wafer protection film falling off during the chemical plating process and effectively improving the problem of chemical plating solution penetration.

[0033] Furthermore, the wafer protection film is adsorbed by an adsorption component having a groove, so that the wafer protection film is accommodated in the groove of the adsorption component in a concave state, and the concave direction of the wafer protection film is opposite to the concave direction of the surface of the wafer to be protected, so that the shape of the edge area of ​​the wafer protection film matches the surface of the wafer that does not need to be protected. From the above, it can be seen that, on the one hand, by adsorbing the wafer protection film by the adsorption component, not only can the wafer protection film be firmly adsorbed, but also the wafer protection film will not be worn; on the other hand, by accommodating the wafer protection film in a concave state in the groove of the adsorption component, it is easy to adjust the relative position between the wafer protection film and the surface of the wafer to be protected, which can ensure that the shape of the edge area of ​​the wafer protection film matches the surface of the wafer that does not need to be protected, so that it can be ensured that when the film is applied, the wafer protection film can not only fit the surface of the wafer to be protected, but also fit the surface of the wafer that does not need to be protected.

[0034] Furthermore, by providing a vacuum in the space between the wafer protection film and the surface to be protected of the wafer and then releasing the vacuum, not only can the film lamination process be achieved so that the wafer protection film fits the surface to be protected and the surface not to be protected of the wafer, but also the wafer protection film will not be worn.

[0035] Furthermore, since the Table component generates suction by releasing vacuum to adsorb the wafer protection film, it can not only firmly adsorb the wafer protection film, but also will not cause wear to the wafer protection film.

[0036] Furthermore, by providing a wafer protection film whose size maintains a preset difference with the size of the wafer, it can be ensured that during the film lamination process, the wafer protection film can not only adhere to the surface of the wafer that needs to be protected, but also adhere to the surface of the wafer that does not need to be protected, thereby significantly reducing the possibility of the wafer protection film falling off during the chemical plating process and effectively improving the problem of chemical plating solution penetration.

[0037] Furthermore, since the size difference between the wafer protection film and the wafer is in the range of 1 to 2 mm, it can not only ensure that the surface to be protected and the surface not to be protected of the wafer are adhered to at the same time, but also reduce the cost required for film adhesion as much as possible. In addition, it can also avoid the problem of difficulty in laminating the wafer protection film due to inappropriate size of the wafer protection film. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0039] Figure 1a to Figure 1c A schematic diagram of the process of film bonding using an existing wafer film bonding method is shown;

[0040] Figure 2 A schematic diagram showing the impact of the flow of a plating solution during wafer plating is shown;

[0041] Figure 3 A schematic diagram of the steps of a wafer film attaching method in an embodiment of this specification is shown;

[0042] Figure 4 A schematic diagram of the steps of placing a wafer protection film in an embodiment of this specification is shown;

[0043] Figure 5 A schematic diagram of the steps of a film pasting process in an embodiment of this specification is shown;

[0044] Figure 6 A schematic diagram of the structure of a wafer film attaching device in an embodiment of this specification is shown;

[0045] Figures 7a to 7c A schematic diagram of the process of film bonding using the wafer film bonding method according to the embodiment of the present specification is shown;

[0046] Figure 8 A schematic diagram showing the impact of the flow of a plating solution during another wafer plating process in an embodiment of this specification is shown. DETAILED DESCRIPTION

[0047] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific implementation disclosed below.

[0048] As described in the background art, in the field of semiconductor device manufacturing technology, before performing a front-side chemical plating process on a wafer, a protective film is usually required to be attached to the back of the wafer to prevent the chemical plating solution from contaminating the back of the wafer during the operation. However, the existing wafer film attachment method is very prone to chemical plating solution penetration and protective film shedding.

[0049] For ease of understanding, the causes of chemical plating solution penetration and protective film shedding are analyzed in combination with the film-mounting process of an existing wafer film-mounting method.

[0050] Reference Figure 1a to Figure 1c The schematic diagram of the process of film bonding using the existing wafer film bonding method is shown in FIG. Figure 1a As shown, a wafer protection film 12 having a size slightly smaller than that of the wafer 13 is pre-cut, and then the wafer protection film 12 is adsorbed by the adsorption component 11; Figure 1b As shown, after the adsorption component 11 adsorbs the wafer protection film 12, the wafer protection film 12 is placed on the back of the wafer 13 under a vacuum environment; Figure 1b and Figure 1c As shown, the vacuum V is quickly released. Since the space between the wafer protection film 12 and the wafer 13 is in a vacuum state, during the process of quickly releasing the vacuum V, due to the pressure difference between the internal and external environments, the wafer protection film 12 is squeezed to the back of the wafer 13 by air pressure, thereby forming Figure 1c The film status shown.

[0051] Reference Figure 2 A schematic diagram of the impact of the flow of the plating solution during the wafer plating process is shown in FIG. Figure 2 As shown in the wafer bonding state obtained by the existing wafer bonding method, the portion of the wafer protection film 12 distributed on the buffering area H of the protection area P of the wafer 13 is too short. During the chemical plating process, due to the impact of the flow of the chemical plating solution ( Figure 2 The arrow indicates the flow direction of the chemical plating solution, and the arc indicates the chemical plating solution), which can easily cause the wafer protection film 12 to fall off from the back side of the wafer 13, and the chemical plating solution to penetrate into the back side of the wafer 13, thereby contaminating the metal on the back side of the wafer 13.

[0052] In response to the above problems, the embodiments of this specification provide a wafer laminating method, by providing a wafer protective film whose size is larger than that of the wafer, further placing the wafer protective film so that the shape of the edge area of ​​the wafer protective film matches the surface of the wafer that does not need protection, and further placing the wafer so that the surface of the wafer that does not need protection is in contact with the edge area of ​​the wafer protective film, so that when the laminating process is performed, the wafer protective film can be made to fit the surface of the wafer that needs protection and the surface that does not need protection, thereby significantly reducing the possibility of the wafer protective film falling off during the chemical plating process and effectively improving the problem of chemical plating solution penetration.

[0053] In order to enable those skilled in the art to better understand and implement the embodiments of this specification, the embodiments of this specification are described in detail below with reference to the accompanying drawings.

[0054] First, the embodiment of this specification provides a wafer film attaching method, referring to Figure 3 The schematic diagram of a wafer film attaching method shown in the figure shows that the wafer can be film attached using the following steps:

[0055] Step A, providing a wafer protection film, wherein the size of the wafer protection film is larger than the size of the wafer.

[0056] In some embodiments of the present specification, a size difference between the wafer protection film and the wafer is within a preset difference range.

[0057] By adopting the above embodiment, a wafer protection film having a size that maintains a preset difference with the size of the wafer can be provided, so that during the film lamination process, the wafer protection film can not only adhere to the surface of the wafer that needs to be protected, but also adhere to the surface of the wafer that does not need to be protected, thereby significantly reducing the possibility of the wafer protection film falling off during the chemical plating process and effectively improving the problem of chemical plating solution penetration.

[0058] As an optional embodiment, the preset difference range is 1 mm (millimeter) to 2 mm.

[0059] According to the above embodiment, since the size difference between the wafer protection film and the wafer is in the range of 1 mm to 2 mm, it can not only ensure that the surface to be protected and the surface not to be protected of the wafer are attached at the same time, but also reduce the cost of attaching the film as much as possible. In addition, it can also avoid the problem that the wafer protection film is difficult to attach due to the inappropriate size of the wafer protection film.

[0060] It should be noted that the embodiments of this specification do not impose any specific restrictions on the size difference range between the wafer protection film and the wafer, and the above size difference range is only used as an optional example.

[0061] Step B: placing the wafer protection film so that the shape of the edge area of ​​the wafer protection film matches the surface of the wafer that does not need to be protected.

[0062] Step C, placing the wafer so that the surface of the wafer that does not need to be protected is in contact with the edge area of ​​the wafer protection film.

[0063] Step D: performing film lamination processing to make the wafer protection film adhere to the surface to be protected and the surface not to be protected of the wafer.

[0064] By adopting the above embodiment, a wafer protection film having a size larger than that of the wafer is provided, the wafer protection film is further placed so that the shape of the edge area of ​​the wafer protection film matches the surface of the wafer that does not need protection, and the wafer is further placed so that the surface of the wafer that does not need protection is in contact with the edge area of ​​the wafer protection film. As a result, when the film is pasted, the wafer protection film can be pasted to the surface to be protected and the surface that does not need protection of the wafer, thereby significantly reducing the possibility of the wafer protection film falling off during the chemical plating process and effectively improving the problem of chemical plating solution penetration.

[0065] In some embodiments of the present specification, the wafer can be concave in shape, the surface to be protected of the wafer is the concave surface of the wafer, and the surface that does not need protection is the outer surface connected to the concave surface; since the outer surface includes the upper surface of the side wall connected to the concave surface and the outer surface of the side wall, when the film is pasted, by making the wafer protection film fit the surface to be protected of the wafer and the surface that does not need protection, the buffer distance of the wafer protection film to the surface to be protected of the wafer can be increased, thereby further reducing the possibility of the wafer protection film falling off during the chemical plating process and further improving the problem of chemical plating solution penetration.

[0066] In other embodiments of the present specification, the wafer may be formed into the concave shape by back grinding technology.

[0067] As an optional embodiment, the wafer may be formed into a concave shape by a Taiko thinning process. Specifically, the Taiko thinning process retains the edge portion of the wafer periphery when grinding the wafer, and only grinds and thins the inside of the wafer, thereby forming a concave shape.

[0068] In some embodiments of this specification, step B may specifically include the following steps:

[0069] Step B1, placing the wafer protection film in a concave state, and the concave direction of the wafer protection film is opposite to the concave direction of the surface to be protected of the wafer, so that the shape of the edge area of ​​the wafer protection film matches the surface of the wafer that does not need to be protected; wherein, the edge area of ​​the wafer protection film includes: the side area of ​​the wafer protection film, and a partial main area connected to the side area.

[0070] By adopting the above embodiment, the wafer protection film is placed in a concave state, and the concave direction of the wafer protection film is opposite to the concave direction of the surface to be protected of the wafer, so that the shape of the edge area of ​​the wafer protection film matches the surface of the wafer that does not need protection. It can be ensured that during the film lamination process, the wafer protection film can not only fit the surface to be protected of the wafer, but also fit the surface of the wafer that does not need protection, thereby significantly reducing the possibility of the wafer protection film falling off during the chemical plating process and effectively improving the problem of chemical plating solution penetration.

[0071] As an optional embodiment, refer to Figure 4 The schematic diagram of the steps of placing a wafer protective film is shown, and for step B1, the steps may specifically include the following steps:

[0072] Step B11, providing an adsorption component, wherein the adsorption component has a groove, and the groove is suitable for accommodating the wafer protection film.

[0073] In some embodiments of the present specification, the adsorption component may include a Table component, and the Table component generates suction by releasing vacuum to adsorb the wafer protection film.

[0074] With the above-mentioned embodiment, the Table component generates suction by releasing vacuum to adsorb the wafer protection film, which not only can firmly adsorb the wafer protection film but also will not cause wear to the wafer protection film.

[0075] It should be noted that the specific implementation method of the above-mentioned adsorption component is only an exemplary description, and the embodiments of this specification do not specifically limit the adsorption component.

[0076] Step B12, adsorbing the wafer protection film through the adsorption component so that the wafer protection film is accommodated in the groove of the adsorption component in a concave state, and the concave direction of the wafer protection film is opposite to the concave direction of the surface to be protected of the wafer, so that the shape of the edge area of ​​the wafer protection film matches the surface of the wafer that does not need to be protected.

[0077] By adopting the above-mentioned embodiment, on the one hand, the wafer protective film is adsorbed by the adsorption component, which not only can firmly adsorb the wafer protective film, but also will not cause wear to the wafer protective film; on the other hand, by accommodating the wafer protective film in a concave state in the groove of the adsorption component, it is easy to adjust the relative position between the wafer protective film and the surface to be protected of the wafer, thereby ensuring that the shape of the edge area of ​​the wafer protective film matches the surface of the wafer that does not need protection, thereby ensuring that when the film is being pasted, the wafer protective film can not only fit the surface to be protected of the wafer, but also fit the surface of the wafer that does not need protection.

[0078] In other embodiments of this specification, step C may specifically include the following steps:

[0079] The wafer is placed so that the outer surface of the wafer is in contact with the edge area of ​​the wafer protection film.

[0080] As an optional embodiment, refer to Figure 5 The schematic diagram of a film laminating process shown in the figure, for step D, may specifically include the following steps:

[0081] In step D1 , a vacuum is provided in the space between the wafer protection film and the surface to be protected of the wafer.

[0082] Step D2, releasing the vacuum to allow the wafer protection film to adhere to the surface to be protected and the surface not to be protected of the wafer.

[0083] By adopting the above embodiment, by providing a vacuum in the space between the wafer protection film and the surface to be protected of the wafer and then releasing the vacuum, not only can the film lamination process be achieved so that the wafer protection film fits the surface to be protected and the surface not to be protected of the wafer, but also the wafer protection film will not be worn.

[0084] For ease of implementation, the present specification also provides a wafer film attaching device, referring to Figure 6 The schematic diagram of the structure of a wafer film mounting device is shown, and the wafer film mounting device X may include:

[0085] The adsorption assembly X1 is suitable for accommodating a wafer protection film so that the shape of the edge area of ​​the wafer protection film matches the surface of the wafer that does not need to be protected.

[0086] The vacuum pumping component X2 is suitable for providing vacuum in the space between the wafer protection film and the surface to be protected of the wafer to perform film lamination processing, so that the wafer protection film is laminated to the surface to be protected and the surface not to be protected of the wafer.

[0087] By adopting the above embodiment, on the one hand, the wafer protection film is accommodated by the adsorption component, and the relative position between the wafer protection film and the wafer can be easily adjusted, so as to ensure that the shape of the edge area of ​​the wafer protection film matches the surface of the wafer that does not need protection; on the other hand, by providing a vacuum in the space between the wafer protection film and the surface of the wafer that needs protection by the vacuum pumping component, not only can the film laminating process be achieved, so that the wafer protection film fits the surface of the wafer that needs protection and the surface that does not need protection, but also the wafer protection film will not be worn. It can be seen from the above that by adopting the above film laminating device, the possibility of the wafer protection film falling off in the chemical plating process can be significantly reduced, and the problem of chemical plating solution penetration can be effectively improved.

[0088] In some embodiments of the present specification, the adsorption component has a groove, and the groove is suitable for accommodating the wafer protection film.

[0089] In the above embodiment, since the wafer protection film needs to fit the surface to be protected and the surface not to be protected of the wafer, a wafer protection film having a size larger than the wafer size can be accommodated by providing a groove on the adsorption component.

[0090] The following describes in detail the process of performing wafer film attaching processing using the wafer film attaching method and wafer film attaching device described in the embodiments of this specification through a specific example.

[0091] Reference Figures 7a to 7c The schematic diagram of the process of film bonding using the wafer film bonding method of the embodiment of this specification is shown. Figure 7a As shown, the size of the provided wafer protection film 72 is 2 mm larger than the size of the wafer 73, and the edge area of ​​the wafer protection film 72 includes: the side area of ​​the wafer protection film 72, and a partial main area connected to the side area; the provided wafer 73 is formed into a concave shape through a Taiko thinning process, and the surface to be protected of the wafer 73 is the concave surface of the wafer, and the surface that does not need to be protected is the outer surface connected to the concave surface, and the outer surface includes the upper surface of the side wall connected to the concave surface and the outer side surface of the side wall; the provided Table component 71 has a groove.

[0092] First, continue to refer to Figure 7a The wafer protection film 72 is adsorbed by the Table component 71 so that the wafer protection film 72 is placed in the groove of the Table component 71 in a concave state, and the concave direction of the wafer protection film 72 is opposite to the concave direction of the surface to be protected of the wafer 73, so that the shape of the edge area of ​​the wafer protection film 72 matches the surface of the wafer 73 that does not need to be protected.

[0093] Furthermore, if Figure 7b As shown, after the Table component 71 absorbs the wafer protection film 72, the wafer 73 is placed in a vacuum environment, and the outer surface of the wafer 73 is attached to the edge area of ​​the wafer protection film 72, so that a vacuum V is formed between the wafer protection film 72 and the surface to be protected (i.e., the concave surface) of the wafer 73.

[0094] Furthermore, if Figure 7c As shown, the vacuum V is quickly released. Since the wafer protection film 72 and the surface to be protected of the wafer 73 are in a vacuum state, during the process of quickly releasing the vacuum V, due to the pressure difference between the internal and external environments, the wafer protection film 72 is squeezed to the surface to be protected of the wafer 73 by air pressure, thereby forming Figure 7cThe film is in the state shown. Figure 7c As shown, the wafer bonding state obtained by the wafer bonding method of the embodiment of this specification has a longer portion of the wafer protection film 72 distributed on the buffer area H of the protection area P of the wafer 73, extending all the way to the upper surface of the side wall connected to the concave surface of the wafer 73 and the outer side surface of the side wall.

[0095] Reference Figure 8 Another schematic diagram of the impact of the flow of the plating solution during the wafer plating process is shown, and compared with the reference Figure 2 ,like Figure 2 As shown in the wafer bonding state obtained by the existing wafer bonding method, the portion of the wafer protection film 12 distributed on the buffering area H of the protection area P of the wafer 13 is too short. During the chemical plating process, due to the impact of the flow of the chemical plating solution ( Figure 2 The arrow indicates the flow direction of the chemical plating solution, and the arc indicates the chemical plating solution), which may easily cause the wafer protection film 12 to fall off from the back side of the wafer 13, and the chemical plating solution to penetrate into the back side of the wafer 13, thereby contaminating the metal on the back side of the wafer 13; however Figure 8 The wafer bonding state obtained by the wafer bonding method of the embodiment of the present specification is shown in FIG. 1 . Since the portion of the wafer protection film 72 distributed on the buffering area H of the protection area P of the wafer 73 is relatively long, during the chemical plating process, the impact of the flow of the chemical plating solution ( Figure 8 The arrow indicates the flow direction of the chemical plating solution, and the arc indicates that it is difficult for the chemical plating solution to wash off the wafer protection film 72 from the back side of the wafer 73, thereby significantly reducing the possibility of the wafer protection film falling off during the chemical plating process and effectively improving the problem of chemical plating solution penetration.

[0096] It is understood that the features described in the various embodiments or claims of this specification may be combined or coupled in various combinations, even if such combinations or couplings are not explicitly described in the present invention. In particular, the features described in the various embodiments or claims of this specification may be combined or coupled in various combinations without departing from the spirit and guidance of the present invention. All of these combinations or couplings fall within the scope of the present invention.

[0097] Although the embodiments of this specification are disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, so the protection scope of the present invention shall be subject to the scope defined by the claims.

Claims

1. A wafer film attaching method, characterized in that: include: Providing a wafer protection film, wherein the size of the wafer protection film is larger than the size of the wafer; Placing the wafer protection film so that the shape of the edge region of the wafer protection film matches the surface of the wafer that does not need to be protected; Placing the wafer so that the surface of the wafer that does not need to be protected is in contact with the edge area of ​​the wafer protection film; The film laminating process is performed to make the wafer protection film adhere to the surface to be protected and the surface not to be protected of the wafer.

2. The wafer film attaching method according to claim 1, characterized in that: The wafer is concave in shape, the surface that needs to be protected is the concave surface of the wafer, and the surface that does not need to be protected is the outer surface connected to the concave surface; wherein the outer surface includes the upper surface of the side wall connected to the concave surface and the outer side surface of the side wall.

3. The wafer film attaching method according to claim 2, characterized in that: Placing the wafer protection film so that the shape of the edge area of ​​the wafer protection film matches the surface of the wafer that does not need to be protected includes: The wafer protection film is placed in a concave state, and the concave direction of the wafer protection film is opposite to the concave direction of the surface of the wafer to be protected, so that the shape of the edge area of ​​the wafer protection film matches the surface of the wafer that does not need to be protected; wherein the edge area of ​​the wafer protection film includes: the side area of ​​the wafer protection film, and a partial main area connected to the side area.

4. The wafer film attaching method according to claim 3, characterized in that: Placing the wafer protection film in a concave state, and the concave direction of the wafer protection film is opposite to the concave direction of the surface of the wafer to be protected, so that the shape of the edge area of ​​the wafer protection film matches the surface of the wafer not to be protected, includes: Providing an adsorption component, wherein the adsorption component has a groove, and the groove is suitable for accommodating the wafer protection film; The wafer protection film is adsorbed by the adsorption component so that the wafer protection film is accommodated in the groove of the adsorption component in a concave state, and the concave direction of the wafer protection film is opposite to the concave direction of the surface to be protected of the wafer, so that the shape of the edge area of ​​the wafer protection film matches the surface of the wafer that does not need to be protected.

5. The wafer attaching method according to claim 3, characterized in that: Placing the wafer so that the surface of the wafer that does not need to be protected is in contact with the edge area of ​​the wafer protection film comprises: The outer surface of the wafer is attached to the edge area of ​​the wafer protection film.

6. The wafer attaching method according to claim 1, characterized in that: The film laminating process is performed to make the wafer protection film adhere to the surface to be protected and the surface not to be protected of the wafer, including: Providing a vacuum in the space between the wafer protection film and the surface to be protected of the wafer; The vacuum is released to allow the wafer protection film to adhere to the surface of the wafer that needs to be protected and the surface that does not need to be protected.

7. The wafer film attaching method according to claim 2, characterized in that: The wafer is formed into the concave shape by back grinding technology.

8. The wafer attaching method according to claim 7, characterized in that: The back grinding technology includes a Taiko process.

9. The wafer attaching method according to claim 4, characterized in that: The adsorption component includes a Table component, and the Table component generates suction by releasing vacuum to adsorb the wafer protection film.

10. The wafer attaching method according to claim 1, characterized in that: The size difference between the wafer protection film and the wafer is within a preset difference range.

11. The wafer attaching method according to claim 10, characterized in that: The preset difference range is 1 mm to 2 mm.

12. A wafer film attaching device, characterized in that: include: An adsorption assembly, adapted to accommodate a wafer protection film, so that the shape of an edge region of the wafer protection film matches a surface of the wafer that does not need to be protected; The vacuum pumping component is suitable for providing vacuum in the space between the wafer protection film and the surface to be protected of the wafer to perform film laminating processing, so that the wafer protection film is laminated to the surface to be protected and the surface not to be protected of the wafer.

13. The wafer film attaching device according to claim 12, characterized in that: The adsorption component has a groove, and the groove is suitable for accommodating the wafer protection film.

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