Pulse test method and device based on XCP protocol, electronic equipment and storage medium
By integrating the pulse testing function in engineering applications and utilizing the XCP protocol, pulse testing of power semiconductor devices is realized at the software level, solving the problem of high testing costs in the existing technology, and achieving an efficient and economical testing process.
Patent Information
- Application Number
- CN202411890044.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-20
- Publication Date
- 2025-03-18
AI Technical Summary
The prior art cannot perform pulse testing of power semiconductor devices at the software level, and additional testing equipment is required, resulting in high testing costs.
By adding the main tone function that carries the pulse test function in the periodic tasks of the engineering application, the pulse test project file and the XCP protocol calibration variable data file are integrated into the engineering application, the target hex file is compiled and generated, and the calibration variable is set based on the XCP protocol by the host computer, and the pulse signal is triggered to control the target power semiconductor device to turn on or off.
It realizes multi-pulse testing of power semiconductor devices at the software level, reducing testing costs, simplifying the testing process, and improving testing efficiency.
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Figure CN119643976A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure belongs to the field of calibration technology, and in particular, relates to a pulse testing method, device, electronic device and storage medium based on an XCP protocol. Background Art
[0002] The XCP protocol is a general measurement and calibration protocol, mainly used for the measurement and calibration of the parameters of the electronic control unit (ECU) of the internal vehicle. The XCP protocol is an upgraded version of the CAN Calibration Protocol (CCP) and can support more transmission media. XCP is subdivided into a protocol layer and a transport layer, where X represents any transport layer (CAN, Ethernet, etc.). XCP is developed to achieve measurement and calibration through different transmission media.
[0003] In circuit design, the parameter characteristics of related devices are usually understood through the technical manuals provided by the manufacturer. However, the parameters provided in the technical manuals are measured under specific conditions, which are different from the actual working conditions. They usually cannot be used directly and need to be calibrated. The calibration of power semiconductor devices can be achieved through pulse testing, that is, the switching characteristics of power semiconductor devices are tested by giving pulse signals, thereby achieving an accurate evaluation of the power semiconductor device. At present, the existing technology cannot perform pulse testing on power semiconductor devices at the software level, and additional testing equipment is required for calibration, which has a high testing cost. Therefore, how to test the switching characteristics of power semiconductor devices at the software level to reduce testing costs is a problem that needs to be solved in this field. Summary of the invention
[0004] To solve the above problems, the present disclosure provides a pulse testing method, device, electronic device and storage medium based on the XCP protocol, which aims to reduce the testing cost of the switching characteristics of power semiconductor devices.
[0005] In order to achieve the above objectives, the present disclosure mainly provides the following technical solutions:
[0006] In a first aspect, the present disclosure provides a pulse testing method based on the XCP protocol, comprising:
[0007] After adding a main calling function for pulse testing to a periodic task of an engineering application, and integrating a pulse testing engineering file for testing a target power semiconductor device and an XCP protocol calibration variable data file into the engineering application, compiling and generating a target hex file of the engineering application;
[0008] Establish a communication connection between the engineering application and the corresponding host computer, and import the target hex file and the A2L file corresponding to the XCP protocol into the host computer;
[0009] Based on the XCP protocol, each calibration variable is set through the calibration software in the host computer, the target hex file and the A2L file to obtain a setting result, wherein the calibration variable is used to perform a pulse test on the target power semiconductor device;
[0010] The engineering application triggers a pulse signal according to the setting result, and controls the target power semiconductor device to turn on or off through the pulse signal.
[0011] Furthermore, each calibration variable includes at least: a pulse channel, a pulse number, a pulse time and an enable, wherein the enable is used to trigger the pulse signal, and the pulse number has a value range of 1 to 10.
[0012] Furthermore, the engineering application triggers a pulse signal according to the setting result, and controls the target power semiconductor device to turn on or off through the pulse signal, including:
[0013] Based on the XCP protocol, the host computer transmits the setting result to the engineering application;
[0014] The engineering application triggers a pulse signal based on the setting result, wherein the enable in the setting result is set to 1;
[0015] The pulse signal is transmitted to the switch control pin of the target power semiconductor device through the chip pin of the micro control unit via the peripheral device to control the target power semiconductor device to turn on or off.
[0016] Further, the engineering application triggers a pulse signal based on the setting result, including:
[0017] The engineering application determines the chip pin that sends the pulse width modulation PWM wave according to the pulse channel in the setting result; and controls the chip pin to send the corresponding PWM wave according to the number of pulses in the setting result, the time of each high level, and the time of the low level between two high levels.
[0018] Furthermore, the engineering application reserves six channels for pulse testing the target power semiconductor device, so that after the pulse test is completed, when a pulse test based on a new pulse channel is required, the current pulse channel is switched to the new pulse channel.
[0019] Furthermore, the A2L file includes calibration variable information, and the calibration variable information includes a calibration variable name, a calibration variable data type, a calibration variable data type range, a calibration variable address, and a calibration variable initial value.
[0020] In a second aspect, the present disclosure provides a pulse testing device based on the XCP protocol, the device comprising:
[0021] A compiling unit, for compiling and generating a target hex file of the engineering application after adding a main calling function for pulse testing to a periodic task of the engineering application and integrating a pulse testing engineering file for testing a target power semiconductor device and an XCP protocol calibration variable data file into the engineering application;
[0022] A connection unit, used to establish a communication connection between the engineering application and a corresponding host computer, and import the target hex file and the A2L file corresponding to the XCP protocol into the host computer;
[0023] A setting unit, for setting each calibration variable based on the XCP protocol through the calibration software in the host computer and the target hex file and the A2L file to obtain a setting result, wherein the calibration variable is used to perform a pulse test on the target power semiconductor device;
[0024] A trigger unit is used for the engineering application to trigger a pulse signal according to the setting result, and control the target power semiconductor device to turn on or off through the pulse signal.
[0025] On the other hand, the present disclosure further provides a storage medium, which is used to store a computer program, wherein when the computer program is running, the device where the storage medium is located is controlled to execute the method of the first aspect above.
[0026] On the other hand, the present disclosure also provides an electronic device, comprising at least one processor, and at least one memory and a bus connected to the processor; wherein the processor and the memory communicate with each other through the bus; and the processor is used to call program instructions in the memory to execute the method of the first aspect as described above.
[0027] Compared with the prior art, the present invention has the following advantages:
[0028] The present disclosure adds a main calling function carrying a pulse test function in the periodic task of the engineering application, compiles the engineering application integrated with the pulse test engineering file and the XCP protocol calibration variable data file to obtain a target hex file, and after establishing a connection with the host computer, imports the target hex file of the engineering application and the A2L file corresponding to the XCP protocol into the host computer, and the host computer sets each calibration variable based on the XCP protocol through a calibration tool to obtain a setting result, and transmits the setting result to the engineering application, and the engineering application uses the setting result to call the pulse test engineering file to send a pulse signal to the target power semiconductor device, and uses the pulse signal to calibrate the switch tube characteristics of the target power semiconductor device. The present disclosure realizes multi-pulse testing of power semiconductor devices at the software level through the engineering application and the host computer, calibrates the power semiconductor device through software, and reduces the testing cost.
[0029] Other features and advantages of the present disclosure will be described in the following description, and partly become apparent from the description, or be understood by implementing the present disclosure. The purpose and other advantages of the present disclosure can be realized and obtained by the structures pointed out in the description, claims and drawings. BRIEF DESCRIPTION OF THE DRAWINGS
[0030] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0031] Figure 1 A schematic flow chart of a pulse testing method based on the XCP protocol according to an embodiment of the present disclosure is shown;
[0032] Figure 2 A schematic diagram of a single pulse signal according to an embodiment of the present disclosure is shown;
[0033] Figure 3 A schematic diagram of a double pulse signal according to an embodiment of the present disclosure is shown;
[0034] Figure 4 A schematic diagram of a multi-pulse signal according to an embodiment of the present disclosure is shown;
[0035] Figure 5 A schematic diagram of the structure of a pulse test device based on the XCP protocol according to an embodiment of the present disclosure is shown;
[0036] Figure 6 A schematic diagram of the structure of an electronic device according to an embodiment of the present disclosure is shown. DETAILED DESCRIPTION
[0037] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.
[0038] Figure 1 A flow chart of a pulse testing method based on the XCP protocol according to an embodiment of the present disclosure is shown. Figure 1 As shown, the pulse test method based on the XCP protocol in the embodiment of the present disclosure includes:
[0039] 101. After adding the main calling function for pulse testing to the periodic task of the engineering application and integrating the pulse testing engineering file of the target power semiconductor device and the XCP protocol calibration variable data file into the engineering application, compile and generate the target hex file of the engineering application.
[0040] Among them, the pulse test engineering file is an engineering file for pulse testing the target power semiconductor device. When the target power semiconductor device needs to be tested, the engineering application calls the pulse test engineering file through the main calling function to perform the pulse test. The XCP protocol calibration variable data file in the embodiment of the present disclosure includes various calibration variables required for pulse testing. And the embodiment of the present disclosure declares calibration variables for pulse testing in the engineering application, and each calibration variable has a different meaning. The calibration variables will be parsed and processed accordingly in the engineering application. The calibration variables can be classified according to the type into pulse emission channel, the time of the low level between two high levels (valid if it is multiple pulses), the number of pulses, the enable command (after filling the other elements of the calibration variable, set the element to enable the pulse signal to be emitted), the high level time of different pulse signals of multiple pulses, etc.
[0041] In this step, the main calling function carrying the pulse test function can be added to the periodic task of the engineering application, and the engineering application is located in the controller. Since the embodiment of the present disclosure adds the main calling function carrying the pulse test function to the periodic task, when the engineering application receives the pulse test instruction sent by the host computer during operation, that is, when the setting result is received, the main calling function can be used to call the pulse test engineering file to perform a pulse test on the target power semiconductor device. In addition, the embodiment of the present disclosure integrates the pulse test engineering file and the XCP protocol calibration variable data file into the engineering application, and compiles after the integration is completed to obtain a new hex file of the engineering application, that is, the target hex file.
[0042] 102. Establish a communication connection between the engineering application and the corresponding host computer, and import the target hex file and the A2L (ASAM MCD-2MC Language) file corresponding to the XCP protocol into the host computer.
[0043] Among them, the A2L file in the embodiment of the present disclosure includes calibration variable information for pulse control, and the calibration variable information includes calibration variable name, calibration variable data type, calibration variable data type range, calibration variable address, calibration variable initial value, etc. The data type of the calibration variable is selected by the XCP protocol through the A2L file, and the data type includes but is not limited to fl oat32, ui nt32, int32, ui nt16, int16, ui nt8, int8.
[0044] In this step, a communication connection is established between the engineering application and the corresponding host computer. After the connection, the engineering application sends the target hex file and the A2L file corresponding to the XCP protocol to the host computer, so that the host computer controls the pulse based on the target hex file A2L file and performs pulse testing on the target power semiconductor device.
[0045] 103. Based on the XCP protocol, each calibration variable is set through the calibration software in the host computer, the target hex file and the A2L file to obtain the setting results.
[0046] Among them, the calibration variables are used to perform pulse tests on the target power semiconductor devices. Each calibration variable includes pulse channel, pulse number, pulse time, pulse width, enable, etc. Enable is used to trigger the pulse signal. When the enable is set to 1, the pulse signal will be triggered. The value range of the pulse number is 1 to 10.
[0047] In this step, after the target hex file and A2L file are imported into the host computer, the staff can set the calibration variables in the calibration software of the host computer based on the XCP protocol. For example, the calibration software I NCA displays the pulse channel, pulse number, pulse time, enable and other calibration variables. The staff selects the corresponding pulse channel, sets the pulse number to 1, and the high level duration to T1. After the staff sets the enable to 1, the setting result will be generated. The setting result is transmitted to the engineering application using the XCP protocol.
[0048] 104. The engineering application triggers a pulse signal according to the setting result, and controls the target power semiconductor device to turn on or off through the pulse signal.
[0049] In this step, after receiving the setting result, the engineering application calls the pulse test engineering file through the main calling function, determines the pulse channel based on the setting result and the pulse test engineering file, and uses the pulse channel to send a pulse signal, which will be transmitted to the power semiconductor device to control the target power semiconductor device to turn on and off. Each pulse channel in the disclosed embodiment corresponds to a chip pin of a microcontroller unit (MCU). The disclosed embodiment can realize the individual control of each chip pin of the MCU, and control the chip pin to send a pulse width modulation (PWM) wave with an optional pulse number accurate to 0.1us level, and use the PWM wave to realize the control of the switch tube of the power semiconductor device. When it is necessary to test the switching characteristics of the power semiconductor device, no more than 10 pulses can be given continuously at the software level to test the switching characteristics of the power semiconductor device. The disclosed embodiment has a large number of continuous pulses, which realizes a more accurate evaluation of the power semiconductor device and the drive circuit.
[0050] For example, when a chip pin is required to test the performance of a target power semiconductor device, Figure 2 As shown in the figure, it is assumed that the pulse signal sent is a single pulse. After selecting the corresponding channel, the duration of the high level, the number of pulses as 1 and other calibration variables, the calibration quantity is transmitted to the engineering application through the XCP protocol. After the engineering application controls the pulse signal to be sent, the level of the corresponding pulse channel will be set high first, and after the high level is maintained for the first high level time T1, the level signal will be switched to a low level to complete the output of a single pulse signal.
[0051] like Figure 3 As shown, assuming that the pulse signal emitted is a double pulse, the corresponding channel is selected, the first high level duration is T1, the low level duration is T0, the second high level duration is T2, the number of pulses is 2, and the enable is set to 1, then the following steps will be executed.
[0052] First, the level of the corresponding channel is set high, and after maintaining the high level for the first high-level time T1; then the channel level signal is set low, and the low level is maintained for a duration of T0; then the channel level signal is set high, and after maintaining the high level for the second high-level time T2; then the level signal is set low to complete the transmission of the double pulse.
[0053] The process of controlling the emission of multiple pulse signals is similar to that of the double pulse, except that the number of pulses and the high-level time of each pulse signal need to be selected. The engineering application program will identify the number of given multi-pulses and the high-level time of different pulses, and then control the chip pins to emit corresponding pulse waves according to the requirements.
[0054] As Figure 4 shown, assuming that n (0 < n ≤ 10) pulse signals need to be emitted, after selecting the corresponding channel, the duration T1 of the first high level, the duration T2 of the second high level to the duration Tn of the nth high level, the duration T0 of the low level, and the number of pulses is n times and enabling, the corresponding pulse wave can be controlled to be emitted.
[0055] In an implementable manner, the engineering application program triggers a pulse signal according to the setting result, and the specific steps of controlling the target power semiconductor device to turn on or off through the pulse signal are as follows:
[0056] Step 1: Based on the XCP protocol, the host computer transmits the setting result to the engineering application program.
[0057] Step 2: The engineering application program triggers a pulse signal based on the setting result.
[0058] Among them, the enable in the setting result is set to 1.
[0059] Exemplarily, the engineering application program determines the chip pin for sending the PWM wave according to the pulse channel in the setting result; and controls the chip pin to emit the corresponding PWM wave according to the number of pulses, the high-level time of each time, and the low-level time between every two high levels in the setting result.
[0060] Step 3: The pulse signal is transmitted through the chip pin of the microcontroller unit to the switch control pin of the target power semiconductor device through the peripheral device to control the target power semiconductor device to turn on or off.
[0061] In this step, the chip pin for emitting the pulse waveform is connected to the switch control pin of the power semiconductor device through relevant peripheral devices. In the embodiment of the present disclosure, the on and off of the power semiconductor device are controlled by controlling the high and low levels of a certain number of pulses of the chip pin, and then the parameter characteristics of the power semiconductor device are tested.
[0062] The engineering application in the embodiment of the present disclosure reserves six channels for pulse testing the target power semiconductor device, so that after the pulse test is completed, when a pulse test based on a new pulse channel is required, the current pulse channel is switched to the new pulse channel. The embodiment of the present disclosure has good reusability.
[0063] The disclosed embodiment adds a main calling function carrying the pulse test function in the periodic task of the engineering application, compiles the engineering application integrated with the pulse test engineering file and the XCP protocol calibration variable data file to obtain the target hex file, and after establishing a connection with the host computer, imports the target hex file of the engineering application and the A2L file corresponding to the XCP protocol into the host computer, and the host computer sets each calibration variable based on the XCP protocol through the calibration tool to obtain the setting result, and transmits the setting result to the engineering application. The engineering application uses the setting result to call the pulse test engineering file to send a pulse signal to the target power semiconductor device, and uses the pulse signal to calibrate the switch tube characteristics of the target power semiconductor device. The disclosed embodiment realizes multi-pulse testing of power semiconductor devices at the software level through the engineering application and the host computer, calibrates the power semiconductor device through software, reduces the test cost, and simplifies the entire test process. In addition, the disclosed embodiment only requires the staff to set each calibration variable on the host computer to trigger the pulse signal during the test, so the disclosed embodiment also improves the test efficiency.
[0064] Based on the above method, the embodiment of the present disclosure provides a pulse test device based on the XCP protocol, which is used to improve and reduce the test cost. The embodiment of the device corresponds to the aforementioned method embodiment. For ease of reading, this embodiment will no longer repeat the details of the aforementioned method embodiment one by one, but it should be clear that the device in this embodiment can correspond to all the contents of the aforementioned method embodiment. Specifically, Figure 5 As shown, the device comprises:
[0065] A compiling unit 31 is used to compile and generate a target hex file of the engineering application after adding a main calling function for pulse testing to a periodic task of the engineering application and integrating a pulse testing engineering file for testing a target power semiconductor device and an XCP protocol calibration variable data file into the engineering application;
[0066] A connection unit 32 is used to establish a communication connection between the engineering application and a corresponding host computer, and import the target hex file and the A2L file corresponding to the XCP protocol into the host computer;
[0067] A setting unit 33 is used to set each calibration variable based on the XCP protocol through the calibration software in the host computer and the target hex file and the A2L file to obtain a setting result, wherein the calibration variable is used to perform a pulse test on the target power semiconductor device;
[0068] The trigger unit 34 is used for the engineering application to trigger a pulse signal according to the setting result, and control the target power semiconductor device to turn on or off through the pulse signal.
[0069] In another embodiment, based on the above embodiment, each calibration variable includes at least: a pulse channel, a pulse number, a pulse time and an enable, wherein the enable is used to trigger the pulse signal, and the pulse number has a value range of 1 to 10.
[0070] In another embodiment, based on the above embodiment, the trigger unit includes:
[0071] A first transmission module, configured to transmit the setting result to the engineering application program by the host computer based on the XCP protocol;
[0072] A trigger module, used for the engineering application to trigger a pulse signal based on the setting result, wherein the enable in the setting result is set to 1;
[0073] The second transmission module is used to transmit the pulse signal to the switch control pin of the target power semiconductor device through the chip pin of the micro control unit via the peripheral device to control the target power semiconductor device to turn on or off.
[0074] In another embodiment, based on the above embodiment, the trigger module is specifically used for:
[0075] The engineering application determines the chip pin that sends the pulse width modulation PWM wave according to the pulse channel in the setting result; and controls the chip pin to send the corresponding PWM wave according to the number of pulses in the setting result, the time of each high level, and the time of the low level between two high levels.
[0076] In another embodiment, based on the above embodiment, the engineering application reserves six channels for pulse testing the target power semiconductor device, so that after the pulse test is completed, when pulse testing based on a new pulse channel is required, the current pulse channel is switched to a new pulse channel.
[0077] In another embodiment, based on the above embodiment, the A2L file includes calibration variable information, and the calibration variable information includes calibration variable name, calibration variable data type, calibration variable data type range, calibration variable address, and calibration variable initial value.
[0078] Furthermore, the embodiment of the present disclosure also provides a processor, the processor is used to run a program, wherein the program executes the above Figure 1 The method described in .
[0079] Furthermore, the embodiment of the present disclosure also provides a storage medium, wherein the storage medium is used to store a computer program, wherein when the computer program is running, the device where the storage medium is located is controlled to execute the above Figure 1 The method described in .
[0080] Furthermore, the present disclosure provides an electronic device 4, such as Figure 6 As shown, the device includes at least one processor 41, at least one memory 42 and a bus 43 connected to the processor 41; the processor 41 and the memory 42 communicate with each other through the bus 43; the processor 41 is used to call the program instructions in the memory 42 to execute the above-mentioned pulse test method based on the XCP protocol. The device in this article can be a server, a PC, a PAD, a mobile phone, etc.
[0081] Furthermore, the present disclosure also provides a computer program product, which, when executed on a data processing device, is suitable for executing a program that initializes the steps of the inspection method for network devices as described above.
[0082] Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure.
Claims
1. A pulse test method based on XCP protocol, characterized in that: The method comprises: After adding a main calling function for pulse testing to a periodic task of an engineering application, and integrating a pulse testing engineering file for testing a target power semiconductor device and an XCP protocol calibration variable data file into the engineering application, compiling and generating a target hex file of the engineering application; Establish a communication connection between the engineering application and the corresponding host computer, and import the target hex file and the A2L file corresponding to the XCP protocol into the host computer; Based on the XCP protocol, each calibration variable is set through the calibration software in the host computer, the target hex file and the A2L file to obtain a setting result, wherein the calibration variable is used to perform a pulse test on the target power semiconductor device; The engineering application triggers a pulse signal according to the setting result, and controls the target power semiconductor device to turn on or off through the pulse signal.
2. The method according to claim 1, characterized in that Each calibration variable includes at least: a pulse channel, a pulse number, a pulse time and an enable, and the enable is used to trigger the pulse signal.
3. The method according to claim 1, characterized in that The pulse number ranges from 1 to 10.
4. The method according to claim 2, characterized in that: The engineering application triggers a pulse signal according to the setting result, and controls the target power semiconductor device to turn on or off through the pulse signal, including: Based on the XCP protocol, the host computer transmits the setting result to the engineering application; The engineering application triggers a pulse signal based on the setting result, wherein the enable in the setting result is set to 1; The pulse signal is transmitted to the switch control pin of the target power semiconductor device through the chip pin of the micro control unit via the peripheral device to control the target power semiconductor device to turn on or off.
5. The method according to claim 4, characterized in that The engineering application triggers a pulse signal based on the setting result, including: The engineering application determines the chip pin for sending the pulse width modulation (PWM) wave according to the pulse channel in the setting result; The engineering application controls the chip pin to emit a corresponding PWM wave according to the number of pulses in the setting result, the duration of each high level, and the duration of a low level between two high levels.
6. The method according to claim 1, characterized in that The engineering application reserves six channels for pulse testing the target power semiconductor device, so that after the pulse test is completed, when a pulse test needs to be performed based on a new pulse channel, the current pulse channel is switched to a new pulse channel.
7. The method according to any one of claims 1 to 6, characterized in that: The A2L file includes calibration variable information, and the calibration variable information includes calibration variable name, calibration variable data type, calibration variable data type range, calibration variable address, and calibration variable initial value.
8. A pulse test device based on XCP protocol, characterized in that: The device comprises: A compiling unit, for compiling and generating a target hex file of the engineering application after adding a main calling function for pulse testing to a periodic task of the engineering application and integrating a pulse testing engineering file for testing a target power semiconductor device and an XCP protocol calibration variable data file into the engineering application; A connection unit, used to establish a communication connection between the engineering application and a corresponding host computer, and import the target hex file and the A2L file corresponding to the XCP protocol into the host computer; A setting unit, for setting each calibration variable based on the XCP protocol through the calibration software in the host computer and the target hex file and the A2L file to obtain a setting result, wherein the calibration variable is used to perform a pulse test on the target power semiconductor device; A trigger unit is used for the engineering application to trigger a pulse signal according to the setting result, and control the target power semiconductor device to turn on or off through the pulse signal.
9. An electronic device, characterized in that: The device includes at least one processor, and at least one memory and a bus connected to the processor; wherein the processor and the memory communicate with each other through the bus; and the processor is used to call program instructions in the memory to execute the method described in any one of claims 1-7.
10. A computer storage medium, characterized in that: The storage medium is used to store a computer program, wherein when the computer program is running, the device where the storage medium is located is controlled to execute the method according to any one of claims 1 to 7.