Die capable of reducing defective rate
By introducing a thimble mechanism, quick cooling mechanism and shock absorbing mechanism into the injection mold, the positioning deviation, temperature unevenness and vibration problems during use of the mold are solved, and the effect of reducing defective rates and improving product quality is achieved.
Patent Information
- Application Number
- CN202510133684.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-06
- Publication Date
- 2025-03-21
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
During the movement of existing injection molds, due to the single guide structure and the connection parts are prone to wear, it is difficult for the upper mold and the lower mold to be accurately matched for a long time, resulting in a high defect rate.
A mold design is adopted including a thimble mechanism, a quick cooling mechanism and a shock absorbing mechanism. The thimble mechanism ensures accurate positioning of the upper mold and the lower mold through the first positioning needle. The quick cooling mechanism achieves uniform and rapid cooling by installing cooling components in the mold. The shock absorbing mechanism absorbs vibration through the guide shaft and the shock absorbing spring.
Through precise positioning, rapid cooling and reduced vibration, the product defect rate is significantly reduced, and product quality and production efficiency are improved.
Smart Images
Figure CN119658935A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of molds, and in particular to a mold capable of reducing the defective rate. Background Art
[0002] An injection mold is a tool used to manufacture injection molded products. It is an integral part of the injection molding process. During the injection molding process, the injection molding machine injects molten plastic into the mold, and the mold cavity and core are used to form the desired product shape. As the plastic cools and solidifies, the mold opens and ejects the finished product, completing the entire injection molding process.
[0003] In the related art, the injection mold is usually composed of guide pins, upper and lower mold seats, upper and lower molds and other components. The upper mold seat and the lower mold seat are both slidably connected to the guide pins. The upper mold and the lower mold are respectively arranged at the opposite ends of the upper mold seat and the lower mold seat. The upper mold and the lower mold are closed and opened by sliding the mold seat on the guide pins, and cooling pipes are arranged in the upper mold and the lower mold to realize cooling of the mold.
[0004] The above-mentioned related technologies have the following defects: the upper mold base and the lower mold base completely rely on the guide pins for guidance during movement. Due to the single guide structure and the easy wear of the connection between the guide pins and the mold base, it is difficult for the upper mold and the lower mold to match accurately for a long time, which easily leads to the production of a large number of defective products. Summary of the invention
[0005] In order to reduce the defective rate, the present application provides a mold that can reduce the defective rate.
[0006] The present application provides a mold that can reduce the defective rate by using the following technical solution: A mold capable of reducing the defective rate comprises a mold base mechanism, a lower mold, an upper mold, an ejector mechanism and a quick cooling mechanism, wherein the mold base mechanism comprises a base, a lower mold base, an upper mold base and a guide rod, wherein the base, the lower mold base and the upper mold base are distributed along the length direction of the guide rod, and in the length direction of the guide rod, the base is connected to the guide rod, and the lower mold base and the upper mold base are both slidably connected to the guide rod; The upper mold and the lower mold are both arranged between the lower mold base and the upper mold base, and the upper mold is installed on the upper mold base, and the lower mold is installed on the lower mold base; The ejector mechanism comprises a first positioning pin parallel to the guide rod, the upper mold base is provided with a first positioning hole coaxial with the first positioning pin, the first positioning pin is arranged between the upper mold and the lower mold, and one end of the first positioning pin away from the first positioning hole is connected to the lower mold; A portion of the rapid cooling mechanism is installed in the upper mold for rapidly cooling the upper mold, and another portion is installed in the lower mold for rapidly cooling the lower mold.
[0007] By adopting the above technical solution, the setting of the first positioning pin in the ejector mechanism can ensure the precise positioning between the upper mold and the lower mold, reduce the deviation between the upper mold and the lower mold during use, and thus reduce the defective rate of the product; at the same time, the rapid cooling mechanism cools the upper mold and the lower mold evenly and quickly, shortens the production cycle, and reduces product deformation caused by uneven temperature, further improving product quality.
[0008] Optionally, a shock absorbing mechanism is connected between the lower mold seat and the base, and the shock absorbing mechanism is arranged between the lower mold and the base.
[0009] By adopting the above technical solution and setting a shock absorbing mechanism, the vibration generated by the upper mold and the lower mold during the working process can be effectively absorbed and buffered, the mold mechanism can be protected, and the service life of the upper mold and the lower mold can be extended. At the same time, the impact of the vibration of the upper mold and the lower mold on the product can be reduced, and the product quality can be improved.
[0010] Optionally, a guide hole is provided along the length direction of the guide rod at one end of the lower die base away from the upper die base; The shock absorbing mechanism comprises a guide shaft and a shock absorbing spring. The guide shaft is coaxially arranged in the guide hole and connected to the base. The shock absorbing spring is coaxially sleeved on the guide shaft and located between the base and the lower mold.
[0011] By adopting the above technical solution, through the cooperation of the guide shaft and the shock-absorbing spring, when the upper mold and the lower mold are closed, the vibration caused by the impact of the upper mold and the lower mold can be effectively reduced, the impact of the vibration of the upper mold and the lower mold on the product can be reduced, and the product quality can be improved.
[0012] Optionally, the shock absorbing mechanism further includes a buffer swing shaft, which intersects with the guide shaft and has one end connected to the lower mold, and the other end is provided with a hinge, and the hinge is slidably connected to the base in the radial direction of the guide shaft.
[0013] By adopting the above technical solution, the buffer swing shaft is used to connect the lower mold and the base to define the relative position between the lower mold and the base. When the lower mold approaches the base, the buffer swing shaft bends and slides on the base to relieve the impact on the lower mold. By adding the buffer swing shaft, the shock absorption effect is further enhanced, and the stability of the upper mold and the lower mold when the mold is closed is improved.
[0014] Optionally, the ejector mechanism further includes a second positioning needle parallel to the guide rod; The second positioning pin is arranged between the base and the lower die base, and one end away from the lower die base is connected to the base; A second positioning hole coaxial with the second positioning pin is provided at one end of the lower mold base away from the upper mold base.
[0015] By adopting the above technical solution, the second positioning pin provides an additional positioning function, provides additional positioning for the movement of the lower mold, and further ensures the precise positioning of the base and the lower mold.
[0016] Optionally, the rapid cooling mechanism includes a lower cooling component and an upper cooling component, the lower cooling component is installed in the lower mold, and the upper cooling component is installed in the upper mold.
[0017] By adopting the above technical solution, the rapid cooling mechanism is divided into a lower cooling component and an upper cooling component, which are respectively installed in the lower mold and the upper mold, thereby achieving uniform and rapid cooling of the mold.
[0018] Optionally, the lower cooling assembly includes a plurality of first lower cooling tubes and a plurality of second lower cooling tubes, wherein the first lower cooling tubes and the second lower cooling tubes are both arranged between the lower mold and the lower mold base, and are both in contact with the lower mold; Two ends of the first lower cooling tube are respectively located on both sides of the length direction of the lower mold, and a plurality of the first lower cooling tubes are distributed along the width direction of the lower mold; Two ends of the second lower cooling tube are respectively located on both sides of the width direction of the lower mold, and a plurality of the second lower cooling tubes are distributed along the length direction of the lower mold.
[0019] By adopting the above technical solution, multiple first lower cooling tubes and multiple second lower cooling tubes are arranged in a staggered manner, thereby achieving uniform cooling of the lower mold. The paths of the first lower cooling tubes and the second lower cooling tubes in the lower mold are shortened as much as possible, so that the coolant can quickly pass through the lower mold, thereby improving the cooling efficiency.
[0020] Optionally, the upper cooling assembly includes a plurality of first upper cooling tubes and a plurality of second upper cooling tubes, and the first upper cooling tubes and the second upper cooling tubes are both arranged in the upper mold; Two ends of the first upper cooling tube are respectively located on both sides of the length direction of the upper mold, and a plurality of the first upper cooling tubes are distributed along the width direction of the upper mold; Two ends of the second upper cooling tube are respectively located on both sides of the width direction of the upper mold, and a plurality of the second upper cooling tubes are distributed along the length direction of the upper mold.
[0021] By adopting the above technical solution, multiple first upper cooling tubes and multiple second upper cooling tubes are arranged in a staggered manner, thereby achieving uniform cooling of the lower mold. The paths of the first upper cooling tubes and the second upper cooling tubes in the upper mold are shortened as much as possible, so that the coolant can quickly pass through the upper mold, thereby improving the cooling efficiency.
[0022] Optionally, the upper cooling assembly includes a tapered liquid inlet pipe and a plurality of liquid outlet pipes, the upper mold base is provided with a countersunk hole at one end away from the upper mold, the end with a larger diameter of the tapered liquid inlet pipe is installed in the countersunk hole, and the end with a smaller diameter of the tapered liquid inlet pipe is installed in the middle of the upper mold; The liquid outlet pipe is arranged between the first upper cooling pipe and the second upper cooling pipe, and the liquid inlet ends of the plurality of liquid outlet pipes are connected to the end with the smaller diameter of the conical liquid inlet pipe, and the liquid outlet ends of the plurality of liquid outlet pipes are distributed along the circumference of the conical liquid inlet pipe.
[0023] By adopting the above technical solution, the conical liquid inlet pipe design is set through the countersunk hole, which shortens the length of the conical liquid inlet pipe, reduces the material usage, and improves the cooling efficiency. Through the conical liquid inlet pipe and multiple liquid outlet pipes distributed along the circumference of the conical liquid inlet pipe, the coolant is evenly distributed and quickly circulated, further improving the cooling effect.
[0024] In summary, the present application includes at least one of the following beneficial technical effects: 1. The present application adopts a ejector pin mechanism, which includes a first positioning pin and a second positioning pin parallel to the guide rod. The first positioning pin can ensure accurate positioning between the upper mold and the lower mold, and the second positioning pin can ensure accurate positioning between the lower mold and the base, thereby reducing the deviation between the upper mold and the lower mold during use, thereby reducing the defective rate of the product.
[0025] 2. In this application, by setting up a shock-absorbing mechanism and utilizing the dual buffering of a shock-absorbing spring and a buffer swing shaft, the vibration generated by the mold during operation is effectively absorbed and buffered, thereby protecting the mold mechanism and extending the service life of the mold.
[0026] 3. In the present application, the lower cooling assembly and the upper cooling assembly are respectively installed in the lower mold and the upper mold, which realizes uniform and rapid cooling of the lower mold and the upper mold, shortens the production cycle, reduces product deformation caused by uneven temperature, and improves product quality. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0028] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application; Figure 2 It is the installation diagram of the ejector mechanism and the shock absorbing mechanism; Figure 3 yes Figure 2 Front view of Figure 4 is a schematic diagram of the structure of the lower cooling assembly; Figure 5 It is a schematic diagram of the structure of the upper cooling assembly.
[0029] Reference numerals: 1. Die base mechanism; 11. Base; 12. Lower die base; 1201. Second positioning hole; 1202. Guide hole; 13. Upper die base; 1301. First positioning hole; 1302. Countersunk hole; 14. Guide rod; 2. Lower die; 20. Upper die; 3. Ejector mechanism; 31. First positioning pin; 32. Second positioning pin; 4. Quick cooling mechanism; 41. Lower cooling assembly; 411. First lower cooling pipe; 412. Second lower cooling pipe; 413. Heat conducting member; 42. Upper cooling assembly; 421. First upper cooling pipe; 422. Second upper cooling pipe; 423. Conical liquid inlet pipe; 424. Liquid outlet pipe; 5. Shock absorbing mechanism; 51. Guide shaft; 52. Shock absorbing spring; 53. Buffer swing shaft; 54. Hinge. DETAILED DESCRIPTION
[0030] The following is combined with Figure 1-5 This application is described in further detail.
[0031] The present application embodiment discloses a mold that can reduce the defective rate. Figure 1 A mold capable of reducing the defective rate includes a mold base mechanism 1, a lower mold 2, an upper mold 20, an ejector mechanism 3 and a quick cooling mechanism 4. The mold base mechanism 1 includes a base 11, a lower mold base 12, an upper mold base 13 and a plurality of guide rods 14, and the plurality of guide rods 14 are parallel to each other. The base 11, the lower mold base 12 and the upper mold base 13 are distributed along the length direction of the guide rods 14, and in the length direction of the guide rods 14, the base 11 is connected to the plurality of guide rods 14, and the lower mold base 12 and the upper mold base 13 are both slidably connected to the guide rods 14.
[0032] Reference Figure 1 and Figure 2 The upper mold 20 and the lower mold 2 are both arranged between the lower mold base 12 and the upper mold base 13, and the upper mold 20 is installed on the upper mold base 13, and the lower mold 2 is installed on the lower mold base 12. By moving the upper mold base 13 and the lower mold base 12 on the guide rod 14, the relative position between the upper mold 20 and the lower mold 2 is adjusted to realize the mold closing and mold opening between the upper mold 20 and the lower mold 2.
[0033] Reference Figure 1 and Figure 2 The ejector mechanism 3 includes a first positioning pin 31 parallel to the guide rod 14, and the upper mold base 13 is provided with a first positioning hole 1301 coaxial with the first positioning pin 31. The first positioning pin 31 is arranged between the upper mold 20 and the lower mold 2, and one end away from the first positioning hole 1301 is connected to the lower mold 2. A part of the rapid cooling mechanism 4 is installed in the upper mold 20 for rapidly cooling the upper mold 20, and the other part is installed in the lower mold 2 for rapidly cooling the lower mold 2.
[0034] Reference Figure 1 and Figure 2 In the embodiment of the present application, a plurality of first positioning pins 31 and a plurality of first positioning holes 1301 are provided, and the plurality of first positioning pins 31 and the plurality of first positioning holes 1301 are provided correspondingly, and the lengths of the plurality of first positioning pins 31 are not consistent. When the upper mold 20 and the lower mold 2 are closed, each first positioning pin 31 needs to extend into the corresponding first positioning hole 1301. The provision of a plurality of first positioning pins 31 of different lengths can ensure the precise positioning between the upper mold 20 and the lower mold 2, reduce the deviation of the upper mold 20 and the lower mold 2 during use, and thus reduce the defective rate of the product. At the same time, the rapid cooling mechanism 4 evenly and rapidly cools the upper mold 20 and the lower mold 2, shortens the production cycle, reduces product deformation caused by uneven temperature, and further improves product quality.
[0035] Reference Figure 2 and Figure 3 A shock absorbing mechanism 5 is connected between the lower die seat 12 and the base 11, and the shock absorbing mechanism 5 is arranged between the lower die 2 and the base 11. A guide hole 1202 arranged along the length direction of the guide rod 14 is provided at one end of the lower die seat 12 away from the upper die seat 13. The shock absorbing mechanism 5 includes a guide shaft 51, a shock absorbing spring 52 and a buffer swing shaft 53. The guide shaft 51 is coaxially arranged in the guide hole 1202 and connected to the base 11. The shock absorbing spring 52 is coaxially sleeved on the guide shaft 51 and is located between the base 11 and the lower die 2. The buffer swing shaft 53 intersects with the guide shaft 51, and one end is connected to the lower die 2, and the other end is provided with a hinge 54, and the hinge 54 is slidably connected to the base 11 in the radial direction of the guide shaft 51.
[0036] Reference Figure 2 and Figure 3In the embodiment of the present application, through the cooperation of the guide shaft 51 and the shock absorbing spring 52, when the upper mold 20 and the lower mold 2 are closed, the vibration caused by the collision between the upper mold 20 and the lower mold 2 can be effectively reduced, and the influence of the vibration of the upper mold 20 and the lower mold 2 on the product can be reduced, thereby improving the product quality. The buffer swing shaft 53 is used to connect the lower mold 2 and the base 11, and define the relative position between the lower mold 2 and the base 11, so that the lower mold 2 can be raised and lowered within a certain range. When the lower mold 2 approaches the base 11, the buffer swing shaft 53 bends and slides on the base 11 to alleviate the impact on the lower mold 2. By adding the buffer swing shaft 53, the shock absorbing effect is further enhanced, and the stability of the upper mold 20 and the lower mold 2 when closing the mold is improved.
[0037] Reference Figure 1 , Figure 2 and Figure 3 The ejector mechanism 3 further includes a second positioning pin 32 parallel to the guide rod 14. The second positioning pin 32 is disposed between the base 11 and the lower die base 12, and one end away from the lower die base 12 is connected to the base 11. The end of the lower die base 12 away from the upper die base 13 is provided with a second positioning hole 1201 coaxial with the second positioning pin 32.
[0038] Reference Figure 1 , Figure 2 and Figure 3 In the embodiment of the present application, a plurality of second positioning pins 32 and second positioning holes 1201 are provided, and the plurality of second positioning pins 32 and the plurality of second positioning holes 1201 are provided correspondingly, and the lengths of the plurality of second positioning pins 32 are not consistent. When the lower mold 2 and the base 11 are close to each other, each second positioning pin 32 needs to extend into the corresponding second positioning hole 1201. The second positioning pins 32 provide an additional positioning function, and provide additional positioning for the movement of the lower mold 2, so that the base 11 and the lower mold 2 can be accurately positioned when the shock absorbing mechanism 5 is in operation.
[0039] Reference Figure 3 , Figure 4 and Figure 5 The rapid cooling mechanism 4 includes a lower cooling component 41 and an upper cooling component 42. The lower cooling component 41 is installed in the lower mold 2 for cooling the lower mold 2. The upper cooling component 42 is installed in the upper mold 20 for cooling the upper mold 20.
[0040] Reference Figure 3 , Figure 4 and Figure 5The lower cooling assembly 41 includes a plurality of first lower cooling tubes 411 and a plurality of second lower cooling tubes 412. The first lower cooling tubes 411 and the second lower cooling tubes 412 are both arranged between the lower mold 2 and the lower mold base 12, and are both in contact with the lower mold 2. A heat conductor 413 is also connected between the lower mold 2. The heat conductor 413 is used to transfer the heat on the lower mold 2 to the first lower cooling tubes 411 and the second lower cooling tubes 412. The two ends of the first lower cooling tube 411 are respectively located on both sides of the length direction of the lower mold 2, and the plurality of first lower cooling tubes 411 are distributed along the width direction of the lower mold 2. The two ends of the second lower cooling tube 412 are respectively located on both sides of the width direction of the lower mold 2, and the plurality of second lower cooling tubes 412 are distributed along the length direction of the lower mold 2. The plurality of first lower cooling tubes 411 and the plurality of second lower cooling tubes 412 are arranged in a staggered manner to achieve uniform cooling of the lower mold 2. The paths of the first lower cooling tube 411 and the second lower cooling tube 412 in the lower mold 2 are shortened as much as possible, so that the coolant can quickly pass through the lower mold 2, quickly cool the lower mold 2, and improve the cooling efficiency.
[0041] Reference Figure 1 , Figure 4 and Figure 5 The upper cooling assembly 42 includes a plurality of first upper cooling tubes 421 and a plurality of second upper cooling tubes 422, and the first upper cooling tubes 421 and the second upper cooling tubes 422 are both arranged in the upper mold 20. The two ends of the first upper cooling tube 421 are respectively located on both sides of the length direction of the upper mold 20, and the plurality of first upper cooling tubes 421 are distributed along the width direction of the upper mold 20. The two ends of the second upper cooling tube 422 are respectively located on both sides of the width direction of the upper mold 20, and the plurality of second upper cooling tubes 422 are distributed along the length direction of the upper mold 20. The plurality of first upper cooling tubes 421 and the plurality of second upper cooling tubes 422 are arranged in an interlaced manner to achieve uniform cooling of the lower mold 2. The paths of the first upper cooling tubes 421 and the second upper cooling tubes 422 in the upper mold 20 are shortened as much as possible, so that the coolant can quickly pass through the upper mold 20, quickly cool down the upper mold 20, and improve the cooling efficiency.
[0042] Reference Figure 1 and Figure 5The upper cooling assembly 42 includes a conical liquid inlet pipe 423 and a plurality of liquid outlet pipes 424. A countersunk hole 1302 is provided at one end of the upper mold base 13 away from the upper mold 20. The end of the conical liquid inlet pipe 423 with a larger diameter is installed in the countersunk hole 1302, and the end of the conical liquid inlet pipe 423 with a smaller diameter is installed in the middle of the upper mold 20. The liquid outlet pipe 424 is arranged between the first upper cooling pipe 421 and the second upper cooling pipe 422. The liquid inlet ends of the plurality of liquid outlet pipes 424 are all connected to the end of the conical liquid inlet pipe 423 with a smaller diameter, and the liquid outlet ends of the plurality of liquid outlet pipes 424 are all distributed along the circumference of the conical liquid inlet pipe 423. The design of setting the conical liquid inlet pipe 423 through the countersunk hole 1302 shortens the length of the conical liquid inlet pipe 423, reduces the material usage, and improves the cooling efficiency. Through the tapered liquid inlet pipe 423 and the plurality of liquid outlet pipes 424 distributed circumferentially along the tapered liquid inlet pipe 423, uniform distribution and rapid circulation of the coolant are achieved, further improving the cooling effect.
[0043] The implementation principle of a mold that can reduce the defective rate in the embodiment of the present application is: By moving the upper mold base 13 and the lower mold base 12 on the guide rod 14, the relative position between the upper mold 20 and the lower mold 2 is adjusted to achieve mold closing and mold opening between the upper mold 20 and the lower mold 2.
[0044] The arrangement of the first positioning pin 31 in cooperation with the guide rod 14 can ensure accurate positioning between the upper mold 20 and the lower mold 2 , reduce deviations between the upper mold 20 and the lower mold 2 during use, and thus reduce the defective rate of products.
[0045] Through the cooperation of the guide shaft 51 and the shock-absorbing spring 52, when the upper mold 20 and the lower mold 2 are closed, the vibration caused by the impact of the upper mold 20 and the lower mold 2 can be effectively reduced, the impact of the vibration of the upper mold 20 and the lower mold 2 on the product can be reduced, and the product quality can be improved.
[0046] The second positioning pin 32 cooperates with the guide rod 14 to provide an additional positioning function, providing additional positioning for the lower mold 2 when it moves toward the base 11, so that the base 11 and the lower mold 2 can be accurately positioned when the shock absorbing mechanism 5 is in operation.
[0047] The lower cooling assembly 41 and the upper cooling assembly 42 are respectively installed in the lower mold 2 and the upper mold 20 , thereby achieving uniform and rapid cooling of the lower mold 2 and the upper mold 20 .
[0048] Unless otherwise defined, the technical terms or scientific terms used in this application should be understood by people with ordinary skills in the field to which this application belongs. The words "first", "second", "third" and similar words used in the specification and claims of this application do not indicate any order, quantity or importance, but are only used to distinguish different components. "One" or "one" and similar words do not indicate a quantitative limit, but indicate that there is at least one. "Include" or "comprise" and similar words mean that the elements or objects appearing before "include" or "comprise" include the elements or objects listed after "include" or "comprise" and their equivalents, and do not exclude other elements or objects. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.
[0049] The above are all optional embodiments of the present application, and are not intended to limit the protection scope of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.
Claims
1. A mold capable of reducing the defective rate, characterized in that: The invention comprises a die base mechanism (1), a lower die (2), an upper die (20), an ejector mechanism (3) and a quick cooling mechanism (4); the die base mechanism (1) comprises a base (11), a lower die base (12), an upper die base (13) and a guide rod (14); the base (11), the lower die base (12) and the upper die base (13) are distributed along the length direction of the guide rod (14); and in the length direction of the guide rod (14), the base (11) is connected to the guide rod (14); and the lower die base (12) and the upper die base (13) are both slidably connected to the guide rod (14); The upper mold (20) and the lower mold (2) are both arranged between the lower mold base (12) and the upper mold base (13), and the upper mold (20) is mounted on the upper mold base (13), and the lower mold (2) is mounted on the lower mold base (12); The ejector mechanism (3) comprises a first positioning pin (31) parallel to the guide rod (14); the upper die seat (13) is provided with a first positioning hole (1301) coaxial with the first positioning pin (31); the first positioning pin (31) is arranged between the upper die (20) and the lower die (2), and an end of the first positioning pin (31) away from the first positioning hole (1301) is connected to the lower die (2); A portion of the rapid cooling mechanism (4) is installed in the upper mold (20) for rapidly cooling the upper mold (20), and another portion of the rapid cooling mechanism (4) is installed in the lower mold (2) for rapidly cooling the lower mold (2).
2. A mold capable of reducing defective product rate according to claim 1, characterized in that: A shock absorbing mechanism (5) is connected between the lower die seat (12) and the base (11); the shock absorbing mechanism (5) is arranged between the lower die (2) and the base (11).
3. A mold capable of reducing defective product rate according to claim 2, characterized in that: An end of the lower die base (12) away from the upper die base (13) is provided with a guide hole (1202) arranged along the length direction of the guide rod (14); The shock absorbing mechanism (5) comprises a guide shaft (51) and a shock absorbing spring (52); the guide shaft (51) is coaxially arranged in the guide hole (1202) and connected to the base (11); the shock absorbing spring (52) is coaxially sleeved on the guide shaft (51) and located between the base (11) and the lower mold (2).
4. A mold capable of reducing defective product rate according to claim 3, characterized in that: The damping mechanism (5) further comprises a buffer swing shaft (53), the buffer swing shaft (53) intersecting with the guide shaft (51), one end of which is connected to the lower mold (2), and the other end of which is provided with a hinge (54), and the hinge (54) is slidably connected to the base (11) in the radial direction of the guide shaft (51).
5. A mold capable of reducing defective product rate according to claim 4, characterized in that: The ejector mechanism (3) further comprises a second positioning needle (32) parallel to the guide rod (14); The second positioning pin (32) is arranged between the base (11) and the lower die base (12), and one end away from the lower die base (12) is connected to the base (11); A second positioning hole (1201) coaxial with the second positioning pin (32) is provided at one end of the lower mold base (12) away from the upper mold base (13).
6. A mold capable of reducing defective product rate according to claim 1, characterized in that: The rapid cooling mechanism (4) comprises a lower cooling component (41) and an upper cooling component (42); the lower cooling component (41) is installed in the lower mold (2), and the upper cooling component (42) is installed in the upper mold (20).
7. A mold capable of reducing defective product rate according to claim 6, characterized in that: The lower cooling assembly (41) comprises a plurality of first lower cooling tubes (411) and a plurality of second lower cooling tubes (412), wherein the first lower cooling tubes (411) and the second lower cooling tubes (412) are both arranged between the lower mold (2) and the lower mold base (12), and are both in contact with the lower mold (2); Two ends of the first lower cooling tube (411) are respectively located on both sides of the length direction of the lower mold (2), and a plurality of the first lower cooling tubes (411) are distributed along the width direction of the lower mold (2); Two ends of the second lower cooling tube (412) are respectively located on both sides of the width direction of the lower mold (2), and a plurality of the second lower cooling tubes (412) are distributed along the length direction of the lower mold (2).
8. A mold capable of reducing defective product rate according to claim 6, characterized in that: The upper cooling assembly (42) comprises a plurality of first upper cooling tubes (421) and a plurality of second upper cooling tubes (422), wherein the first upper cooling tubes (421) and the second upper cooling tubes (422) are both arranged in the upper mold (20); Two ends of the first upper cooling tube (421) are respectively located on both sides of the length direction of the upper mold (20), and a plurality of the first upper cooling tubes (421) are distributed along the width direction of the upper mold (20); Two ends of the second upper cooling tube (422) are respectively located on both sides of the width direction of the upper mold (20), and a plurality of the second upper cooling tubes (422) are distributed along the length direction of the upper mold (20).
9. A mold capable of reducing defective product rate according to claim 8, characterized in that: The upper cooling assembly (42) comprises a conical liquid inlet pipe (423) and a plurality of liquid outlet pipes (424); a countersunk hole (1302) is provided at one end of the upper mold base (13) away from the upper mold (20); an end of the conical liquid inlet pipe (423) with a larger diameter is installed in the countersunk hole (1302); and an end of the conical liquid inlet pipe (423) with a smaller diameter is installed in the middle of the upper mold (20); The liquid outlet pipe (424) is arranged between the first upper cooling pipe (421) and the second upper cooling pipe (422), and the liquid inlet ends of the plurality of liquid outlet pipes (424) are all connected to the end with a smaller diameter of the conical liquid inlet pipe (423), and the liquid outlet ends of the plurality of liquid outlet pipes (424) are all distributed along the circumference of the conical liquid inlet pipe (423).