Wafer detection method based on line-scan digital camera, image splicing method based on line-scan digital camera and equipment

Abstract

The invention provides a wafer detection method based on a line-scan digital camera, and an image splicing method and device. The wafer detection method comprises the following steps: controlling a wafer to be detected to move according to a spiral line track; in the moving process of the to-be-detected wafer, image acquisition is carried out on the to-be-detected wafer by using the line-scan digital camera to obtain a plurality of line images output by the line-scan digital camera. And carrying out image splicing based on a plurality of line images output by the line-scan digital camera, and determining a wafer image. Therefore, the to-be-detected wafer can be detected based on the wafer image. Through the method, the to-be-detected wafer can be controlled to move according to the spiral line track, so that the line-scan digital camera can scan all the to-be-detected wafers through one-time scanning, then the wafer image is obtained through image splicing for detection, the to-be-detected wafer does not need to be moved many times, the wafer detection time can be shortened, and the detection efficiency is improved. And the wafer detection efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of image processing technology, and in particular to a wafer detection method, image stitching method and device based on a linear array camera. Background Art

[0002] Since semiconductors are highly precise and complex, every step in the semiconductor manufacturing process has extremely high requirements. As the basic material for manufacturing semiconductors, the quality of wafers directly affects the performance of the final manufactured semiconductors. Therefore, during the semiconductor manufacturing process, wafers need to be inspected for defects to ensure that the quality of the wafers meets the design requirements.

[0003] During wafer inspection, a linear array camera is usually used to capture images of the wafer. That is, the wafer is controlled to move in a straight line, and the linear array camera captures images of the wafer line by line during the movement, and the wafer is inspected based on the captured images. However, when scanning line by line, the position of the wafer needs to be readjusted before scanning, that is, the position of the wafer needs to be re-moved multiple times during the scanning of the entire wafer, and the scanning time is long, which also leads to a longer wafer inspection time, affecting the efficiency of wafer inspection. Summary of the invention

[0004] In view of this, the present application is committed to providing a wafer inspection method, image stitching method and equipment based on a linear array camera, so as to reduce the time of wafer inspection and improve the efficiency of wafer inspection.

[0005] In a first aspect, the present application provides a wafer inspection method based on a linear array camera, the method comprising:

[0006] Control the wafer to be inspected to move along a spiral trajectory;

[0007] During the movement of the wafer to be inspected, using a linear array camera to collect images of the wafer to be inspected to obtain a plurality of line images;

[0008] determining a wafer image based on a plurality of the row images;

[0009] The wafer to be inspected is inspected based on the wafer image.

[0010] In a possible implementation manner, determining a wafer image based on a plurality of row images includes:

[0011] For each pixel point in the row image, determining a wafer position corresponding to the pixel point in the wafer to be inspected, wherein the wafer position represents a position in a wafer coordinate system;

[0012] Performing conversion based on the wafer coordinate system and the wafer image coordinate system, converting the wafer position to obtain an image position in the wafer image coordinate system;

[0013] The pixel value of the pixel point corresponding to the image position is determined based on the pixel value of the pixel point to obtain the wafer image.

[0014] In a possible implementation, the performing conversion based on the wafer coordinate system and the wafer image coordinate system to convert the wafer position to obtain the image position in the wafer image coordinate system includes:

[0015] Determining the length of the actual space represented by each pixel in the wafer image coordinate system;

[0016] Determining the size of the wafer image based on the length and the size of the wafer to be inspected;

[0017] The image position is obtained by performing calculation based on the wafer position, the length, and the size of the wafer image.

[0018] In a possible implementation, the wafer position includes a first horizontal coordinate and a first vertical coordinate, the image position includes a second horizontal coordinate and a second vertical coordinate, and the image position is obtained by calculating based on the wafer position, the length, and the size of the wafer image, including:

[0019] Calculating a first ratio of the first abscissa to the length and a second ratio of the first ordinate to the length;

[0020] The second abscissa is determined based on half of the lateral length of the wafer image and the sum of the first ratio, and the second ordinate is determined based on half of the longitudinal length of the wafer image and the sum of the second ratio.

[0021] In a possible implementation manner, determining the wafer position corresponding to the pixel point in the wafer to be inspected includes:

[0022] Obtaining the encoded data of the middle pixel point of the row image;

[0023] Determining the encoding data of the remaining pixels in the row image based on the relative position relationship between the remaining pixels in the row image and the middle pixel;

[0024] Based on the coded data, determine the wafer position corresponding to the corresponding pixel point in the wafer to be inspected.

[0025] In a possible implementation, the starting position of the wafer to be inspected satisfies: the edge position of the wafer to be inspected is located below the linear array camera;

[0026] The condition for the wafer to be inspected to stop moving includes: the wafer to be inspected moves laterally along the diameter direction until the center of the wafer to be inspected is located below the linear array camera.

[0027] In a possible implementation, controlling the wafer to be inspected to move along a spiral trajectory includes:

[0028] The wafer to be inspected is controlled to rotate at a preset rotation speed and to move laterally at a preset speed, and a trajectory of the lateral movement matches the diameter of the wafer to be inspected.

[0029] In a second aspect, the present application provides an image stitching method based on a line array camera, the method comprising:

[0030] For each pixel point in a line image output by a line array camera, determining a first position corresponding to the pixel point in a photographed object, wherein the line image is an image of the photographed object captured by the line array camera;

[0031] Performing conversion based on the coordinate system of the photographed object and the target image coordinate system, converting the first position to obtain a second position in the target image coordinate system;

[0032] The pixel value of the pixel point corresponding to the second position is determined based on the pixel value of the pixel point to obtain a target image of the photographed object.

[0033] In a possible implementation, the performing the conversion based on the coordinate system of the photographed object and the target image coordinate system to convert the first position to obtain a second position in the target image coordinate system includes:

[0034] Determine the length of the actual space represented by each pixel in the target image coordinate system;

[0035] Determine the size of the target image based on the length and the size of the photographed object;

[0036] The second position is obtained by performing calculation based on the first position, the length, and the size of the target image.

[0037] In a possible implementation, the first position includes a first horizontal coordinate and a first vertical coordinate, the second position includes a second horizontal coordinate and a second vertical coordinate, and the calculation based on the first position, the length, and the size of the target image to obtain the second position includes:

[0038] Calculating a first ratio of the first abscissa to the length and a second ratio of the first ordinate to the length;

[0039] The second abscissa is determined based on half of the horizontal length of the target image and the sum of the first ratio, and the second ordinate is determined based on half of the vertical length of the target image and the sum of the second ratio.

[0040] In a possible implementation manner, determining the first position corresponding to the pixel point in the photographed object includes:

[0041] Obtaining the encoding data of the target pixel point of the row image;

[0042] Determining the encoding data of the remaining pixels in the row image based on the relative position relationship between the remaining pixels in the row image and the target pixel;

[0043] Based on the encoded data, it is determined that a corresponding pixel point corresponds to a first position in the photographed object.

[0044] In a possible implementation manner, the photographed object moves along a spiral trajectory, and the line array camera captures the photographed object during the movement of the photographed object.

[0045] In a possible implementation, the photographed object is a circular object, and the starting position of the photographed object satisfies: the edge position of the photographed object is located below the line array camera; the condition for the photographed object to stop moving includes: the photographed object moves laterally along the diameter direction until the center of the circle of the photographed object is located below the line array camera.

[0046] In a third aspect, the present application provides a wafer inspection device based on a linear array camera, the device comprising:

[0047] A moving unit, used for controlling the wafer to be inspected to move along a spiral trajectory;

[0048] An image acquisition unit, used to acquire images of the wafer to be inspected by using a linear array camera during the movement of the wafer to be inspected, so as to obtain a plurality of line images;

[0049] An image determination unit, configured to determine a wafer image based on a plurality of row images;

[0050] A detection unit is used to detect the wafer to be detected based on the wafer image.

[0051] In a fourth aspect, the present application provides an image stitching device based on a line array camera, the device comprising:

[0052] a position determination unit, configured to determine, for each pixel point in a line image output by the line array camera, a first position corresponding to the pixel point in the photographed object, wherein the line image is an image of the photographed object captured by the line array camera;

[0053] a conversion unit, configured to perform conversion based on a coordinate system of the photographed object and a target image coordinate system, and convert the first position into a second position in the target image coordinate system;

[0054] An image stitching unit is used to determine the pixel value of the pixel point corresponding to the second position based on the pixel value of the pixel point to obtain a target image of the photographed object.

[0055] In a fifth aspect, the present application provides an electronic device, the device comprising: a memory and a processor;

[0056] The memory is used to store relevant program codes;

[0057] The processor is used to call the program code to execute the wafer inspection method based on a line array camera described in any implementation manner of the first aspect or the image stitching method based on a line array camera described in any implementation manner of the second aspect.

[0058] In a sixth aspect, the present application provides a computer-readable storage medium, wherein the computer-readable storage medium is used to store a computer program, and the computer program is used to execute the wafer inspection method based on a linear array camera described in any implementation manner of the first aspect or the image stitching method based on a linear array camera described in any implementation manner of the second aspect.

[0059] In the seventh aspect, the present application provides a computer program product, which includes a computer program / instructions, and when the computer program / instructions are executed by a processor, it implements the wafer inspection method based on the line array camera described in any implementation manner of the first aspect or the image stitching method based on the line array camera described in any implementation manner of the second aspect.

[0060] In the above-mentioned implementation of the present application, in order to inspect the wafer to be inspected, it is necessary to control the wafer to be inspected to move along a spiral trajectory. In the process of the movement of the wafer to be inspected, a linear array camera is used to capture images of the wafer to be inspected, and multiple row images output by the linear array camera are obtained. Image stitching is performed based on the multiple row images output by the linear array camera to determine the wafer image. Thus, the wafer to be inspected can be inspected based on the wafer image. Through the method provided in the present application, the wafer to be inspected can be controlled to move along a spiral trajectory, so that the linear array camera can scan all the wafers to be inspected through a one-time scan, and then the wafer image is obtained by image stitching for inspection, without moving the wafer to be inspected multiple times, thereby reducing the wafer inspection time and improving the efficiency of wafer inspection. BRIEF DESCRIPTION OF THE DRAWINGS

[0061] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. It is obvious that the drawings described below are only some embodiments provided in the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0062] Figure 1 A schematic diagram of an application scenario provided in an embodiment of the present application;

[0063] Figure 2 A flow chart of a wafer inspection method based on a linear array camera provided in an embodiment of the present application;

[0064] Figure 3 A schematic diagram of movement of a wafer to be inspected provided in an embodiment of the present application;

[0065] Figure 4a A schematic diagram of a wafer coordinate system provided in an embodiment of the present application;

[0066] Figure 4b A schematic diagram of a wafer image coordinate system provided in an embodiment of the present application;

[0067] Figure 5 A flow chart of an image stitching method based on a line array camera provided in an embodiment of the present application;

[0068] Figure 6 A schematic diagram of a wafer inspection device based on a linear array camera provided in an embodiment of the present application;

[0069] Figure 7 A schematic diagram of an image stitching device based on a line array camera provided in an embodiment of the present application;

[0070] Figure 8 A schematic diagram of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0071] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. The described embodiments are only exemplary implementation methods of the present application, not all implementation methods. Those skilled in the art can combine the embodiments of the present application to obtain other embodiments without creative work, and these embodiments are also within the scope of protection of the present application.

[0072] During wafer inspection, a linear array camera is usually used to capture images of the wafer. That is, the wafer is controlled to move in a straight line, and the linear array camera captures images of the wafer line by line during the movement, and the wafer is inspected based on the captured images. However, when scanning line by line, the position of the wafer needs to be readjusted before scanning, that is, the position of the wafer needs to be re-moved multiple times during the scanning of the entire wafer, and the scanning time is long, which also leads to a longer wafer inspection time, affecting the efficiency of wafer inspection.

[0073] Based on this, an embodiment of the present application provides a wafer detection method based on a linear array camera, so as to reduce the time of wafer detection and improve the efficiency of wafer detection. In specific implementation, at the beginning of the detection, the wafer to be detected is controlled to move along a spiral trajectory. In the process of the movement of the wafer to be detected, the linear array camera is used to capture images of the wafer to be detected, and multiple row images output by the linear array camera are obtained. Image stitching is performed based on the multiple row images output by the linear array camera to determine the wafer image. Thus, the wafer to be detected can be detected based on the wafer image. Through the method provided by the present application, the wafer to be detected can be controlled to move along a spiral trajectory, so that the linear array camera can scan all the wafers to be detected through a one-time scan, and then the wafer image is obtained by image stitching for detection, without moving the wafer to be detected multiple times, thereby reducing the time of wafer detection and improving the efficiency of wafer detection.

[0074] In order to facilitate the understanding of the technical solution provided by the embodiments of the present application, a detailed introduction will be given below in conjunction with the drawings of the embodiments.

[0075] See also Figure 1 As shown, Figure 1 A schematic diagram of an application scenario provided for an embodiment of the present application.

[0076] In this application scenario, the wafer to be inspected is placed on a moving table, and the wafer to be inspected can move with the moving table, that is, the moving table can move with the wafer to be inspected. For example, the wafer to be inspected can be placed on the moving table by adsorption.

[0077] During the inspection process, the moving stage can be controlled to move along a spiral trajectory with the wafer to be inspected. That is, the wafer to be inspected is controlled to rotate at a preset speed and move laterally at a preset speed. At this time, the movement trajectory of the wafer to be inspected is a spiral trajectory.

[0078] In a possible implementation, the motion stage may only include a turntable, that is, the turntable is controlled to rotate at a preset speed and move laterally at a preset speed on the lateral moving stage, and the wafer to be inspected moves along with the movement of the turntable.

[0079] In a possible implementation, the motion stage may include a turntable and a transverse moving stage, wherein the relative transverse positions of the turntable and the transverse moving stage remain unchanged. During the movement process, the turntable may be controlled to rotate at a preset speed at a fixed position of the transverse moving stage, and the transverse moving stage may be controlled to move transversely at a preset speed. At this time, the turntable simultaneously follows the transverse moving stage to move transversely at a preset speed, and the trajectory of the wafer to be inspected following the turntable to move is a spiral line.

[0080] When the wafer to be inspected moves, the linear array camera continuously collects images of the wafer to be inspected and can output multiple line images. Then, the wafer image is determined based on the multiple line images, so that the wafer to be inspected can be inspected based on the wafer image.

[0081] See also Figure 2 As shown, Figure 2 A flow chart of a wafer inspection method based on a linear array camera provided in an embodiment of the present application.

[0082] The method may be performed by a wafer inspection device, and the method may include the following steps:

[0083] S201: Control the wafer to be inspected to move along a spiral trajectory.

[0084] When inspecting the wafer to be inspected, the wafer to be inspected is controlled to move along a spiral trajectory, so that the line array camera can scan the entire image of the wafer to be inspected at one time.

[0085] Specifically, the wafer to be inspected can be controlled to rotate at a preset speed and move laterally at a preset speed, and the trajectory of the wafer to be inspected is a spiral trajectory. For example, the wafer to be inspected can be controlled to rotate counterclockwise at a preset speed and move leftward at a preset speed.

[0086] Optionally, the wafer to be inspected can be placed on a moving table, and the moving table can move with the wafer to be inspected. For example, the wafer to be inspected can be placed on the moving table by adsorption. The wafer to be inspected can be moved by controlling the movement of the moving table.

[0087] Before moving, it is necessary to determine the starting position of the wafer to be inspected. In one possible implementation, the edge position of the wafer to be inspected can be controlled to be located below the linear array camera, where the linear array camera refers to a camera used to capture images of the wafer to be inspected. The shape of the wafer to be inspected can be approximately simplified to a circle, and the edge position of the wafer to be inspected represents the position on the circumference. At the beginning, any position on the edge of the wafer to be inspected can be controlled to be located below the linear array camera. According to Figure 1 In the wafer to be inspected shown, point A, point B, and point C all belong to the edge positions of the wafer to be inspected.

[0088] During the movement of the wafer to be inspected, the wafer to be inspected is controlled to rotate at a preset speed and to move laterally along the diameter direction at a preset speed. That is, the trajectory of the lateral movement of the wafer to be inspected matches the diameter of the wafer to be inspected.

[0089] S202: While the wafer to be inspected is moving, a linear array camera is used to collect images of the wafer to be inspected, to obtain a plurality of line images.

[0090] Since the linear array camera outputs line images, only a partial image of the wafer to be inspected can be captured in one shot. Therefore, during the movement of the wafer to be inspected, the linear array camera can be controlled to continuously capture images of the wafer to be inspected, thereby obtaining multiple line images output by the linear array camera.

[0091] The main working principle of the line array camera includes the following: When light shines on the first row of pixels, initial photocharges are generated. In the next clock cycle, these charges are transferred to the second row of pixels. At the same time, the first row of pixels continues to receive new photons and generate new charges. The above process continues, and each row of pixels receives new photons and accumulates charges from the previous row. When the charge reaches the last row of pixels, the accumulated signal of the last row of pixels is read out to form the final image signal, that is, the row image output by the line array camera.

[0092] In order to ensure that the linear array camera can clearly capture the image of the wafer to be inspected and prevent the image from being blurred, it is necessary to control the moving speed of the wafer to be inspected. Specifically, it can be achieved in the following way: based on the line frequency of the linear array camera and the pixel size in the line image, determine the linear speed of the wafer to be inspected when it rotates. Among them, the pixel size represents the length of the actual space represented by each pixel. The line frequency can represent the charge transfer frequency in the linear array camera. Since the charge transfer speed can be obtained by the pixel size in the line image and the time to move the pixel size, and the time can be expressed as the inverse of the frequency, the charge transfer speed can be obtained by calculating the product of the pixel size in the line image and the line frequency. In order to make the image of the wafer to be inspected captured by the linear array camera clearer, the charge transfer speed can be synchronized with the linear speed of the wafer to be inspected. That is, the product of the pixel size in the line image and the line frequency can be calculated to obtain the linear speed of the wafer to be inspected when it rotates.

[0093] Optionally, the line array camera can be a time delay integration (TDI) camera. The TDI camera is used to collect images of the wafer to be inspected. The TDI camera can significantly improve the signal strength by accumulating light signals multiple times, while capturing the details of bright and dark areas, obtaining images with high contrast, improving the signal-to-noise ratio of the image, and outputting high-quality image signals. Due to the use of time delay integration technology, the TDI camera can complete image acquisition in a short time, thereby achieving clear imaging in motion scenes.

[0094] At the beginning of the inspection, the edge position of the wafer to be inspected can be controlled to be located below the linear array camera, and then the wafer to be inspected is controlled to rotate at a preset speed while being controlled to move laterally along the diameter direction at a preset speed. When the linear array camera completes the acquisition of all images of the wafer to be inspected, the wafer to be inspected can be controlled to stop moving, and the condition for stopping the movement can be: the wafer to be inspected moves laterally along the diameter direction until the center of the wafer to be inspected is located below the linear array camera.

[0095] by Figure 1 Taking the wafer to be inspected as an example, at the beginning of the inspection, the left edge position A of the wafer to be inspected can be controlled to be located below the linear array camera. Then the wafer to be inspected is controlled to rotate counterclockwise at a preset speed, and move leftward along the diameter direction at a preset speed until the center O of the wafer to be inspected is located below the linear array camera. At this time, the wafer to be inspected can be controlled to stop moving. For details, see Figure 3As shown, a schematic diagram of the movement of a wafer to be inspected provided in an embodiment of the present application is provided. During the movement of the wafer to be inspected, the linear array camera continuously collects images of the wafer to be inspected. When the center O of the wafer to be inspected moves to the bottom of the linear array camera, the linear array camera can theoretically collect all images of the wafer to be inspected.

[0096] It should be noted that the application scenario provided in the above embodiment is only an exemplary description and is not limited to the above movement method, as long as the wafer to be inspected moves along the spiral trajectory. For example, the right edge position of the wafer to be inspected can be controlled to be located below the linear array camera, and the wafer to be inspected can be controlled to rotate at a preset speed and move rightward in the diameter direction at a preset speed. At this time, the movement trajectory of the wafer to be inspected is also a spiral line.

[0097] S203: Determine a wafer image based on the multiple row images.

[0098] Since the line array camera can only capture images of a partial area of ​​the wafer to be inspected each time, and the wafer to be inspected is in a moving state during the shooting process of the line array camera, the line image output by the line array camera each time captures a different area of ​​the wafer to be inspected. Therefore, the multiple line images output by the line array camera can be used for image stitching to obtain a complete wafer image of the wafer to be inspected.

[0099] In specific implementation, each row image output by the line array camera can be executed according to the following steps, which mainly include the following steps:

[0100] A1: For each pixel point in the row image, determine the wafer position corresponding to the pixel point in the wafer to be inspected.

[0101] The wafer position refers to the position in the wafer coordinate system. When the linear array camera collects the image of the wafer to be inspected, a light beam can be projected onto the wafer to be inspected, and the light will be reflected to the linear array camera, so the linear array camera can capture the illuminated area of ​​the wafer to be inspected to form an image. Therefore, for each pixel in the line image, the corresponding position of the pixel in the wafer to be inspected, that is, the wafer position, can be determined.

[0102] A2: Based on the wafer coordinate system and the wafer image coordinate system, the wafer position is converted to obtain the image position in the wafer image coordinate system.

[0103] Among them, the wafer position is the position in the wafer coordinate system. In order to obtain the corresponding position in the wafer image, conversion can be performed based on the wafer coordinate system and the wafer image coordinate system, so that the wafer position in the wafer coordinate system is converted to obtain the corresponding image position in the wafer image coordinate system.

[0104] A3: Determine the pixel value of the pixel point corresponding to the image position based on the pixel value of the pixel point to obtain the wafer image.

[0105] After determining the image position corresponding to the wafer position, the pixel value of the pixel point corresponding to the image position in the wafer image can be determined based on the pixel value of the pixel point corresponding to the wafer position. The above steps are performed for each pixel point in the row image, and the pixel value of each corresponding image position in the wafer image can be determined, and finally the wafer image is obtained.

[0106] The above steps will be described in detail below in conjunction with the embodiments.

[0107] First, step A1 "for each pixel point in the row image, determining the wafer position corresponding to the pixel point in the wafer to be inspected" is introduced.

[0108] In a possible implementation, during the movement of the wafer to be detected, an encoder can be used to encode the movement process of the wafer to be detected (motion stage) to generate coded data. Optionally, the movement of the motion stage can be controlled by a motor, and the movement of the motor can be encoded. The encoder generates coded data of the movement of the wafer to be detected and sends the coded data to the wafer detection device. Since the linear array camera is also collecting images of the wafer to be detected during the movement of the wafer to be detected, and the wafer detection device can obtain the row image data output by the linear array camera, the wafer detection device can match the coded data with the row image data one by one. For example, the coded data and the row image generated at the same time can be matched.

[0109] Optionally, the coding data may include: an angle coding value and a circle center distance coding value. The angle coding value may represent the angle of the light spot of the wafer to be detected in the spiral line, and the circle center distance coding value may represent the length of the light spot of the wafer to be detected from the center of the wafer to be detected, that is, the current radius of the spiral line where the wafer to be detected is located.

[0110] In a possible implementation, the edge position of the wafer to be inspected is located below the linear array camera as the starting position, and the center of the wafer to be inspected is located below the linear array camera as the moving end position, then the current radius of the spiral line where the wafer to be inspected is located can be expressed in the following way:

[0111]

[0112] Where r represents the current radius. R represents the starting radius, that is, the radius of the wafer to be inspected. θ represents the current rotation angle. Indicates that the ratio of θ to 2π is rounded down. For example, when the ratio of θ to 2π is 2.7, the rounded down ratio is 2. Pitch indicates the spacing between adjacent spiral tracks, which can be set in advance.

[0113] Since the coded data is usually a set of data corresponding to the light spot, and the line image includes multiple pixels, in order to establish a matching relationship between the coded data and the line image, in a possible implementation, before using the line array camera to collect the wafer to be inspected, the line array camera and the wafer to be inspected can be calibrated to determine the position correspondence between the line image of the line array camera and the wafer to be inspected. Specifically, after the light beam is irradiated on the wafer to be inspected to form a light spot, the light is reflected to the line array camera, and the line array camera generates a line image of the illuminated area of ​​the wafer to be inspected. The middle pixel point in the line image can be aligned with the midpoint of the light spot. Then, the coded data corresponding to the light spot can be expressed as the coded data of the middle pixel point.

[0114] Based on this, when determining the wafer position corresponding to the pixel point in the row image, the encoding data of the middle pixel point of the row image is first obtained. Then, based on the relative position relationship between the remaining pixel points in the row image and the middle pixel point, the encoding data of the remaining pixel points in the row image is determined. Thus, the wafer position corresponding to the corresponding pixel point in the wafer to be inspected can be determined based on the encoding data.

[0115] It should be noted that in the above embodiment, the light spot is calibrated with the middle pixel point of the row image, and the light spot may also be calibrated with any other pixel point in the row image. The principle is the same and will not be described in detail.

[0116] According to the above embodiments, the coding data includes angle coding values ​​and center distance coding values. If the angle coding values ​​corresponding to the pixels in the same row image are the same, it is necessary to determine the center distance coding values ​​of the remaining pixels based on the relative position relationship between the remaining pixels and the middle pixel. Specifically, first determine the length of the actual space represented by each pixel in the row image, then determine the distance between the remaining pixels and the middle pixel based on the number of pixels between the remaining pixels and the middle pixel, and if the center distance coding value corresponding to the middle pixel is known, then determine the center distance coding values ​​corresponding to the remaining pixels, and obtain the coding data of the remaining pixels.

[0117] Since the pixel coding data includes the angle coding value and the center distance coding value, the angle coding value indicates the angle of the spiral line where the light spot of the wafer to be detected is located, and the center distance coding value can indicate the current radius of the spiral line where the wafer to be detected is located, the corresponding relationship between the polar coordinate system and the rectangular coordinate system can be used to determine the wafer position of the pixel according to the current radius and angle. α represents the angle of the spiral line where the light spot of the wafer to be detected is located, r represents the current radius, and the wafer position is expressed as (x, y), then it can be known that x = r*cosα, y = r*sinα.

[0118] The angle range of the light spot in the spiral line is [0, 2π), and the coding range corresponding to the angle coding value can be pre-set as [0, max). After obtaining the angle coding value of the pixel point, the current angle w can be determined according to the corresponding relationship between the angle coding value and the angle. For example, when there is a linear relationship between the angle coding value and the angle, the current angle w = angle coding value / max*2π.

[0119] After determining the wafer position of the pixel point, the following will specifically introduce step A2 "converting based on the wafer coordinate system and the wafer image coordinate system to convert the wafer position to obtain the image position in the wafer image coordinate system" in conjunction with the embodiment.

[0120] In order to obtain a wafer image, it is necessary to determine the size of the wafer image according to the size of the wafer to be inspected. Specifically, the length of the actual space represented by each pixel in the wafer image can be determined first, that is, the size of each pixel in the wafer image coordinate system. Since the size of the wafer to be inspected, such as the diameter of the wafer to be inspected, can be known, in order to accommodate the completed wafer to be inspected in the wafer image, the size of the wafer image can be determined according to the size of the wafer to be inspected and the length of the actual space represented by each pixel in the wafer image.

[0121] Among them, the wafer to be detected can be approximately circular, then the ratio of the diameter of the wafer to be detected to the length of the actual space represented by each pixel in the wafer image can be calculated, and determined as the minimum side length of the wafer image. At this time, the wafer image is a square image. That is, the minimum size of the wafer image can be determined based on the above ratio. In actual application scenarios, the length and width of the wafer image can be greater than the ratio, and the embodiments of the present application are not limited to this.

[0122] It should be noted that after the size of the wafer image is determined in advance, a blank image of the size can be prepared in advance as the initial wafer image, and then the pixel value of each pixel in the blank image (initial wafer image) is determined to obtain the wafer image. After determining the size of the wafer image, the wafer position corresponding to the image position in the wafer image can be calculated based on the wafer position of the pixel, the length of the actual space represented by each pixel in the wafer image, and the size of the wafer image.

[0123] Since the origin position of the wafer image coordinate system will affect the image position of the wafer to be inspected, the process of determining the image position will be introduced in conjunction with an application scenario below.

[0124] See also Figure 4a and Figure 4b As shown, Figure 4a A schematic diagram of a wafer coordinate system provided in an embodiment of the present application, Figure 4b A schematic diagram of a wafer image coordinate system provided in an embodiment of the present application.

[0125] In the wafer to be inspected, the wafer coordinate system can be established with the center O of the wafer to be inspected as the coordinate origin. Figure 4b As shown, a wafer image coordinate system is established, and the coordinate origin is p. Among them, the square area containing the wafer to be inspected, which is composed of two dotted lines and the coordinate axis, can be represented as a wafer image area. Taking the wafer position point D of the wafer to be inspected as an example, it is determined that point D corresponds to the image position point pd in the wafer image. Among them, the wafer position of point D can be composed of a first horizontal coordinate and a first vertical coordinate, and it is necessary to calculate the second horizontal coordinate and the second vertical coordinate corresponding to the image position point pd.

[0126] according to Figure 4a and Figure 4b It can be seen that the first ratio of the first horizontal coordinate of point D to the length of the actual space represented by each pixel in the wafer image, and the second ratio of the first vertical coordinate to the length of the actual space represented by each pixel in the wafer image are first calculated. The first ratio and the second ratio can then represent the number of corresponding pixels. When determining the second horizontal coordinate of point pd, the sum of half the horizontal length of the wafer image (half the side length) and the first ratio can be calculated to obtain the second horizontal coordinate. When determining the second vertical coordinate of point pd, since the wafer to be inspected is located below the horizontal coordinate axis, the sum of half the longitudinal length of the wafer image (half the side length) and the second ratio is calculated, and then the negative of the sum is calculated as the second vertical coordinate.

[0127] It should be noted that the above embodiment only introduces the relationship between the wafer coordinate system and the wafer image coordinate system and the process of how to determine the image position in combination with an application scenario, but this embodiment does not limit the present application in any form. For example, the position of the wafer coordinate system and the wafer image coordinate system can also be adjusted, and this embodiment of the present application will not be described in detail. Other deformation implementation methods obtained based on the principles of the above embodiment also belong to the protection scope of the present application.

[0128] The following will specifically introduce step A3 "determining the pixel value of the pixel point corresponding to the image position based on the pixel value of the pixel point to obtain the wafer image" in conjunction with the embodiment.

[0129] For each pixel point of the wafer position, after determining the image position corresponding to the pixel point in the wafer image, the pixel value of the pixel point corresponding to the image position can be determined based on the pixel value of the pixel point. For example, the pixel value of the pixel point can be determined as the pixel value of the pixel point corresponding to the image position. The above steps are performed for each pixel point in the row image output by the linear array camera, and the pixel value of each pixel point in the wafer image can be obtained, and the wafer image can be obtained.

[0130] In a possible implementation, after the image position is obtained, there may be no pixel at the image position, that is, the image position may be between two adjacent pixel points. At this time, the ratio of the horizontal coordinate (vertical coordinate) of the image position to the length of the actual space represented by each pixel in the wafer image can be calculated. When the ratio is an integer, it corresponds to the nth pixel point in the horizontal axis direction (vertical axis direction) of the wafer image. When the ratio is not an integer, the coordinates of the two pixel points corresponding to the two integers adjacent to the ratio can be calculated, and then the pixel point corresponding to the coordinate closer to the image position in the two coordinates is determined as the pixel point corresponding to the image position.

[0131] In a possible implementation, among the multiple row images output by the linear array camera, there may be images that capture the same position of the wafer to be inspected, that is, there may be multiple pixels at the same wafer position in different row images, and the same image position of the wafer image may correspond to multiple pixel values, and the multiple pixel values ​​may be different. Optionally, the newly determined pixel value can be used to overwrite the pixel value of the same image position before. Alternatively, for multiple pixel values ​​at the same image position, the average value of the multiple pixel values ​​can be calculated as the pixel value of the image position.

[0132] S204: Inspect the wafer to be inspected based on the wafer image.

[0133] After obtaining the wafer image of the wafer to be inspected, the wafer to be inspected can be inspected based on the wafer image, for example, the position and size of defects in the wafer to be inspected can be detected.

[0134] Through the method provided in the embodiment of the present application, the wafer to be inspected can be controlled to move along a spiral trajectory, so that the linear array camera can scan all the wafers to be inspected with a one-time scan, and then the wafer image is obtained by image stitching for inspection. There is no need to move the wafer to be inspected multiple times, thereby reducing the wafer inspection time and improving the efficiency of wafer inspection.

[0135] Based on the above method embodiment, the present application embodiment further provides an image stitching method based on a line array camera, which will be described below in conjunction with the accompanying drawings.

[0136] See also Figure 5 As shown, Figure 5 A flow chart of an image stitching method based on a line array camera provided in an embodiment of the present application.

[0137] The method may be performed by an image processing device, and the method may include the following steps:

[0138] S501: For each pixel point in the line image output by the line array camera, determine a first position corresponding to the pixel point in the photographed object.

[0139] The line image is an image of the object captured by the line array camera. The line array camera can output multiple line images of the object. The process is performed for each line image to achieve image stitching, so as to obtain a target image of the object.

[0140] A light beam can be used to illuminate the photographed object, and the light is reflected to the line array camera, so that the line array camera can capture the image of the illuminated area of ​​the photographed object and output a line image. Therefore, for each pixel point in the line image, the first position corresponding to the pixel point in the photographed object can be determined.

[0141] In a possible implementation, if the photographed object is in a moving state, the moving state of the photographed object can be encoded by an encoder to obtain encoded data of the photographed object. For example, the encoded data can be represented as encoded data corresponding to a light spot irradiated on the photographed object.

[0142] Before using the line array camera for acquisition, the line array camera and the photographed object can be calibrated to determine the position correspondence between the line array camera's line image and the photographed object. Specifically, after the light beam is irradiated on the photographed object to form a light spot, the light is reflected to the line array camera, and the line array camera generates a line image of the illuminated area of ​​the photographed object. Then, the target pixel point in the line image can be aligned with the midpoint of the light spot. Then, the coded data corresponding to the light spot can be represented as the coded data of the target pixel point. For example, the target pixel point can be the middle pixel point of the line image.

[0143] Based on this, the first position of the pixel point can be determined in the following manner: obtain the encoding data of the target pixel point of the row image. Based on the relative position relationship between the remaining pixel points in the row image and the target pixel point, determine the encoding data of the remaining pixel points in the row image. Based on the encoding data, determine the first position of the corresponding pixel point in the photographed object.

[0144] S502: Performing conversion based on the coordinate system of the photographed object and the target image coordinate system, converting the first position to obtain a second position in the target image coordinate system.

[0145] After obtaining the first position of the pixel point in the photographed object, the first position can be transformed using the conversion relationship between the coordinate system of the photographed object and the target image coordinate system to obtain a second position corresponding to the target image coordinate system.

[0146] In a possible implementation, the length of the actual space represented by each pixel in the target image coordinate system may be determined first. Then, based on the length and the size of the photographed object, the size of the target image may be determined. A calculation may be performed based on the first position, the length, and the size of the target image to obtain the second position.

[0147] Taking the first position including the first horizontal coordinate and the first vertical coordinate as an example, it is necessary to calculate the second horizontal coordinate and the second vertical coordinate included in the second position. Specifically, the first ratio of the first horizontal coordinate to the length and the second ratio of the first vertical coordinate to the length are calculated. The second horizontal coordinate is determined based on half of the horizontal length of the target image and the sum of the first ratio. And the second vertical coordinate is determined based on half of the vertical length of the target image and the sum of the second ratio.

[0148] S503: Determine the pixel value of the pixel point corresponding to the second position based on the pixel value of the pixel point, and obtain a target image of the photographed object.

[0149] For example, the pixel value of a pixel point at the first position may be determined as the pixel value of a corresponding pixel point at the second position.

[0150] In a possible implementation, among the multiple row images output by the line array camera, there may be images that capture the same position of the photographed object, that is, there may be multiple pixels with the same first position in different row images, and the same second position may correspond to multiple pixel values, and the multiple pixel values ​​may be different. Optionally, the newly determined pixel value can be used to overwrite the pixel value of the same second position. Alternatively, for the multiple pixel values ​​of the same second position, the average value of the multiple pixel values ​​can be calculated as the pixel value of the second position.

[0151] In a possible implementation, the photographed object moves along a spiral trajectory, and the line array camera captures the photographed object during the movement of the photographed object.

[0152] In a possible implementation, the photographed object is a circular object, and the starting position of the photographed object satisfies: the edge position of the photographed object is located below the linear array camera; the condition for the photographed object to stop moving includes: the photographed object moves laterally along the diameter direction until the center of the photographed object is located below the linear array camera.

[0153] For example, the photographed object may be a wafer. The specific implementation principle of each step can also refer to the embodiment of the wafer detection method above, which will not be repeated here.

[0154] Based on the above method embodiment, the present application embodiment also provides a wafer inspection device based on a linear array camera. Figure 6 , which is a schematic diagram of a wafer inspection device based on a linear array camera provided in an embodiment of the present application.

[0155] The device 600 comprises:

[0156] The moving unit 601 is used to control the wafer to be inspected to move along a spiral trajectory;

[0157] An image acquisition unit 602 is used to acquire images of the wafer to be inspected by using a line array camera during the movement of the wafer to be inspected to obtain a plurality of line images;

[0158] An image determination unit 603, configured to determine a wafer image based on a plurality of row images;

[0159] The detection unit 604 is used to detect the wafer to be detected based on the wafer image.

[0160] In a possible implementation, the image determination unit 603 is specifically used to determine, for each pixel point in the row image, a wafer position corresponding to the pixel point in the wafer to be inspected, wherein the wafer position represents a position in a wafer coordinate system; perform conversion based on the wafer coordinate system and the wafer image coordinate system to convert the wafer position to obtain an image position in the wafer image coordinate system; determine a pixel value of a pixel point corresponding to the image position based on the pixel value of the pixel point to obtain the wafer image.

[0161] In a possible implementation, the image determination unit 603 is specifically used to determine the length of the actual space represented by each pixel in the wafer image coordinate system; determine the size of the wafer image based on the length and the size of the wafer to be inspected; and obtain the image position by calculating based on the wafer position, the length and the size of the wafer image.

[0162] In a possible implementation, the wafer position includes a first horizontal coordinate and a first vertical coordinate, the image position includes a second horizontal coordinate and a second vertical coordinate, and the image determination unit 603 is specifically used to calculate a first ratio of the first horizontal coordinate to the length and a second ratio of the first vertical coordinate to the length; determine the second horizontal coordinate based on half of the lateral length of the wafer image and the sum of the first ratio, and determine the second vertical coordinate based on half of the longitudinal length of the wafer image and the sum of the second ratio.

[0163] In a possible implementation, the image determination unit 603 is specifically used to obtain the encoding data of the middle pixel point of the row image; determine the encoding data of the remaining pixel points in the row image based on the relative position relationship between the remaining pixel points in the row image and the middle pixel point; and determine the wafer position corresponding to the corresponding pixel point in the wafer to be inspected based on the encoding data.

[0164] In a possible implementation, the starting position of the wafer to be inspected satisfies: the edge position of the wafer to be inspected is located below the linear array camera; the condition for the wafer to be inspected to stop moving includes: the wafer to be inspected moves laterally along the diameter direction until the center of the wafer to be inspected is located below the linear array camera.

[0165] In a possible implementation, the moving unit 601 is specifically used to control the wafer to be inspected to rotate at a preset rotation speed and to move laterally at a preset speed, and a trajectory of the lateral movement matches the diameter of the wafer to be inspected.

[0166] In addition, the present application also provides an image stitching device based on a line array camera. Figure 7 , which is a schematic diagram of an image stitching device based on a line array camera provided in an embodiment of the present application.

[0167] The device 700 comprises:

[0168] A position determination unit 701 is used to determine, for each pixel point in a line image output by a line scan camera, a first position corresponding to the pixel point in a photographed object, wherein the line image is an image of the photographed object captured by the line scan camera;

[0169] A conversion unit 702, configured to perform conversion based on a coordinate system of the photographed object and a target image coordinate system, and convert the first position into a second position in the target image coordinate system;

[0170] The image stitching unit 703 is used to determine the pixel value of the pixel point corresponding to the second position based on the pixel value of the pixel point, so as to obtain the target image of the photographed object.

[0171] In one possible implementation, the conversion unit 702 is specifically used to determine the length of the actual space represented by each pixel in the target image coordinate system; determine the size of the target image based on the length and the size of the photographed object; and obtain the second position by calculating based on the first position, the length, and the size of the target image.

[0172] In a possible implementation, the first position includes a first horizontal coordinate and a first vertical coordinate, the second position includes a second horizontal coordinate and a second vertical coordinate, and the conversion unit 702 is specifically used to calculate a first ratio of the first horizontal coordinate to the length and a second ratio of the first vertical coordinate to the length; determine the second horizontal coordinate based on half of the horizontal length of the target image and the sum of the first ratio, and determine the second vertical coordinate based on half of the vertical length of the target image and the sum of the second ratio.

[0173] In a possible implementation, the position determination unit 701 is specifically used to obtain the encoding data of the target pixel point of the row image; determine the encoding data of the remaining pixel points in the row image based on the relative position relationship between the remaining pixel points in the row image and the target pixel point; and determine the first position of the corresponding pixel point in the photographed object based on the encoding data.

[0174] In a possible implementation manner, the photographed object moves along a spiral trajectory, and the line array camera captures the photographed object during the movement of the photographed object.

[0175] In a possible implementation, the photographed object is a circular object, and the starting position of the photographed object satisfies: the edge position of the photographed object is located below the line array camera; the condition for the photographed object to stop moving includes: the photographed object moves laterally along the diameter direction until the center of the circle of the photographed object is located below the line array camera.

[0176] Based on the above method embodiment and device embodiment, the present application embodiment further provides an electronic device, which will be described below in conjunction with the accompanying drawings.

[0177] See also Figure 8 , Figure 8 A schematic diagram of an electronic device provided in an embodiment of the present application.

[0178] The device 800 includes: a memory 801 and a processor 802;

[0179] The memory 801 is used to store relevant program codes;

[0180] The processor 802 is used to call the program code to execute the wafer inspection method based on the line array camera or the image stitching method based on the line array camera described in the above method embodiment.

[0181] In addition, an embodiment of the present application also provides a computer-readable storage medium, which is used to store a computer program, and the computer program is used to execute the wafer inspection method based on a linear array camera or the image stitching method based on a linear array camera described in the above method embodiment.

[0182] An embodiment of the present application also provides a computer program product, which includes a computer program / instruction. When the computer program / instruction is executed by a processor, the wafer inspection method based on a linear array camera or the image stitching method based on a linear array camera described in the above method embodiment is implemented.

[0183] It should be noted that the technical features of the higher-level means provided in the embodiments of the present application are clear to those skilled in the art, and the problems to be solved by the higher-level means are also clear. The means for obtaining the corresponding features can be selected by those skilled in the art according to specific implementation requirements. The means provided in this application should not be regarded as a limitation on the solution or as the only means of implementation.

[0184] It should be noted that the various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same and similar parts between the various embodiments can refer to each other. In particular, for the system or device embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can refer to the partial description of the method embodiment. The device embodiment described above is only exemplary, in which the units or modules described as separate components may or may not be physically separated, and the components displayed as units or modules may or may not be physical modules, that is, they may be located in one place, or they may be distributed on multiple network units, and some or all of the units or modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. Ordinary technicians in this field can understand and implement it without paying creative work.

[0185] The flowchart and block diagram in the accompanying drawings illustrate the possible architecture, function and operation of the method, device and equipment etc. of various embodiments of the present application. In this regard, each box in the flowchart or block diagram can represent a module, a program segment or a part of a code, and the module, the program segment or a part of the code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or the flowchart, and the combination of the boxes in the block diagram and / or the flowchart can be implemented with a dedicated hardware-based system that performs the specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0186] It should be understood that in the present application, "at least one (item)" means one or more, and "plurality" means two or more. "And / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally indicates that the objects associated before and after are in an "or" relationship. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0187] It should also be noted that, in this application, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0188] The steps of the method or algorithm described in conjunction with the embodiments disclosed in this application can be implemented directly using hardware, a software module executed by a processor, or a combination of the two. The software module can be placed in a random access memory (RAM), a memory, a read-only memory (ROM), an electrically programmable ROM, an electrically erasable programmable ROM, a register, a hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art.

[0189] The above description of the disclosed embodiments enables professionals and technicians in the field to implement or use the present application. Various modifications to these embodiments will be apparent to professionals and technicians in the field, and the general principles defined in this application can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown in the present application, but will conform to the widest range consistent with the principles and novel features disclosed in the present application.

Claims

1. A wafer inspection method based on a linear array camera, characterized in that: The method comprises: Control the wafer to be inspected to move along a spiral trajectory; During the movement of the wafer to be inspected, using a linear array camera to collect images of the wafer to be inspected to obtain a plurality of line images; determining a wafer image based on a plurality of the row images; The wafer to be inspected is inspected based on the wafer image.

2. The method according to claim 1, characterized in that The step of determining a wafer image based on a plurality of row images comprises: For each pixel point in the row image, determining a wafer position corresponding to the pixel point in the wafer to be inspected, wherein the wafer position represents a position in a wafer coordinate system; Performing conversion based on the wafer coordinate system and the wafer image coordinate system, converting the wafer position to obtain an image position in the wafer image coordinate system; The pixel value of the pixel point corresponding to the image position is determined based on the pixel value of the pixel point to obtain the wafer image.

3. The method according to claim 2, characterized in that The step of converting the wafer position to obtain the image position in the wafer image coordinate system based on the wafer coordinate system and the wafer image coordinate system includes: Determining the length of the actual space represented by each pixel in the wafer image coordinate system; Determining the size of the wafer image based on the length and the size of the wafer to be inspected; The image position is obtained by performing calculation based on the wafer position, the length, and the size of the wafer image.

4. The method according to claim 3, characterized in that The wafer position includes a first horizontal coordinate and a first vertical coordinate, the image position includes a second horizontal coordinate and a second vertical coordinate, and the image position is obtained by calculating based on the wafer position, the length, and the size of the wafer image, including: Calculating a first ratio of the first abscissa to the length and a second ratio of the first ordinate to the length; The second abscissa is determined based on half of the lateral length of the wafer image and the sum of the first ratio, and the second ordinate is determined based on half of the longitudinal length of the wafer image and the sum of the second ratio.

5. The method according to claim 2, characterized in that: The step of determining the wafer position corresponding to the pixel point in the wafer to be inspected includes: Obtaining the encoded data of the middle pixel point of the row image; Determining the encoding data of the remaining pixels in the row image based on the relative position relationship between the remaining pixels in the row image and the middle pixel; Based on the coded data, determine the wafer position corresponding to the corresponding pixel point in the wafer to be inspected.

6. The method according to claim 1, characterized in that The starting position of the wafer to be inspected satisfies: the edge position of the wafer to be inspected is located below the linear array camera; The condition for the wafer to be inspected to stop moving includes: the wafer to be inspected moves laterally along the diameter direction until the center of the wafer to be inspected is located below the linear array camera.

7. The method according to claim 1, characterized in that The step of controlling the wafer to be inspected to move along a spiral trajectory includes: The wafer to be inspected is controlled to rotate at a preset rotation speed and to move laterally at a preset speed, and a trajectory of the lateral movement matches the diameter of the wafer to be inspected.

8. An image stitching method based on a line array camera, characterized in that: The method comprises: For each pixel point in a line image output by a line array camera, determining a first position corresponding to the pixel point in a photographed object, wherein the line image is an image of the photographed object captured by the line array camera; Performing conversion based on the coordinate system of the photographed object and the target image coordinate system, converting the first position to obtain a second position in the target image coordinate system; The pixel value of the pixel point corresponding to the second position is determined based on the pixel value of the pixel point to obtain a target image of the photographed object.

9. The method according to claim 8, characterized in that The converting based on the coordinate system of the photographed object and the target image coordinate system to convert the first position into a second position in the target image coordinate system includes: Determine the length of the actual space represented by each pixel in the target image coordinate system; Determine the size of the target image based on the length and the size of the photographed object; The second position is obtained by performing calculation based on the first position, the length, and the size of the target image.

10. An electronic device, characterized in that: The device comprises: a memory and a processor; The memory is used to store relevant program codes; The processor is used to call the program code to execute the wafer inspection method based on a linear array camera according to any one of claims 1 to 7 or the image stitching method based on a linear array camera according to claim 8 or 9.

Images