Bearing part, bearing device and process method suitable for bearing device

Abstract

The invention relates to the technical field of semiconductors, and discloses a bearing part, a bearing device and a process method suitable for the bearing device. The bearing part comprises a substrate; the first surface of the substrate is provided with at least one groove-shaped bearing unit; the bearing unit is used for bearing a chip to be subjected to process treatment, and at least one protruding part is arranged on at least one of two surfaces, oppositely arranged in the borne direction, of the chip; when one of the two surfaces of the chip is subjected to process treatment, the other surface, which is not subjected to process treatment, of the two surfaces faces the bearing unit, and when the other surface facing the bearing unit is provided with a protruding part, the protruding part is located in the groove of the bearing unit. And the bearing part can improve the process reliability, so that the yield of the chip is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a carrier, a carrier device and a process method suitable for the carrier device. Background Art

[0002] Infrared focal plane detectors are usually made of a readout circuit chip with indium bumps and an infrared detection chip that are pressed together by flip-chip interconnection. In order to ensure the quality of flip-chip interconnection, a series of process treatments must be performed before flip-chip interconnection, such as cleaning or testing, especially on the back of the readout circuit chip and the infrared detection chip.

[0003] In the related art, a plurality of indium bump arrays for electrical connection are prepared on the front side of the readout circuit chip for flip-chip interconnection. When the front side of the readout circuit chip is subjected to process treatment, such as cleaning or inspection, the front side can be turned upward to fix the back side of the readout circuit chip. However, when the back side of the readout circuit chip is subjected to process treatment, the back side needs to be turned upward to fix the front side of the readout circuit chip. Since the texture of the indium bumps is relatively soft, they are easily deformed during the fixing process. The front side of the readout circuit chip cannot be effectively fixed, and the effect of the process treatment on the back side is poor, which affects the yield rate of the readout circuit chip.

[0004] Therefore, there is an urgent need to provide a solution to solve the above problems. Summary of the invention

[0005] The purpose of the present invention is to at least provide a carrying part, a carrying device and a process method suitable for the carrying device, which can at least solve the problem of low chip yield caused by poor process reliability, and at least achieve the effect of improving process reliability and then improving chip yield.

[0006] In order to solve the above technical problems, the present invention provides a carrying part, including: a substrate; a first surface of the substrate is provided with at least one groove-shaped carrying unit; the carrying unit is used to carry the chip to be processed, and at least one of the two surfaces of the chip arranged opposite to each other along the carrying direction is provided with at least one protrusion; when processing is performed on one of the two surfaces of the chip, the other surface of the two surfaces that has not been processed faces the carrying unit, and when the other surface facing the carrying unit is provided with a protrusion, the protrusion is located in the groove of the carrying unit.

[0007] The carrier provided by the present invention uses a carrier unit to carry a chip to be processed, and processes the surface of the chip. Since at least one of the two surfaces of the chip to be processed is provided with at least one protrusion along the carrying direction, the carrier unit is provided in a groove shape. When one of the two surfaces of the chip is processed, the other surface that has not been processed faces the carrier unit and the other surface facing the carrier unit is provided with a protrusion, the protrusion is located in the groove of the carrier unit, which can avoid deformation of the protrusion during the process of the carrier unit carrying the chip to be processed, effectively fix the other surface of the chip that has not been processed on the carrier unit, and effectively process the surface of the chip that is away from the carrier unit, thereby improving process reliability and further improving the yield rate of the chip.

[0008] In addition, it also includes: a plurality of stoppers, which are located on the first surface of the substrate and are arranged around the groove opening of at least one carrying unit, and the stoppers are used to hold and stop the edge of the chip when the carrying unit carries the chip to be processed. This improves the stability of the chip during the process and prevents the chip from shaking and moving and causing damage to the chip; it is conducive to effectively cleaning the surface of the chip and removing stubborn stains on the chip surface.

[0009] In addition, the height of the limiter is 0.5 to 0.8 times the height of the chip. If the height of the limiter is greater than 0.8 times the height of the chip, the production cost is high, the overall volume of the bearing part is large, and when two bearing parts are used to fix and flip in the vertical direction, the chip is likely to shake up and down between the two bearing parts, and the effect of improving the stability of the chip during process processing is weakened; if the height of the limiter is less than 0.5 times the height of the chip, the effect of supporting and limiting the edge of the chip is small. Therefore, the height of the limiter is 0.5 to 0.8 times the height of the chip, which can take into account the requirements of high stability and strong limiting effect, low production cost and small volume during process processing of the chip.

[0010] In addition, a through hole is provided on the side wall of the groove of the carrier unit, and the through hole penetrates the substrate, so as to form a connecting gas path between the groove of the carrier unit and the vacuum device located outside the substrate. After the chip to be processed is placed on the carrier unit, the inside of the groove is evacuated by the vacuum device, so that the chip to be processed is adsorbed on the carrier unit, so as to avoid the chip being blown away by the ejected gas or cleaning liquid during the process, thereby improving the stability of the chip during the process, and improving the process reliability of the chip, thereby improving the yield rate of the chip.

[0011] In addition, among the multiple communicating air paths between the grooves of each carrying unit and the vacuum device, there is at least one communicating air path in which all sections of each communicating air path are located inside the substrate.

[0012] In addition, among the multiple communicating air paths between the grooves of each carrying unit and the vacuum device, there is at least one communicating air path in which a portion of each communicating air path is located inside the substrate and another portion of each communicating air path is located in the grooves of other carrying units.

[0013] In addition, the material of the substrate includes polytetrafluoroethylene. Polytetrafluoroethylene is a high molecular polymer obtained by polymerization of tetrafluoroethylene as a monomer. It is a non-metallic material with the characteristics of corrosion resistance. The substrate made of polytetrafluoroethylene can prevent the cleaning liquid from corroding the substrate during the process of processing the chip (such as cleaning), thereby improving the effect of the process of processing the chip.

[0014] The present invention also provides a bearing device, comprising: the above-mentioned bearing part; wherein a first fixing part is provided on the first surface of the substrate in one bearing part, and a second fixing part is provided on the first surface of the substrate in the other bearing part; the first fixing part and the second fixing part are detachably fixed to allow the grooves of at least one pair of bearing units in the two bearing parts to be separably mirror-coordinated; by flipping up and down the two bearing parts fixed in the vertical direction, the upper and lower positions of the two bearing units in mirror-coordinated coordination are changed to change the corresponding bearing unit for the chip located between the two bearing units. When the two bearing parts are fixed in the vertical direction, the side edge of one bearing part is aligned with the side wall edge of the other bearing part to avoid misalignment between the two bearing parts, ensure that when the two bearing parts carry the chip respectively, the contact area and position of the chip and the bearing unit are consistent, and enhance the bearing capacity of the bearing part for the chip.

[0015] In addition, the number of the first fixing parts and the second fixing parts is the same. When the number of the first fixing parts and the second fixing parts is multiple, at least two first fixing parts and two second fixing parts are detachably fixed in a one-to-one correspondence, and the two first fixing parts are located at both ends of the center line of the first surface of the substrate, and the two second fixing parts are located at both ends of the center line of the first surface of the substrate. When the two bearing parts are fixed in the vertical direction, the effect of avoiding misalignment between the two bearing parts is enhanced; the effect of improving the stability when the two bearing parts fixed in the vertical direction are flipped up and down is enhanced.

[0016] The present invention also provides a process method applicable to the above-mentioned carrier device, comprising: placing a chip to be processed on a carrier unit on the first surface of a carrier part, at least one of the two surfaces of the chip arranged opposite to each other along the carrying direction is provided with at least one protrusion, and when at least one of the protrusions is provided on the surface facing the carrier unit, the protrusion is located in the groove of the carrier unit; processing is performed on one of the two surfaces of the chip that is away from the carrier unit; after the processing of one surface is completed, another carrier part is fixed to the current carrier part along the first surface so that the carrier unit of the other carrier part is mirror-coordinated with the carrier unit of the current carrier part carrying the chip; flipping up and down the two carrier parts fixed along the vertical direction, changing the upper and lower positions of the two carrier units in mirror-coordinated coordination, so as to change the corresponding carrier unit of the chip to the carrier unit of another carrier part; removing the current carrier part from the other carrier part to expose the other surface of the chip that has not been processed; processing is performed on the other surface of the chip that has not been processed. The above-mentioned carrier device is used to flip the chip using two carrier parts, so that the two surfaces of the chip can be effectively processed separately.

[0017] In addition, the process treatment includes cleaning treatment or inspection treatment. The process has a wide range of uses. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0019] Figure 1 A schematic diagram of the structure of an infrared focal plane detector provided for related technologies;

[0020] Figure 2 A schematic structural diagram of a bearing portion provided in Embodiment 1 of the present invention;

[0021] Figure 3 Another structural schematic diagram of the bearing portion provided in Embodiment 1 of the present invention;

[0022] Figure 4 Another structural schematic diagram of the bearing portion provided in Embodiment 1 of the present invention;

[0023] Figure 5 A schematic diagram of the structure of a chip to be processed provided in Example 1 of the present invention;

[0024] Figure 6 A schematic diagram of the structure of an infrared focal plane detector provided in Example 1 of the present invention;

[0025] Figure 7 A flow chart of a process for preparing a carrier device applicable to Example 2 provided in Example 3 of the present invention;

[0026] Figure 8 It is a structural schematic diagram of a chip to be processed in Embodiment 3 of the present invention being placed on a carrying unit on a first surface of a carrying portion;

[0027] Fig. 9 It is a structural schematic diagram of a chip to be processed in Embodiment 3 of the present invention being placed on a carrying unit on a first surface of another carrying portion. DETAILED DESCRIPTION

[0028] refer to Figure 1 The related art provides an infrared focal plane detector, including: a readout circuit chip 100 and a detection chip 200 arranged opposite to each other; an indium bump 300 is arranged on the surface of the readout circuit chip 100 facing the detection chip 200, and the indium bump 300 is suitable for interconnecting the detection chip 200 and the readout circuit chip 100; and a foreign object 400 is arranged on the surface of the readout circuit chip 100 facing away from the indium bump 300. Among them, the surface of the readout circuit chip 100 facing the detection chip 200 is the front side of the readout circuit chip 100, and the surface of the readout circuit chip 100 facing away from the indium bump 300 is the back side of the readout circuit chip 100. Because the process treatment effect of the back side of the readout circuit chip 100 is poor before the flip-chip interconnection process is performed, foreign matter cannot be effectively removed, resulting in inconsistent height difference between the readout circuit chip 100 and the detection chip 200 during welding, some indium bumps cannot contact the detection chip 200, and misalignment is easily caused between the readout circuit chip 100 and the detection chip 200, affecting the reliability of the flip-chip interconnection.

[0029] Therefore, there is an urgent need to provide a solution to solve the problem of poor reliability of flip-chip interconnection caused by poor process reliability.

[0030] In order to make the purpose, technical scheme and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, it can be understood by those skilled in the art that in the embodiments of the present invention, many technical details are provided to enable readers to better understand the present invention. However, even without these technical details and various changes and modifications based on the following embodiments, the technical scheme claimed in the present invention can be implemented.

[0031] Example 1

[0032] The embodiment of the present invention provides a bearing portion, referring to Figures 2 to 4, comprising: a substrate 1; a first surface of the substrate 1 is provided with at least one groove-shaped carrying unit 2; the carrying unit 2 is used to carry a chip 4 to be processed (reference Figure 5 ), at least one of the two surfaces of the chip 4 that are arranged opposite to each other along the carrying direction is provided with at least one protrusion 5; when one of the two surfaces of the chip 4 is subjected to process treatment, the other surface of the two surfaces that has not been processed faces the carrying unit 2, and when the protrusion 5 is provided on the other surface facing the carrying unit 2, the protrusion 5 is located in the groove 3 of the carrying unit 2.

[0033] In this embodiment, the chip 4 to be processed is carried by the carrier unit 2, and the surface of the chip 4 is processed. Since at least one of the two surfaces of the chip 4 to be processed is provided with at least one protrusion 5 along the carrying direction, the carrier unit 2 is provided in a groove shape, and when one of the two surfaces of the chip 4 is processed, the other surface that has not been processed faces the carrier unit 2 and the other surface facing the carrier unit 2 is provided with the protrusion 5, the protrusion 5 is located in the groove 3 of the carrier unit 2, which can avoid deformation of the protrusion 5 during the process of the carrier unit 2 carrying the chip 4 to be processed, effectively fix the other surface of the chip 4 that has not been processed on the carrier unit 2, and effectively process the surface of the chip 4 that is away from the carrier unit 2, thereby improving the process reliability and further improving the yield rate of the chip 4.

[0034] In one embodiment, a groove-shaped carrying unit 2 is disposed on the first surface of the substrate 1 , and the carrying unit 2 is used to carry a chip 4 to be processed. Figure 2 and Figure 3 As an example, a groove-shaped carrying unit 2 is provided on the first surface of the substrate 1 .

[0035] In another embodiment, a plurality of groove-shaped carrying units 2 are provided on the first surface of the substrate 1, and the plurality of carrying units 2 are used to carry a plurality of chips to be processed 4. The carrying units 2 of the substrate 1 are used to simultaneously process one of the surfaces of the plurality of chips to be processed 4, so as to realize batch operation of the process and improve the efficiency of the process.

[0036] Figure 4 In the figure, four groove-shaped carrying units 2 are provided on the first surface of the substrate 1 as an illustration. In other embodiments, the first surface of the substrate may also be provided with other numbers of groove-shaped carrying units, which is not limited here.

[0037] It should be noted that the design of the carrier unit 2 is flexible, and the number of the groove-shaped carrier units 2 provided on the first surface of the substrate 1 can be selected according to the actual number of chips 4 to be processed.

[0038] In one embodiment, the material of the substrate 1 includes polytetrafluoroethylene. Polytetrafluoroethylene is a high molecular polymer obtained by polymerization of tetrafluoroethylene as a monomer, and is a non-metallic material with the characteristic of corrosion resistance. The substrate 1 made of polytetrafluoroethylene can prevent the cleaning liquid from corroding the substrate 1 during the process of processing (such as cleaning) the surface of the chip 4, thereby improving the effect of the process treatment on the surface of the chip 4. In other embodiments, the material of the substrate also includes other corrosion-resistant materials.

[0039] In one embodiment, continue to refer to Figures 2 to 4 The bearing part further includes: a plurality of stoppers 6, which are located on the first surface of the substrate 1 and are arranged around the opening of the groove 3 of at least one bearing unit 2. The stoppers 6 are used to hold and stop the edge of the chip 4 when the bearing unit 2 carries the chip 4 to be processed. This improves the stability of the chip 4 during the process and prevents the chip 4 from shaking and moving and causing damage to the chip 4; it is conducive to effectively cleaning the surface of the chip 4 and removing stubborn stains on the surface of the chip 4.

[0040] It can be known that when the carrier unit 2 carries the chip 4 to be processed, the dimension of the chip 4 to be processed along the parallel to the first surface is greater than the dimension of the opening of the groove 3 of the carrier unit 2 along the parallel to the first surface, and is less than or equal to the dimension of the stopper 6 along the parallel to the first surface around the opening of the groove 3, and the depth of the groove 3 along the perpendicular to the first surface is greater than or equal to the height of the protrusion 5; it can also be known that the distance from the edge of the protrusion 5 to the edge of the chip 4 is greater than or equal to the distance from the end of the stopper 6 facing the opening of the groove 3 to the side wall of the opening of the groove 3. That is, the area from the end of the stopper 6 facing the opening of the groove 3 to the side wall of the opening of the groove 3 is used to carry the edge of the chip 4 to be processed, and when the protrusion 5 on the surface of the chip 4 is not processed and faces the carrier unit 2, the protrusion 5 is located in the groove, so as to avoid the protrusion 5 from touching other parts of the carrier during the process, avoid damage to the protrusion 5, and improve the process reliability of the chip 4.

[0041] In one embodiment, the cross-sectional shape of the opening of the groove 3 of the carrying unit 2 parallel to the first surface includes a square. In other embodiments, the cross-sectional shape of the opening of the groove of the carrying unit parallel to the first surface includes other shapes, such as a circle.

[0042] In one embodiment, a plurality of limiting members 6 are provided separately. Figures 2 to 4 As an example, eight limiters 6 are provided, and two limiters 6 are arranged around each side of the opening of the groove 3. In other embodiments, the number of limiters may be other numbers, and the arrangement of the limiters may be other arrangements.

[0043] In other embodiments, a plurality of limiting members may be continuously arranged, and the limiting members are annular structures.

[0044] In one embodiment, the height of the stopper 6 is 0.5 to 0.8 times the height of the chip 4. If the height of the stopper 6 is greater than 0.8 times the height of the chip 4, the production cost is high, the overall volume of the bearing part is large, and when two bearing parts are used to fix and flip in the vertical direction, the probability of the chip 4 shaking up and down between the two bearing parts is large, and the effect of improving the stability of the chip 4 during the process is weakened; if the height of the stopper 6 is less than 0.5 times the height of the chip 4, the effect of holding and limiting the edge of the chip 4 is small. Therefore, the height of the stopper 6 is 0.5 to 0.8 times the height of the chip 4, which can take into account the requirements of high stability and strong limiting effect, low production cost and small volume when the chip 4 is processed. In this embodiment, it is preferred that the height of the stopper 6 is equal to 0.5 times the height of the chip 4, and the stability of the chip 4 during the process is improved and the effect of holding and limiting is enhanced. It should be noted that in other embodiments, the height of the stopper is not limited to the multiple of the height of the chip.

[0045] The height direction of the limiting member 6 is perpendicular to the first surface.

[0046] In one embodiment, continue to refer to Figures 2 to 4 , a through hole 7 is provided on the side wall of the groove 3 of the carrier unit 2, and the through hole 7 penetrates the substrate 1, and is used to form a communicating air path between the groove 3 of the carrier unit 2 and the vacuum device located outside the substrate 1. Specifically, the through hole 7 can be connected to the vacuum device through a hose. The chip 4 to be processed is placed on the carrier unit 2, and the inside of the groove 3 is evacuated by the vacuum device so that the chip 4 to be processed is adsorbed on the carrier unit 2, so as to avoid shaking and movement of the chip 4 during the process, improve the stability of the chip 4 during the process, and improve the process reliability of the chip 4, thereby improving the yield rate of the chip 4.

[0047] In one embodiment, the vacuum device includes, but is not limited to, a vacuum pump.

[0048] In one embodiment, among the multiple communicating air paths between the groove 3 of each carrier unit 2 and the vacuum device, there is at least one communicating air path in which all sections of each communicating air path are located inside the substrate 1. It should be understood that when a groove-type carrier unit 2 is provided on the first surface of the substrate 1, a through hole 7 is provided on any side wall of the groove 3, and a communicating air path is formed between the groove 3 of the carrier unit 2 and the vacuum device located outside the substrate 1; when a plurality of groove-type carrier units 2 are provided on the first surface of the substrate 1, a through hole is provided on the side wall of the groove 3 of each carrier unit 2, and there are no through holes between the grooves 3 of adjacent carrier units 2, and there are a plurality of vacuum devices outside the substrate 1, a communicating air path is formed between the groove 3 of each carrier unit 2 and a vacuum device outside the substrate 1, and the plurality of communicating air paths are independently provided. Figure 2 and Figure 3 As an illustration, a groove-shaped carrying unit 2 is provided on the first surface of the substrate 1 , and the section of the connecting gas path is located inside the substrate 1 .

[0049] In another embodiment, among the multiple communicating air paths between the grooves 3 of each carrier unit 2 and the vacuum device, there is at least one communicating air path in which a portion of each communicating air path is located inside the substrate 1, and another portion of each communicating air path is located inside the grooves 3 of other carrier units 2. That is, when a plurality of groove-type carrier units 2 are provided on the first surface of the substrate 1, at least the grooves 3 of adjacent carrier units 2 are connected through the through holes 7, and when the grooves 3 of all the carrier units 2 are connected through the through holes 7, a communicating air path is formed between the grooves 3 of all the carrier units 2 and a vacuum device outside the substrate. Figure 4 In the figure, four groove-shaped carrying units 2 are arranged on the first surface of the substrate 1 , a part of a connecting gas path is located inside the substrate 1 , and another part of the path is located in the grooves 3 of other carrying units 2 as an illustration.

[0050] In one embodiment, the process treatment includes cleaning treatment or detection treatment. When the process treatment is cleaning treatment, the chip 4 to be cleaned is first carried by the carrier unit 2. During the carrying process, the surface of the chip 4 that has not been cleaned faces the carrier unit 2 and a protrusion 5 is provided on the surface facing the carrier unit 2. The protrusion 5 is located in the groove of the carrier unit 2. In this way, when one of the two surfaces of the chip 4 is subjected to process treatment, the other surface of the chip 4 that has not been cleaned is effectively fixed on the carrier unit 2, and one surface of the chip 4 can be effectively cleaned; then the chip 4 can be clamped with tweezers to flip the chip, so that one surface of the chip 4 is effectively fixed on the carrier unit, and the protrusion 5 is facing away from the carrier unit 2, and the other surface of the chip 4 with the protrusion 5 is cleaned. In the process of cleaning treatment, a rinsing method can be used: the carrier unit 2 carrying the chip 4 to be cleaned is placed in the cleaning liquid and shaken, and the foreign matter on the two surfaces of the chip 4 is removed respectively by the impact force of the cleaning liquid. A purging method can also be used, for example, a spray pen or a nitrogen spray gun is used to purge the two surfaces of the chip 4 respectively. When the process is a detection process, the steps of the above-mentioned cleaning process can be referred to and will not be repeated; the detection process is: placing the carrier unit carrying the chip to be detected under a microscope for detection. In other embodiments, the cleaning process can adopt other cleaning methods; the detection process can adopt other detection methods, which are not limited here.

[0051] In other embodiments, the process includes other processing performed on the chip.

[0052] It can be known that the substrate 1 also has a second surface arranged opposite to the first surface, and the second surface is a smooth plane, that is, the second surface is not provided with a groove 3 and a stopper 6. It can also be known that the two surfaces of the chip 4 are the front and back of the chip, respectively. In the present embodiment, a protrusion 5 is provided on any one of the two surfaces of the chip 4 arranged opposite to each other along the carrying direction, that is, a protrusion 5 is provided on the front or back of the chip 4. In other embodiments, a protrusion is provided on two surfaces of the chip arranged opposite to each other along the carrying direction, that is, a protrusion is provided on both the front and back of the chip. No limitation is made here.

[0053] In one embodiment, the chip 4 is a readout circuit chip, and a protrusion 5 is provided on the front of the chip 4. The material of the protrusion 5 includes but is not limited to indium. The shape of the protrusion 5 includes but is not limited to a sphere. In one embodiment, the diameter of the protrusion 5 is 5 μm to 30 μm, for example, 5 μm, 10 μm, 25 μm or 30 μm. With the protrusion of the above size, more protrusions 5 can be integrated without changing the area of ​​the readout circuit chip.

[0054] refer to Figure 6 , this embodiment provides an infrared focal plane detector, including: a readout circuit chip 41 and a detection chip 42 arranged opposite to each other; a protrusion 5 is arranged on the front of the readout circuit chip 41, and the protrusion 5 is located between the detection chip 42 and the readout circuit chip 41, suitable for interconnecting the detection chip 42 and the readout circuit chip 41. It can be known that the protrusion 5 is a welding portion 51. The two surfaces of the readout circuit chip 41 are respectively processed (cleaned) by the above-mentioned bearing part, which can effectively remove the stubborn stains on the two surfaces of the readout circuit chip 41. The back of the readout circuit chip 41 is relatively flat, so that when the readout circuit chip and the detection chip are pressure-welded, the protrusion 5 on the surface of the readout circuit chip 41 and the electrode on the surface of the detection chip 42 can be avoided from being misaligned, thereby improving the interconnection effect of the readout circuit chip 41 and the detection chip 42. The reliability of flip-chip interconnection between the readout circuit chip 41 and the detection chip 42 is high.

[0055] In other embodiments, the chip is other chips that require processing on two surfaces separately.

[0056] In one embodiment, the number of the protrusions 5 is one or more. When the number of the protrusions 5 is multiple (for example, thousands or millions), the multiple protrusions 5 are distributed in a matrix form, and in particular, the multiple protrusions 5 are arranged in an array.

[0057] refer to Figure 5 , a plurality of protrusions 5 are provided on the chip 4, and the plurality of protrusions 5 are arranged in an array as an illustration. In other embodiments, the plurality of protrusions are arranged in other forms, such as a circle. The arrangement form of the plurality of protrusions is not limited here.

[0058] Example 2

[0059] This embodiment provides a bearing device, comprising two bearing parts provided in the above-mentioned embodiment 1.

[0060] refer to Figures 2 to 4, wherein a first fixing portion 8 is provided on the first surface of the substrate 1 in one of the bearing parts, and a second fixing portion 9 is provided on the first surface of the substrate 1 in the other bearing part; the first fixing portion 8 and the second fixing portion 9 are detachably fixed to each other, so that the grooves 3 of at least one pair of bearing units 2 in the two bearing parts can be separated and mirror-coordinated; by flipping up and down the two bearing parts fixed in the vertical direction, the upper and lower positions of the two bearing units 2 in mirror-coordinated are changed to change the corresponding bearing unit 2 loaded by the chip 4 located between the two bearing units 2. When the two bearing parts are fixed in the vertical direction, the side edge of one bearing part is aligned with the side wall edge of the other bearing part to avoid misalignment between the two bearing parts, ensure that when the two bearing parts carry the chip 4 respectively, the contact area and position of the chip 4 and the bearing unit 2 are consistent, and enhance the bearing capacity of the bearing part for the chip 4.

[0061] In one embodiment, reference Figure 2 The first fixing portion 8 is provided as a protrusion on the first surface of the substrate 1 in a bearing portion, referring to Figure 3 and Figure 4 , the second fixing portion 9 is set as a depression on the first surface of the substrate 1 in the other bearing portion; in other embodiments, the first fixing portion is set as a depression on the first surface of the substrate in one bearing portion, and the second fixing portion is set as a protrusion on the first surface of the substrate in the other bearing portion. In other embodiments, other detachable fixing structures can be set between the first fixing portion and the second fixing portion.

[0062] In one embodiment, the cross-sectional shapes of the first fixing portion 8 and the second fixing portion 9 along the first surface both include but are not limited to circles.

[0063] In one embodiment, the number of the first fixing parts 8 and the second fixing parts 9 is the same. When the number of the first fixing parts 8 and the second fixing parts 9 is plural, at least two first fixing parts 8 and two second fixing parts 9 are detachably fixed in a one-to-one correspondence, and the two first fixing parts 8 are located at both ends of the center line of the first surface of the substrate 1, and the two second fixing parts 9 are located at both ends of the center line of the first surface of the substrate 1. When the two bearing parts are fixed in the vertical direction, the effect of preventing the two bearing parts from being misaligned is enhanced; the effect of improving the stability when the two bearing parts fixed in the vertical direction are flipped upside down is enhanced.

[0064] Figures 2 to 4 The number of the first fixing parts 8 and the second fixing parts 9 are the same, and the number of the first fixing parts 8 and the second fixing parts 9 are both two, and the two first fixing parts 8 and the second fixing parts 9 are respectively located at the two ends of the center line of the first surface of the substrate 1 as an illustration. In other embodiments, the two first fixing parts and the second fixing parts may not be located at the two ends of the center line of the first surface of the substrate, and the number of the first fixing parts and the second fixing parts is other numbers.

[0065] Example 3

[0066] The embodiment of the present invention provides a process method applicable to the carrier device provided in the above embodiment 2, referring to Figure 7 ,include:

[0067] Step S1: placing a chip to be processed on a carrier unit on a first surface of a carrier unit, at least one of two surfaces of the chip disposed opposite to each other along a carrying direction is provided with at least one protrusion, and when at least one protrusion is provided on the surface facing the carrier unit, the protrusion is located in a groove of the carrier unit;

[0068] Step S2: performing a process on one of the two surfaces of the chip that faces away from the carrier unit;

[0069] Step S3: After the process treatment of one surface is completed, another carrying part is fixed to the current carrying part along the first surface so that the carrying unit of the other carrying part is mirror-coordinated with the carrying unit of the chip carried by the current carrying part;

[0070] Step S4: flipping up and down the two carriers fixed in the vertical direction, changing the upper and lower positions of the two carrier units in mirror-image coordination, so as to change the carrier unit corresponding to the chip to the carrier unit of the other carrier unit;

[0071] Step S5: removing the current carrier from another carrier to expose another surface of the chip that has not been processed;

[0072] Step S6: performing a process on the other surface of the chip that has not been processed.

[0073] In one embodiment, the process includes cleaning or testing. Specifically, one of the two surfaces of the chip 4 facing away from the carrier unit 2 is subjected to process cleaning or testing; the other surface of the chip 4 that has not been processed is subjected to process cleaning or testing. In other embodiments, the process includes other processing performed on the chip.

[0074] Combined with reference Figure 3 and reference Figure 8In step S1, the chip 4 to be processed is placed on a carrier unit 2 on the first surface of a carrier part, and at least one of the two surfaces of the chip 4 arranged opposite to each other along the carrying direction is provided with at least one protrusion 5. When at least one protrusion 5 is provided on the surface facing the carrier unit, at least one protrusion 5 is located in the groove 3 of the carrier unit. Since the carrier part also includes a stopper 6 and a through hole 7, the stopper 6 can hold and limit the edge of the chip 4, and the through hole 7 can form a connecting air path between the groove 3 of the carrier unit 2 and the vacuum device located outside the substrate 1, so that the stability of the chip 4 during the process can be improved, and the process reliability of the chip 4 can be improved, thereby improving the yield rate of the chip 4.

[0075] In step S3, after another carrying part is fixed to the current carrying part along the first surface, since the groove 3 of the carrying unit 2 of the current carrying part has a vacuum environment inside, the carrying unit 2 corresponding to the chip 4 is the current carrying part. When the carrying unit 2 corresponding to the chip 4 is subsequently changed, the vacuum environment of the current carrying part needs to be broken.

[0076] In step S4, after flipping the two carriers fixed in the vertical direction upside down, the vacuum environment inside the groove of the carrier unit 2 of the current carrier is broken, so that the carrier unit 2 corresponding to the chip is the carrier unit of another carrier; at the same time, the through hole 7 of the other carrier is used to evacuate the inside of the groove 3, so that the chip 4 is adsorbed on the carrier unit 2; the edge of the chip 4 is held and limited by the limiter 6. It can be known that flipping the two carriers fixed in the vertical direction upside down in step S4 means rotating the carriers 180° together, and the positions of the two carriers before and after flipping are opposite.

[0077] refer to Fig. 9 In step S5: the current carrier is removed from another carrier to expose another surface of the chip 4 that has not been processed, that is, the surface of the chip 4 with the protrusion 5 is exposed.

[0078] In summary, by adopting the above-mentioned carrying device and utilizing two carrying parts to realize flipping of the chip 4, the two surfaces of the chip 4 can be effectively processed separately, and during the process of process treatment, the limit member 6 and the vacuum environment effectively fix the chip 4, which can improve the stability of the chip 4, avoid damage to the chip 4, improve the process reliability of the chip 4, and thus improve the yield rate of the chip 4; since the carrying part of the carrying device can have multiple carrying units 2 at the same time, multiple chips 4 can be processed at the same time, realizing process batch operation and improving the efficiency of process treatment; in addition, the carrying device has the advantage of small size and easy process implementation; the chip 4 can be cleaned and inspected by the carrying device, and the process has a wide range of uses.

[0079] It should be understood that the expressions "mechanism", "device", "component" and the like used in this application are only a method for distinguishing different components, elements, parts, portions or assemblies at different levels. However, if other words can achieve the same purpose, the word can be replaced by other expressions.

[0080] Those skilled in the art can understand that the above-mentioned embodiments are specific examples for realizing the present invention, and in practical applications, the technical features of the above-mentioned embodiments can be arbitrarily combined. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification, and various changes can be made in form and details without departing from the spirit and scope of the present invention.

Claims

1. A bearing portion, characterized in that: include: substrate; The first surface of the substrate is provided with at least one groove-shaped carrying unit; The carrying unit is used to carry the chip to be processed, and at least one of the two surfaces of the chip that are arranged opposite to each other along the carrying direction is provided with at least one protrusion; When one of the two surfaces of the chip is processed, the other surface of the two surfaces that has not been processed faces the carrier unit, and when the protrusion is provided on the other surface facing the carrier unit, the protrusion is located in the groove of the carrier unit.

2. The bearing portion according to claim 1, characterized in that: Also includes: A plurality of limiting members are located on the first surface of the substrate and are arranged around the groove opening of at least one of the carrying units. The limiting members are used to hold and limit the edge of the chip when the carrying unit carries the chip to be processed.

3. The bearing portion according to claim 2, characterized in that: The height of the limiting member is 0.5 to 0.8 times the height of the chip.

4. The bearing portion according to claim 1, characterized in that: A through hole is arranged on the side wall of the groove of the carrying unit, and the through hole penetrates the substrate, so as to form a communicating air path between the groove of the carrying unit and a vacuum device located outside the substrate.

5. The bearing portion according to claim 4, characterized in that: Among the plurality of communicating air paths between the groove of each of the carrying units and the vacuum device, there is at least one communicating air path in which all sections of each communicating air path are located inside the substrate.

6. The bearing portion according to claim 4, characterized in that: Among the multiple communicating air paths between the grooves of each of the carrying units and the vacuum device, there is at least one communicating air path in which a portion of each communicating air path is located inside the substrate and another portion of each communicating air path is located in the grooves of other carrying units.

7. The bearing portion according to claim 1, characterized in that: The material of the substrate includes polytetrafluoroethylene.

8. A carrying device, characterized in that: include: Two bearing parts according to claims 1 to 7; A first fixing portion is provided on the first surface of the substrate in one of the bearing parts, and a second fixing portion is provided on the first surface of the substrate in the other bearing part; the first fixing portion and the second fixing portion are detachably fixed to each other, so that at least one pair of grooves of the bearing units in the two bearing parts can be detachably mirror-coordinated; By flipping up and down the two carrying parts fixed in the vertical direction, the upper and lower positions of the two carrying units in mirror-image coordination are changed to change the carrying unit corresponding to the chip located between the two carrying units.

9. The carrying device according to claim 8, characterized in that: The number of the first fixing parts and the number of the second fixing parts are the same. When the number of the first fixing parts and the number of the second fixing parts are both plural, at least two of the first fixing parts and two of the second fixing parts are detachably fixed in a one-to-one correspondence, and the two first fixing parts are located at both ends of the center line of the first surface of the substrate, and the two second fixing parts are located at both ends of the center line of the first surface of the substrate.

10. A process method applicable to the carrier device according to claim 8 or 9, characterized in that: include: Placing the chip to be processed on the carrier unit of the first surface of a carrier unit, at least one of the two surfaces of the chip disposed opposite to each other along the carrying direction is provided with at least one protrusion, and when at least one protrusion is provided on the surface facing the carrier unit, the protrusion is located in the groove of the carrier unit; Performing a process on a surface of the two surfaces of the chip that is away from the carrying unit; After the process treatment of the one surface is completed, another carrying part is fixed to the current carrying part along the first surface, so that the carrying unit of the another carrying part is mirror-coordinated with the carrying unit of the current carrying part carrying the chip; Flipping up and down the two carrying parts fixed in the vertical direction, changing the upper and lower positions of the two carrying units in mirror-image coordination, so as to change the carrying unit corresponding to the chip to the carrying unit of the other carrying part; Removing the current carrier from the other carrier to expose another surface of the chip that has not been processed; The other surface of the chip which has not been processed is processed.

11. The process method of the carrier device according to claim 10, characterized in that: The process treatment includes a cleaning treatment or a testing treatment.

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