Substrate with heat dissipation net and manufacturing method thereof, chip
By designing heat conductors and heat dissipation mesh structures on the substrate, the heat dissipation problem of high-power chips is solved, achieving a more efficient heat dissipation effect and enhancing the chip's heat dissipation capability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- ZHIHAOTONG (TIANJIN) INFORMATION TECHNOLOGY CO LTD
- Filing Date
- 2024-11-20
- Publication Date
- 2026-05-29
AI Technical Summary
Traditional chip heat dissipation methods are insufficient to meet the heat dissipation requirements of high-power chips, and existing technologies are unable to effectively improve the heat dissipation performance of chips.
The substrate design with a heat dissipation mesh includes a substrate body, a heat conductor, a first heat dissipation mesh, and a first heat-conducting layer. By opening a through hole on the first side of the substrate body, the heat conductor passes through the through hole, the first heat dissipation mesh is connected to the heat conductor, and a heat-conducting layer is formed on the first side of the substrate body to enhance the heat dissipation effect.
It improves the heat dissipation efficiency and effect of the chip, enabling it to quickly and efficiently transfer heat from the chip to the outside, reducing thermal stress deformation and increasing the heat dissipation area.
Smart Images
Figure CN122121658A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of heat dissipation technology, specifically to a substrate with a heat dissipation mesh, its manufacturing method, and a chip. Background Technology
[0002] With the continuous improvement of electronic device performance, the heat dissipation problem of chips has become increasingly prominent. Traditional chip heat dissipation methods, such as using heat sinks and fans, are no longer sufficient to meet the heat dissipation requirements of high-power chips. Therefore, it is necessary to develop new heat dissipation technologies to improve the heat dissipation effect of chips. Summary of the Invention
[0003] In view of this, this application provides a substrate with a heat dissipation mesh, a method for manufacturing the same, and a chip, to improve the heat dissipation effect of the chip.
[0004] In a first aspect, embodiments of the present invention provide a substrate with a heat dissipation mesh, comprising: a substrate body, wherein a through hole is formed on a first side of the substrate body; a heat conductor passing through the through hole; a first heat dissipation mesh disposed on the first side of the substrate body, the first heat dissipation mesh comprising a plurality of mesh wires, wherein at least some of the mesh wires of the first heat dissipation mesh intersect at the first opening of the through hole and are connected to the heat conductor passing through the through hole, wherein the first opening of the through hole is located on the first side of the substrate body; and a first thermally conductive layer disposed on the first side of the substrate body, and the first thermally conductive layer being thermally connected to the first heat dissipation mesh.
[0005] In one specific implementation, among the plurality of wires included in the first heat dissipation mesh, at least some of the wires have a first cross-section, and another portion of the wires have a second cross-section, wherein the first cross-section is different from the second cross-section; and / or, among the plurality of wires included in the first heat dissipation mesh, at least some of the adjacent wires have a first spacing, and another portion of the adjacent wires have a second spacing, wherein the first spacing is different from the second spacing.
[0006] In one specific implementation, the heat conductor includes a column, a first cover, and a second cover. The column is located inside the through hole. The first cover is disposed at the first opening of the through hole and connected to the first end of the column. The second cover is disposed at the second opening of the through hole and connected to the second end of the column.
[0007] In one specific implementation, the mesh wires of the first heat dissipation mesh that intersect at the first opening of the through hole are connected to the first cover of the heat conductor that passes through the through hole.
[0008] In one specific implementation, the material of the heat conductor is metal; and / or, the material of the first heat-conducting layer is nanomaterial; and / or, the material of the first heat dissipation mesh is metal.
[0009] In one specific embodiment, the system further includes a second heat dissipation mesh and a second thermally conductive layer. The second heat dissipation mesh is disposed on the second side of the substrate body and includes a plurality of mesh wires. At least some of the mesh wires in the second heat dissipation mesh intersect at the second opening of the through hole and are connected to a thermally conductive body passing through the through hole. The second opening of the through hole is located on the second side of the substrate body. The second thermally conductive layer is disposed on the second side of the substrate body and is thermally connected to the second heat dissipation mesh.
[0010] Secondly, embodiments of the present invention also provide a chip, the chip comprising: a substrate; a die, the die being bonded to one side of the substrate; wherein the substrate is any of the substrates described in the embodiments of this application.
[0011] In one specific implementation, the chip further includes a heat dissipation system, which includes at least one of a fan, a heat sink, and a liquid cooler.
[0012] Thirdly, embodiments of the present invention also provide a method for manufacturing a substrate with a heat dissipation mesh, the method comprising: preparing a substrate body; forming a through hole on a first side of the substrate body; inserting a heat conductor into the through hole of the substrate body; providing a first heat dissipation mesh on the first side of the substrate body, wherein the first heat dissipation mesh comprises a plurality of mesh wires, the first heat dissipation mesh being configured such that: at least some of the mesh wires included in the first heat dissipation mesh intersect at the first opening of the through hole and are connected to the heat conductor inserted into the through hole, wherein the first opening of the through hole is located on the first side of the substrate body; forming a first thermally conductive layer on the first side of the substrate body, and thermally connecting the first thermally conductive layer to the first heat dissipation mesh.
[0013] In one specific implementation, after the first heat dissipation mesh is provided on the first side of the substrate body, the method further includes: providing a second heat dissipation mesh on the second side of the substrate body, wherein the second heat dissipation mesh includes a plurality of mesh wires, and the second heat dissipation mesh is configured such that: at least some of the mesh wires included in the second heat dissipation mesh intersect at the second opening of the through hole and are connected to the heat conductor inserted into the through hole, wherein the second opening of the through hole is located on the second side of the substrate body; a second heat-conducting layer is formed on the second side of the substrate body, and the second heat-conducting layer is thermally connected to the second heat dissipation mesh.
[0014] The substrate and its manufacturing method, as well as the chip, provided in the embodiments of the present invention include a substrate body, a heat conductor, a first heat dissipation mesh, and a first heat-conducting layer. A through-hole is formed on a first side of the substrate body; the heat conductor passes through the through-hole; the first heat dissipation mesh is disposed on the first side of the substrate body and includes multiple mesh wires. At least some of the mesh wires in the first heat dissipation mesh intersect at the first opening of the through-hole and are connected to the heat conductor passing through the through-hole, wherein the first opening of the through-hole is located on the first side of the substrate body; the first heat-conducting layer is disposed on the first side of the substrate body and is thermally connected to the first heat dissipation mesh. This substrate can quickly dissipate heat from the chip, effectively improving the chip's heat dissipation efficiency and effect. Attached Figure Description
[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0016] Figure 1 A schematic diagram of a substrate with a heat dissipation mesh provided in an embodiment of this application; Figure 2 A flowchart illustrating a method for manufacturing a substrate with a heat dissipation mesh, as provided in an embodiment of this application.
[0017] Explanation of key figure labels: 10-Substrate; 11-Substrate body; 12-Heat conductor; 13-First heat dissipation mesh; 14-First heat-conducting layer; 15-Through hole. Detailed Implementation
[0018] The embodiments of the present invention will now be described in detail with reference to the accompanying drawings.
[0019] It should be understood that the described embodiments are merely some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0020] With the continuous improvement of electronic device performance, the heat dissipation problem of chips has become increasingly prominent. Traditional chip heat dissipation methods, such as using heat sinks and fans, are no longer sufficient to meet the heat dissipation requirements of high-power chips. To improve the heat dissipation effect of chips, the first aspect is, such as... Figure 1 As shown, an embodiment of the present invention provides a substrate 10 with a heat dissipation mesh, which may include: a substrate body 11, a heat conductor 12, a first heat dissipation mesh 13, and a first heat-conducting layer 14.
[0021] The first side of the substrate body 11 has a through hole; wherein, the substrate body 11 can be made of copper foil, resin, wet film, dry film, ceramic, glass, metal materials, etc., and can be used to manufacture PCB (Printed Circuit Board) to provide a basis for the connection of various electronic components on the PCB, and can also be used for chip packaging to provide physical support and electrical connection for the chip.
[0022] In this embodiment, the through holes can be used to set the heat conductor 12. There can be multiple through holes, and the size and distribution density of the through holes can be specifically set according to the heat dissipation requirements of different areas of the substrate body 11. For example, in order to maximize the overall heat dissipation capacity of the substrate body 11, through holes can be opened on the substrate body 11 with the highest possible distribution density under a preset hole diameter. In addition, under some working conditions, through holes can also be opened in areas with high thermal power and areas with low thermal power of the substrate body 11 with different distribution densities, so that the temperature of each area of the substrate body 11 is balanced, and the thermal stress deformation caused by the large temperature difference between different areas of the substrate body 11 is reduced.
[0023] A heat conductor 12 is disposed through a through hole; there are multiple heat conductors 12, and each through hole is respectively provided with a heat conductor 12; the heat conductor 12 can be used to construct a heat dissipation channel between the first side and the second side of the substrate body 11. For example, when a component with a large heat dissipation power is disposed on the second side of the substrate body 11, the heat on that side can be transferred to the first side of the substrate body 11 through the heat conductor 12, thereby increasing the heat dissipation area and heat dissipation capacity.
[0024] A first heat dissipation mesh 13 is disposed on the first side of the substrate body 11. The first heat dissipation mesh 13 includes a plurality of mesh wires. At least some of the mesh wires in the first heat dissipation mesh 13 intersect at the first opening of the through hole and are connected to the heat conductor 12 passing through the through hole. The first opening of the through hole is located on the first side of the substrate body 11. The first heat dissipation mesh 13 can be made of a material with strong thermal conductivity. Due to its mesh structure, it can effectively reduce structural deformation caused by thermal stress. It can be understood that the heat generated on the second side of the substrate body 11 is transferred to the first side of the substrate 10 via the heat conductor 12. The heat can then be transferred outward more quickly and efficiently through the first heat dissipation mesh 13 disposed on the first side of the substrate 10, thereby further improving the heat dissipation effect. In some embodiments, vias 15 can also be formed on the substrate body 11 at positions corresponding to the mesh of the first heat dissipation mesh 13. The vias 15 can be used for electrical connections between components on both sides of the substrate 10.
[0025] The first thermally conductive layer 14 is disposed on the first side of the substrate body 11, and the first thermally conductive layer 14 is thermally connected to the first heat dissipation mesh 13. The first thermally conductive layer 14 can be a layered structure or a film structure to avoid the large amount of thermal expansion deformation caused by thermal stress due to the use of a rigid structure, and can further improve the contact reliability and thermal conductivity effectiveness with the first heat dissipation mesh 13.
[0026] The substrate 10 provided in the embodiments of the present invention includes a substrate body 11, a heat conductor 12, a first heat dissipation mesh 13, and a first heat-conducting layer 14. A through hole is formed on a first side of the substrate body 11; the heat conductor 12 passes through the through hole; the first heat dissipation mesh 13 is disposed on the first side of the substrate body 11, and the first heat dissipation mesh 13 includes a plurality of mesh wires. At least some of the mesh wires in the first heat dissipation mesh 13 intersect at the first opening of the through hole and are connected to the heat conductor 12 passing through the through hole, wherein the first opening of the through hole is located on the first side of the substrate body 11; the first heat-conducting layer 14 is disposed on the first side of the substrate body 11, and the first heat-conducting layer 14 is thermally connected to the first heat dissipation mesh 13. This substrate 10 can quickly dissipate heat from the chip, effectively improving the chip's heat dissipation efficiency and effect.
[0027] Since the components arranged in different parts of the substrate body 11 have different power, for example, the power of the chips in certain areas of the substrate body 11 is relatively high, and the heat generation is also relatively high. Therefore, the heat dissipation capacity of these areas needs to be further enhanced. Therefore, in order to achieve differentiated configuration of heat dissipation capacity in different areas of the substrate body 11, optionally, in one embodiment of the present invention, at least some of the mesh wires included in the first heat dissipation mesh 13 have a first cross-section, and another part of the mesh wires have a second cross-section, the first cross-section and the second cross-section being different; and / or, at least some of the adjacent mesh wires included in the first heat dissipation mesh 13 have a first spacing, and another part of the adjacent mesh wires have a second spacing, the first spacing and the second spacing being different. For example, the mesh wires of the first heat dissipation mesh 13 at the location corresponding to the area with higher thermal power of the substrate body 11 can be configured with a first cross-section, and the mesh wires of the first heat dissipation mesh 13 at the location corresponding to the area with lower thermal power of the substrate body 11 can be configured with a second cross-section. The heat dissipation capacity of the first cross-section is better than that of the second cross-section. For example, the cross-sectional area of the first cross-section can be larger than that of the second cross-section, or the heat dissipation surface area of the first cross-section can be larger than that of the second cross-section. Alternatively, a first spacing can be configured between adjacent wires of the first heat dissipation mesh 13 at the location corresponding to the region with higher thermal power of the substrate body 11, and a second spacing can be configured between adjacent wires of the first heat dissipation mesh 13 at the location corresponding to the region with lower thermal power of the substrate body 11. The first spacing can be greater than the second spacing, so that the heat dissipation capacity of adjacent wires with the first spacing is better than that of adjacent wires with the second spacing.
[0028] Optionally, in one embodiment of the present invention, the heat conductor 12 includes a column, a first cover, and a second cover. The column is located inside the through hole, the first cover is disposed at the first opening of the through hole and connected to the first end of the column, and the second cover is disposed at the second opening of the through hole and connected to the second end of the column. Optionally, in one embodiment of the present invention, the mesh wires of the first heat dissipation mesh 13 that intersect at the first opening of the through hole are connected to the first cover of the heat conductor 12 that passes through the through hole. The heat conductor 12 can be formed by filling the through hole with metal. Since the heat conductor 12 has a first cover at the first opening of the through hole and a second cover at the second opening of the through hole, the first cover or the second cover can have a larger cross-sectional area than the column. In this way, when the mesh wires of the first heat dissipation mesh 13 that intersect at the first opening of the through hole are connected to the first cover, a larger connection area can be formed, thereby ensuring the reliability of heat transfer between the first heat dissipation mesh 13 and the heat conductor 12.
[0029] Optionally, in one embodiment of the present invention, the material of the heat conductor 12 is metal; and / or, the material of the first heat-conducting layer 14 is nanomaterial; and / or, the material of the first heat dissipation mesh 13 is metal. The first heat-conducting layer 14 may be a graphene coating with a thickness of 30~50nm; the first heat-conducting layer 14 may be made of nanomaterials such as graphene or carbon nanotubes; the first heat dissipation mesh 13 may be made of metal wires with a diameter of 0.05~0.1mm and a spacing of 0.2~0.5mm to further enhance the heat dissipation capacity.
[0030] Optionally, in one embodiment of the present invention, a second heat dissipation mesh and a second heat-conducting layer are further included. The second heat dissipation mesh is disposed on the second side of the substrate body 11 and includes a plurality of mesh wires. At least some of the mesh wires in the second heat dissipation mesh intersect at the second opening of the through hole and are connected to the heat conductor 12 passing through the through hole. The second opening of the through hole is located on the second side of the substrate body 11. The second heat-conducting layer is disposed on the second side of the substrate body 11 and is thermally connected to the second heat dissipation mesh. For example, when components such as chips are disposed on the second side of the substrate body 11, the second heat dissipation mesh disposed on the second side of the substrate body 11 can quickly and efficiently absorb the heat of the components such as chips, and can dissipate heat outward from the second side of the substrate body 11. At the same time, it can also transfer heat to the first heat dissipation mesh 13 disposed on the first side of the substrate body 11 through the heat conductor 12 disposed in the through hole, thereby dissipating heat on the first side of the substrate body 11. It can be seen that by simultaneously disposing of the first heat dissipation mesh 13 and the second heat dissipation mesh on both sides of the substrate body 11, the heat dissipation area is further increased and the heat dissipation capacity is improved.
[0031] Secondly, embodiments of the present invention also provide a chip that can effectively improve the heat dissipation effect of the chip. The chip includes: a substrate 10; a die, the die being bonded to one side of the substrate 10; wherein the substrate 10 is any of the substrates 10 described in the embodiments of this application.
[0032] The chip provided in the embodiments of the present invention includes: a substrate 10; and a die. The substrate 10 includes a substrate body 11, a heat conductor 12, a first heat dissipation mesh 13, and a first heat-conducting layer 14. A through-hole is formed on a first side of the substrate body 11. The heat conductor 12 passes through the through-hole. The first heat dissipation mesh 13 is disposed on the first side of the substrate body 11 and includes multiple mesh wires. At least some of the mesh wires in the first heat dissipation mesh 13 intersect at the first opening of the through-hole and are connected to the heat conductor 12 passing through the through-hole. The first opening of the through-hole is located on the first side of the substrate body 11. The first heat-conducting layer 14 is disposed on the first side of the substrate body 11 and is thermally connected to the first heat dissipation mesh 13. This substrate 10 can quickly dissipate heat from the chip, effectively improving the chip's heat dissipation efficiency and effect.
[0033] Optionally, in one embodiment of the present invention, the chip further includes a heat dissipation system, which includes at least one of a fan, a heat sink, and a liquid cooler.
[0034] Thirdly, embodiments of the present invention also provide a method for manufacturing a substrate 10 with a heat dissipation mesh, which can effectively improve the heat dissipation effect of the chip.
[0035] like Figure 2 As shown, the manufacturing method of the substrate 10 provided in this application embodiment may include: S11, Prepare substrate body 11; S12. A through hole is formed on the first side of the substrate body 11; S13. Insert the heat conductor 12 into the through hole of the substrate body 11; S14. A first heat dissipation mesh 13 is provided on the first side of the substrate body 11, wherein the first heat dissipation mesh 13 includes a plurality of mesh wires, and the first heat dissipation mesh 13 is configured such that: at least some of the mesh wires included in the first heat dissipation mesh 13 intersect at the first opening of the through hole and are connected to the heat conductor 12 inserted into the through hole, wherein the first opening of the through hole is located on the first side of the substrate body 11. S15. A first thermally conductive layer 14 is formed on the first side of the substrate body 11, and the first thermally conductive layer 14 is thermally connected to the first heat dissipation mesh 13.
[0036] The method for manufacturing a substrate 10 provided in the embodiments of the present invention produces a substrate 10 comprising a substrate body 11, a heat conductor 12, a first heat dissipation mesh 13, and a first heat-conducting layer 14. A through-hole is formed on a first side of the substrate body 11; the heat conductor 12 passes through the through-hole; the first heat dissipation mesh 13 is disposed on the first side of the substrate body 11, and the first heat dissipation mesh 13 includes a plurality of mesh wires. At least some of the mesh wires in the first heat dissipation mesh 13 intersect at the first opening of the through-hole and are connected to the heat conductor 12 passing through the through-hole, wherein the first opening of the through-hole is located on the first side of the substrate body 11; the first heat-conducting layer 14 is disposed on the first side of the substrate body 11, and the first heat-conducting layer 14 is thermally connected to the first heat dissipation mesh 13. This substrate 10 can rapidly dissipate heat from the chip, effectively improving the chip's heat dissipation efficiency and effect.
[0037] Optionally, in one embodiment of the present invention, after the first heat dissipation mesh 13 is provided on the first side of the substrate body 11, the method further includes: providing a second heat dissipation mesh on the second side of the substrate body 11, wherein the second heat dissipation mesh includes a plurality of mesh wires, and the second heat dissipation mesh is configured such that: at least some of the mesh wires included in the second heat dissipation mesh intersect at the second opening of the through hole and are connected to the heat conductor 12 inserted into the through hole, wherein the second opening of the through hole is located on the second side of the substrate body 11; a second heat-conducting layer is formed on the second side of the substrate body 11, and the second heat-conducting layer is thermally connected to the second heat dissipation mesh.
[0038] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0039] The various embodiments in this specification are described in a related manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.
[0040] In particular, the device embodiment is basically similar to the method embodiment, so the description is relatively simple. For relevant details, please refer to the description of the method embodiment.
[0041] For ease of description, the above apparatus is described by dividing it into various functional units / modules. Of course, in implementing this invention, the functions of each unit / module can be implemented in one or more software and / or hardware.
[0042] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.
Claims
1. A substrate with a heat dissipation mesh, characterized in that, include: A substrate body, wherein a through hole is formed on the first side of the substrate body; A heat conductor, wherein the heat conductor passes through the through hole; A first heat dissipation mesh is disposed on a first side of the substrate body. The first heat dissipation mesh includes a plurality of mesh wires. At least some of the mesh wires in the first heat dissipation mesh intersect at the first opening of the through hole and are connected to a heat conductor passing through the through hole. The first opening of the through hole is located on the first side of the substrate body. A first thermally conductive layer is disposed on a first side of the substrate body, and the first thermally conductive layer is thermally connected to the first heat dissipation mesh.
2. The substrate as described in claim 1, characterized in that, The first heat dissipation mesh comprises a plurality of wires, at least some of which have a first cross-section, and another portion of which have a second cross-section, wherein the first cross-section and the second cross-section are different; and / or, The first heat dissipation mesh includes a plurality of mesh wires, at least some of the adjacent mesh wires have a first spacing, and another part of the adjacent mesh wires have a second spacing, wherein the first spacing and the second spacing are different.
3. The substrate as described in claim 1, characterized in that, The heat conductor includes a column, a first cover, and a second cover. The column is located inside the through hole. The first cover is placed over the first opening of the through hole and connected to the first end of the column. The second cover is placed over the second opening of the through hole and connected to the second end of the column.
4. The substrate as described in claim 3, characterized in that, The mesh wires of the first heat dissipation mesh that intersect at the first opening of the through hole are connected to the first cover of the heat-conducting body that passes through the through hole.
5. The substrate as claimed in claim 1, characterized in that, The material of the heat conductor is metal; and / or, the material of the first heat-conducting layer is nanomaterial; and / or, the material of the first heat dissipation mesh is metal.
6. The substrate as claimed in claim 1, characterized in that, It also includes a second heat dissipation mesh and a second thermally conductive layer. The second heat dissipation mesh is disposed on the second side of the substrate body and includes a plurality of mesh wires. At least some of the mesh wires in the second heat dissipation mesh intersect at the second opening of the through hole and are connected to the thermally conductive body passing through the through hole. The second opening of the through hole is located on the second side of the substrate body. The second thermally conductive layer is disposed on the second side of the substrate body and is thermally connected to the second heat dissipation mesh.
7. A chip, characterized in that, include: substrate; A grain, said grain being bonded to one side of the substrate; wherein the substrate is the substrate according to any one of claims 1-6.
8. The chip as described in claim 7, characterized in that, It also includes a heat dissipation system, which includes at least one of a fan, a heat sink, and a liquid-cooled radiator.
9. A method for manufacturing a substrate with a heat dissipation mesh, characterized in that, include: Preparation of the substrate body; A through hole is formed on the first side of the substrate body; The heat conductor is placed into the through hole of the substrate body; A first heat dissipation mesh is provided on the first side of the substrate body, wherein the first heat dissipation mesh includes a plurality of mesh wires, and the first heat dissipation mesh is configured such that: at least some of the mesh wires included in the first heat dissipation mesh intersect at the first opening of the through hole and are connected to the heat conductor inserted into the through hole, wherein the first opening of the through hole is located on the first side of the substrate body. A first thermally conductive layer is formed on a first side of the substrate body, and the first thermally conductive layer is thermally connected to the first heat dissipation mesh.
10. The method for manufacturing a substrate as described in claim 9, characterized in that, After the first heat dissipation mesh is provided on the first side of the substrate body, the method further includes: providing a second heat dissipation mesh on the second side of the substrate body, wherein the second heat dissipation mesh includes a plurality of mesh wires, and the second heat dissipation mesh is configured such that: at least some of the mesh wires included in the second heat dissipation mesh intersect at the second opening of the through hole and are connected to the heat conductor inserted into the through hole, wherein the second opening of the through hole is located on the second side of the substrate body; A second thermally conductive layer is formed on the second side of the substrate body, and the second thermally conductive layer is thermally connected to the second heat dissipation mesh.