Conductive mesh and electronic device

Abstract

The application discloses a conductive grid and electronic equipment, and relates to the technical field of electronic devices, wherein the conductive grid comprises a main body area, a buffer area and a pin area which are sequentially distributed, the buffer area and the main body area are both formed with a grid, a boundary line body is arranged between the buffer area and the main body area, the main body area is provided with a first line body connected with the boundary line body, the buffer area is provided with at least one row of second line bodies which are distributed along the extension direction of the boundary line body, and the position where the boundary line body is connected with the first line body is staggered with the position where the boundary line body is connected with the second line body. The technical scheme provided by the application aims to reduce the probability of line body floating or breaking at the connection position of the pin area and the main body area.

Description

Technical Field

[0001] This invention relates to the field of electronic device technology, and in particular to a conductive grid and an electronic device. Background Technology

[0002] Conductive meshes typically consist of leads and mesh lines. Due to the small size of the mesh lines and the low residual copper content in the mesh area, the adhesion of the mesh lines is weak. At the same time, the thermal expansion coefficient of the substrate is large, and its size changes significantly during the fabrication process. Both factors combined make the mesh lines prone to floating and breaking, especially in the junction area between the leads and the mesh lines. Summary of the Invention

[0003] The main objective of this invention is to provide a conductive mesh and electronic device that aims to reduce the probability of wire detachment or breakage at the connection between the pin area and the body area.

[0004] To achieve the above objectives, the conductive mesh proposed in this invention includes a main body region, a buffer zone, and a pin region distributed sequentially. Both the buffer zone and the main body region are formed with a mesh. A boundary line is provided between the buffer zone and the main body region. The main body region has a first line connecting to the boundary line. The buffer zone has at least one row of second lines distributed along the extension direction of the boundary line. The position where the boundary line connects to the first line is staggered from the position where the boundary line connects to the second line.

[0005] In one embodiment, the buffer zone forms multiple rows of the second line bodies, and a third line body is provided between two adjacent rows of the second line bodies. The third line body and the dividing line body are parallel, and the position of the third line body connecting to one of the adjacent rows of the second line bodies is staggered from the position of the third line body connecting to the second line body connecting to the other adjacent row.

[0006] In one embodiment, the second line body is set to have at least four rows.

[0007] In one embodiment, for both sides of the third line body, each of the second lines body on one side is centrally located in the region between two adjacent second lines body on the other side.

[0008] In one embodiment, the line width of the second line body is greater than the line width of the first line body.

[0009] In one embodiment, the line width of the second line body is at least twice the line width of the first line body.

[0010] In one embodiment, the distance between the pin area and the dividing line body is greater than or equal to 8 mm.

[0011] In one embodiment, for a second line body connected to the dividing line body, the dividing line body has at least one second line body connected between every two adjacent first line bodies.

[0012] In one embodiment, for the second line body connected to the dividing line body, each second line body is disposed in the middle of the region between two adjacent first line bodies, or a second line body is disposed close to a first line body.

[0013] In one embodiment, the grid of the buffer is rhomboid, rectangular, or parallelogram-shaped.

[0014] In one embodiment, the grid of the main area is diamond-shaped or rectangular.

[0015] The present invention also proposes an electronic device comprising the aforementioned conductive mesh.

[0016] In one embodiment, the electronic device is configured as a head-mounted display device, the lenses of which are provided with at least one of an antenna structure, an electrochromic film, and an electrothermal film, wherein at least one of the antenna structure, the electrochromic film, and the electrothermal film includes the conductive mesh.

[0017] In one embodiment, the electronic device includes a touch screen, the touch screen including the conductive mesh.

[0018] In one embodiment, the electronic device has an electromagnetic shielding structure, the electromagnetic shielding structure including the conductive mesh.

[0019] In one embodiment, for the conductive grid of the antenna structure of the head-mounted display device, the main body region, the buffer zone, and the pin region are arranged in a ring shape and distributed sequentially from the inside out.

[0020] In this invention, a buffer zone effectively releases stress between the main body area and the pin area. The connection position of the second wire in the buffer zone on the boundary line is staggered from the connection position of the first wire in the main body area on the boundary line, thus dispersing stress between the pin area and the main body area. This allows for a more uniform load distribution, reducing the risk of localized overload and lowering the probability of wire detachment or breakage at the connection point between the pin area and the main body area. This improves the manufacturability of the conductive mesh. Furthermore, the use of extremely fine linewidths in the main body area ensures the structural stability of the conductive mesh. Simultaneously, the conductive mesh exhibits good electrical performance and high light transmittance, making it suitable for applications such as transparent antennas and touch screens. Moreover, since the buffer zone also forms a mesh, its impact on the light transmittance and conductivity of the conductive mesh is minimal, further ensuring the performance of the conductive mesh and its applicability to transparent antennas and touch screens. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the application structure of an embodiment of the conductive mesh provided by the present invention;

[0023] Figure 2 A schematic diagram of the structure of an embodiment of the conductive mesh provided by the present invention;

[0024] Figure 3 A schematic diagram of another embodiment of the conductive mesh provided by the present invention;

[0025] Figure 4 A schematic diagram of another embodiment of the conductive mesh provided by the present invention;

[0026] Figure 5 A schematic diagram of another embodiment of the conductive mesh provided by the present invention;

[0027] Figure 6 A schematic diagram of the cross-sectional structure of a preset line body of the conductive mesh provided by the present invention in each processing step;

[0028] Figure 7 A schematic diagram of a conductive mesh mounted on the lens of a head-mounted display device.

[0029] Explanation of icon numbers:

[0030] 100. Conductive grid; 110. Main body area; 120. Buffer zone; 130. Pin area;

[0031] 101. First line body; 102. Second line body; 103. Third line body; 104. Boundary line body;

[0032] 210, Substrate; 220, Cover layer; 230, Adhesive layer.

[0033] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0034] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0035] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0036] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0037] This invention proposes a conductive mesh.

[0038] Please see Figures 2 to 5 In one embodiment of the present invention, the conductive mesh 100 includes a main body region 110, a buffer zone 120, and a pin region 130 arranged sequentially. Both the buffer zone 120 and the main body region 110 are formed with meshes. A dividing line 104 is provided between the buffer zone 120 and the main body region 110. The main body region 110 has a first line 101 connecting to the dividing line 104. The buffer zone 120 has at least one row of second lines 102 distributed along the extension direction of the dividing line 104. The position where the dividing line 104 is connected to the first line 101 is staggered from the position where the dividing line 104 is connected to the second line 102.

[0039] It is understood that the pin area 130 is provided with pins for connecting to the circuit, and both the buffer area 120 and the main body area 110 are provided with lines, which form a grid. The lines include a first line 101 located in the buffer area 120, a boundary line 104 located between the buffer area 120 and the main body area 110, and a second line 102 located in the buffer area 120. The first line 101 can be configured as a row distributed along the extension direction of the boundary line 104 to form a rectangular grid, or the first line 101 can be intersecting to form a rhomboid grid. In constructing a rectangular grid, a row of first line 101 may include at least two first line 101s to construct at least one grid in the area of ​​a row, and the remaining areas of the main body area 110 are also constructed in this way to form multiple rows of grids. Alternatively, the two ends of the first line 101 may be connected to two boundary lines 104 respectively to form a row of grids in the main body area 110, and multiple grids may be formed in the area of ​​a row by setting multiple first line 101s.

[0040] The second line body 102 can be arranged in a row, with the dividing line body 104 connected to one end of the second line body 102, and the pins of the pin area 130 connected to the other end of the second line body 102. When there is a vacancy in the pin area 130, the buffer 120 also has an edge line body parallel to the dividing line body 104 on the side near the pin area 130, for the second line body 102 to be connected to the end near the pin area 130.

[0041] The second line body 102 can also be configured in two or more rows. A third line body 103 parallel to the dividing line body 104 is provided between two adjacent rows of second line bodies 102 for connecting the two connected rows of second line bodies 102. The second line body 102 near the main body area 110 is connected to the dividing line body 104, and the second line body 102 near the pin area 130 is connected to the pin or edge line body of the aforementioned pin area 130.

[0042] In this invention, the buffer zone 120 effectively releases the stress between the main body region 110 and the pin region 130. The connection position of the second wire 102 of the buffer zone 120 on the dividing line 104 is staggered from the connection position of the first wire 101 of the main body region 110 on the dividing line 104. This disperses the stress between the pin region 130 and the main body region 110, allowing for a more uniform load distribution and reducing the risk of localized overload. It also lowers the probability of wire detachment or breakage at the connection point between the pin region 130 and the main body region 110, thereby improving the manufacturability of the conductive mesh 100. Furthermore, the extremely fine linewidth of the wires in the main body region 110 ensures the structural stability of the conductive mesh 100. Simultaneously, the conductive mesh 100 exhibits good electrical performance and high light transmittance, making it suitable for applications such as transparent antennas and touch screens. Furthermore, since the buffer zone 120 also forms a grid, it has little impact on the transmittance and conductivity of the conductive grid 100, which helps to ensure the performance of the conductive grid 100 and its applicability to fields such as transparent antennas and touch screens.

[0043] In one embodiment, please refer to Figure 2 , Figure 3 and Figure 5 Multiple second lines 102 in the same row are arranged at intervals. In this way, a quadrilateral grid can be formed by constructing a row of second lines 102, and the connection points between adjacent second lines 102 on the boundary line do not coincide, which is more conducive to improving the stress dispersion effect. Of course, in other embodiments, provided that the stress dispersion requirements are met, multiple second lines 102 in the same row can also be connected sequentially to construct a triangular grid.

[0044] Furthermore, in this embodiment, multiple second lines 102 in the same row are parallel. This allows for the construction of a parallelogram-shaped mesh, which improves the stress distribution uniformity of the buffer zone 120, thereby ensuring the structural stability of the conductive mesh 100. Of course, in other embodiments, multiple second lines 102 in the same row can also be constructed to form a trapezoidal mesh, wherein an isosceles trapezoidal mesh is beneficial for ensuring the stress distribution uniformity of the buffer zone 120.

[0045] Furthermore, in this embodiment, multiple second wires 102 in the same row are evenly spaced. This results in a relatively uniform mesh size formed by a row of second wires 102, which helps to further improve the stress distribution uniformity of the buffer zone 120, thereby ensuring the structural stability of the conductive mesh 100. Of course, in other embodiments, the distribution density of the second wires 102 can be increased in areas with higher stress concentration and decreased in areas with lower stress.

[0046] Optionally, please refer to Figure 2 and Figure 3 The second line body 102 is parallel to the distribution direction of the pin area 130 and the main body area 110. "Parallel" means parallel or approximately parallel, allowing the second line body 102 to be set perpendicular or approximately perpendicular to the boundary line body 104. This enables the formation of a rectangular grid, facilitating the processing and shaping of the conductive grid 100. Optionally, please refer to... Figure 5 The second line body 102 is inclined relative to the distribution direction of the pin area 130 and the main body area 110. The parallelogram grid formed in this way has strong deformation ability and can absorb a certain amount of energy through deformation after being subjected to external force, thereby reducing the possibility of breakage.

[0047] In one embodiment, please refer to Figure 4 The multiple second lines 102 in the same row include multiple groups of lines formed by the intersection of two first lines 101. In this way, the line groups can connect with the structures on both sides to form a triangular structure. The triangular structure improves the structural stability of the buffer zone 120, thereby ensuring the connection stability between the main body area 110 and the pin area 130.

[0048] Furthermore, in this embodiment, adjacent sides of two adjacent line groups are connected to the dividing line 104 at the same position. This creates a direct connection between adjacent line groups, providing more paths for stress conduction and dispersion, thereby further improving the structural stability of the buffer zone 120 and ensuring the connection stability between the main body area 110 and the pin area 130. Of course, in other embodiments, adjacent sides of two adjacent line groups may be connected to the dividing line 104 at different positions.

[0049] In one embodiment, please refer to Figure 2 , Figure 4 and Figure 5 The dividing line body 104 has at least one second line body 102 connected between every two adjacent first line bodies 101. In this way, it can be ensured that there are a sufficient number of second line bodies 102 along the extension of the dividing line, and that the distribution density is relatively uniform, which is beneficial to ensuring the structural strength of the buffer zone 120, thereby ensuring the structural stability of the conductive grid 100.

[0050] In this embodiment, each second line body 102 connected to the dividing line body 104 is positioned in the middle of the region between two adjacent first line bodies 101. It is understood that "middle" does not refer to the exact midpoint, but rather the region near the midpoint. In this embodiment, the second line body 102 is positioned in the middle of the dividing line between two adjacent first line bodies 101, ensuring sufficient offset between the connection points of the first line bodies 101 and the second line bodies 102, thereby ensuring the force distribution effect of the lines in the buffer zone 120. This method is particularly suitable when the line widths of the second line body 102 and the first line body 101 are comparable, because in this case, sufficient offset ensures uniform stress distribution, which is beneficial for maintaining the structural stability of the conductive mesh 100.

[0051] Of course, the second line body 102 connected to the dividing line body 104 can also be, as follows: Figure 3 As shown, the second wire 102 is positioned close to the first wire 101. This shortens the force transmission path from the first wire 101 to the second wire 102. When the second wire 102 has sufficient structural strength, it can effectively help the first wire 101 absorb external forces, thereby ensuring the connection stability between the main body area 110 and the pin area 130.

[0052] Without loss of generality, the dividing line 104 connects a second line 102 between every two adjacent first lines 101. That is, the spacing between two second lines 102 is roughly the same as the spacing between two first lines 101, which helps to improve the uniformity of the grid distribution, thereby improving the uniformity of stress distribution and ensuring the structural stability of the conductive grid 100. Of course, in other embodiments, the dividing line 104 may connect more than one second line 102 between every two adjacent first lines 101, such that the distribution density of the second lines 102 is greater than the distribution density of the first lines 101.

[0053] In one embodiment, please refer to Figure 2 The buffer zone 120 is formed with multiple rows of second wires 102. The position of the third wire 103 connected to one of the adjacent rows of second wires 102 is staggered from the position connected to the second wires 102 connected to the other adjacent row. In this way, the buffer zone 120 achieves further stress dispersion through the sequential staggered arrangement of multiple rows of wires. The load can be evenly distributed in both the extension directions of the second wires 102 and the extension directions of the third wires 103, which can further reduce the risk of excessive local stress and help prevent the wires in the buffer zone 120 from floating away or breaking, thereby ensuring the structural stability of the conductive wires.

[0054] Furthermore, in this embodiment, the second wire 102 is arranged in at least four rows, which can effectively disperse the stress between the pin area 130 and the main body area 110, reduce the stress on the wires of the buffer zone 120, and thus prevent the wires of the buffer zone 120 from floating or breaking. Of course, in other embodiments, if the requirements for the use of the conductive mesh 100 can be met, the second wire 102 can also be arranged in two or three rows.

[0055] Furthermore, for both sides of the third wire 103, each of the second wires 102 on one side is centrally located in the region between two adjacent second wires 102 on the other side. Similarly, this ensures that the second wires 102 on both sides of the third wire 103 have sufficient offset, thereby guaranteeing the force dispersion effect of the buffer zone 120. Without loss of generality, between each pair of adjacent second wires 102 on one side, the third wire 103 is connected to a second wire 102. Thus, the spacing between the second wires 102 on opposite sides of the third wire 103 is relatively uniform, which helps improve the uniformity of the mesh distribution, thereby improving the uniformity of stress distribution and ensuring the structural stability of the conductive mesh 100. Of course, in other embodiments, the second wires 102 on both sides of the third wire 103 can also be configured with different distribution densities.

[0056] In one embodiment, please refer to Figure 3 The line width of the second line body 102 is greater than that of the first line body 101. In this way, by increasing the line width of the second line body 102, the ability of the second line body 102 to resist external forces can be improved. The second line body 102 is not easily deformed, which helps to avoid the second line body 102 from breaking, thereby ensuring the structural stability of the conductive grid 100.

[0057] Furthermore, in this embodiment, the linewidth of the second line body 102 is at least twice the linewidth of the first line body 101. This ensures that the second line body 102 possesses sufficient strength to guarantee its resistance to deformation, thereby ensuring the structural stability of the conductive mesh 100. Additionally, it should be noted that the linewidth of the second line body 102 should be less than or equal to the line spacing between two adjacent second line bodies 102. Of course, in other embodiments, the linewidth of the second line body 102 can also be 1.5 times or 1.8 times the linewidth of the first line body 101.

[0058] In one embodiment, the distance between the pin area 130 and the boundary line 104 is greater than or equal to 8 mm. This ensures that the buffer zone 120 covers the high-risk area between the pin area 130 and the main body area 110, which is the area where the wire is prone to breakage. The mesh of the buffer zone 120 can thus disperse stress in this high-risk area, preventing structural damage at the connection between the pin area 130 and the main body area 110, thereby ensuring the structural stability of the conductive mesh 100. Of course, in other embodiments, this distance can be adjusted to less than 8 mm, provided that the structural stability of the conductive mesh 100 is ensured.

[0059] In one embodiment, please refer to Figure 6 At least the main body area 110 is equipped with a preset line body, the thickness of which is (refer to...) Figure 6 The indicated h) and line width (refer to) Figure 6 The ratio of w1 and w2 (indicated by the line thickness) is greater than or equal to 1. It can be understood that the line thickness direction is the direction of penetration within the grid space, while the line width direction is the distribution direction of the grid formed on both sides of the line body. The ratio of line thickness to line width is the ratio of line thickness to line width. By increasing the line thickness, the structural strength of the main body 110 is improved, thereby further enhancing the structural stability of the conductive grid 100. Simultaneously, a thicker line body provides better conductivity, the ability to carry large currents, and excellent heat dissipation performance, which is beneficial for ensuring the performance of the conductive grid 100. Furthermore, the line width of the preset line body can be maintained at a relatively fine level to ensure a transparent visual effect, thus ensuring applicability in fields such as touch screens and transparent antennas. Preferably, the ratio of the line thickness to the line width of the preset line body is greater than or equal to 1.4, which allows for a smaller line width and is more conducive to forming a transparent visual effect. In addition, the ratio of the thickness to the width of the preset line body is less than 3, making the line body less likely to tip over, which helps to ensure the structural stability of the conductive grid 100.

[0060] In one embodiment, the line width of the preset line is within 10 micrometers. This allows the preset line to be relatively thin, making it suitable for more precise applications and easier to create a transparent visual effect.

[0061] In one embodiment, the thickness of the preset line body is 6 to 12 micrometers. That is, the thickness of the preset line body is greater than or equal to 6 micrometers and less than or equal to 12 micrometers. In this way, the thickness and width of the preset line body are both within a suitable range to ensure the performance of the conductive grid 100. Preferably, the thickness of the preset line body is 8 to 10 micrometers.

[0062] In one embodiment, the conductive mesh 100 is disposed on a substrate 210. The preset line has a first surface and a second surface that are relatively distributed in the line thickness direction. The first surface is located on the side closer to the substrate 210. The linewidth of the second surface w2 exceeds the linewidth w1 of the first surface by less than 10%. That is, the linewidth w2 at the second surface exceeds the linewidth w1 at the first surface, and the ratio of the linewidth exceeding the first surface to the linewidth of the first surface is less than 10%, i.e., the value of (w2-w1) / w1 is less than or equal to 10%. In this way, the preset line can exhibit a relatively uniform linewidth in the line thickness direction, which is beneficial to ensuring the conductivity and structural stability of the preset line.

[0063] It is understood that the first surface is connected to the substrate 210 via adhesive layer 230, and the second surface is connected to the cover layer 220 or other structures via adhesive layer 230. Due to the larger linewidth at the second surface, the contact area between the second surface and the cover layer 220 or other upper components can be increased, thereby improving the uniformity of lateral current distribution and reducing surface resistance. When viewed from one side, the second surface can shield other parts of the conductive mesh 100, making the mesh appear finer and less conspicuous, thus improving the product's visual appearance. Furthermore, when the cover layer 220 or other materials are bonded to the conductive mesh 100, the wider second surface helps guide and disperse the adhesive, ensuring its uniform distribution and avoiding the formation of bubbles or voids, thereby improving the overall packaging quality. Of course, in other embodiments, the first surface may also have a wider linewidth.

[0064] In one embodiment, please refer to Figure 6 The linewidth of the preset line gradually increases from the first surface to the second surface. This allows the linewidth to vary uniformly, which helps ensure the structural stability and conductivity of the preset line. Of course, in other embodiments, the linewidth of the preset line may also have a uniform portion in the line thickness direction.

[0065] In one embodiment, please refer to Figure 6The cross-section of the preset line body is configured as a quasi-isosceles trapezoid or a quasi-rectangular shape. This means the preset line body has strong symmetry in the line width direction, which helps ensure its structural stability and electrical conductivity. Specifically, configuring the cross-section of the preset line body as a quasi-isosceles trapezoid or a quasi-rectangular shape means that the shapes of the two surfaces of the preset line body distributed in the line width direction closely match the two sides of an isosceles trapezoid or the two long sides of a rectangle, with low deviation and without loss of generality; the maximum deviation should preferably not exceed 5% of the average line width. Of course, in other embodiments, the cross-section of the preset line body can also be configured as a near-rectangular parallelogram shape.

[0066] It is understandable that the conductive mesh 100 is typically formed by placing conductors on a substrate 210 and then etching the mesh. However, when processing materials with significant thickness, the etching process can easily lead to uneven width along the thickness direction. Please refer to [link to relevant documentation]. Figure 6 In this invention, with a dry film covering the second surface, an over-etching process is first used to make the line form an inverted trapezoidal shape on the substrate 210, meaning the width of the second surface is much wider than the width of the first surface. Then, the dry film is removed, followed by rapid etching. At this point, there is no dry film on the second surface, while the first surface adheres to the substrate 210. The substrate 210 provides some protection for the line on this side, resulting in a higher etching rate on the second surface than on the first surface, thus forming a line with uniform thickness. Specifically, since the line is formed by etching, pits will be formed on the two surfaces distributed along the line width direction, which distinguishes it from other processes. Of course, in other embodiments, the grid area of ​​the conductive mesh 100 can also be formed using processes such as laser direct writing or imprint lithography.

[0067] In one embodiment, please refer to Figure 6 The conductive mesh 100 is formed from rolled metal material through an etching process. Before coating with the dry film, the rolled metal material can be surface-treated using a micro-etching process to ensure its thickness meets the line thickness range of the conductive mesh 100. Without loss of generality, the rolled metal material can be copper, silver, etc. Alternatively, in other embodiments, the conductive mesh 100 can be formed by etching a deposited indium tin oxide film.

[0068] In one embodiment, please refer to Figure 2Both the main body region 110 and the buffer zone 120 are constructed to form multiple rows of rectangular grids. In this case, the linewidth of the second line body 102 can be set to be comparable to (equal to or approximately equal to) the linewidth of the first line body 101, and the line spacing between two adjacent second line bodies 102 can also be comparable to the line spacing between two adjacent first line bodies 101. This helps ensure a transparent visual effect in the buffer zone 120, thereby ensuring the applicability of the conductive grid 100 in fields such as transparent antennas and touch screens. Specifically, a row of first line bodies 101 forms multiple grids, and a row of second line bodies 102 also forms multiple grids. The number of grids formed by a row of second line bodies 102 and a row of first line bodies 101 is comparable. This allows stress to be dispersed through the second line bodies 102, ensuring the structural stability of the conductive grid 100, while also ensuring that the grid size formed by the second line bodies 102 is appropriate, so that a transparent visual effect can be formed in the buffer zone 120. Furthermore, the spacing between each second line body 102 and its two adjacent first line bodies 101 is also comparable, thereby ensuring a uniform distribution of stress. Furthermore, the lines of the main body area 110 and the buffer zone 120, as well as the dividing line 104, are all configured as preset lines, so that the lines of the grid area of ​​the conductive grid 100 can have consistency, which facilitates the processing and shaping of the conductive grid 100.

[0069] In one embodiment, please refer to Figure 3 The main body area 110 forms multiple rows of rectangular grids, while the buffer zone 120 forms only one row of rectangular grids. The line width of the second line body 102 in the buffer zone 120 is greater than that of the line body in the main body area 110, and the second line body 102 is offset from the first line body 101 by a small displacement. This ensures that the second line bodies 102 are evenly distributed on the same side of the corresponding first line body 101 and are positioned close to the corresponding first line body 101. In this way, the force on the first line body 101 can be transmitted to the structurally stronger second line body 102 more quickly. The second line body 102 absorbs the energy of external forces, which helps prevent line breakage at the connection between the main body area 110 and the pin area 130. If the length of the second line body 102 is greater than 8mm, it can effectively cover the area between the main body area 110 and the pin area 130 that is prone to line breakage. Furthermore, the lines and dividing lines 104 of the main area 110 are configured as preset lines, and the second line 102 of the buffer zone 120, apart from the ratio of line width to line thickness, can also have other features such as line thickness and cross-sectional shape set with reference to the preset lines.

[0070] In one embodiment, please refer to Figure 4 and Figure 5The main body area 110 forms a rhomboid grid. The lines in the buffer zone 120 can be constructed to form a rhomboid grid similar to that of the main body area 110. Alternatively, the buffer zone 120 can be provided with multiple evenly spaced and parallel second lines 102. The second lines 102 and the lines in one direction of the main body area 110 are inclined in the same direction to form a parallelogram grid. Without loss of generality, the lines and boundary lines 104 of the main body area 110 are configured as preset lines. The lines in the buffer zone 120 can also be configured as lines, or, except for the ratio of line width to line thickness, other features such as line thickness and cross-sectional shape can be set with reference to the preset lines.

[0071] The present invention also proposes an electronic device, which includes a conductive mesh 100. The specific structure of the conductive mesh 100 is as described in the above embodiments. Since the electronic device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0072] In one embodiment, the electronic device is configured as a head-mounted display device. An antenna structure is disposed on the lens of the head-mounted display device. The lens of the head-mounted display device is also disposed on at least one of the antenna structure, an electrochromic film, and an electrically heated film. At least one of the antenna structure, electrochromic film, and electrically heated film includes the conductive mesh. The antenna structure, electrochromic film, and electrically heated film may completely cover the lens of the head-mounted display device or may only partially cover it.

[0073] Please see Figure 7 Without loss of generality, for the antenna structure, the main body region 110, the buffer zone 120, and the pin region 130 are arranged in a ring shape and distributed sequentially from the inside out. The pin region 130 is located near the edge of the lens to facilitate concealment within the lens frame. This effectively utilizes the peripheral area of ​​the lens while ensuring that the signal transmission path between the pins of the pin region 130 and the lines in the grid area is as short as possible. Furthermore, the overall ring-shaped structure of the antenna can shield external electromagnetic interference to a certain extent, protect the internal circuitry from external noise, help reduce the impact of electromagnetic radiation generated by the antenna itself on the external environment, and improve the antenna's directivity and gain characteristics, thereby enhancing its ability to resist multipath effects.

[0074] Of course, in other embodiments, the conductive mesh 100 can also be configured on the touch screen or electromagnetic shielding structure of an electronic device, or on the display screen of a HUD display device, i.e., on the windshield of a vehicle.

[0075] It is understandable that the conductive meshes in the above structures can take the same form to improve the standardization of materials, or they can take different forms to better adapt to different functions.

[0076] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the technical concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A conductive mesh, characterized in that, It includes a main body area, a buffer area and a pin area distributed in sequence. Both the buffer area and the main body area are formed with a grid. A dividing line body is provided between the buffer area and the main body area. The main body area has a first line body connected to the dividing line body. The buffer area has at least one row of second line bodies distributed along the extension direction of the dividing line body. The position where the dividing line body is connected to the first line body is staggered from the position where the dividing line body is connected to the second line body.

2. The conductive mesh as described in claim 1, characterized in that, The buffer zone forms multiple rows of the second line bodies, and a third line body is provided between two adjacent rows of the second line bodies. The third line body and the dividing line body run parallel to each other, and the position of the third line body connecting to one of the adjacent rows of the second line bodies is staggered from the position connecting to the second line body connecting to the other adjacent row.

3. The conductive mesh as described in claim 2, characterized in that, The second line body is set to have at least four rows.

4. The conductive mesh as described in claim 2, characterized in that, For both sides of the third line body, each of the second lines body on one side is centrally located in the region between two adjacent second lines body on the other side.

5. The conductive mesh as described in claim 1, characterized in that, The line width of the second line body is greater than the line width of the first line body.

6. The conductive mesh as described in claim 5, characterized in that, The line width of the second line body is at least twice the line width of the first line body.

7. The conductive mesh as claimed in claim 1, characterized in that, The distance between the pin area and the dividing line is greater than or equal to 8mm.

8. The conductive mesh as described in claim 1, characterized in that, For the second line body connected to the dividing line body, the dividing line body has at least one second line body connected between every two adjacent first line bodies.

9. The conductive mesh as described in claim 1, characterized in that, For the second line body connected to the dividing line body, each second line body is disposed in the middle of the region between two adjacent first line bodies, or a second line body is disposed close to a first line body.

10. The conductive mesh as claimed in claim 1, characterized in that, The grid of the buffer zone is rhomboid, rectangular, or parallelogram-shaped; And / or, the grid of the main area is diamond-shaped or rectangular.

11. An electronic device, characterized in that, Includes the conductive mesh as described in any one of claims 1 to 10.

12. The electronic device as claimed in claim 11, characterized in that, The electronic device is configured as a head-mounted display device, and the lenses of the head-mounted display device are provided with at least one of an antenna structure, an electrochromic film, and an electroheating film, wherein at least one of the antenna structure, the electrochromic film, and the electroheating film includes the conductive mesh. And / or, the electronic device includes a touch screen, the touch screen including the conductive mesh; And / or, the electronic device has an electromagnetic shielding structure, the electromagnetic shielding structure including the conductive mesh.

13. The electronic device as claimed in claim 12, characterized in that, For the conductive grid of the antenna structure of the head-mounted display device, the main body area, the buffer area and the pin area are in a ring shape and are distributed sequentially from the inside out.

Images