A power conversion device, system card, integrated capacitor plate manufacturing method and power supply module

Abstract

The application provides a power conversion device, comprising a full-bridge circuit, two magnetic cores, four synchronous rectification circuits, the full-bridge circuit comprising two upper switches, two middle switches, a resonance capacitor, a first high-voltage winding and a second high-voltage winding; each of the synchronous rectification circuits comprises a first lower switch, a second lower switch, a first low-voltage winding and a second low-voltage winding; further comprising an input end and an output end, the input end comprising an input positive end and a GND end, and the output end comprising an output positive end and a GND end. Through the winding mode of the magnetic cores and windings of the two groups of magnetic components, the application realizes a high ratio of input voltage to output voltage of 15:1 of the power conversion device; on the other hand, through the two groups of magnetic components, the four groups of synchronous rectification circuits, the four groups of output terminals and the layout of the corresponding devices, the parasitic resistance on the path of large current is reduced, and the conversion efficiency of the power conversion device is improved.

Description

Technical Field

[0001] This invention belongs to the field of high-frequency power supply technology, and particularly relates to a power conversion device, a system card, a method for manufacturing an integrated capacitor board, and a power supply module.

[0002] With the development of artificial intelligence, the power requirements of intelligent data processing chips, such as GPUs / CPUs / NPUs / TPUs (collectively referred to as xPUs), are increasing, leading to a significant increase in server power consumption and a gradual shift in server input voltage from 12V to 48V. Meanwhile, the operating voltage of xPUs is decreasing with advancements in manufacturing processes, moving from 0.8V to 0.65V. Consequently, the ratio of input voltage to output voltage is increasing, making the two-stage buck converter architecture increasingly mainstream. This architecture includes a front-end proportional converter and a rear-end voltage regulator. To reduce the size of the rear-end voltage regulator and improve its dynamic response speed, the switching frequency has increased from 1MHz to 10MHz, resulting in a lower input voltage for the rear-end voltage regulator, from 12V to 6.75V, and further down to 5V or 3.3V. This leads to an increasingly larger voltage gain ratio (input voltage to output voltage) for the front-end proportional converter. Furthermore, as the output voltage of the proportional converter decreases, the output current also increases to achieve the same or higher power output.

[0003] This invention proposes a high voltage gain ratio front-end proportional converter, achieving an input voltage to output voltage ratio of 15:1. This provides suitable voltage and power to the subsequent voltage regulator, enabling it to operate at its optimal state. Furthermore, by optimizing the transformer winding method and power device layout, the front-end proportional converter achieves low loss and small size characteristics. This invention also proposes a power supply structure for using this front-end proportional converter, further reducing parasitic losses in the output current path. Summary of the Invention

[0004] In view of this, one of the objectives of the present invention is to provide a power conversion device, comprising a full-bridge circuit, two magnetic cores, and four synchronous rectifier circuits. The full-bridge circuit includes two upper switches, two middle switches, a resonant capacitor, a first high-voltage winding, and a second high-voltage winding. The resonant capacitor, the first high-voltage winding, and the second high-voltage winding are connected in series. The four synchronous rectifier circuits are connected in parallel. Each synchronous rectifier circuit includes a first lower switch, a second lower switch, a first low-voltage winding, and a second low-voltage winding. The low-voltage windings in the same synchronous rectifier circuit are all wound on the same magnetic core. The first high-voltage winding and the second high-voltage winding are wound around two magnetic cores; It also includes an input terminal and an output terminal. The input terminal includes a positive input terminal and a GND terminal. The output terminal includes a positive output terminal and a GND terminal. The full-bridge circuit is electrically connected to the input terminal. The four synchronous rectifier circuits are electrically connected to the output terminal.

[0005] Preferably, the four synchronous rectifier circuits are a first synchronous rectifier circuit, a second synchronous rectifier circuit, a third synchronous rectifier circuit, and a fourth synchronous rectifier circuit; in each of the synchronous rectifier circuits, the second end of the first low-voltage winding and the second end of the second low-voltage winding are electrically connected to the positive output terminal, the first end of the first low-voltage winding is electrically connected to the first lower switch, and the first end of the second low-voltage winding is electrically connected to the second lower switch; both the first lower switch and the second lower switch are electrically connected to the GND terminal.

[0006] Preferably, the two upper switches are a first upper switch and a second upper switch, and the two middle switches are a first middle switch and a second middle switch. The first upper switch and the first middle switch are electrically connected to a first node, and the second upper switch and the second middle switch are electrically connected to a second node. The resonant capacitor, the first high-voltage winding, and the second high-voltage winding are connected in series and then connected in series between the first node and the second node. The first end of the second high-voltage winding is electrically connected to the second end of the first high-voltage winding. Both the first upper switch and the second upper switch are electrically connected to the positive input terminal, and both the first middle switch and the second middle switch are electrically connected to the positive output terminal.

[0007] Preferably, the first end of the first high-voltage winding, the first end of the second high-voltage winding, the first end of each of the first low-voltage windings, and the second end of each of the second low-voltage windings are terminals with the same name.

[0008] Preferably, the two magnetic cores are a first magnetic core and a second magnetic core, respectively; each magnetic core includes a first side post, a middle post, a second side post, an upper magnetic cover, and a lower magnetic cover, wherein the first side post, the second side post, and the middle post are located between the upper magnetic cover and the lower magnetic cover; the first side post, the middle post, and the second side post are arranged sequentially in the same direction; a first winding channel is formed between the first side post and the middle post, and a second winding channel is formed between the second side post and the middle post; each magnetic core includes opposing inner and outer sides, wherein the inner sides of the first magnetic core and the inner sides of the second magnetic core are arranged adjacent to each other.

[0009] Preferably, the first low-voltage winding in each of the synchronous rectifier circuits passes through a winding channel, and the second low-voltage winding in each of the synchronous rectifier circuits passes through another winding channel.

[0010] Preferably, the first end of the first high-voltage winding and the second end of the second high-voltage winding are both located near the inner side of the magnetic core and near the first winding channel. From the first end of the first high-voltage winding to the second end of the second high-voltage winding, the high-voltage winding is first wound around the central column of the first magnetic core and the central column of the second magnetic core in one direction for at least three turns, reaching the intermediate node. Then it is divided into a first winding and a second winding. The first winding is wound around the central column of the first magnetic core in the same direction for one turn, reaching the second node. The second winding is wound around the central column of the second magnetic core for one turn, also reaching the second node. The first winding and the second winding are connected in parallel between the intermediate node and the second node. The second node is the second end of the second high-voltage winding.

[0011] Preferably, the first end of the first high-voltage winding and the second end of the second high-voltage winding are both located near the inner side of the magnetic core and near the first winding channel. From the first end of the first high-voltage winding to the second end of the second high-voltage winding, the high-voltage winding is first wound around the central column of the first magnetic core and the central column of the second magnetic core in one direction for at least three turns, reaching the intermediate node. Then it is divided into a first winding and a second winding. The first winding is wound around the central column of the first magnetic core in the same direction for one turn, reaching the second node. The second winding is wound around the central column of the second magnetic core for one turn, also reaching the second node. The first winding and the second winding are connected in parallel between the intermediate node and the second node. The second node is the second end of the second high-voltage winding.

[0012] Preferably, In the first synchronous rectifier circuit, the first low-voltage winding passes through the first winding channel of the first magnetic core from the first end to the second end along a first direction; the second low-voltage winding passes through the second winding channel of the first magnetic core from the first end to the second end along a first direction; in the second synchronous rectifier circuit, the first low-voltage winding passes through the second winding channel of the first magnetic core from the first end to the second end along a second direction; in the third synchronous rectifier circuit, the first low-voltage winding passes through the second winding channel of the second magnetic core from the first end to the second end along a second direction; in the fourth synchronous rectifier circuit, the first low-voltage winding passes through the first winding channel of the second magnetic core from the first end to the second end along a first direction; the first direction is opposite to the second direction.

[0013] Preferably, it further includes at least three output capacitor groups, which are respectively disposed outside the lower switch of the second synchronous rectifier circuit, between the lower switches of the first synchronous rectifier circuit and the third synchronous rectifier circuit, and outside the lower switch of the fourth synchronous rectifier circuit.

[0014] Preferably, it also includes at least four sets of output terminals, each set of output terminals being adjacent to the lower switch of the corresponding synchronous rectifier circuit.

[0015] Preferably, the first lower switch includes two switches connected in parallel, and the second lower switch includes two switches connected in parallel. The first lower switch, the second lower switch, and the output capacitor are all disposed on the top and bottom surfaces of the substrate. The two parallel switches in the first lower switch are respectively disposed on the top and bottom surfaces of the substrate, and the projections of the two parallel switches on the top surface of the substrate at least partially overlap. Similarly, the two parallel switches in the second lower switch are respectively disposed on the top and bottom surfaces of the substrate, and the projections of the two parallel switches on the top surface of the substrate at least partially overlap. The projections of the output capacitor disposed on the top surface of the substrate and the output capacitor disposed on the bottom surface of the substrate at least partially overlap on the top surface of the substrate.

[0016] Preferably, the two first winding channels are arranged in a horizontal direction and the two second winding channels are arranged in a horizontal direction.

[0017] Preferably, the system further includes a substrate, the substrate having opposing top and bottom surfaces, and the two magnetic cores are respectively assembled with the substrate; the two upper switches and the two middle switches are disposed adjacent to the first side post, and the two upper switches and the two middle switches are disposed sequentially in the same direction along the order of the first middle switch, the first upper switch, the second upper switch and the second middle switch; the resonant capacitor is disposed adjacent to the upper switches and the middle switches.

[0018] Preferably, it further includes an input terminal and an input capacitor, which are disposed adjacent to the upper switch and the middle switch.

[0019] Preferably, the system further includes a substrate, the substrate having opposing top and bottom surfaces, a plurality of holes and a plurality of slots, the holes and slots penetrating the top and bottom surfaces of the substrate, the holes being used to place the first side post and the middle post of the magnetic core, and the slots being used to place the second side post of the magnetic core.

[0020] This invention also provides a power conversion device, including an input positive terminal, an input negative terminal, an output positive terminal, an output negative terminal, a high-voltage switch, a low-voltage switch, and a magnetic component. The magnetic component includes two magnetic cores, a high-voltage winding, and a low-voltage winding. The high-voltage switch is electrically connected to the high-voltage winding, and the low-voltage switch is electrically connected to the low-voltage winding. The two magnetic cores are a first magnetic core and a second magnetic core. Each magnetic core includes an upper magnetic cover, a lower magnetic cover, a first side post, a middle post, and a second side post. The first side post, the middle post, and the second side post are arranged sequentially in the same direction, and are all located between the upper and lower magnetic covers. In the same magnetic core, a first winding channel is formed between the first side post and the middle post, and a second winding channel is formed between the second side post and the middle post. The first magnetic core and the second magnetic core are arranged adjacent to each other, and the two first winding channels and the two second winding channels are connected in the horizontal direction. The high-voltage winding is wound around the central column of the two magnetic cores; the low-voltage winding passes through the first winding channel or the second winding channel of the two magnetic cores.

[0021] Preferably, the high-voltage winding includes a first high-voltage winding and a second high-voltage winding. The second end of the first high-voltage winding and the first end of the second high-voltage winding are connected in series and short-circuited. The first end of the first high-voltage winding and the second end of the second high-voltage winding are both located between the two magnetic cores and adjacent to the first side post. The high-voltage winding is wound from the first end to the second end as follows: First, starting from between the two magnetic cores, the winding is wound N times in the same direction around the two center posts to reach the middle node, where N is a natural number greater than or equal to 1. The middle node is also located in the middle of the two magnetic cores. Then, the winding is divided into a first winding and a second winding from the middle node. The first winding continues to be wound one turn around the center post of the first magnetic core in the same direction to reach the second node. The second winding continues to be wound one turn around the center post of the second magnetic core in the same direction to reach the second node. The first winding and the second winding are connected in parallel between the middle node and the second node. The second node is the second end of the second high-voltage winding.

[0022] Preferably, the low-voltage switch is located on opposite sides of the first magnetic core and opposite sides of the second magnetic core, the first end of the low-voltage winding is electrically connected to the low-voltage switch, the second end of the low-voltage winding is electrically connected to the positive output terminal, the low-voltage switch is electrically connected to the negative output terminal, and the low-voltage winding includes a first low-voltage winding and a second low-voltage winding; the first low-voltage winding and the second low-voltage winding respectively pass through a first winding channel and a second winding channel in the same magnetic core.

[0023] The present invention also provides a system card, comprising a system board, a load chip, a slot, a voltage regulator array, and a power conversion device as described in claim 1. The system board includes a top surface and a bottom surface opposite to each other. The load chip is disposed on the top surface of the system board, and the voltage regulator array is disposed on the bottom surface of the system board. The projections of the voltage regulator array and the load chip on the system board at least partially overlap. The voltage regulator array is electrically connected to the load chip through the system board, and the power conversion device is electrically connected to the voltage regulator array. The slot is disposed on opposite sides of the voltage regulator array, and the slot is electrically connected to the load chip.

[0024] Preferably, the system further includes the module substrate, which has a top surface and a bottom surface facing each other; the voltage regulation array and the power conversion device are both disposed on the top surface of the module substrate, and the power conversion device is disposed on opposite sides of the voltage regulation array; the bottom surface of the module substrate is provided with BGA pads, and the bottom surface of the module substrate is soldered to the bottom surface of the system board through the BGA pads.

[0025] Preferably, the power conversion device is disposed on the top surface of the system board and on opposite sides of the load chip, the trace between the power conversion device and the voltage regulation array is disposed along the X direction, and the trace between the load chip and the slot is disposed along the Y direction.

[0026] Preferably, the system further includes a first output capacitor and a second output capacitor. The first output capacitor is disposed adjacent to the power conversion device and is electrically connected to the output terminal of the power conversion device. The second output capacitor is disposed around each voltage regulator and is electrically connected to the output terminal of the voltage regulation array.

[0027] Preferably, the system further includes a module substrate, which has a top surface and a bottom surface opposite to each other; the voltage regulation array is disposed on the top surface of the module substrate, and the bottom surface of the module substrate is provided with BGA pins, through which the module substrate is electrically connected to the system board; a second output capacitor is integrated in the module substrate, and the second output capacitor is electrically connected to the output terminal of the voltage regulation array.

[0028] This invention also provides a method for manufacturing an integrated capacitor substrate, including a capacitor and a double-sided board, wherein the capacitor includes two pads; the step of integrating the capacitor into the substrate is as follows: Step 1: Embed the capacitor into the double-sided board and bring out the solder pad pins of the capacitor through laser drilling; Step 2: Press an insulating layer and a copper foil onto the top and bottom surfaces of the double-sided board with embedded capacitors to form a substrate with at least four layers. Step 3: For the at least four-layer substrate, drill through holes in areas where no capacitors are embedded; in areas where capacitors are embedded, drill laser holes corresponding to the pad lead-out positions; all capacitors are placed adjacent to the through holes. Step 4: Place balls at the via locations and laser aperture locations within the at least four-layer substrate to form BGA pins.

[0029] Preferably, the capacitor is a silicon capacitor, and the pads of the silicon capacitor are square pads.

[0030] The present invention also provides a power supply module, including a circuit board, a voltage regulator array, and a plurality of power conversion devices; the circuit board includes a top surface and a bottom surface opposite to each other; the voltage regulator array and the power conversion devices are disposed on the bottom surface of the circuit board; the power conversion devices are electrically connected to the voltage regulator array and provide power to the voltage regulator array; the voltage regulator array provides power to a load chip; the projections of the load chip and the voltage regulator array on the bottom surface of the circuit board at least partially overlap; the plurality of power conversion devices are respectively disposed on opposite sides of the circuit regulator array.

[0031] Preferably, the circuit board is a system board, and the load chip is disposed on the top surface of the system board.

[0032] Preferably, BGA pins are provided on the top surface of the circuit board.

[0033] The beneficial effects of this invention are: (1) The present invention achieves a high voltage gain ratio of 15:1 for the power conversion device by means of the winding method of the magnetic core and winding of two sets of magnetic components; (2) By using two sets of magnetic components, four sets of synchronous rectification circuits and four sets of output terminals, as well as the layout of the corresponding devices, the parasitic resistance on the path through which the large current flows is reduced, and the conversion efficiency of the power conversion device is improved. (3) A power supply structure for using this preamplifier is also proposed to further reduce parasitic losses on the output current path of this preamplifier. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 This is a circuit diagram of a power conversion device; Figures 2A to 2BThis refers to the winding method of the winding; Figures 3A to 3C This is a schematic diagram of the layout of the power conversion device.

[0036] Figures 4A to 4D This is one layout of the power conversion device on the system board; Figure 5A and Figure 5B This is another layout of the power conversion device on the system board; Figure 6A and Figure 6B This is a schematic diagram of the substrate for the embedded module of the output capacitor. Detailed Implementation

[0037] One of the core aspects of this invention is to provide a power conversion device with an input voltage to output voltage ratio that is higher than the output voltage ratio, also known as a power conversion device with a high voltage gain ratio or a proportional converter with a high voltage gain ratio.

[0038] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0039] This invention provides a proportional converter with a voltage gain ratio of 15:1 as an example for illustration. The circuit diagram is shown below. Figure 1 As shown, the circuit includes a first sub-circuit, a second sub-circuit, a first high-voltage winding, a second high-voltage winding, a resonant capacitor, an input capacitor, an output capacitor, an input terminal, and an output terminal. The input terminal includes a positive input terminal and a negative input terminal, and the output terminal includes a positive output terminal and a negative output terminal. In this embodiment, the negative input terminal and the negative output terminal are electrically connected to the GND terminal. The first sub-circuit includes an upper switch Q1, a middle switch Q2, a first synchronous rectifier circuit, and a second synchronous rectifier circuit. The second sub-circuit includes an upper switch Q3, a middle switch Q4, a first synchronous rectifier circuit, and a second synchronous rectifier circuit. Specifically, the source of the upper switch Q1 and the drain of the middle switch Q2 in the first sub-circuit are electrically connected to the first node SW1, and the drain of the upper switch Q1 is electrically connected to the positive input terminal Vin+, while the source of the middle switch Q2 is electrically connected to the positive output terminal Vo+. Similarly, the source of the upper switch Q3 and the drain of the middle switch Q4 in the second sub-circuit are electrically connected to the second node SW2, and the drain of the upper switch Q3 is electrically connected to the positive input terminal Vin+, while the source of the middle switch Q4 is electrically connected to the positive output terminal Vo+. The resonant capacitor Cr, the first high-voltage winding TW11, and the second high-voltage winding TW21 are connected in series and then bridging the first node SW1 and the second node SW2; wherein the second end of the first high-voltage winding TW11 is electrically connected to the first end of the second high-voltage winding TW21.

[0040] The first synchronous rectifier circuit in the first sub-circuit includes a first low-voltage winding T12, a second low-voltage winding T15, a first lower switch SR1, and a second lower switch SR4. The second end of the first low-voltage winding T12 and the second end of the second low-voltage winding T15 are both electrically connected to the positive output terminal Vo+. The first end of the first low-voltage winding T12 is electrically connected to the drain of the first lower switch SR1, and the first end of the second low-voltage winding T15 is electrically connected to the drain of the second lower switch SR4. The sources of the first lower switch SR1 and the second lower switch SR4 are both electrically connected to the GND terminal. The second synchronous rectifier circuit in the first sub-circuit includes a first low-voltage winding T14, a second low-voltage winding T13, a first lower switch SR3, and a second lower switch SR2. The second end of the first low-voltage winding T14 and the second end of the second low-voltage winding T13 are both electrically connected to the positive output terminal Vo+. The first end of the first low-voltage winding T14 is electrically connected to the drain of the first lower switch SR3. The first end of the second low-voltage winding T13 is electrically connected to the drain of the second lower switch SR2. The sources of the first lower switch SR3 and the second lower switch SR2 are both electrically connected to the GND terminal. The first synchronous rectifier circuit in the second sub-circuit includes a first low-voltage winding T22, a second low-voltage winding T25, a first lower switch SR5, and a second lower switch SR8. The second end of the first low-voltage winding T22 and the second end of the second low-voltage winding T25 are both electrically connected to the positive output terminal Vo+. The first end of the first low-voltage winding T22 is electrically connected to the drain of the first lower switch SR5, and the first end of the second low-voltage winding T25 is electrically connected to the drain of the second lower switch SR8. The sources of the first lower switch SR5 and the second lower switch SR8 are both electrically connected to the GND terminal. The second synchronous rectifier circuit in the second sub-circuit includes a first low-voltage winding T24, a second low-voltage winding T23, a first lower switch SR7, and a second lower switch SR6. The second terminals of both the first and second low-voltage windings T24 and T23 are electrically connected to the positive output terminal Vo+. The first terminal of the first low-voltage winding T24 is electrically connected to the drain of the first lower switch SR7, and the first terminal of the second low-voltage winding T23 is electrically connected to the drain of the second lower switch SR6. The sources of both the first and second lower switches SR7 and SR6 are electrically connected to the GND terminal. In this embodiment, by connecting four synchronous rectifier circuits in parallel, the parasitic resistance on the output circuit is significantly reduced, thereby minimizing the losses of the power conversion device.

[0041] Additionally, the input capacitor Cin is connected between the input positive terminal Vin+ and the output positive terminal Vo+, and the output capacitor Co is connected between the output positive terminal Vo+ and the GND terminal. The first end of each high-voltage winding, the first end of each first low-voltage winding, and the second end of each second low-voltage winding are terminals with the same name, labeled as dot terminals; the high-voltage winding and low-voltage winding shown in this embodiment are wound on two magnetic cores.

[0042] Detailed as Figure 2A and Figure 2B, Figure 2A The diagram shows the winding method of the high-voltage winding. Figure 2B The diagram illustrates the winding method of the low-voltage winding. This embodiment includes two magnetic cores, namely magnetic cores TW1 and TW2. Magnetic core TW1 includes a first side post 11, a second side post 12, a middle post 13, an upper magnetic cover, and a lower magnetic cover. The first side post 11, the second side post 12, and the middle post 13 are located between the upper and lower magnetic covers. The first side post 11, the middle post 13, and the second side post 12 are arranged sequentially in the same direction. The channel between the first side post 11 and the middle post 13 is the first winding channel 14, and the channel between the middle post 13 and the second side post 12 is the second winding channel 15. The magnetic core TW2 includes a first side post 21, a second side post 22, a middle post 23, an upper magnetic cover, and a lower magnetic cover. The first side post 21, the second side post 22, and the middle post 23 are located between the upper magnetic cover and the lower magnetic cover. The first side post 21, the middle post 23, and the second side post 22 are arranged sequentially in the same direction. The channel between the first side post 21 and the middle post 23 is the first winding channel 24, and the channel between the middle post 23 and the second side post 22 is the second winding channel 25. Each magnetic core also includes opposing inner and outer surfaces. The inner surfaces of magnetic core TW1 and magnetic core TW2 are adjacent to each other, and the first winding channels and the second winding channels of the two magnetic cores are connected in the horizontal direction.

[0043] like Figure 2A As shown, the first end of the first high-voltage winding TW11 (electrically connected to one end of the resonant inductor Cr) and the second end of the second high-voltage winding TW21 (second node SW2) are both located between the two magnetic cores and adjacent to the first side posts 11 and 21. The winding method from the first end of the first high-voltage winding TW11 to the second end of the second high-voltage winding TW21 is as follows: First, the first high-voltage winding TW11 passes through the first winding channel 14 from the inside of the magnetic core from the first end, and winds three turns counterclockwise around the middle posts 13 and 23, reaching the middle node SWM. Then it is divided into the first winding and the second winding. The first winding wind winds one turn counterclockwise around the middle post 13, reaching the second node SW2; the second winding wind winds one turn counterclockwise around the middle post 23, reaching the second node SW2. Here, the first and second windings are connected in parallel. In this embodiment, the first high-voltage winding TW11 and the second high-voltage winding TW21 are connected in parallel with one turn to achieve 0.5 turns for each high-voltage winding, and then connected in series with three turns to achieve 3.5 turns for each high-voltage winding. In other embodiments, 0.5 turns for each high-voltage winding can also be achieved in the same way, and then connected in series with N turns to achieve (N+0.5) turns for each high-voltage winding, where N is a natural number.

[0044] like Figure 2BAs shown, each low-voltage winding passes through a corresponding winding channel once, meaning each low-voltage winding has 0.5 turns. According to the expression for the output voltage in this embodiment: Vo = (Vin - Vo) * D * 0.5 / 3.5, where the duty cycle D = 0.5, the voltage gain ratio Vin / Vo = 15.

[0045] Specifically, in each sub-circuit, the first end of the low-voltage winding in the first synchronous rectifier circuit is located near the inner side of the magnetic core, and its second end is located near the outer side of the corresponding magnetic core; the first end of the low-voltage winding in the second synchronous rectifier circuit is located near the outer side of the corresponding magnetic core, and its second end is located near the inner side of the magnetic core. Accordingly, in the first synchronous rectifier circuit of the first sub-circuit, the first low-voltage winding TW12 passes through the first winding channel 14 from the first end to the second end along the second direction (from right to left), and the second low-voltage winding TW15 passes through the second winding channel 15 from the first end to the second end along the second direction (from right to left); in the second synchronous rectifier circuit of the first sub-circuit, the first low-voltage winding TW14 passes through the second winding channel 15 from the first end to the second end along the first direction (from left to right), and the second low-voltage winding TW13 passes through the first winding channel 14 from the first end to the second end along the first direction (from left to right). In the first synchronous rectifier circuit of the second sub-circuit, the first low-voltage winding TW22 passes through the second winding channel 25 along the first direction from the first end to the second end, and the second low-voltage winding TW25 passes through the first winding channel 24 along the first direction from the first end to the second end; in the second synchronous rectifier circuit of the second sub-circuit, the first low-voltage winding TW24 passes through the first winding channel 24 along the second direction from the first end to the second end, and the second low-voltage winding TW23 passes through the second winding channel 25 along the second direction from the first end to the second end.

[0046] Simultaneously refer to Figures 1 to 2B The upper and middle switches in the first sub-circuit, the upper and middle switches in the second sub-circuit, the first high-voltage winding, the second high-voltage winding, and the resonant capacitor form a full-bridge circuit. According to the winding method of the high-voltage winding and the low-voltage winding as described above, a high voltage gain ratio is achieved. Furthermore, this full-bridge circuit drives two transformers and four sets of synchronous rectifier circuits, which on the one hand reduces the parasitic resistance on the path through which the large current flows, thereby reducing the loss of the power conversion device; on the other hand, it further reduces the thickness of the magnetic core.

[0047] Figure 3A This is a top view diagram of the power conversion device. Figure 3B This is a schematic diagram of the bottom surface of the power conversion device. Figure 3CThis is an exploded top view. The power conversion device includes a substrate 10, which includes an upper surface 101, a lower surface 102, holes 111, 113, 121, and 123, and slots 112 and 122. The holes 111, 113, 121, and 123, and the slots 112 and 122 penetrate the upper surface 101 and the lower surface 102. These holes and slots allow magnetic cores to pass through. After magnetic cores TW1 and TW2 are mounted on the substrate 10, the two magnetic cores are arranged along the X-axis, and each winding channel is parallel to the X-axis.

[0048] In this embodiment, in the first sub-circuit, the lower switches SR1 and SR4 in the first synchronous rectification circuit are disposed near the inner side of the magnetic core TW1, with the first lower switch SR1 disposed near the first winding channel 14 and the second lower switch SR4 disposed near the second winding channel 15; in the second synchronous rectification circuit, the lower switches SR2 and SR3 are disposed near the outer side of the magnetic core TW1, with the first lower switch SR3 disposed near the second winding channel 15 and the second lower switch SR2 disposed near the first winding channel 14. In the second sub-circuit, the lower switches SR5 and SR8 in the first synchronous rectification circuit are disposed near the inner side of the magnetic core TW2, with the first lower switch SR5 disposed near the second winding channel 25 and the second lower switch SR8 disposed near the first winding channel 24; in the second synchronous rectification circuit, the lower switches SR7 and SR6 are disposed near the outer side of the magnetic core TW2, with the first lower switch SR7 disposed near the first winding channel 24 and the second lower switch SR6 disposed near the second winding channel 25. In this embodiment, each first lower switch and each second lower switch are implemented by two switches connected in parallel. These lower switches are respectively disposed on the upper surface 101 and the lower surface 102, and each lower switch disposed on the upper surface 101 and each lower switch connected in parallel on the lower surface 102 are configured in a one-to-one correspondence. Here, one-to-one correspondence means that the projections of the device disposed on the upper surface and the corresponding device disposed on the lower surface on the upper surface of the substrate at least partially overlap.

[0049] The output capacitors Co are divided into three groups, respectively located between lower switches SR1 and SR4 and lower switches SR5 and SR8, outside of lower switches SR2 and SR3, and outside of lower switches SR6 and SR7. In this embodiment, the output capacitors Co are simultaneously located on the upper surface 101 and the lower surface 102, and the positions of the output capacitor groups on the upper surface correspond one-to-one with the positions of the corresponding output capacitor groups on the lower surface. On the upper surface 101 and / or the lower surface 102, along the X-axis direction, the lower switches SR2 / SR3, magnetic core TW1, lower switches SR1 / SR4, lower switches SR5 / SR8, magnetic core TW2, and lower switches SR7 / SR6 are arranged in a row in sequence; furthermore, along the X-axis direction, the output capacitors, lower switches SR2 / SR3, magnetic core TW1, lower switches SR1 / SR4, output capacitors, lower switches SR5 / SR8, magnetic core TW2, lower switches SR7 / SR6, and output capacitors are arranged in a row in sequence.

[0050] Input terminals and output terminals are also provided on the lower surface 102 of the substrate. The input terminals include a positive input terminal Vin+ and a GND terminal, and the output terminals include a positive output terminal Vo+ and a GND terminal. In this embodiment, the power conversion device includes four sets of output terminals and one set of input terminals. The four sets of output terminals are respectively disposed on the inner and outer sides of each magnetic core, and are respectively disposed adjacent to the second side post of the magnetic core and the corresponding lower switch. In each set of output terminals, each positive output terminal is disposed adjacent to the magnetic core relative to the GND terminal. Preferably, each positive output terminal Vo+ and GND terminal are arranged in a line along the X-axis. In this embodiment, there is a center line between magnetic cores TW1 and TW2, which extends along the Y-axis. Magnetic cores TW1 and TW2 are symmetrical along the center line, and the arrangement of the lower switch and the output capacitor group is also symmetrical along the center line. Furthermore, the output terminals are also symmetrical along the center line.

[0051] Additionally, on the upper surface 101 of the substrate, the upper and middle switches in the first and second sub-circuits are positioned adjacent to the first side post of the magnetic core and symmetrically arranged on both sides of the center line. These four switches are arranged from left to right in the order of the middle switch in the first sub-circuit, the upper switch in the first sub-circuit, the upper switch in the second sub-circuit, and the middle switch in the second sub-circuit. The drains of upper switch Q1 and upper switch Q3 are adjacent and electrically connected; the source of upper switch Q1 is adjacent and electrically connected to the drain of middle switch Q2; and the source of upper switch Q3 is adjacent and electrically connected to the drain of middle switch Q4. A resonant capacitor is positioned between the upper / middle switches and the lower switch. On the lower surface 102 of the substrate, an input terminal, a Signal terminal, and a PMBus terminal are also provided. The input terminal is positioned adjacent to the center line and on both sides of the center line; the input capacitor Cin is positioned between the input terminal and the lower switch and adjacent to the upper / middle switches.

[0052] In this embodiment, by using two sets of magnetic components, four sets of parallel-connected synchronous rectifier circuits, and four sets of output terminals, the parasitic resistance along the path of high current flow is significantly reduced, thereby reducing the losses of the power conversion device. Furthermore, by providing parallel-connected switches on the upper and lower surfaces of the substrate, the losses caused by parasitic resistance are further reduced.

[0053] An application structure of the power conversion device disclosed in this invention on a system card (e.g., a GPU card) is as follows: Figures 4A to 4D As shown, the system card includes a system board 1, an xPU 2, a socket 3, and a power supply module 4. The xPU 2 is located on the top surface of the system board 1, while the socket 3 and the power supply module 4 are located on the bottom surface of the system board 1. The two sockets 3 are respectively located on opposite sides of the power supply module 4. The power supply module 4 is used to convert 54V voltage to 0.8V voltage to power the xPU.

[0054] like Figure 4C and Figure 4D As shown, the power supply module 4 includes a module substrate 41, a proportional converter 5, a voltage regulator array 6, and BGA pins. The proportional converter 5 and the voltage regulator array 6 are both located on the top surface of the module substrate 41, and the BGA pins are located on the bottom surface of the module substrate 41. In this embodiment, there are four proportional converters 5, respectively arranged on opposite sides of the voltage regulator array 6, with two converters on each side; the voltage regulator array 6 consists of 25 voltage regulators arranged in a 5x5 array, with the input terminals and output terminals connected in parallel. The power supply module 4 also includes output capacitors Co1 and Co2. Output capacitor Co1 is the output capacitor of the proportional converter 5 and is located around the proportional converter 5; output capacitor Co2 is the output capacitor of the voltage regulator and is located around each voltage regulator.

[0055] In detail, the proportional converter is used to convert the input voltage of 50V to the output voltage of 3.3V, and the voltage regulator converts the input voltage of 3.3V to the output voltage of 0.8V. In this embodiment, the ratio of the input voltage to the output voltage of the proportional converter is 15:1. The lower the output voltage, the more advantageous it is to use a higher switching frequency in the voltage regulator, which helps to reduce the inductance of the output inductor and the size of the voltage regulator, and can obtain better dynamic response performance. However, the lower the output voltage of the proportional converter, the larger the output current of the proportional converter is to obtain the same output power, which makes the loss in the current path between the proportional converter and the voltage regulator greater. Therefore, in the power supply module 4, the proportional converter and the voltage regulator are placed on the same module substrate, so that the proportional converter and the voltage regulator only have parasitic resistance loss caused by the wiring on the module substrate, and no parasitic loss caused by the BGA pin solder joints, thereby further improving the conversion efficiency of the power supply module. In addition, the voltage regulator array 6 is positioned in the middle of the power supply module 4, so that the output of each voltage regulator is connected to the BGA pin with the shortest distance, and then to the input pin of the xPU with the shortest distance. In other words, the voltage regulator, the BGA pin output of the power supply module, the BGA pin input of the xPU, and the xPU are vertically aligned, which further reduces the parasitic resistance between the voltage regulator and the xPU. On the other hand, the proportional converter is positioned on both sides of the voltage regulator array, so that the proportional converter is relatively far away from the BGA pin input of the xPU and will not affect the setting of the BGA pin input of the xPU.

[0056] Figure 5A and Figure 5B Another embodiment is disclosed, in which the xPU 2 and the proportional converter 5 are both disposed on the top surface of the system board 1, with the proportional converter 5 disposed above and below the xPU, respectively; the voltage regulator array 6 and the socket 3 are disposed on the bottom surface of the system board 1, with the voltage regulator array 6 positioned perpendicularly to the xPU, i.e., directly below the xPU, and the two sockets 3 disposed to the left and right of the voltage regulator array 6, respectively. In this embodiment, the power supply module 4 includes only the voltage regulator array 6, reducing the size of the power supply module and further improving the reliability of the power supply system. The traces between the xPU and the socket are arranged along the X direction, while the traces between the proportional converter and the power supply module are arranged along the Y direction. Therefore, these two types of traces do not interfere with each other on the system board, minimizing the parasitic resistance between the proportional converter and the power supply module, and helping to reduce losses on this parasitic resistance.

[0057] Within the module substrate, the output capacitor Co2 of the voltage regulator can be further integrated. This output capacitor Co2 is a silicon capacitor with square pads, such as... Figures 6A to 6BAs shown, where Figure 6B The diagram shows the top-view, front-view, lateral-view, and bottom-view of a silicon capacitor. Figure 6A A side view schematic diagram of a silicon capacitor embedded in a module substrate is shown. In this embodiment, a module substrate with at least four layers is used as an example for illustration. The specific method is to first embed the silicon capacitor in a double-sided board and bring out the square copper pad pins of the silicon capacitor through laser drilling; then, a layer of PP and a layer of copper foil are respectively laminated on the top and bottom surfaces of the double-sided board with the embedded silicon capacitor, thereby forming a module substrate with at least four layers. For the at least four-layer module substrate, vias are drilled in areas where no silicon capacitors are embedded; in areas where silicon capacitors are embedded, laser-drilled holes are drilled at the locations of square copper pads; finally, balls are placed at the via locations and the laser-drilled holes of the silicon capacitors within the at least four-layer module substrate to form the BGA pins of the power supply module; each silicon capacitor is placed adjacent to the vias penetrating the at least four-layer module substrate; this allows for at least two copper layers or at least one PP layer between the silicon capacitors and the BGA pins, and reduces the internal resistance between BGA pins with the same electrical network, making the current flowing through each BGA pin nearly equal, thereby reducing the current density of the BGA pins; placing the silicon capacitors adjacent to the vias further ensures that the current through each BGA pin is nearly equal. Embedding output capacitors within the module substrate further increases the capacitance of the voltage regulator's output capacitor, further improving the dynamic response characteristics of the power supply module.

[0058] The power supply module 4 in the above two embodiments is not limited to a proportional converter that converts a 50V input voltage to a 3.3V output voltage and a voltage regulator that converts a 3.3V input voltage to a 0.8V output voltage; it can also be a proportional converter that converts a 48V input voltage to a 12V output voltage and a voltage regulator that converts a 12V input voltage to a 0.8V output voltage. In other embodiments, the proportional converter and voltage regulator can also use other input and output voltages, and can all adopt the structural layout shown in the aforementioned embodiments. In addition, the technical features of the above proportional converter can also be applied to adjustable converters to achieve the same technical effect.

[0059] The switching transistors disclosed in this invention are all illustrated using MOSFETs as an example, but they are not limited to this. Si MOSFETs, SiC MOSFETs, GaN devices, or IGBTs can all be used to achieve the switching function disclosed in this invention.

[0060] The power module described in the above embodiments can also be part of an electronic device, as long as it meets the technical features and benefits disclosed in this invention.

[0061] The terms "equal to," "identical to," or "equal to" disclosed in this invention must take into account the parameter distribution of the engineering process, with an error distribution within ±30%. "Parallel" is defined as the angle between two line segments or lines being less than or equal to 45 degrees. "Perpendicular" is defined as the angle between two line segments or lines being within the range of [60, 120] degrees. The definition of "phase misalignment" also needs to consider the parameter distribution of the engineering process, with an error distribution of the phase misalignment degree within ±30%.

[0062] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0063] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A power conversion device, characterized in that, The system includes a full-bridge circuit, two magnetic cores, and four synchronous rectifier circuits. The full-bridge circuit includes two upper switches, two middle switches, a resonant capacitor, a first high-voltage winding, and a second high-voltage winding. The resonant capacitor, the first high-voltage winding, and the second high-voltage winding are connected in series. The four synchronous rectifier circuits are connected in parallel. Each synchronous rectifier circuit includes a first lower switch, a second lower switch, a first low-voltage winding, and a second low-voltage winding. The low-voltage windings in the same synchronous rectifier circuit are all wound on the same magnetic core. The first high-voltage winding and the second high-voltage winding are wound around two magnetic cores; It also includes an input terminal and an output terminal. The input terminal includes a positive input terminal and a GND terminal. The output terminal includes a positive output terminal and a GND terminal. The full-bridge circuit is electrically connected to the input terminal. The four synchronous rectifier circuits are electrically connected to the output terminal.

2. The power conversion device according to claim 1, characterized in that, The four synchronous rectifier circuits are a first synchronous rectifier circuit, a second synchronous rectifier circuit, a third synchronous rectifier circuit, and a fourth synchronous rectifier circuit. In each of the synchronous rectifier circuits, the second end of the first low-voltage winding and the second end of the second low-voltage winding are electrically connected to the positive output terminal, the first end of the first low-voltage winding is electrically connected to the first lower switch, and the first end of the second low-voltage winding is electrically connected to the second lower switch. Both the first lower switch and the second lower switch are electrically connected to the GND terminal.

3. The power conversion device according to claim 2, characterized in that, The two upper switches are the first upper switch and the second upper switch, and the two middle switches are the first middle switch and the second middle switch. The first upper switch and the first middle switch are electrically connected to the first node, and the second upper switch and the second middle switch are electrically connected to the second node. The resonant capacitor, the first high-voltage winding, and the second high-voltage winding are connected in series and then connected in series between the first node and the second node. The first end of the second high-voltage winding is electrically connected to the second end of the first high-voltage winding. The first upper switch and the second upper switch are both electrically connected to the positive input terminal, and the first middle switch and the second middle switch are both electrically connected to the positive output terminal.

4. The power conversion device according to claim 3, characterized in that, The first end of the first high-voltage winding, the first end of the second high-voltage winding, the first end of each of the first low-voltage windings, and the second end of each of the second low-voltage windings are the same end.

5. The power conversion device according to claim 3, characterized in that, The two magnetic cores are a first magnetic core and a second magnetic core, respectively. Each magnetic core includes a first side post, a middle post, a second side post, an upper magnetic cover, and a lower magnetic cover. The first side post, the second side post, and the middle post are located between the upper magnetic cover and the lower magnetic cover. The first side post, the middle post, and the second side post are arranged sequentially in the same direction. A first winding channel is formed between the first side post and the middle post, and a second winding channel is formed between the second side post and the middle post. Each magnetic core includes opposing inner and outer sides, with the inner sides of the first magnetic core and the inner sides of the second magnetic core arranged adjacent to each other.

6. The power conversion device according to claim 5, characterized in that, The first low-voltage winding in each of the synchronous rectifier circuits passes through a winding channel, and the second low-voltage winding in each of the synchronous rectifier circuits passes through another winding channel.

7. The power conversion device according to claim 5, characterized in that, The first end of the first high-voltage winding and the second end of the second high-voltage winding are both located near the inner side of the magnetic core and near the first winding channel. From the first end of the first high-voltage winding to the second end of the second high-voltage winding, the high-voltage winding is first wound around the central column of the first magnetic core and the central column of the second magnetic core in one direction for at least three turns, reaching the intermediate node. Then it is divided into a first winding and a second winding. The first winding is wound around the central column of the first magnetic core in the same direction for one turn, reaching the second node. The second winding is wound around the central column of the second magnetic core for one turn, also reaching the second node. The first winding and the second winding are connected in parallel between the intermediate node and the second node. The second node is the second end of the second high-voltage winding.

8. The power conversion device according to claim 5, characterized in that, The system also includes a substrate, which has opposing top and bottom surfaces, and the two magnetic cores are respectively assembled with the substrate. The lower switch in the first synchronous rectification circuit is disposed near the inner side of the first magnetic core, and the first lower switch in the first synchronous rectification circuit is disposed near the first winding channel; the second lower switch in the first synchronous rectification circuit is disposed near the second winding channel; the lower switch in the second synchronous rectification circuit is disposed near the outer side of the first magnetic core, and the first lower switch in the second synchronous rectification circuit is disposed near the second winding channel; the lower switch in the third synchronous rectification circuit is disposed near the inner side of the second magnetic core, and the first lower switch in the third synchronous rectification circuit is disposed near the second winding channel; the second lower switch in the third synchronous rectification circuit is disposed near the first winding channel; the lower switch in the fourth synchronous rectification circuit is disposed near the outer side of the second magnetic core, and the first lower switch in the fourth synchronous rectification circuit is disposed near the first winding channel; the second lower switch in the fourth synchronous rectification circuit is disposed near the second winding channel.

9. The power conversion device according to claim 8, characterized in that, In the first synchronous rectifier circuit, the first low-voltage winding passes through the first winding channel of the first magnetic core from the first end to the second end along the first direction; in the second synchronous rectifier circuit, the second low-voltage winding passes through the second winding channel of the first magnetic core from the first end to the second end along the first direction; in the second synchronous rectifier circuit, the first low-voltage winding passes through the second winding channel of the first magnetic core from the first end to the second end along the second direction; in the second synchronous rectifier circuit, the second low-voltage winding passes through the first winding channel of the first magnetic core from the first end to the second end along the second direction. The first low-voltage winding in the third synchronous rectifier circuit passes through the second winding channel of the second magnetic core from the first end to the second end along the second direction, and the second low-voltage winding in the third synchronous rectifier circuit passes through the first winding channel of the second magnetic core from the first end to the second end along the second direction. The first low-voltage winding in the fourth synchronous rectifier circuit passes through the first winding channel of the second magnetic core from the first end to the second end along the first direction, and the second low-voltage winding in the fourth synchronous rectifier circuit passes through the second winding channel of the second magnetic core from the first end to the second end along the first direction. The first direction is opposite to the second direction.

10. The power conversion device according to claim 8, characterized in that, It also includes at least three output capacitor groups, which are respectively disposed outside the lower switch of the second synchronous rectifier circuit, between the lower switches of the first synchronous rectifier circuit and the third synchronous rectifier circuit, and outside the lower switch of the fourth synchronous rectifier circuit.

11. The power conversion device according to claim 8, characterized in that, It also includes at least four sets of output terminals, each set of which is adjacent to the lower switch of the corresponding synchronous rectifier circuit.

12. The power conversion device according to claim 8, characterized in that, The first lower switch includes two switches connected in parallel, and the second lower switch includes two switches connected in parallel. The first lower switch, the second lower switch, and the output capacitor are all disposed on the top and bottom surfaces of the substrate. The two switches connected in parallel in the first lower switch are disposed on the top and bottom surfaces of the substrate, and the projections of the two switches connected in parallel on the top surface of the substrate at least partially overlap. The two switches connected in parallel in the second lower switch are disposed on the top and bottom surfaces of the substrate, and the projections of the two switches connected in parallel on the top surface of the substrate at least partially overlap. The projections of the output capacitor disposed on the top surface of the substrate and the output capacitor disposed on the bottom surface of the substrate on the top surface of the substrate at least partially overlap.

13. The power conversion device according to claim 5, characterized in that, The two first winding channels are connected in the horizontal direction, and the two second winding channels are connected in the horizontal direction.

14. The power conversion device according to claim 5, characterized in that, It also includes a substrate, which has a top surface and a bottom surface facing each other, and the two magnetic cores are respectively assembled with the substrate; the two upper switches and the two middle switches are arranged adjacent to the first side post, and the two upper switches and the two middle switches are arranged in the same direction in the order of the first middle switch, the first upper switch, the second upper switch and the second middle switch; the resonant capacitor is arranged adjacent to the upper switches and the middle switches.

15. The power conversion device according to claim 14, characterized in that, It also includes input terminals and input capacitors, which are disposed adjacent to the upper switch and the middle switch.

16. The power conversion device according to claim 5, characterized in that, It also includes a substrate, which has a top surface and a bottom surface opposite each other, a plurality of holes and a plurality of slots, wherein the holes and slots penetrate the top surface and the bottom surface of the substrate, the holes are used to place the first side post and the middle post of the magnetic core, and the slots are used to place the second side post of the magnetic core.

17. A power conversion device, characterized in that, The device includes an input positive terminal, an input negative terminal, an output positive terminal, an output negative terminal, a high-voltage switch, a low-voltage switch, and a magnetic component. The magnetic component includes two magnetic cores, a high-voltage winding, and a low-voltage winding. The high-voltage switch and the high-voltage winding are electrically connected, and the low-voltage switch and the low-voltage winding are also electrically connected. The two magnetic cores are a first magnetic core and a second magnetic core. Each magnetic core includes an upper magnetic cover, a lower magnetic cover, a first side post, a middle post, and a second side post. The first side post, the middle post, and the second side post are arranged sequentially in the same direction, and are all located between the upper and lower magnetic covers. In the same magnetic core, the first side post and the middle post form a first winding channel, and the second side post and the middle post form a second winding channel. The first magnetic core and the second magnetic core are arranged adjacent to each other, and the two first winding channels and the two second winding channels are connected in the horizontal direction. The high-voltage winding is wound around the central column of the two magnetic cores; the low-voltage winding passes through the first winding channel or the second winding channel of the two magnetic cores.

18. The power conversion device according to claim 17, characterized in that, The high-voltage winding includes a first high-voltage winding and a second high-voltage winding. The second end of the first high-voltage winding and the first end of the second high-voltage winding are connected in series and short-circuited. The first end of the first high-voltage winding and the second end of the second high-voltage winding are both located between the two magnetic cores and adjacent to the first side post. The high-voltage winding is wound from the first end to the second end as follows: First, starting from between the two magnetic cores, it is wound N turns around the two center posts in the same direction to reach the middle node, where N is a natural number greater than or equal to 1. The middle node is also located in the middle of the two magnetic cores. Then, it is divided into a first winding and a second winding from the middle node. The first winding continues to be wound around the center post of the first magnetic core in the same direction once to reach the second node. The second winding continues to be wound around the center post of the second magnetic core in the same direction once to reach the second node. The first winding and the second winding are connected in parallel between the middle node and the second node. The second node is the second end of the second high-voltage winding.

19. The power conversion device according to claim 17, characterized in that, The low-voltage switches are respectively located on opposite sides of the first magnetic core and on opposite sides of the second magnetic core. The first end of the low-voltage winding is electrically connected to the low-voltage switch, the second end of the low-voltage winding is electrically connected to the positive output terminal, and the low-voltage switch is electrically connected to the negative output terminal. The low-voltage winding includes a first low-voltage winding and a second low-voltage winding. The first low-voltage winding and the second low-voltage winding pass through the first winding channel and the second winding channel in the same magnetic core, respectively.

20. A system card, characterized in that, The device includes a system board, a load chip, slots, a voltage regulator array, and a power conversion device as described in claim 1. The system board includes opposing top and bottom surfaces. The load chip is disposed on the top surface of the system board, and the voltage regulator array is disposed on the bottom surface of the system board. The projections of the voltage regulator array and the load chip on the system board at least partially overlap. The voltage regulator array is electrically connected to the load chip through the system board, and the power conversion device is electrically connected to the voltage regulator array. The slots are disposed on opposite sides of the voltage regulator array, and the slots are electrically connected to the load chip.

21. The system card according to claim 20, characterized in that, It also includes the module substrate, which has a top surface and a bottom surface facing each other; the voltage regulation array and the power conversion device are both disposed on the top surface of the module substrate, and the power conversion device is disposed on opposite sides of the voltage regulation array; the bottom surface of the module substrate is provided with BGA pads, and the bottom surface of the module substrate is soldered to the bottom surface of the system board through the BGA pads.

22. The system card according to claim 20, characterized in that, The power conversion device is disposed on the top surface of the system board and on opposite sides of the load chip. The trace between the power conversion device and the voltage regulation array is arranged along the X direction, and the trace between the load chip and the slot is arranged along the Y direction.

23. The system card according to claim 20, characterized in that, It also includes a first output capacitor and a second output capacitor. The first output capacitor is disposed adjacent to the power conversion device and is electrically connected to the output terminal of the power conversion device. The second output capacitor is disposed around each voltage regulator and is electrically connected to the output terminal of the voltage regulation array.

24. The system card according to claim 20, characterized in that, It also includes a module substrate, which has a top surface and a bottom surface facing each other; the voltage regulation array is disposed on the top surface of the module substrate, and the bottom surface of the module substrate is provided with BGA pins, and the module substrate is electrically connected to the system board through the BGA pins; a second output capacitor is integrated in the module substrate, and the second output capacitor is electrically connected to the output terminal of the voltage regulation array.

25. A method for manufacturing an integrated capacitor substrate, characterized in that, The substrate includes a capacitor and a double-sided board, wherein the capacitor includes two pads; the steps for integrating the capacitor into the substrate are as follows: Step 1: Embed the capacitor into the double-sided board and bring out the solder pad pins of the capacitor through laser drilling; Step 2: Press an insulating layer and a copper foil onto the top and bottom surfaces of the double-sided board with embedded capacitors to form a substrate with at least four layers. Step 3: For the at least four-layer substrate, drill through holes in areas where no capacitors are embedded; in areas where capacitors are embedded, drill laser holes corresponding to the pad lead-out positions; all capacitors are placed adjacent to the through holes. Step 4: Place balls at the via locations and laser aperture locations within the at least four-layer substrate to form BGA pins.

26. The integrated capacitor substrate according to claim 25, characterized in that, The capacitor is a silicon capacitor, and the pads of the silicon capacitor are square pads.

27. A power supply module, characterized in that, The device includes a circuit board, a voltage regulator array, and multiple power conversion devices. The circuit board has a top surface and a bottom surface facing each other. The voltage regulator array and the power conversion devices are disposed on the bottom surface of the circuit board. The power conversion devices are electrically connected to the voltage regulator array and provide power to the voltage regulator array. The voltage regulator array provides power to a load chip. The projections of the load chip and the voltage regulator array on the bottom surface of the circuit board at least partially overlap. The multiple power conversion devices are respectively disposed on opposite sides of the circuit regulator array.

28. The power supply module according to claim 27, characterized in that, The circuit board is a system board, and the load chip is disposed on the top surface of the system board.

29. The power supply module according to claim 27, characterized in that, BGA pins are provided on the top surface of the circuit board.

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